JPH1114868A - Uv irradiation adhesion device for optical component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain the UV irradiation adhesion device for an optical component which has superior performance quality of connection by increasing the curing speed of an ultraviolet-ray setting type adhesive. SOLUTION: A top-surface ultraviolet-ray irradiation part 15 and a reverse-surface ultraviolet-ray irradiation part 16 are arranged above and below a waveguide chip element 3. Both the ultraviolet-ray irradiation parts 15 and 16 move horizontally between an optical component connection position A and an illuminance adjustment position B. At the illuminance adjustment position B, an ultraviolet-ray illuminance sensor 17 is arranged. The sensor 17 is set with its ultraviolet-ray detection surface 22 up to detect the ultraviolet-ray irradiation illuminance of the top-surface ultraviolet- ray irradiation part 15, whose vertical position is adjusted so that the detected illuminance reaches reference irradiation illuminance. Similarly, the ultraviolet-ray irradiation illuminance detected with the external-ray detection surface 22 down is matched with the reference irradiation illuminance. After the illuminance adjustment, both the irradiation parts 15 and 16 are moved to the optical component connection position A and the connection position of a waveguide chip element 3 is irradiated with ultraviolet rays from both alcove and below to set the applied ultraviolet-ray setting adhesive, thereby connecting the optical component.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a UV irradiating and bonding apparatus for an optical component, which irradiates an ultraviolet curable adhesive applied to a connecting portion of the optical component with ultraviolet rays to bond and fix the aligned optical components. More particularly, the present invention relates to an apparatus provided with a detection sensor for detecting irradiation intensity of ultraviolet rays.

[0002]

2. Description of the Related Art Optical components such as an optical fiber array, an optical waveguide chip element, and a light emitting element are connected to each other by using an ultraviolet curing adhesive (UV adhesive). When the optical components are connected to each other, first, the optical component on one side and the optical component on the other side are aligned, and in this aligned state, an ultraviolet-curing type coated on the connection end face of both optical components is used. The adhesive was irradiated with ultraviolet rays, and the ultraviolet-curable adhesive was cured to connect and fix the optical components to each other.

[0003]

However, when irradiating the ultraviolet ray to the ultraviolet ray curable adhesive, if the illuminance of the ultraviolet ray irradiation is too large, the amount of heat applied to the optical component increases, and the performance quality of the optical component is adversely affected. There is a problem that exerts. Conversely, if the irradiance of the ultraviolet light is too small, the curing speed of the ultraviolet-curable adhesive becomes slow, which takes a long time and causes a problem that satisfactory adhesive strength cannot be obtained.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to detect the irradiation illuminance of ultraviolet rays to adjust the irradiation illuminance optimally and to improve the efficiency of the bonding work of optical parts. UV of optical components that can be performed
An object of the present invention is to provide an irradiation bonding apparatus.

[0005]

In order to achieve the above object, the present invention takes the following measures. That is,
A first invention is an optical component UV irradiation bonding apparatus for connecting and fixing an optical component by irradiating ultraviolet rays to an ultraviolet curing adhesive applied to a connection portion of the optical component in an aligned state of the optical component to be connected. In the above, the upper surface side ultraviolet irradiation unit that irradiates ultraviolet rays from the upper side of the connection part of the optical component, the lower side ultraviolet irradiation unit that irradiates ultraviolet light from the lower side of the connection part of the optical component, and the optical component at the alignment connection position An ultraviolet illuminance sensor disposed at a position separated in the horizontal direction with an ultraviolet detection surface substantially at the same height as the optical component, wherein the upper-surface-side ultraviolet irradiator is configured to irradiate an upper-surface ultraviolet-irradiation position on the optical component and the ultraviolet light; The horizontal movement between the upper facing position of the illuminance sensor is freely provided, and the lower-surface-side ultraviolet irradiation unit is capable of moving horizontally between the lower-surface ultraviolet irradiation position on the optical component and the lower-facing position of the ultraviolet illuminance sensor. Provided, The UV illuminance sensor is provided so that the UV detection surface can rotate freely upward and downward, detects the UV irradiation illuminance of the upper UV irradiation unit at the upward rotation position of the UV detection surface, and at the downward rotation position of the UV detection surface. This is a means for solving the problem by adopting a configuration in which the ultraviolet irradiation illuminance of the lower ultraviolet irradiation unit is detected.

According to a second aspect of the present invention, in the apparatus having the configuration of the first aspect, data of reference irradiation illuminance of the upper-side ultraviolet irradiation section and the lower-side ultraviolet irradiation section is given in advance. The ultraviolet irradiating unit and the lower ultraviolet irradiating unit are provided so as to be freely movable in the vertical direction, and the corresponding ultraviolet irradiating the upper and lower surfaces so that the ultraviolet irradiance detected by the ultraviolet illuminance sensor becomes the reference irradiation illuminance. This is a means for solving the problem with a configuration in which illuminance adjustment means for adjusting the illuminance by moving the unit vertically up and down with respect to the ultraviolet detection surface of the ultraviolet illuminance sensor is provided.

According to a third aspect of the present invention, there is provided the ultraviolet illuminance sensor according to the first aspect, wherein reference illuminance data of the upper-side ultraviolet irradiator and the lower-side ultraviolet irradiator is given in advance. And an illumination adjusting means for adjusting the illumination power by controlling the drive power of the corresponding ultraviolet irradiating units on the upper surface and the lower surface so that the ultraviolet irradiation illuminance detected by the above becomes the reference illumination illuminance. Is a means to solve.

According to a fourth aspect of the present invention, there is provided the apparatus according to the first aspect, wherein reference irradiation illuminance data of the upper-side ultraviolet irradiation section and the lower-side ultraviolet irradiation section are given in advance. Is provided with a condensing lens, and illuminance adjusting means for adjusting illuminance by adjusting the focus of the lens so that the ultraviolet irradiation illuminance detected by the ultraviolet illuminance sensor is the reference irradiation illuminance is provided. It is a means to solve the problem with a certain configuration.

In the present invention, the upper ultraviolet ray irradiating section and the lower ultraviolet ray irradiating section are positioned at positions vertically opposed to the ultraviolet illuminance sensor, respectively, and the detection surface of the ultraviolet illuminance sensor is set to an upward rotation position. Ultraviolet light is irradiated from the upper surface side ultraviolet irradiation section toward the ultraviolet illuminance sensor, and the irradiation illuminance of the ultraviolet light is detected by the ultraviolet illuminance sensor. This detection signal is applied to the illuminance adjusting means. The illuminance adjusting means compares the reference illumination illuminance given in advance with the detected illuminance, and when the two are different, the detected illuminance is adjusted in the direction in which the detected illuminance matches the reference illumination illuminance. The ultraviolet irradiance emitted from the upper-surface-side ultraviolet irradiator is set to the reference irradiation irradiance by moving the upper-side ultraviolet-irradiator in the vertical direction or controlling the drive power of the upper-surface-side ultraviolet-irradiator.

Similarly, while the illuminance detection surface of the ultraviolet illuminance sensor is rotated downward, ultraviolet light is emitted from the lower ultraviolet irradiator to the ultraviolet illuminance sensor, and the illuminance is detected by the ultraviolet illuminance sensor. The irradiation illuminance of the lower surface side ultraviolet irradiation unit is adjusted so as to match the reference irradiation illuminance given in advance.

After the irradiation illuminance of the upper and lower ultraviolet irradiation units is adjusted, the upper and lower ultraviolet irradiation units are moved in the horizontal direction to adjust the upper and lower irradiation positions of the optical component. Positioning is set at each of the lower-side irradiation positions.

In this state, ultraviolet rays are irradiated from the upper-side ultraviolet irradiation section and the lower-side ultraviolet irradiation section toward the ultraviolet-curable adhesive applied to the connection portion of the optical component in the centered state. That is, ultraviolet light is irradiated from the upper surface side ultraviolet irradiation portion toward the upper surface side of the connection portion of the optical component, and ultraviolet light is irradiated from the lower surface side ultraviolet irradiation portion toward the lower surface side of the connection portion of the optical component.

As described above, by irradiating the ultraviolet rays from both the upper surface and the lower surface of the connection part of the optical component, the ultraviolet curable adhesive can be efficiently cured in a short time. In the present invention, since the upper-surface-side ultraviolet irradiator and the lower-surface-side ultraviolet irradiator irradiate the ultraviolet-curable adhesive with ultraviolet light having an optimum irradiation intensity, the ultraviolet illuminance may be in an insufficient state or an excessive state. Since the ultraviolet curing is performed by the ultraviolet rays having the optimum irradiation illuminance, the adhesive connection of the optical component having the high bonding strength and the high connection quality is achieved.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 shows the configuration of an embodiment of a UV irradiation bonding apparatus according to the present invention. The UV irradiation bonding apparatus according to the present embodiment is incorporated in a centering device for optical components, and one example of the centering device is shown in FIG.

In FIG. 2, the centering device includes a fixed stage 1 and a moving stage 2. A waveguide chip element 3 of an optical component is removably mounted and fixed above the fixed stage 1, and an optical fiber array 4 of an optical component is similarly removably mounted and fixed above the moving stage 2. ing.

The waveguide chip element 3 has an appropriate optical waveguide formed therein, and has end faces 5, 6 on both front and rear sides.
The waveguide terminals 7 are exposed at an equal pitch interval.

The optical fiber array 4 is formed by connecting a ferrule 10 to the distal end side of an optical fiber core 8 such as an optical tape in which multiple optical fibers are arranged and arranged. The same number of optical fiber insertion holes 11 as the number of the waveguide terminals of the element 3 are arranged and formed, and the optical fiber exposed by removing the coating material on the distal end side of the optical fiber 8 is inserted into the optical fiber insertion hole 11. Then, in this inserted state, the optical fiber and the ferrule 10 are fixed using an adhesive. The connection end face 12 of the ferrule 10 is polished and flattened together with the tip end face of the optical fiber, and the connection end face 12 of the ferrule 10 has an optical fiber terminal 13 which is the same as the waveguide end 7 of the waveguide chip element 3. It is exposed in an array at equal pitch intervals.

The free end side of the optical fiber core 8 is detachably connected to the light incident means 14, and light is incident on the designated optical fiber of the optical fiber core 8 by the light incident means 14. It has become. The moving stage 2 moves in the X direction, which is the arrangement direction of the optical fiber terminals 13, and the upper and lower Y directions perpendicular to the X direction.
The optical fiber array 4 is formed such that it can freely move in the Z direction, which is the length direction of the optical fiber of the optical fiber array 4 orthogonal to both the X and Y directions. (Not shown). The moving stage 2 moves in the rotational theta _Z around the Z-axis are formed freely, is performed by the rotation control also control the theta _Z.

Waveguide chip element 3 using this centering device
The alignment operation between the optical fiber array 4 and the optical fiber array 4 is performed as follows. First, light is incident on each optical fiber of the optical fiber array 4 by the light incident means 14, and the light incident on each optical fiber is transmitted to the corresponding waveguide terminal of the waveguide chip element 3 (the waveguide terminal on the end face 6 side). ), The light is received by a power meter (not shown), and the optical power is measured. Then, for example, the moving stage 2 is moved to X, Y, Z so that the optical power of the light emitted from each waveguide terminal 7 becomes a preset value.
And the movement of the rotation θ _Z about the Z axis are controlled,
The position at which the output light power from each waveguide terminal 7 has reached the above-mentioned set value is defined as the centering position between the waveguide chip element 3 and the optical fiber array 4. The end face 5 of the waveguide chip element 3 is abutted, and in this state, an ultraviolet curable adhesive is applied to a connection portion between the waveguide chip element 3 and the optical fiber array 4, that is, a butt portion between the end faces 12 and 5. (The application of the adhesive may not be performed at the time of centering, but may be applied to one or both of the end surfaces 5 and 12 in advance before centering). Then, in this aligned state, the ultraviolet curing adhesive is cured by ultraviolet irradiation using the UV irradiation bonding apparatus of this embodiment.

The UV irradiation bonding apparatus of this embodiment shown in FIG. 1 is provided between the fixed stage 1 and the moving stage 2 of the centering device. FIG. 1 shows the moving stage shown in FIG. 2 is not shown. FIG. 1A shows a front view of the UV irradiation bonding apparatus, and FIG. 1B shows a side view.

The UV irradiation bonding apparatus according to the present embodiment includes an upper surface-side ultraviolet irradiation unit 15, a lower surface-side ultraviolet irradiation unit 16, and an ultraviolet illuminance sensor 17.

The upper-side ultraviolet irradiation section 15 and the lower-side ultraviolet irradiation section 16 are attached to the distal ends of arms 18 and 19, respectively. These arms 18 and 19 are horizontally moved by corresponding arm driving mechanisms 20 and 21, respectively. The upper and lower UV irradiation units 15 and 16 are connected to the optical component connection position A (UV irradiation position at the time of connection) by the forward and backward movements of the arms 18 and 19. It is configured to move horizontally between adjustment positions (positions facing the illuminance sensor) B. The drive control of the arm drive mechanisms 20 and 21 is performed by a control device.
0 and 21 are configured using a mechanism such as a solenoid or an air cylinder.

In the present embodiment, the horizontal movement direction of the upper-side ultraviolet irradiation section 15 and the lower-side ultraviolet irradiation section 16 is the same as that of FIG.
In the arrangement direction (X direction) of the waveguide terminal 7 and the optical fiber terminal 13 at the time of, so that the alignment of the waveguide chip element 3 and the optical fiber array 4 does not hinder the movement of the moving stage 2. It is configured to retract from the optical component connection position A to the illuminance adjustment position B.

The upper-side ultraviolet irradiating section 15 and the lower-side ultraviolet irradiating section 16 are provided with ultraviolet irradiating means such as an ultraviolet lamp, and the intensity of ultraviolet irradiance is controlled by driving power (driving voltage). The arm driving mechanisms 20 and 21 move the arms 18 and 19 forward and backward in the horizontal direction. If necessary, the arm driving mechanisms 20 and 21 can be moved up and down.
18, 19, that is, the ultraviolet irradiation parts 15,
The up and down movement of 16 is controlled by the control device.

The ultraviolet illuminance sensor 17 has an ultraviolet detection surface 22 on its surface, and is capable of rotating 180 ° inverting between the side plates 23a and 23b with the pin 24 as a fulcrum.

In the present embodiment, the height position of the center of rotation of the pin 24 is made to coincide with the height position of the ultraviolet ray detection surface 22 in the upward state, and is also made coincident with the height position of the upper surface of the waveguide chip element 3. Therefore, even when the ultraviolet illuminance sensor 17 is inverted and the ultraviolet detection surface 22 faces downward, the height of the ultraviolet detection surface 22 matches the upper surface of the waveguide chip element 3.

By setting the position of the center of rotation of the pin 24 on the lower side, the ultraviolet detecting surface 22 is aligned with the upper surface of the waveguide chip element 3 in the upward state, and the lower surface of the waveguide chip element 3 in the downward state. It is also possible to make the height position of the ultraviolet ray detection surface in the upward direction and the downward direction to a desired position by the position of the pin 24.

The side plates 23a and 23b are connected to a mounting frame 25, and the ultraviolet illuminance sensor 17 is mounted on the sensor stage 26 by the mounting frame 25. The sensor stage 26 can be freely moved in three axial directions of X, Y and Z, and this movement is performed by a control device.

The upper and lower surfaces of the space surrounded by the side plates 23a, 23b and the mounting frame 25 are open, and in the state shown in FIG. The light enters the ultraviolet detection surface 22 of the illuminance sensor 17 and the ultraviolet illuminance is detected. Also, by inverting the ultraviolet illuminance sensor 17 by 180 ° with the pin 24 as a fulcrum, the ultraviolet detection surface 22 is directed downward, and ultraviolet light emitted from the lower surface side ultraviolet irradiation unit 16 is incident on the ultraviolet detection surface 22,
Ultraviolet illuminance is detected.

FIG. 3 shows a configuration for adjusting the illuminance of the ultraviolet rays of the upper surface ultraviolet irradiation 15 and the lower surface ultraviolet irradiation unit 16. In the figure, the illuminance adjustment means 27 is given in advance the values of the reference illuminance of the ultraviolet light of the upper-surface-side ultraviolet irradiator 15 and the value of the ultraviolet-ray reference irradiation of the lower-surface-side ultraviolet irradiator 16. The reference irradiation illuminance is determined in advance by an experiment or the like to determine the optimum irradiation irradiance of ultraviolet light for curing the ultraviolet-curable adhesive, and the irradiation irradiance is given to the illuminance adjusting means 27 as the value of the reference irradiation irradiance. . In this embodiment, the arm driving mechanisms 20 and 21 are configured so as to be able to move up and down, and the illuminance adjusting means 27 includes an upper-surface-side ultraviolet irradiation unit.
The arm drive mechanism 20 is controlled such that the detection signal of the ultraviolet irradiation illuminance of 15 is received from the ultraviolet illuminance sensor 17, and the illuminance detected by the ultraviolet illuminance sensor 17 becomes the reference irradiation illuminance of the upper-surface-side ultraviolet irradiating unit, The upper-surface-side ultraviolet irradiator 15 is controlled to move in the vertical direction via the arm 18 and the height position of the upper-surface-side ultraviolet irradiator is adjusted so that the detected illuminance matches the reference irradiation illuminance.

Similarly, the illuminance adjusting means 27 takes in the detection signal of the irradiation illuminance of the lower ultraviolet irradiation unit 16 from the ultraviolet illuminance sensor 17 and sets the arm so that the detected illuminance matches the reference irradiation illuminance of the lower ultraviolet irradiation unit. The movement of the lower-surface-side ultraviolet irradiator 16 in the vertical direction is controlled via the drive mechanism 21, and the ultraviolet-irradiation illuminance of the lower-surface-side ultraviolet irradiator 16 is adjusted to the reference irradiation illuminance.

In this embodiment, the ultraviolet detecting surface 22 of the ultraviolet illuminance sensor 17 when the sensor 17 is facing upward is positioned at the height of the waveguide chip element 3 set on the fixed stage 1 (in this embodiment, the waveguide chip element). 3), the detected illuminance of the ultraviolet rays of the ultraviolet irradiation units 15 and 16 becomes equal to the illuminance of the connection portion between the waveguide chip element 3 and the optical fiber array 4. By the illuminance adjustment of the illuminance adjustment means 27, the ultraviolet curable adhesive applied to the connection portions on the upper surface side and the lower surface side of the waveguide chip element 3 and the optical fiber array 4 are both provided with the upper surface side ultraviolet irradiation portion. The lower surface side ultraviolet irradiating section 16 irradiates ultraviolet rays with the reference irradiation illuminance, and the adhesive connection between the waveguide chip element 3 and the optical fiber array 4 is achieved.

Adjustment of the irradiation illuminance of the upper-side ultraviolet irradiation section 15 and the lower-side ultraviolet irradiation section 16 is performed by adjusting the upper-side ultraviolet irradiation section 15.
And the lower surface side ultraviolet irradiation unit 16 is horizontally moved from the optical component connection position A to the illuminance adjustment position B and is performed at a position vertically opposed to the ultraviolet illuminance sensor 17, and the waveguide chip element 3 and the optical fiber array 4 After centering, the upper-side ultraviolet irradiation unit 15 and the lower-side ultraviolet irradiation unit 16 move horizontally from the illuminance adjustment position B to the optical component connection position A, and at this optical component connection position A, the upper-surface ultraviolet irradiation unit 15 and the lower-side ultraviolet light Ultraviolet rays are radiated from the irradiating section 16 to the ultraviolet-curable adhesive applied to the connection site, respectively, and the ultraviolet-curing of the adhesive is suitably performed, thereby achieving the centering connection of the optical component.

According to this embodiment, both the upper and lower surfaces of the connection portion between the waveguide chip element 3 and the optical fiber array 4 are irradiated with ultraviolet rays simultaneously from the upper and lower ultraviolet irradiation portions 15 and 16. Therefore, the ultraviolet curable adhesive can be efficiently cured in a short time without unevenness in curing, and the workability of curing the adhesive can be improved.

Further, the ultraviolet curing adhesive is irradiated with the ultraviolet irradiance irradiated from the upper surface side and the ultraviolet irradiance irradiated from the lower surface side adjusted to the optimum reference irradiation illuminance. Accordingly, problems such as insufficient or excessive UV irradiation illuminance are eliminated, and highly reliable bonding of optical components having high bonding strength and excellent bonding quality can be performed.

Further, in the case of adjusting the irradiation illuminance of the upper-surface-side ultraviolet irradiation section 15 and the lower-surface-side ultraviolet irradiation section 16, in this embodiment, since the ultraviolet irradiance sensor 17 is provided so as to be reversible, one ultraviolet irradiance sensor is provided. The sensor 17 makes it possible to measure both the irradiation illuminance of the upper-side ultraviolet irradiation unit 15 and the irradiation illuminance of the lower-side ultraviolet irradiation unit 16.
Since the illuminance of the ultraviolet irradiators 15 and 16 on both the upper and lower sides can be detected by the 17, the ultraviolet illuminance of the ultraviolet illuminance sensor 17 can be compared with the case where the ultraviolet illuminance of each ultraviolet irradiator 15 and 16 is detected using a separate ultraviolet illuminance sensor. The number of parts can be reduced, the configuration of the device can be simplified, the size of the device can be reduced, and the cost of the device can be reduced.

The present invention is not limited to the above-described embodiment, but can adopt various embodiments. For example,
In the above embodiment, the adjustment of the UV irradiation illuminance of the upper surface side UV irradiator 15 and the lower surface side UV irradiator 16 is performed by illuminance adjustment means.
The arm driving mechanisms 20 and 21 are controlled by 27 to irradiate the ultraviolet light irradiating section 15 to the ultraviolet detecting surface 22 (waveguide chip element 3).
The height position of the upper surface 16 and the lower surface ultraviolet irradiation unit 16 are controlled by controlling the driving power of the upper surface ultraviolet irradiation unit 15 and the lower surface ultraviolet irradiation unit 16. ,
The 16 UV illuminances may be adjusted.

In this case, the driving power (driving voltage) of the ultraviolet irradiation units 15 and 16 is variably controlled by the illuminance adjusting means 27, as shown by the broken arrow in FIG. That is, the illuminance adjustment means 27 takes in the detected illuminance of the upper-side ultraviolet irradiator 15 from the ultraviolet irradiance sensor 17 and drives the upper-side ultraviolet irradiator 15 so that the detected illuminance matches the predetermined reference irradiance. A (drive voltage) control signal is applied to the power driver 28. Thereby, the power of the upper surface side ultraviolet irradiation unit 15 is changed by the power drive unit 28,
The driving power of the upper-surface-side ultraviolet irradiation unit 15 is adjusted to a driving power at which the detected illuminance matches the reference irradiation illuminance. Similarly, the illuminance adjusting means 27 takes in the detected illuminance of the lower-surface-side ultraviolet irradiating unit 16 from the ultraviolet-light illuminance sensor 17 so that the ultraviolet-irradiation irradiance of the lower-surface-side ultraviolet irradiating unit 16 matches the predetermined reference irradiance. The driving power of the lower-surface-side ultraviolet irradiator 16 is adjusted so that the ultraviolet-curable adhesive applied to the connection portion between the waveguide chip element 3 and the optical fiber array 4 is removed from the upper-surface-side ultraviolet irradiator 15 and the lower surface. Irradiation is performed with ultraviolet rays of the reference illuminance from the ultraviolet irradiating sections 16, respectively, and, similarly to the above-described embodiment, connection of optical components with high work efficiency, high connection strength, and excellent connection quality is achieved.

Further, reference irradiation illuminance data of the upper-side ultraviolet irradiation section 15 and the lower-side ultraviolet irradiation section 16 are given in advance, the ultraviolet irradiation section is provided with a condensing lens, and is detected by an ultraviolet illuminance sensor. The illuminance adjusting means may be configured to adjust the focus of the lens so that the illuminance of the ultraviolet irradiation becomes the reference illuminance.

In the above embodiment, the connection between the waveguide chip element 3 and the optical components of the optical fiber array 4 has been described as an example. However, the connection between the optical fiber arrays 4 and the connection between the waveguide chip elements 3 are described. The present invention is applied as a UV irradiation bonding apparatus for connecting various optical components, such as a connection between a light emitting element and a waveguide chip element and a connection between a light emitting element and an optical fiber array.

Further, it goes without saying that the optical component is not necessarily a multi-core type and may be a single-core type.

Further, the upper ultraviolet ray irradiation section 15 and the lower ultraviolet ray irradiation section 16 are configured to move horizontally between the optical component connection position A and the illuminance adjustment position B in the horizontal direction. It may be configured to rotate (rotate) between the illuminance adjustment position B and the horizontal plane. However, when the ultraviolet irradiation units 15 and 16 are rotated, the size of the apparatus is easily increased. Therefore, it is desirable that the ultraviolet irradiation units 15 and 16 on the upper surface and the lower surface advance and retreat as in the present embodiment. It is preferable to adopt a configuration that moves.

Further, in the embodiment, the ultraviolet illuminance sensor can be freely rotated by 180 ° inversion, but it can be freely rotated by 360 °, and the posture may be maintained at a position where the detection surface is directed upward and downward. .

[0044]

According to the present invention, since the ultraviolet light is applied to both the upper surface and the lower surface of the connection part of the optical component, the curing speed of the ultraviolet curable adhesive applied to the connection part of the optical component is increased. In addition, it is possible to increase the efficiency of the work of bonding optical components.

Further, according to the present invention, the irradiation illuminance of the upper-side ultraviolet irradiating section irradiating the upper side of the connection portion of the optical component and the lower-side ultraviolet irradiating section irradiating the lower side are adjusted to the optimum reference irradiation illuminance by the illuminance adjusting means. Because it is configured to adjust, it is possible to irradiate the ultraviolet ray of the optimal illuminance to the ultraviolet curable adhesive bonding the optical component from both the upper side and the lower side, and thereby the curing speed of the adhesive due to insufficient illuminance The problem that the efficiency of the bonding work is reduced due to slowing down, the UV illuminance becomes excessive, the heat is kept in the optical components, and the quality of the optical components is reduced is eliminated, the bonding strength is high, and the connection performance of the optical components is high. It is possible to bond high quality and highly reliable optical components.

Further, in the present invention, the ultraviolet illuminance sensor for detecting the ultraviolet illuminance irradiated from the ultraviolet irradiator is configured to be reversible. The UV illuminance is detected, and the UV detection surface is directed downward, so that the illuminance of the lower UV irradiating section is detected. Thus, the illuminance of both the upper and lower UV irradiating sections is detected by one UV illuminance sensor. Therefore, the number of UV illuminance sensors can be reduced and the configuration of the device can be simplified as compared with the case where UV illuminance sensors for detecting the illuminance of the upper UV irradiator and the lower UV irradiator are separately provided. Accordingly, the size of the device can be reduced, and the cost of the device can be reduced.

[Brief description of the drawings]

FIG. 1 is a configuration explanatory view of a UV irradiation bonding apparatus according to an embodiment of the present invention.

FIG. 2 is an explanatory diagram of an optical component centering device in which the UV irradiation bonding device of the embodiment is incorporated.

FIG. 3 is a block configuration diagram of a unit for adjusting ultraviolet illuminance in the embodiment.

[Explanation of symbols]

 15 Upper-side UV irradiator 16 Lower-side UV irradiator 17 UV illuminance sensor 22 UV detection surface 26 Sensor stage 27 Illuminance adjusting means 28 UV irradiator power driver

Claims (4)

[Claims] 1. An optical component UV irradiation bonding apparatus for connecting and fixing an optical component by irradiating an ultraviolet ray to an ultraviolet curing adhesive applied to a connection portion of the optical component in an aligned state of the optical component to be connected. An upper-surface-side ultraviolet irradiator that irradiates ultraviolet rays from the upper side of the connection part of the optical component, a lower-side ultraviolet irradiator that irradiates ultraviolet light from the lower side of the connection part of the optical component, An ultraviolet light illuminance sensor arranged at a position separated in the direction so that the ultraviolet ray detection surface is substantially at the same height as the optical component, and the upper surface side ultraviolet irradiator is configured to irradiate the upper surface side ultraviolet light irradiating position to the optical component and the ultraviolet irradiance. The horizontal movement between the upper facing position of the sensor is freely provided, and the lower surface ultraviolet irradiation unit is freely provided for the horizontal movement between the lower surface ultraviolet irradiation position on the optical component and the lower facing position of the ultraviolet illuminance sensor. Before The UV illuminance sensor is provided so that the UV detection surface can rotate freely upward and downward, detects the UV irradiation illuminance of the upper UV irradiation unit at the upward rotation position of the UV detection surface, and at the downward rotation position of the UV detection surface. A UV irradiation bonding device for an optical component configured to detect the UV irradiation illuminance of the UV irradiation section on the lower surface side. 2. The reference irradiation illuminance data of the upper-side ultraviolet irradiation section and the lower-side ultraviolet irradiation section are given in advance, and the upper-side ultraviolet irradiation section and the lower-side ultraviolet irradiation section are freely movable in the vertical direction. The ultraviolet irradiation irradiance detected by the ultraviolet illuminance sensor is moved up and down in the vertical direction with respect to the ultraviolet detection surface of the ultraviolet illuminance sensor so that the corresponding ultraviolet irradiators on the upper surface side and the lower surface side become the reference illumination illuminance. The UV irradiation bonding apparatus for an optical component according to claim 1, further comprising an illuminance adjusting unit for adjusting the illuminance. 3. The reference irradiation illuminance data of the upper-surface-side ultraviolet irradiation unit and the lower-surface-side ultraviolet irradiation unit are given in advance, and the upper-surface-side irradiation unit detects the ultraviolet irradiation illuminance detected by the ultraviolet illuminance sensor so as to be the reference irradiation illuminance. 2. An optical component according to claim 1, further comprising an illuminance adjusting means for adjusting the illuminance by increasing / decreasing a driving power of a corresponding ultraviolet irradiating section on the lower surface side.
V irradiation bonding equipment. 4. The reference irradiation illuminance data of the upper-side ultraviolet irradiation unit and the lower-side ultraviolet irradiation unit is given in advance, and the ultraviolet irradiation unit is provided with a condensing lens and detected by an ultraviolet illuminance sensor. 2. The UV irradiation bonding apparatus for an optical component according to claim 1, further comprising illuminance adjustment means for adjusting the illuminance by adjusting the focus of the lens so that the illuminance of the irradiated ultraviolet light becomes the reference illuminance.