JPH11154653A5 - - Google Patents

Info

Publication number
JPH11154653A5
JPH11154653A5 JP1998205138A JP20513898A JPH11154653A5 JP H11154653 A5 JPH11154653 A5 JP H11154653A5 JP 1998205138 A JP1998205138 A JP 1998205138A JP 20513898 A JP20513898 A JP 20513898A JP H11154653 A5 JPH11154653 A5 JP H11154653A5
Authority
JP
Japan
Prior art keywords
plating
area
wiring
substrate
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1998205138A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11154653A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP20513898A priority Critical patent/JPH11154653A/ja
Priority claimed from JP20513898A external-priority patent/JPH11154653A/ja
Priority to TW087115386A priority patent/TW405158B/zh
Priority to DE69839066T priority patent/DE69839066T2/de
Priority to KR1019980038368A priority patent/KR100554855B1/ko
Priority to EP98117633A priority patent/EP0903774B1/en
Priority to US09/154,895 priority patent/US6294059B1/en
Publication of JPH11154653A publication Critical patent/JPH11154653A/ja
Priority to US09/945,711 priority patent/US6929722B2/en
Priority to US10/786,110 priority patent/US20040163947A1/en
Publication of JPH11154653A5 publication Critical patent/JPH11154653A5/ja
Pending legal-status Critical Current

Links

JP20513898A 1997-09-17 1998-07-21 基板メッキ装置 Pending JPH11154653A (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP20513898A JPH11154653A (ja) 1997-09-17 1998-07-21 基板メッキ装置
TW087115386A TW405158B (en) 1997-09-17 1998-09-16 Plating apparatus for semiconductor wafer processing
US09/154,895 US6294059B1 (en) 1997-09-17 1998-09-17 Substrate plating apparatus
EP98117633A EP0903774B1 (en) 1997-09-17 1998-09-17 Substrate plating apparatus
KR1019980038368A KR100554855B1 (ko) 1997-09-17 1998-09-17 기판도금장치
DE69839066T DE69839066T2 (de) 1997-09-17 1998-09-17 Vorrichtung zur Substratbeschichtung
US09/945,711 US6929722B2 (en) 1997-09-17 2001-09-05 Substrate plating apparatus
US10/786,110 US20040163947A1 (en) 1997-09-17 2004-02-26 Substrate plating apparatus

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP27049397 1997-09-17
JP9-270493 1997-09-17
JP20513898A JPH11154653A (ja) 1997-09-17 1998-07-21 基板メッキ装置

Publications (2)

Publication Number Publication Date
JPH11154653A JPH11154653A (ja) 1999-06-08
JPH11154653A5 true JPH11154653A5 (enrdf_load_stackoverflow) 2004-12-09

Family

ID=26514878

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20513898A Pending JPH11154653A (ja) 1997-09-17 1998-07-21 基板メッキ装置

Country Status (1)

Country Link
JP (1) JPH11154653A (enrdf_load_stackoverflow)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000074128A1 (fr) 1999-06-01 2000-12-07 Tokyo Electron Limited Procede de fabrication de dispositif a semiconducteur et appareil de fabrication associe
US6423200B1 (en) * 1999-09-30 2002-07-23 Lam Research Corporation Copper interconnect seed layer treatment methods and apparatuses for treating the same
US6730596B1 (en) 1999-10-15 2004-05-04 Ebara Corporation Method of and apparatus for forming interconnection
US6660139B1 (en) * 1999-11-08 2003-12-09 Ebara Corporation Plating apparatus and method
JP3367655B2 (ja) * 1999-12-24 2003-01-14 島田理化工業株式会社 めっき処理装置及びめっき処理方法
US6716329B2 (en) 2000-05-02 2004-04-06 Tokyo Electron Limited Processing apparatus and processing system
JP2006339665A (ja) * 2000-10-12 2006-12-14 Ebara Corp 半導体基板製造装置
JP2003073845A (ja) * 2001-08-29 2003-03-12 Sony Corp 回転式メッキ装置およびメッキ方法
JP2004304021A (ja) * 2003-03-31 2004-10-28 Ebara Corp 半導体装置の製造方法及び製造装置
JP4663965B2 (ja) * 2003-02-27 2011-04-06 株式会社荏原製作所 基板処理方法及び基板処理装置
JP6116317B2 (ja) * 2013-03-28 2017-04-19 株式会社荏原製作所 めっき装置およびめっき方法
US9388504B2 (en) 2013-03-26 2016-07-12 Ebara Corporation Plating apparatus and plating method
JP6239417B2 (ja) * 2014-03-24 2017-11-29 株式会社荏原製作所 基板処理装置

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