JPH11133890A - Led display device and led display system - Google Patents

Led display device and led display system

Info

Publication number
JPH11133890A
JPH11133890A JP30118897A JP30118897A JPH11133890A JP H11133890 A JPH11133890 A JP H11133890A JP 30118897 A JP30118897 A JP 30118897A JP 30118897 A JP30118897 A JP 30118897A JP H11133890 A JPH11133890 A JP H11133890A
Authority
JP
Japan
Prior art keywords
louver
light
led display
light emitting
shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP30118897A
Other languages
Japanese (ja)
Other versions
JP3287457B2 (en
Inventor
Tsuzuku Takahashi
続 高橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Chemical Industries Ltd
Original Assignee
Nichia Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Chemical Industries Ltd filed Critical Nichia Chemical Industries Ltd
Priority to JP30118897A priority Critical patent/JP3287457B2/en
Publication of JPH11133890A publication Critical patent/JPH11133890A/en
Application granted granted Critical
Publication of JP3287457B2 publication Critical patent/JP3287457B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3025Electromagnetic shielding

Abstract

PROBLEM TO BE SOLVED: To improve a contrast ratio by forming a sectional shape of a louver to a curved surface shape in its upper side tip part and adding minute ruggedness to the surface of the curved surface shape. SOLUTION: The section of the louver 311 is formed into the nearly curved surface shape in the upper side tip part of the louver 311 so as to enlarge an radiation angle of light emitted from an LED arranged upward it. Thus, a surface area viewed from a viewer side is increased, and a reflection surface of external light is formed large. Particularly, on the upper side tip part 307 of the louver 311, reflection light is observed remarkably since the reflection light of the external light directly turns toward the viewer side. Furnher, by making the upper side tip part 317 of the louver 321 section have the curved surface shape having the ruggedness, an adverse effect due to the reflection surface is reduced. Although the surface of the curved surface shape having the ruggedness forms the reflection surface, it diffusedly reflects the external light by the minute ruggedness, and the reflection light directly turning toward the viewer is reduced.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、複数の発光ダイオード
が配置されると共に各発光ダイオードに照射される太陽
光などの影響を少なくするルーバーを持ったLED表示
器に係わり、特に視野角を多くしつつ外来光の影響を少
なくしたコントラストの高いLED表示器に係わる。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LED display having a plurality of light emitting diodes arranged therein and having a louver for reducing the influence of sunlight or the like radiated to each light emitting diode, and particularly to an LED display having a wide viewing angle. The present invention relates to a high-contrast LED display in which the influence of extraneous light is reduced while reducing the influence of external light.

【0002】[0002]

【従来技術】今日、1000mcd以上にも及ぶ超高輝
度にRGB(赤、緑、青)が発光可能な発光ダイオード
(以下、LEDとも呼ぶ。)がそれぞれ開発された。こ
れにより、低消費電力、長寿命のLEDを利用したフル
カラーLEDディスプレイが可能となった。このような
LED表示装置は、高輝度に発光することができる。
2. Description of the Related Art Light emitting diodes (hereinafter, also referred to as LEDs) capable of emitting RGB (red, green, blue) light with an ultra-high brightness of over 1000 mcd have been developed. As a result, a full-color LED display using LEDs with low power consumption and long life has become possible. Such an LED display device can emit light with high luminance.

【0003】そのため屋外や駅のプラットホームに挙げ
られる半屋外など比較的外来光の強い場所においても高
輝度に使用できるLEDディスプレイとして注目を浴び
ている。
[0003] For this reason, attention has been paid to an LED display that can be used with high brightness even in a place where external light is relatively strong, such as outdoors or semi-outdoors, which are listed as platforms on train stations.

【0004】図4にLED表示装置の模式的正面図を示
す。具体的にはRGBが発光可能な各発光ダイオード4
02を1画素として16×16のドットマトリクス状に
配置させてある。ダイナミック駆動の場合、映像データ
に基づいてLED表示装置の駆動手段406であるコモ
ンドライバやセグメントドライバを駆動させ所望のLE
Dを点灯させることにより所望の画像などを表示させる
ことができる。各画素ごとの段には太陽光などの外来光
が直接LEDに照射されることを低減するルーバー40
1が配置されている。このようなLED表示装置全体と
して、コントラストの向上したLED表示装置とするこ
とができる。LED表示器に設けられたルーバー401
は、太陽光など一定の角度からの入射光を遮光する目的
のため所望の角度、長さ幅や厚みを選択して決められ
る。
FIG. 4 is a schematic front view of an LED display device. Specifically, each light emitting diode 4 capable of emitting RGB light
02 is arranged as a pixel in a 16 × 16 dot matrix. In the case of dynamic driving, a common driver or a segment driver, which is a driving unit 406 of the LED display device, is driven based on video data, and a desired LE is driven.
By turning on D, a desired image or the like can be displayed. A louver 40 is provided on the stage for each pixel to reduce external light such as sunlight from being directly applied to the LED.
1 is arranged. Such an LED display device as a whole can be an LED display device with improved contrast. Louver 401 provided on LED display
Is determined by selecting a desired angle, length, width and thickness for the purpose of shielding incident light from a certain angle such as sunlight.

【0005】他方、LED表示装置はビルボードなどの
視認者よりも高い位置に設置されることが多い。さらに
ルーバー401は樹脂や金属により形成されるものの一
定の強度を持たす必要がある。そのため遮光部材である
ルーバー401は、一定の長さ及び厚みを必要とする。
On the other hand, an LED display device is often installed at a position higher than a viewer such as a billboard. Further, the louver 401 is formed of resin or metal, but needs to have a certain strength. Therefore, the louver 401 as a light shielding member needs a certain length and thickness.

【0006】[0006]

【発明が解決しようとする課題】しかしながら、ルーバ
ー301の長さが長く、且つ厚みが厚くなると図3
(A)の如きLED表示器の正面よりも下側にいる視認
者(図中、視認者の目の位置を表示)にとってはLED
302(発光ダイオードの一部分を表示)の発光がルー
バー301の陰となる。そのため視認者が視認できる範
囲が狭くなることがある。特に、ビルボードなど比較的
LED表示器の設置位置が高いと少しの仰角角の差が視
認できる範囲に大きく影響する。また、RGBを発光す
るLEDが近接して配置させ混色発光を利用する場合、
ルーバー301により部分的に画素を構成するLED3
02が隠れることにより所望通りの発光色を得ることが
できないという問題を生ずる。
However, if the length of the louver 301 is long and the louver 301 is thick, the louver 301 shown in FIG.
For a viewer below the front of the LED display (A) (the position of the viewer's eyes is shown in the figure), the LED is used.
The light emission of 302 (displaying a part of the light emitting diode) is shaded by the louver 301. Therefore, the range that can be visually recognized by a viewer may be narrowed. In particular, if the installation position of the LED display such as a billboard is relatively high, a slight difference in elevation angle greatly affects the visible range. In addition, when LEDs that emit RGB light are arranged close to each other to use mixed color light emission,
LED3 partially constituting a pixel by louver 301
Occlusion of 02 causes a problem that a desired emission color cannot be obtained.

【0007】特に、RGBを発光するLEDを別々の発
光ダイオードの混色により発光させる場合は、互いの発
光ダイオードの距離が離れる。視認者からは混色して一
画素として観測されるもののルーバーと近接配置された
各LED間にとっては大きな距離を生じる。したがっ
て、視認者の位置で混色性がより大きく崩れることとな
る。
In particular, when LEDs emitting RGB light are emitted by mixing colors of different light emitting diodes, the distance between the light emitting diodes is increased. Although a mixed color is observed as one pixel by a viewer, a large distance is generated between the louver and each of the LEDs arranged in close proximity. Therefore, the color mixing will be more greatly destroyed at the position of the viewer.

【0008】これらの場合、図3(B)の如きルーバー
311の断面形状がルーバーの上側先端部307を曲面
形状に形成することによりLED312(発光ダイオー
ドの一部分を表示)の発光がルーバー311によって陰
になることを低減し、視認範囲を広げることができる。
しかしながら、このような構成としたLED表示装置は
コントラスト比が大幅に低下する。したがって、本発明
者は上記問題点を解決したLED表示装置を提供するこ
とを目的とする。
In these cases, the cross-sectional shape of the louver 311 as shown in FIG. 3 (B) is such that the upper end 307 of the louver is formed in a curved shape, so that the light emission of the LED 312 (part of the light emitting diode is displayed) is shaded by the louver 311. , And the viewing range can be widened.
However, the LED display device having such a configuration significantly reduces the contrast ratio. Therefore, an object of the present invention is to provide an LED display device which solves the above-mentioned problems.

【0009】[0009]

【課題を解決するための手段】本発明は、複数の発光ダ
イオードを配置させると共に発光ダイオード間にルーバ
ーを配置させたLED表示装置である。特に、そのルー
バーの断面形状がルーバーの上側先端部を曲面形状に形
成すると共にその曲面形状の表面が微細な凹凸を有する
LED表示装置である。
The present invention is an LED display device in which a plurality of light emitting diodes are arranged and a louver is arranged between the light emitting diodes. In particular, this is an LED display device in which the cross-sectional shape of the louver forms the upper end portion of the louver into a curved shape and the surface of the curved shape has fine irregularities.

【0010】本発明の請求項2に記載のLED表示装置
は、複数の発光ダイオードを配置させると共に発光ダイ
オード間にルーバーを配置させたLED表示器と、該L
ED表示器を駆動させる駆動手段とを有する。特に、ル
ーバーの上側先端部をそれよりも上方に配置されるLE
Dが放出される光の放射角を大きくする曲面形状である
と共に曲面形状が乱反射させ視認者に直接向かう反射光
を少なくする凹凸を有する。
According to a second aspect of the present invention, there is provided an LED display device having a plurality of light emitting diodes arranged and a louver arranged between the light emitting diodes;
Driving means for driving the ED display. In particular, the upper end of the louver is placed above the LE.
D has a curved surface shape that increases the emission angle of the emitted light, and the curved surface shape has irregularities that irregularly reflect and reduce reflected light that goes directly to the viewer.

【0011】[0011]

【発明の実施の形態】本発明者は、種々の実験の結果、
LED表示装置に利用される遮光部材となるルーバーを
特定形状とすることによりLEDから放出される光の放
射角を増やすことができると共にLED表示装置のコン
トラスト比が大幅に向上することを見いだし本発明を成
すに到った。
BEST MODE FOR CARRYING OUT THE INVENTION The inventor of the present invention
The present invention has been found to be able to increase the emission angle of light emitted from the LED and significantly improve the contrast ratio of the LED display device by making the louver serving as a light shielding member used in the LED display device a specific shape. It came to accomplish.

【0012】即ち、ルーバーの上側先端部をそれよりも
上方に配置されるLEDが放出される光の放射角を大き
くするようにルーバーの断面を略曲面形状に形成する。
ルーバー自体はもともと外来光によりLEDが直接晒さ
れないよう突き出して設けられている。そのためルーバ
ー上側先端部の断面形状が図3(B)のような特定形状
とすると、図3(A)に対して図3(B)の如く視認者
側(図中、視認者の目の位置を表示)から見た表面積が
増えると共に外来光の反射面が大きく形成されることと
なる。特に、ルーバーの上側先端部307は外来光が視
認者側に直接反射した光が向かうため反射光が顕著に観
測される。また、ルーバーの上側先端部の断面を曲面形
状としたことにより、反射面が広がり太陽角の変化に伴
わず常に反射面が形成される。
That is, the cross section of the louver is formed in a substantially curved shape so that the emission angle of the light emitted from the LED disposed above the upper end of the louver is increased.
The louver itself is originally provided so as to protrude so that the LED is not directly exposed to extraneous light. For this reason, if the cross-sectional shape of the upper end portion of the louver is a specific shape as shown in FIG. 3B, the viewer side (the eye position of the viewer in FIG. 3B) as shown in FIG. ), The surface area for reflection of extraneous light is increased. Particularly, at the upper end portion 307 of the louver, the reflected light is remarkably observed because the external light is reflected directly to the viewer side. In addition, since the cross section of the upper end portion of the louver has a curved surface shape, the reflection surface is widened and the reflection surface is always formed regardless of a change in the sun angle.

【0013】本発明は図3(C)の如くルーバー321
断面の上側先端部317が凹凸を有する曲面形状とする
ことより反射面による弊害を低減したものである。凹凸
を有する曲面形状の表面は、反射面を形成するものの微
細な凹凸により乱反射させ視認者に直接向かう反射光を
少なくする。これによりルーバー321による視野角低
下を防ぎつつコントラスト比の向上を図ることができる
ものである。
The present invention employs a louver 321 as shown in FIG.
By forming the upper end portion 317 of the cross section into a curved shape having irregularities, the adverse effects of the reflection surface are reduced. The curved surface having irregularities forms a reflecting surface, but irregularly reflects due to minute irregularities and reduces reflected light directed toward the viewer. Thereby, the contrast ratio can be improved while preventing the louver 321 from lowering the viewing angle.

【0014】本発明のLED表示装置の一例を図1及び
図2に示す。図1及び図2には、RGB(赤色102、
緑色112、青色122)がそれぞれ発光可能なLED
を青色1個、緑色2個、赤色2個使用し基板上に1画素
として16×16のドットマトリックス状に配置させた
1部である。各画素の行間には太陽光の直接入射が少な
くなるようにアルミニウム合金製のルーバー101をL
ED表示面の垂線に対して6゜傾けて配置させてある。
発光ダイオード202、内部回路が配置された基板20
4、206などを外部から保護するためきょう体203
内を部分的に充填剤205で被覆させてある。これによ
りLED表示装置を構成させてある。
FIGS. 1 and 2 show an example of the LED display device of the present invention. FIGS. 1 and 2 show RGB (red 102,
LED that can emit green 112 and blue 122) respectively
Is a part in which one blue pixel, two green pixels and two red pixels are used and arranged as a pixel in a 16 × 16 dot matrix on the substrate. A louver 101 made of aluminum alloy is placed between rows of each pixel so that direct incidence of sunlight is reduced.
It is arranged at an angle of 6 ° with respect to the perpendicular to the ED display surface.
Light emitting diode 202, substrate 20 on which internal circuits are arranged
Case 203 for protecting 4, 206 etc. from the outside
The inside is partially covered with a filler 205. This constitutes an LED display device.

【0015】本発明のルーバー201の先端は、特に下
から見た視認者に対して各絵素が隠れることが少なく視
認角が稼げるように薄く、且つ断面が上側に凸形状の半
円状に形成させてある。また、ルーバー201はアルミ
ニウム合金によりなり、ルーバー201に微少な酸化珪
素粒子を含有させた艶消し剤入り黒色塗料を塗布するこ
とによりルーバー201表面に凹凸を形成してある。形
成されたLED表示装置は、視認者からの視認角度が増
えるばかりでなくLED表示装置全体のコントラスト比
も向上することができる。以下、本発明の構成について
詳述する。
The tip of the louver 201 of the present invention is thin so that each picture element is less concealed particularly to a viewer viewed from below and a viewing angle can be obtained, and the cross section is formed in a semicircular shape having an upwardly convex shape. It has been formed. Further, the louver 201 is made of an aluminum alloy, and irregularities are formed on the surface of the louver 201 by applying a matting agent-containing black paint containing fine silicon oxide particles to the louver 201. The formed LED display device can not only increase the viewing angle from the viewer, but also improve the contrast ratio of the entire LED display device. Hereinafter, the configuration of the present invention will be described in detail.

【0016】(ルーバー101、201、321)本発
明に用いられるルーバー101、201、321は、太
陽光など外来光が直接発光ダイオードに照射されるのを
抑制させるものであり、種々の材料、形状やLED表示
面に所望の角度で取り付けられる。
(Lovers 101, 201, 321) The louvers 101, 201, 321 used in the present invention are for suppressing external light such as sunlight from being directly radiated to the light emitting diode, and are made of various materials and shapes. Or on the LED display surface at a desired angle.

【0017】本発明に利用されるルーバー321の上側
先端部317は、外部に突きだしたルーバー321先端
の主として外来光が照射される光を直接発光ダイオード
322に照射されないようにする部位である。特に、本
発明においてはその上側先端部317により、そのルー
バー321よりも上方に配置された発光ダイオード32
2が発光する光を遮光し難く放射角が多くなる(即ち、
仰角が小さくなる)曲面形状である。
The upper end portion 317 of the louver 321 used in the present invention is a portion of the louver 321 projecting to the outside so as not to directly irradiate the light mainly irradiated with the external light to the light emitting diode 322. In particular, in the present invention, the light emitting diode 32 arranged above the louver 321 by its upper end 317.
2 is difficult to block the light emitted, and the radiation angle increases (ie,
(Elevation angle becomes smaller).

【0018】本発明のルーバー321の上側先端部31
7に設けられた曲面形状とは、LED表示器を横から見
た場合において、ルーバーの断面がルーバー先端の少な
くとも外来光が入射される上側に形成された凸曲面をい
う。具体的には、半円形状や楕円形状、放物線状など種
々の曲面形状が形成されたものが挙げられる。曲面形状
とすることによりルーバー321の上側先端部317の
強度を高めつつ視野角を増やすことができる。
The upper end portion 31 of the louver 321 of the present invention
The curved surface shape provided in 7 refers to a convex curved surface formed at the top of the louver tip where at least external light is incident when the LED display is viewed from the side. More specifically, those having various curved surface shapes such as a semicircular shape, an elliptical shape, and a parabolic shape are exemplified. With the curved shape, the viewing angle can be increased while increasing the strength of the upper end portion 317 of the louver 321.

【0019】また、本発明に用いられるルーバー321
上側先端部断面の曲面形状に形成される微細な凹凸と
は、外来光からの視認者側に直接光が反射することによ
り生ずるコントラスト比の低下を防ぐことができるもの
であれば良い。したがって、ルーバー321自体に凹凸
を設けても良いし、ルーバー321の上側先端部317
に設けられた凸曲面上に微細な凹凸が形成される塗装膜
などを塗布などさせて構成しても良い。このような微細
な凹凸は、JIS B0601により、粗さ曲線のカッ
トオフ値(λc)0.8mm、粗さ曲線の基準長さ2.
40mmの条件で算術平均粗さ(Ra)が1〜50μm
の範囲が好ましく、より好ましくは2〜10μの範囲で
ある。また、十点平均粗さ(Rz)が5〜100μmの
範囲が好ましく、より好ましくは10〜50μmの範囲
である。このような凹凸を持った曲面は、凹凸処理を施
していない平滑面とは光の散乱の点で明らかに異なる。
The louver 321 used in the present invention
The fine unevenness formed in the curved shape of the cross section of the upper end portion may be any as long as it can prevent a decrease in the contrast ratio caused by the direct reflection of extraneous light toward the viewer side. Therefore, the louver 321 itself may be provided with irregularities, or the upper end 317 of the louver 321 may be provided.
May be formed by applying a coating film or the like in which fine irregularities are formed on the convex curved surface provided on the substrate. According to JIS B0601, such fine unevenness has a roughness curve cutoff value (λc) of 0.8 mm and a reference length of the roughness curve of 2.
Arithmetic average roughness (Ra) is 1 to 50 μm under the condition of 40 mm
Is more preferable, and more preferably, 2 to 10 μm. The ten-point average roughness (Rz) is preferably in the range of 5 to 100 μm, and more preferably in the range of 10 to 50 μm. A curved surface having such unevenness is clearly different from a smooth surface not subjected to the unevenness treatment in light scattering.

【0020】太陽光などからの光は、LED表示装置の
上側から照射される太陽角を持つ。そのためLED表示
面に対するルーバー101、201、321の取り付け
にある程度の角度がついていることが望ましい。この角
度は、使用場所や使用時間を考慮して所望に調節するこ
とでルーバー101、201、321により発光ダイオ
ードが直接太陽に照射される割合が変わる。
Light from sunlight or the like has a sun angle irradiated from above the LED display device. Therefore, it is desirable that the louvers 101, 201, and 321 are attached to the LED display surface at a certain angle. By adjusting the angle as desired in consideration of the place of use and the time of use, the rate at which the light emitting diodes are directly radiated to the sun by the louvers 101, 201, and 321 changes.

【0021】ルーバー101、201、321の具体的
材料としてはポリカーボネート樹脂、ABS樹脂、エポ
キシ樹脂やフェノール樹脂などやアルミニウム、銅の単
体及びそれら金属中にMg、Si、Fe、Cu、Mn、
Cr、Zn、Ni、Ti、Pb、Snなど他の金属を所
望量含有させた合金が好適に挙げられる。
Specific materials of the louvers 101, 201, 321 include polycarbonate resin, ABS resin, epoxy resin, phenol resin, etc., aluminum and copper alone, and Mg, Si, Fe, Cu, Mn,
An alloy containing a desired amount of another metal such as Cr, Zn, Ni, Ti, Pb, or Sn is preferably used.

【0022】特に、ガラス繊維入りポリカーボネート
は、強度が強く耐熱性や耐候性のあるルーバー101、
201、321を比較的簡単に形成することができる。
また、着色剤を含有させることによりルーバー101、
201、321自体を黒色など暗色系に着色することが
できる。一方、ルーバー101、201、321の強度
をより向上させるためにガラス繊維が10%以上にもお
よぶ大量に含有させることがある。ガラス繊維を大量に
含有された樹脂により形成させたルーバー101、20
1、321は、ルーバーの表面にガラス繊維が見えるこ
とがある。そのため、太陽光などの外光によりガラス繊
維を含むルーバーの上側先端部307で反射する割合が
増える。この場合、ルーバー311に着色剤を含有させ
ていたとしてもコントラスト比が低下することがある。
したがって、樹脂中にガラス繊維を含有させた樹脂を本
発明のルーバー321として利用したときにはコントラ
スト比の低下をより顕著に抑制することができる。
Particularly, polycarbonate containing glass fiber is a louver 101 having high strength, heat resistance and weather resistance.
201 and 321 can be formed relatively easily.
Further, by containing a coloring agent, the louver 101,
201 and 321 themselves can be colored in a dark color such as black. On the other hand, in order to further improve the strength of the louvers 101, 201, and 321, glass fibers may be contained in a large amount of 10% or more. Louvers 101 and 20 formed of resin containing a large amount of glass fiber
In Nos. 1 and 321, glass fibers may be visible on the surface of the louver. For this reason, the ratio of reflection at the upper end 307 of the louver containing glass fiber by external light such as sunlight increases. In this case, even if the louver 311 contains a coloring agent, the contrast ratio may be reduced.
Therefore, when a resin in which glass fibers are contained in the resin is used as the louver 321 of the present invention, a decrease in the contrast ratio can be suppressed more remarkably.

【0023】同様に金属材料をルーバー101、20
1、321として用いた場合においても金属表面により
反射される光を黒色塗料で被覆してコントラスト比を改
善することができる。しかしながら、比較的平滑な金属
表面では塗布された塗料面自体が暗色系であったとして
も全反射されコントラスト比が低下する場合がある。そ
のため、金属により形成されたルーバー101、20
1、321の上側先端部の表面自体、或いはルーバー1
01、201、321の上側先端部に微少な粒子などを
含有させた艶消し剤入りの着色剤を塗布することにより
コントラスト比の低下をより顕著に抑制することができ
る。
Similarly, the louvers 101, 20
Even when used as 1, 321, the light reflected by the metal surface can be covered with black paint to improve the contrast ratio. However, on a relatively smooth metal surface, even if the applied paint surface itself is a dark color system, it may be totally reflected and the contrast ratio may be reduced. Therefore, the louvers 101 and 20 formed of metal are used.
1, 321 the upper end surface itself or louver 1
By applying a matting agent-containing coloring agent containing fine particles or the like to the upper end portions of 01, 201, and 321, a decrease in the contrast ratio can be more remarkably suppressed.

【0024】また、ルーバー101、201、321は
視認距離に合わせてその角度を変更できるようきょう体
103、203と角度が可変とすることができる構成と
することが好ましい。この場合視認角度や距離によって
所望に選択できる。このような角度として好ましくは、
表示面の垂直線から下側(視認者側)に0度から10度
の範囲が好ましい。また、ルーバー101、201、3
21だけでなく、LED表示装置全体を接地面と傾斜し
て構成することもできる。なお、ルーバーの上側先端部
の曲面に設けられる凹凸をルーバー全体やきょう体全体
に施すこともできる。
It is preferable that the louvers 101, 201, and 321 have a structure in which the angles of the louvers 101, 201, and 321 can be changed so that the angles can be changed in accordance with the viewing distance. In this case, it can be selected as desired depending on the viewing angle and the distance. Preferably, such an angle is
A range of 0 ° to 10 ° below the vertical line of the display surface (viewer side) is preferable. Also, the louvers 101, 201, 3
Not only 21 but also the entire LED display device can be configured to be inclined with the ground plane. In addition, the unevenness | corrugation provided in the curved surface of the upper end part of a louver can also be given to the whole louver and the whole body.

【0025】(発光ダイオード102、202、32
2)発光ダイオード102、202、322は、種々の
半導体発光素子を樹脂などでモールドしたものが好適に
用いられる。発光ダイオード中に配置されるLEDチッ
プは一種類で単色発光させても良いし複数用いて単色或
いは多色発光させても良い。具体的には、液相成長法、
HDVPE法やMOCVD法により基体上にZnS、S
iC、GaN、GaP、ZnSe、GaAsP、GaA
lAs、InGaN、GaAlN、AlInGaP、A
lInGaN等の半導体を発光層として形成させたもの
が好適に用いられる。半導体の構造としては、MIS接
合、PIN接合やPN接合を有したホモ構造、ヘテロ構
造あるいはダブルへテロ構成のものが挙げられる。半導
体層の材料やその混晶度によって発光波長を紫外光から
赤外光まで種々選択することができる。
(Light emitting diodes 102, 202, 32)
2) For the light emitting diodes 102, 202, and 322, various semiconductor light emitting elements molded with resin or the like are suitably used. One type of LED chip disposed in the light emitting diode may emit a single color, or a plurality of LEDs may emit a single color or multicolor. Specifically, the liquid phase growth method,
ZnS, S on the substrate by HDVPE method or MOCVD method
iC, GaN, GaP, ZnSe, GaAsP, GaAs
lAs, InGaN, GaAlN, AlInGaP, A
A light emitting layer formed of a semiconductor such as lInGaN is preferably used. Examples of the semiconductor structure include a homostructure having a MIS junction, a PIN junction, and a PN junction, a heterostructure, and a double heterostructure. The emission wavelength can be variously selected from ultraviolet light to infrared light depending on the material of the semiconductor layer and the degree of mixed crystal thereof.

【0026】また、所望に応じて量子効果が生ずる薄膜
とした単一量子井戸構造や多重量子井戸構造とすること
もできる。発光ダイオードのモールドは、各LEDチッ
プ等を外部から保護するため好適に設けられる。モール
ド部材の材料としては、エポキシ樹脂、ユリア樹脂など
の耐候性に優れた透明樹脂や酸化珪素、酸化チタンなど
の無機材料が好適に用いられる。
Further, a single quantum well structure or a multiple quantum well structure having a thin film where a quantum effect occurs can be provided as desired. The light emitting diode mold is preferably provided to protect each LED chip and the like from the outside. As a material of the mold member, a transparent resin having excellent weather resistance such as an epoxy resin or a urea resin, or an inorganic material such as silicon oxide or titanium oxide is preferably used.

【0027】また、モールド部材に拡散剤を含有させる
ことによって発光ダイオードからの指向性を緩和させ視
野角を増やすことができる。拡散剤としては、チタン酸
バリウム、酸化チタン、酸化アルミニウム、酸化珪素等
が好適に用いられる。更に、モールド部材を所望の形状
にすることによって発光ダイオードからの発光を集束さ
せたり拡散させたりするレンズ効果を持たせることがで
きる。したがって、モールド部材は複数積層した構造で
もよい。具体的には、凸レンズ形状、凹レンズ形状やそ
れらを複数組み合わせた形状である。さらにモールド部
材に着色顔料や着色染料を含有させ所望外の波長をカッ
トするフィルターの役目をもたすこともできる。
Further, by including a diffusing agent in the mold member, the directivity from the light emitting diode can be reduced and the viewing angle can be increased. As the diffusing agent, barium titanate, titanium oxide, aluminum oxide, silicon oxide and the like are suitably used. Further, by forming the mold member into a desired shape, it is possible to have a lens effect of converging or diffusing light emitted from the light emitting diode. Therefore, a structure in which a plurality of mold members are stacked may be used. Specifically, it is a convex lens shape, a concave lens shape, or a shape obtained by combining a plurality of them. Further, the mold member may contain a coloring pigment or a coloring dye to serve as a filter that cuts out wavelengths not desired.

【0028】野外などでLED表示装置の使用を考慮す
る場合、緑色系及び青色系として窒化ガリウム化合物半
導体を用いることが好ましく、また、赤色系ではガリウ
ム・アルミニウム・砒素系の半導体やアルミニウム・イ
ンジュウム・ガリウム・燐系の半導体を用いることが好
ましい。また、比較的短波長が高効率に発光可能な窒化
物系化合物半導体(AlaInbGa1-a-bN、0≦a、
0≦b、a+b≦1)とその発光波長により励起され発
光する蛍光体(例えばYAG:Ce)とを組み合わせた
発光ダイオードにより構成することもできる。
When the use of the LED display device is considered outdoors, it is preferable to use a gallium nitride compound semiconductor for the green and blue colors, and to use a gallium-aluminum-arsenic-based semiconductor or aluminum-indium-oxide semiconductor for the red color. It is preferable to use a gallium-phosphorus semiconductor. Further, a nitride-based compound semiconductor (Al a In b Ga 1-ab N, 0 ≦ a, capable of emitting light with a relatively short wavelength with high efficiency)
It is also possible to use a light-emitting diode in which 0 ≦ b, a + b ≦ 1) and a phosphor (for example, YAG: Ce) that emits light when excited by its emission wavelength.

【0029】また、所望によって波長の異なるLEDチ
ップをステム上に複数配置させ、それぞれが独立に駆動
可能なようにインナー・リードなどと電気的に接続させ
た多色発光ダイオードとすることもできる。例えば青色
を2個、緑色及び赤色をそれぞれ1個ずつのLEDチッ
プとして構成することができる。なお、カラー表示装置
として発光ダイオードを利用するためには赤色の発光波
長が610nmから700nm、緑色が495nmから
565nm、青色の発光波長が430nmから490n
mの半導体を用いたLEDチップを使用することが好ま
しい。
Further, a multi-color light emitting diode in which a plurality of LED chips having different wavelengths are arranged on the stem as desired, and which are electrically connected to inner leads or the like so that each of them can be driven independently can be used. For example, two blue LED chips and one green and one red LED chip can be configured. In order to use a light emitting diode as a color display device, a red light emission wavelength is 610 nm to 700 nm, a green light emission wavelength is 495 nm to 565 nm, and a blue light emission wavelength is 430 nm to 490 n.
It is preferable to use an LED chip using a semiconductor of m.

【0030】(きょう体103、203)きょう体10
3、203は、基板上204にマトリックス状など所望
の形状に配置したLED202や駆動手段206が配置
された基板などを外部から機械的に保護する物であっ
て、所望の大きさに形成させることができる。きょう体
103、203の材料としては成形のしやすさなどから
ポリカーボネート樹脂、ABS樹脂、エポキシ樹脂、フ
ェノール樹脂等が好ましい。また、きょう体103、2
03の内部表面を凹凸加工させて接着面積を増やした
り、プラズマ処理して充填材との密着性を向上させても
良い。
(Today 103, 203) Today 10
Reference numerals 3 and 203 denote mechanically protecting the LEDs 202 arranged in a desired shape such as a matrix shape on the substrate 204 and the substrate on which the driving means 206 are arranged from the outside, and forming the LED 202 in a desired size. Can be. As a material for the casings 103 and 203, a polycarbonate resin, an ABS resin, an epoxy resin, a phenol resin, or the like is preferable from the viewpoint of ease of molding. In addition, the body 103, 2
The inner surface of No. 03 may be roughened to increase the bonding area, or may be subjected to plasma treatment to improve the adhesion to the filler.

【0031】(基板204)基板204は、発光ダイオ
ード202を所望の配置に固定するために好適に利用す
ることができる。発光ダイオード202を配置する基板
204としては、各発光ダイオード202を所望の形状
に配置し電気的に接続するために用いられるものであ
り、場合によっては駆動手段206が配置された基板と
兼用しても良い。発光ダイオード202の配置は映像用
ディスプレイなどとして使用する場合はマトリックス形
状とすることができる。また、本発明の遮光部材である
ルーバー101、201、321が配置できる限り矢印
信号など所望に応じて発光ダイオード102、202、
321を配置すれば良い。基板は、機械的強度が高く熱
変形の少ないものが好ましい。具体的にはセラミック
ス、ガラス、アルミニウム合金等を用いたプリント基板
が好適に利用できる。発光ダイオードが実装される基板
表面はLED表示面と一致するためコントラスト向上の
ために着色してあることが好ましい。また、充填材との
密着性向上のために凹凸加工させても良い。
(Substrate 204) The substrate 204 can be suitably used for fixing the light emitting diodes 202 in a desired arrangement. The substrate 204 on which the light emitting diodes 202 are arranged is used for arranging the respective light emitting diodes 202 in a desired shape and electrically connecting them. In some cases, the substrate 204 also serves as a substrate on which the driving means 206 is arranged. Is also good. The arrangement of the light emitting diodes 202 can be in a matrix when used as a video display or the like. Also, as long as the louvers 101, 201, and 321 as the light shielding member of the present invention can be arranged, the light emitting diodes 102, 202,
321 may be arranged. The substrate is preferably one having high mechanical strength and low thermal deformation. Specifically, a printed circuit board using ceramics, glass, an aluminum alloy, or the like can be suitably used. Since the surface of the substrate on which the light emitting diodes are mounted coincides with the LED display surface, it is preferable that the surface is colored to improve the contrast. In addition, unevenness may be applied to improve the adhesion to the filler.

【0032】(充填材205)充填材205としては、
発光ダイオード202、きょう体203、発光ダイオー
ドが配置された基板204及び遮光部材201などとの
密着性がよいことが求められる。また、内部回路を保護
するために機械的強度及び耐候性が要求される。このよ
うな充填材205として具体的には、エポキシ樹脂、ウ
レタン樹脂、シリコン樹脂などが挙げられる。また、コ
ントラスト比向上のためにこれらの樹脂中に黒色など暗
色系の着色染料や着色顔料を含有させても良い。さら
に、熱伝導を向上させる目的で熱伝導部材を含有させて
も良い。熱伝導部材としては発光ダイオード202間に
も配されることから電気電導しないことが求められる。
具体的には酸化銅、酸化銀が挙げられる。
(Filler 205) As the filler 205,
Good adhesion to the light emitting diode 202, the housing 203, the substrate 204 on which the light emitting diode is disposed, the light shielding member 201, and the like is required. In addition, mechanical strength and weather resistance are required to protect the internal circuit. Specific examples of such a filler 205 include an epoxy resin, a urethane resin, and a silicone resin. Further, in order to improve the contrast ratio, these resins may contain a coloring dye or coloring pigment of a dark color such as black. Further, a heat conduction member may be included for the purpose of improving heat conduction. Since the heat conducting member is also arranged between the light emitting diodes 202, it is required that the heat conducting member does not conduct electricity.
Specific examples include copper oxide and silver oxide.

【0033】(駆動手段206)駆動手段206とは、
点灯回路などを有し発光ダイオード202を複数個配置
したLED表示器と電気的に接続されるものである。ダ
イナミック駆動の場合、具体的には駆動回路からの出力
パルスによってマトリックス状などに配置したLED表
示器を駆動する。駆動回路としては、入力される表示デ
ータを一時的に記憶させるRAM(Random Ac
cess Memory)と、RAMに記憶されるデー
タから発光ダイオード202を所定の明るさに点灯させ
るための階調信号を演算する階調制御回路と、階調制御
回路の出力信号でスイッチングされて、発光ダイオード
202を点灯させるドライバとにより構成することがで
きる。
(Driving Means 206) The driving means 206 includes:
It is electrically connected to an LED display having a lighting circuit and the like and having a plurality of light emitting diodes 202 arranged thereon. In the case of the dynamic drive, specifically, an LED display arranged in a matrix or the like is driven by an output pulse from a drive circuit. As the driving circuit, a RAM (Random Ac) for temporarily storing input display data is used.
cess memory), a gradation control circuit for calculating a gradation signal for lighting the light emitting diode 202 to a predetermined brightness from the data stored in the RAM, and an output signal of the gradation control circuit for switching to emit light. A driver for lighting the diode 202 can be used.

【0034】駆動手段は中央演算処理装置などを用いて
比較的簡単に形成させることができる。階調制御回路
は、RAMに記憶されるデータから発光ダイオードの点
灯時間を演算してパルス信号を出力する。階調制御回路
から出力されるパルス信号である階調信号は、発光ダイ
オード202のドライバに入力されてドライバをスイッ
チングさせる。ドライバがオンになると発光ダイオード
202が点灯され、オフになると消灯することができ
る。各発光ダイオード202の点灯時間を制御すること
により所望の映像データなどを表示することができる。
以下、本発明の実施例について説明するが、本発明は具
体的実施例のみに限定されるものではないことは言うま
でもない。
The driving means can be formed relatively easily using a central processing unit or the like. The gradation control circuit calculates a lighting time of the light emitting diode from data stored in the RAM and outputs a pulse signal. A gray scale signal which is a pulse signal output from the gray scale control circuit is input to a driver of the light emitting diode 202 to switch the driver. The light emitting diode 202 can be turned on when the driver is turned on, and can be turned off when the driver is turned off. By controlling the lighting time of each light emitting diode 202, desired video data or the like can be displayed.
Hereinafter, examples of the present invention will be described, but it goes without saying that the present invention is not limited to only specific examples.

【0035】(実施例1)緑色、青色及び赤色が発光可
能なLEDチップに用いられる発光層の半導体としてそ
れぞれInGaN(発光波長525nm)、InGaN
(発光波長470nm)、AlGaInP(発光波長6
60nm)を使用した。各LEDチップをリードフレー
ムと金線及びAgペーストを用いてそれぞれ電気的に接
続させた後、凸レンズ状のモールド部としてエポキシ樹
脂で被覆させてRGBが発光可能な発光ダイオードをそ
れぞれ形成させた。この発光ダイオードを図1の如く近
接させて赤色2個、緑色2個、青色1個で1画素を構成
した。プリント基板上に16×16画素のドットマトリ
ックス状に配置させ基板の導電性パターンとハンダ付け
させた。これをガラス繊維入りポリカーボネートにより
形成させたきょう体内部に配置し固定させた。
(Example 1) InGaN (emission wavelength: 525 nm) and InGaN were used as semiconductors of a light emitting layer used for an LED chip capable of emitting green, blue and red light, respectively.
(Emission wavelength 470 nm), AlGaInP (emission wavelength 6
60 nm). Each LED chip was electrically connected to the lead frame using a gold wire and an Ag paste, and then covered with an epoxy resin as a convex lens-shaped mold portion to form light emitting diodes capable of emitting RGB light. As shown in FIG. 1, two pixels of red, two green and one blue light constitute one pixel. They were arranged in a 16 × 16 pixel dot matrix on a printed circuit board and soldered to the conductive pattern of the board. This was arranged and fixed inside a casing made of polycarbonate containing glass fiber.

【0036】他方、10%のガラス繊維入りポリカーボ
ネートの板状ルーバーの外来光が入射される上側先端部
を図3(C)の如く、凸半円形状の曲面形状に形成す
る。また、凸半円形状の表面には微細な凹凸を持った形
状とさせてある。ルーバーの曲面形状に形成された微細
な凹凸は、金型による一体成形により比較的簡単に形成
することができる。きょう体内部に設けられた凹部とル
ーバーの端部とを符合させることによって発光ダイオー
ドが並べられた基板上に基板と略垂直に保持した。ルー
バーの一部はマトリックス状に配置された画素を構成す
る発光ダイオードの行間に挿入されている。発光ダイオ
ードの先端部を除いてきょう体、発光ダイオード、基板
及び遮光板の一部をシリコンゴムによって充填させた。
その後、常温で硬化させLED表示器を構成させた。次
に、このLED表示器を駆動手段と電気的に接続させL
ED表示装置を形成させた。
On the other hand, as shown in FIG. 3C, the upper end of the plate-shaped louver made of polycarbonate containing 10% glass fiber, into which extraneous light is incident, is formed into a convex semicircular curved surface. Further, the surface of the convex semicircular shape has a shape with fine irregularities. The fine unevenness formed in the curved shape of the louver can be formed relatively easily by integral molding using a mold. By matching the concave portion provided inside the casing with the end of the louver, the light emitting diode was held on the substrate on which the light emitting diodes were arranged, substantially perpendicular to the substrate. A part of the louver is inserted between rows of light emitting diodes constituting pixels arranged in a matrix. Except for the tip of the light emitting diode, the housing, the light emitting diode, the substrate and a part of the light shielding plate were filled with silicon rubber.
Then, it was cured at room temperature to form an LED display. Next, this LED display is electrically connected to the driving means, and L
An ED display was formed.

【0037】輝度測定器(TOPCON社製BM-7)によってLE
D表示装置の輝度を測定した。投光器をLED表示装置
の表面と垂直な線に対してルーバー上55゜の角度に配
置させた。輝度測定器をLED表示装置の正面で約4.
5mの距離に離して暗輝度を測定した。全点灯時に53
08(cd/m2)であり暗輝度は130(cd/m2
であった。コントラスト比は約1/40である。なお、
半円形状となったルーバー上側先端部の凹凸をJIS
B0601に従って、カットオフ値0.8mm、長さ
2.40mmの条件で測定した結果、算術平均粗さ(R
a)3.943μm、十点平均粗さ(Rz)20.15
μmであった。
LE was measured by a luminance measuring device (BM-7 manufactured by TOPCON).
The luminance of the D display was measured. The projector was placed at an angle of 55 ° on the louver with respect to a line perpendicular to the surface of the LED display. 3. Place the luminance meter in front of the LED display device.
Dark luminance was measured at a distance of 5 m. 53 when fully lit
08 (cd / m 2 ) and the dark luminance is 130 (cd / m 2 )
Met. The contrast ratio is about 1/40. In addition,
The semi-circular louver upper and lower ends are JIS
As a result of measurement under the conditions of a cutoff value of 0.8 mm and a length of 2.40 mm according to B0601, the arithmetic average roughness (R
a) 3.943 μm, ten-point average roughness (Rz) 20.15
μm.

【0038】(比較例1)ルーバー表面に凹凸加工を施
さず図3(B)の如きLED表示装置とした以外は実施
例1と同様にしてLED表示装置を形成させた。実施例
1と同様にして測定したルーバーの上側先端部は算術平
均粗さ(Ra)が0.2511μm、十点平均粗さ(R
z)が2.645μmの平滑面とした。実施例1と同様
にして輝度を測定したところ、全点灯時に5477(c
d/m2)であり暗輝度は225(cd/m2)であっ
た。実施例1と同様、コントラスト比は約1/24であ
る。
(Comparative Example 1) An LED display device was formed in the same manner as in Example 1, except that the louver surface was not subjected to unevenness processing, and the LED display device as shown in FIG. 3B was used. The upper end of the louver measured in the same manner as in Example 1 had an arithmetic average roughness (Ra) of 0.2511 μm and a ten-point average roughness (R).
z) was a smooth surface of 2.645 μm. When the luminance was measured in the same manner as in Example 1, it was found that the luminance was 5577 (c
d / m 2 ), and the dark luminance was 225 (cd / m 2 ). As in the first embodiment, the contrast ratio is about 1/24.

【0039】(比較例2)ルーバー上側先端部の断面形
状を凸半円形状とせず図3(A)の如き矩形形状とした
以外は実施例1と同様にしてLED表示装置を形成させ
た。ルーバーの表面粗さは、ほぼ比較例1と同様であ
る。形成されたLED表示装置を実施例1と同様にして
輝度を測定したところ、全点灯時に5301(cd/m
2)であり暗輝度は124(cd/m2)であった。コン
トラスト比は約1/43であった。
Comparative Example 2 An LED display device was formed in the same manner as in Example 1 except that the cross-sectional shape of the upper end portion of the louver was not a convex semicircular shape but a rectangular shape as shown in FIG. The surface roughness of the louver is almost the same as in Comparative Example 1. When the luminance of the formed LED display device was measured in the same manner as in Example 1, the luminance was 5301 (cd / m 2) at the time of full lighting.
2 ) and the dark luminance was 124 (cd / m 2 ). The contrast ratio was about 1/43.

【0040】実施例1のLED表示器を比較例1及び比
較例2で形成されたLED表示器と共に高さ約15mの
位置に設置した。LED表示器を設置後、視認距離の違
いによる色ずれを確認する試験を行った。比較例2にお
いて、混色により画素を構成するLEDが部分的にルー
バーにより遮光され色味が変化する位置Aから約6mL
ED表示器側に近づいた位置Bに置いても比較例1及び
実施例1は共に色ずれが見られなかった。このことから
ルーバー上側先端部の断面が凸曲面形状を構成する構造
においては視認範囲が大きく広がることがわかる。以上
の結果より、本発明は、広視野角とコントラスト比の向
上とを共に達成するLED表示器とすることができる。
The LED display of Example 1 was placed at a height of about 15 m together with the LED displays formed in Comparative Examples 1 and 2. After installing the LED display, a test was conducted to confirm the color shift due to the difference in the viewing distance. In Comparative Example 2, about 6 mL from the position A where the LED constituting the pixel due to the color mixture is partially shielded by the louver and the color is changed
In Comparative Example 1 and Example 1, no color misregistration was observed even at the position B near the ED display side. From this, it can be seen that in the structure in which the cross section of the upper end portion of the louver has a convex curved shape, the visible range is greatly expanded. From the above results, the present invention can provide an LED display that achieves both a wide viewing angle and an improvement in contrast ratio.

【0041】[0041]

【発明の効果】本発明は、ルーバー上側先端部の断面を
曲面形状に形成することにより強度を保持したまま視野
角を増やすことができる。また、ルーバーの上側先端部
が曲面状に形成されたことにより生じる直接的な反射光
を曲面形状の表面に形成された微細な凹凸により散乱さ
せ抑制することができるものである。したがって、本発
明により広視野角とコントラスト比の向上とを共に達成
することができるものである。
According to the present invention, by forming the cross section of the upper end portion of the louver into a curved shape, the viewing angle can be increased while maintaining the strength. Further, it is possible to suppress direct reflected light generated by the upper end portion of the louver being formed into a curved surface by being scattered by fine irregularities formed on the curved surface. Therefore, according to the present invention, both a wide viewing angle and an improvement in contrast ratio can be achieved.

【図面の簡単な説明】[Brief description of the drawings]

【図1】図1は本発明のLED表示装置を示す部分的な
模式的平面図である。
FIG. 1 is a partial schematic plan view showing an LED display device of the present invention.

【図2】図2は図1のAA断面における本発明のLED
表示装置を示す模式的断面図である。
FIG. 2 is an LED according to the invention in the section AA in FIG. 1;
It is a typical sectional view showing a display.

【図3】図3は、本発明の効果を説明する模式的説明図
であり、図3(A)は本発明と比較のために示した一般
的なルーバーを用いたLED表示器の模式的断面図であ
り、図3(B)は比較のために示したルーバーの上側先
端部が曲面形状であるLED表示器の模式的断面図であ
り、図3(C)は本発明のルーバーを用いたLED表示
装置の模式的断面図である。
FIG. 3 is a schematic explanatory view for explaining an effect of the present invention, and FIG. 3A is a schematic diagram of an LED display using a general louver shown for comparison with the present invention. FIG. 3B is a schematic cross-sectional view of an LED display in which the upper end of the louver shown in FIG. 3B has a curved surface shape for comparison, and FIG. FIG. 2 is a schematic sectional view of the LED display device.

【図4】図4は、本発明と比較のために示したLED表
示装置の模式的斜視図である。
FIG. 4 is a schematic perspective view of an LED display device shown for comparison with the present invention.

【符号の説明】[Explanation of symbols]

101、201、321・・・先端の縦断面が凸曲面で
あり微少な凹凸を持ったルーバー 102・・・R(赤色)に発光できる発光ダイオード 112・・・G(緑色)に発光できる発光ダイオード 122・・・B(青色)に発光できる発光ダイオード 103、203、403・・・きょう体 204・・・発光ダイオードが配置された基板 205・・・充填剤 206、406・・・駆動手段 301、401・・・先端の縦断面が矩形であるルーバ
ー 311・・・先端の縦断面が凸曲面となったルーバー 302、312、322、402・・・発光ダイオード 307・・・表面が微少な凹凸である上側先端部 317・・・表面が平滑な上側先端部
101, 201, 321... Louver having a convex vertical cross section at the tip and having fine irregularities 102... Light emitting diode capable of emitting R (red) 112. Light emitting diode capable of emitting G (green) 122: Light-emitting diodes capable of emitting B (blue) light 103, 203, 403: Housing 204: Substrate on which light-emitting diodes are disposed 205: Fillers 206, 406: Driving means 301, Reference numeral 401: a louver having a rectangular vertical cross section at the tip 311: a louver having a convex vertical cross section at the tip 302, 312, 322, 402: light emitting diode 307: fine irregularities on the surface Certain upper tip 317: Upper tip with a smooth surface

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】複数の発光ダイオードを配置させると共に
発光ダイオード間にルーバーを配置させたLED表示器
であって、 前記ルーバーの断面形状がルーバーの上側先端部を曲面
形状に形成すると共にその曲面形状の表面が微細な凹凸
を有することを特徴とするLED表示器。
1. An LED display in which a plurality of light emitting diodes are arranged and a louver is arranged between the light emitting diodes, wherein the cross-sectional shape of the louver is such that an upper end portion of the louver is formed in a curved shape and the curved shape is formed. An LED display characterized in that the surface of the LED has fine irregularities.
【請求項2】複数の発光ダイオードを配置させると共に
発光ダイオード間にルーバーを配置させたLED表示器
と、該LED表示器を駆動させる駆動手段とを有するL
ED表示装置であって、 前記ルーバーの上側先端部をそれよりも上方に配置され
るLEDが放出される光の放射角を大きくする曲面形状
とすると共に該曲面形状が乱反射させ視認者に直接向か
う反射光を少なくする凹凸を有することを特徴とするL
ED表示装置。
2. An LED having a plurality of light-emitting diodes disposed therein and a louver disposed between the light-emitting diodes, and driving means for driving the LED displays.
An ED display device, wherein an upper end portion of the louver has a curved surface shape for increasing a radiation angle of light emitted from an LED disposed above the louver, and the curved surface shape is irregularly reflected to directly go to a viewer. L having irregularities for reducing reflected light
ED display device.
JP30118897A 1997-10-31 1997-10-31 LED display and LED display device Expired - Lifetime JP3287457B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30118897A JP3287457B2 (en) 1997-10-31 1997-10-31 LED display and LED display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30118897A JP3287457B2 (en) 1997-10-31 1997-10-31 LED display and LED display device

Publications (2)

Publication Number Publication Date
JPH11133890A true JPH11133890A (en) 1999-05-21
JP3287457B2 JP3287457B2 (en) 2002-06-04

Family

ID=17893841

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
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Publication number Priority date Publication date Assignee Title
JP2005275178A (en) * 2004-03-25 2005-10-06 Koha Co Ltd Outdoor display unit
JP2006338020A (en) * 2005-05-31 2006-12-14 Lg Philips Lcd Co Ltd Backlight assembly for liquid crystal display device and liquid crystal display device using same
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US8212744B2 (en) * 2006-07-21 2012-07-03 Hewlett-Packard Development Company, L.P. See-through display
JP2016099393A (en) * 2014-11-18 2016-05-30 レシップホールディングス株式会社 Led display unit
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CN113270441B (en) * 2021-05-27 2022-12-13 深圳市思坦科技有限公司 LED chip structure, preparation method thereof, display module and electronic equipment

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