JPH1093061A - Image-detecting apparatus, array substrate and manufacturing the image-detecting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a high precision image of natural size on a large screen by forming wavelength converting means on a surface facing an image-detecting board so as to cover an image detecting region, and connecting scanning lines, signal lines and driving means at regions not covered with an insulation board having a pixel array surface of the detecting board. SOLUTION: Array boards 102a-d are adhered to a support board 105 to fix the mutual positions. The board 105 is larger than an image-detecting region 104 and smaller than an image-detecting board 101. Wavelength converting means are formed on a surface facing the combined array boards 102a-d and detecting board 101 so as to cover the detecting region 104. The board 101 has a surface having a pixel array 103 which forms exposed regions not covered with the support board to connect scanning lines for driving pixels to a scanning line drive circuit and detection signal-reading signal lines to signal line driving means. This improves the connectability of the pixel array and scanning lines and signal lines and circuit reliability.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image detecting device, and more particularly to an image detecting device capable of obtaining an image on a large screen. The present invention also relates to an array substrate, and more particularly to an array substrate used in combination. Further, the present invention relates to a method of manufacturing an image detecting device manufacturing apparatus, and more particularly to a method of manufacturing an image detecting device capable of obtaining an image on a large screen.

[0002]

2. Description of the Related Art For example, in an X-ray image detecting apparatus widely used for diagnosis in the medical field, in order to observe an X-ray image, for example, an X-ray TV apparatus displays an image as a transparent image on a TV monitor. Or photographing on a silver lead film and displaying the image as an X-ray photograph. In particular, in the case of film images, it is possible to observe fine and subtle changes in detail, and it is possible to save the photographed film and observe it at any time, so that it does not change its position as a medical image detection device until now. It is assumed.

[0003] In the case of medical use, the area is divided into one large-sized cut film so that a large number of images are printed, or one image is put on a single large-sized cut film at the actual size or near the actual size. Or print it on a scale. In particular, in the case of a substantially full-size image, the condition of the affected part can be grasped in correspondence with the surroundings, and therefore, it is often used as an X-ray image for diagnosis.

In recent years, with the remarkable development of computer technology, medical images are also treated as digital image data, and by making full use of image processing technology, it is possible to obtain information that could not be obtained as silver-lead photographs. Has become possible, and more accurate diagnosis has been made possible.

In order to obtain a medical image as digital image data, a silver lead film is read by an image scanner and converted into digital data, or a video signal from an X-ray TV device is subjected to A / D conversion (analog / digital conversion). Digital data.

However, the method of reading a silver lead film with an image scanner has a problem that the accuracy of the image scanner is not sufficient and a problem that it takes time and labor to read an image.

[0007] In addition, the video signal from the X-ray TV device is
In the D conversion method, there are problems such as the image density and gradation of the image detection system, and the image is distorted by the optical system due to the use of the optical system. There is a problem that an image which reflects important information cannot be obtained.

[0008] A CCD (Chargecoupled de) can be used to obtain an image as an electric signal.
image) elements, but these image sensors cannot enlarge the image detection surface due to manufacturing problems. Therefore, the image detection area is small,
When the imaging target is larger than the image detection area, an optical system must be used for imaging. In addition, since the area of the imaging surface is small, even if the number of pixels is maximized by reducing the unit pixel area by making full use of semiconductor fine processing technology and increasing the pixel density, a large subject such as the human body In this case, the area of the human body corresponding to one pixel increases. This means that a very rough image is obtained when the human body is enlarged to a real scale, and at present, it cannot be substituted for direct imaging using an X-ray film.

On the other hand, in recent years, a two-dimensional image detection device having a side of about 10 to 20 cm, in which photoelectric conversion elements corresponding to minute-sized pixels are arranged in a matrix, has appeared. In this image detection device, since a photoelectric conversion element and a detection circuit are arranged in pixel units in a planar area, a mechanical scanning mechanism unlike a conventional line sensor is unnecessary. Examples of such an image detection device include, for example, US Pat. Nos. 4,689,487 and 5,184,018.
No., etc.

FIG. 10 is a diagram schematically showing an example of the configuration of a conventional image detecting device.

On an array substrate 901, a pixel array 9 in which pixels are arranged in a matrix as a region for detecting an image is provided.
02 is formed. Each pixel receives a radiation of an electromagnetic wave in a state where a bias is applied, and a photoelectric conversion element such as a photodiode in which a resistance changes according to the energy of the received electromagnetic wave, and a switching element for opening and closing the output of the photodiode. And a unit detection circuit comprising:

The unit detection circuit includes a power supply for driving the photodiode, a scanning signal line for controlling the on / off of the switch, and a readout signal line for reading out the electric signal accumulated in the photodiode via the switch. It is connected to the. The read signal wiring is connected to an output circuit for sampling and outputting the output of the photodiode. Then, such a plurality of unit detection circuits are arranged in a matrix, for example, to form a pixel array as an image detection surface.

In the plurality of unit detection circuits arranged in a matrix, the scanning signal wiring is arranged in the row direction, and the read wiring is arranged in the column direction. A control line (gate electrode) for opening / closing control of a switch of each unit detection circuit is connected to a scanning signal wiring belonging to the unit detection circuit, and a switch of each detection circuit belonging to the row collectively on a row basis. On / off control.

Each unit detection circuit, which is a pixel, is connected to a readout signal line corresponding to the column to which the unit belongs, and an output signal of a photodiode output through a switch of each unit detection circuit. Is derived. Each read signal wiring is provided with a sense amplifier which is an output circuit for obtaining a detection output by accumulating and outputting a signal guided through the read signal wiring for a predetermined time.

When an optical image is formed on the two-dimensional image detecting device having such a configuration, light of an image portion located at a corresponding position enters each pixel. A bias voltage is applied to the photodiode from the power supply, and when the switch is turned on,
A current output corresponding to the amount of incident light is generated. Then, this output is input to a sense amplifier, which is an output circuit, via a read signal wiring, and is integrated there to become a detection output signal (pixel signal).

As described above, each pixel is connected to one corresponding scanning signal line on a row basis, and is connected to one corresponding readout signal wiring on a column basis. Therefore, by sequentially scanning each scanning line wiring in the row direction, a switch constituting each pixel in a row unit is turned on / off.
It can be turned off, and the output of the photodiode of each pixel whose switch is on can be detected by the sense amplifier of each column.

Therefore, each scanning signal line is sequentially turned on by a predetermined time unit, and prior to this turning-on operation, the residual charge (previous measured value) of the integrating circuit section of each sense amplifier is cleared every time. Thus, the image detection area of the two-dimensional image detection device can be sequentially scanned with the line width in the scanning line direction of the unit detection circuit, and the output of each pixel can be output as an image detection signal.

The image detection apparatus of this system can output unit detection circuit signals composed of the line at a time one line at a time in parallel, and can obtain image data at high speed. (1 line parallel output). That is, a CCD is generally used as an image detection device. Although an image is captured in units of lines so that a CCD image pickup device for image detection is compatible with TV scanning, detection signals of one line are sequentially transmitted. The output is serial data (serial output), so the superiority (high speed) of the parallel output method is high.

Such a pixel array can be formed by a thin film semiconductor process. A scanning signal for driving the pixel array 902 is generated by a scanning line driver 903 and input to the pixel array 902 via a flat cable 904. On the other hand, as for the detection signal from the pixel array 902, similarly, the detection signal from the readout signal wiring is input to each sense amplifier formed in the signal line driver 906 via the flat cable 905. The signal line driver includes a detection signal processing circuit, a processing signal transmission circuit, and the like in addition to the sense amplifier, and outputs a signal from a wiring 907 to an external circuit. Reference numeral 908 denotes a scanning line driving unit 903 and a signal line driving unit 907
This is a cable for synchronizing.

Meanwhile, the conventional image detecting apparatus illustrated in FIG. 10 is an image detecting apparatus in which pixels are arranged in a matrix and sequentially scanned line by line, thereby sampling a signal detected by the pixel. , The output of each pixel connected to the scanning line is detected by the sense amplifier via the readout signal wiring. The image detection area depends on the size of the matrix in which the pixels are arranged, that is, the size of the pixel array, and the resolution depends on the density of pixels formed in a unit area.

An array substrate having such a pixel matrix can be formed into a substrate of, for example, about 300 mm × 400 mm by a conventionally known thin film semiconductor process. However, an image detection device having an image detection surface larger than an array substrate that can be realized by a thin film semiconductor process cannot be manufactured.

On the other hand, even if it becomes possible to form a larger array substrate, all the unit detection circuits need to operate completely, and an increase in the detection area of the detection device requires an increase in the number of unit detection circuits. This leads to an increase in the wiring length, resulting in a significant decrease in productivity.

Further, in the case of an array substrate having a large image detection area, there is a problem that the length of the scanning signal wiring becomes long and the distortion of the scanning signal for controlling the switch increases. In addition, there is a problem in that the length of the read signal wiring increases the attenuation of a signal reaching the sense amplifier and the superimposition of noise. In particular, in such an image detection device, the detected signal is weak, and attenuation of the detection signal and superposition of noise are extremely serious problems. Particularly in medical applications, pixel defects caused by enlarging the size of one array substrate, attenuated detected signals, and a reduction in imaging reliability due to superposition of noise are extremely serious problems.

[0024]

SUMMARY OF THE INVENTION The present invention has been made to solve such a problem. That is, an object of the present invention is to provide an image detection device capable of obtaining a high-resolution full-size image on a large screen. It is another object of the present invention to provide an image detection device capable of preventing attenuation of a detection signal and superimposition of noise and obtaining a high-quality image on a large screen. It is a further object of the present invention to provide an image detection device capable of obtaining a highly reliable image suitable for medical use on a large screen. Another object of the present invention is to provide an array substrate suitable for use in combination with a plurality of substrates. Still another object of the present invention is to provide a method for manufacturing an image detection device capable of obtaining high-definition imaging on a large screen.

[0025]

According to the present invention, there is provided an image detecting apparatus comprising: a pixel array in which pixels having photoelectric conversion elements are formed in a matrix of i rows and j columns; and a scanning line for driving the pixel array in units of rows. And a first array substrate and a second array substrate having signal lines for reading out detection signals from the pixel array in column units to form a rectangular image detection region in which the pixel arrays of each substrate are substantially continuous. And a wavelength conversion means arranged opposite to the surface of the image detection substrate having the pixel array, and formed on the surface facing the image detection substrate so as to cover the image detection region. An insulating substrate that is larger than the image detection region and smaller than the image detection substrate, and the scanning line is formed in a region of the image detection substrate having a pixel array that is not covered by the insulating substrate. Characterized by comprising a signal line drive means connected to the connection with the scanning line drive means and the signal line.

In this image detecting device, the end faces of the first array substrate and the second array substrate which are adjacent to each other are connected to the first substrate which is formed on the first surface side and is in contact with the first and second substrates.
And a second portion formed on the second surface side and separated from the substrates. The thickness of the first portion may be designed according to the size, material, and the like of the array substrate so as to obtain necessary strength. The second portion may be formed, for example, in a tapered shape.

The scanning line driving unit and the signal line driving unit may be configured such that the first array substrate and the second array substrate constituting the image detection substrate are arranged such that the first array substrate and the second array substrate When the i-th row of the pixel array is combined with a shift of the number of pixels Δy, or the j-th column of the first pixel array and the j-th column of the second pixel array are combined with a shift of the number of pixels Δx. At this time, a timing shift means for shifting the scan line drive timing or the signal line drive timing of the first pixel array and the second pixel array in accordance with the amount of time required for driving the pixel number Δx or Δy is provided. It may be.

The array substrate of the present invention has an i.
A pixel having a photoelectric conversion element formed in a matrix of rows and j columns, a pixel having a nonlinear switching element connected to the photoelectric conversion element, i scanning lines for applying a drive signal to the nonlinear switching element; An array substrate having j signal lines for reading out a detection signal from the photoelectric conversion element via an element, wherein the first signal line is provided between a pixel in a first column and a pixel in a second column. The i-th signal line is disposed between the pixel in the (i-1) th column and the pixel in the i-th column.

According to the method of manufacturing an image detecting device of the present invention, a first array substrate having a pixel array in which pixels having photoelectric conversion elements are formed in a matrix on a plane and a second array substrate are provided.
Of the pixel array of the first array substrate and the second
Arranging the pixel array of the array substrate so as to form a substantially continuous rectangular image detection region, and fixing the mutual positional relationship; Forming a phosphor layer in a region of the above, and laminating the first and second array substrates and the insulating substrate such that the phosphor layer covers the image detection region. .

That is, in the image detection apparatus of the present invention, a plurality of array substrates having a pixel array formed in a matrix are combined so that the pixel array of each substrate forms a substantially continuous rectangular image detection region. By doing
This is an image detection device capable of obtaining a full-scale image corresponding to an image pickup object at almost 1: 1 with high definition and a large screen.

Although it is preferable to combine a plurality of substrates having the same size from the viewpoint of alignment and the like, a plurality of substrates having different sizes may be used as long as a predetermined image detection area can be obtained by combination. . Similarly, the size of the pixel array formed on each substrate is the same,
It is preferable to combine pixel arrays having the same number of rows and the same number of columns from the viewpoint of alignment, driving of pixels, and the like.However, even when the size, the number of rows, and the number of columns of the combined pixel arrays are different, Thus, a substantially rectangular image detection area may be obtained. The image detection substrate constituting the image detection device of the present invention is formed from a plurality of array substrates having a pixel array, but each array substrate has no gap larger than a size corresponding to substantially one pixel. Are combined as follows. Further, the displacement parallel to the bonding surface of the combined array substrate may be shifted as long as no gap occurs in the image detection area. The image detection substrate combined with the array substrate is bonded to, for example, a substrate having the required strength, whereby the positional relationship between the array substrates is fixed, and the image detection substrate having insufficient strength by itself is also supported. As a substrate for fixing an image detection substrate in which such an array substrate is combined, for example, an insulating substrate in which a phosphor layer serving as a wavelength conversion means is formed on an insulating substrate may be used. The phosphor layer may be formed so as to cover the entire image detection area. Then, the size of the substrate on which the wavelength conversion means is formed is
Formed to have a size larger than the image detection area and smaller than the image detection substrate, the surface of the image detection substrate on which the pixel array is formed and the surface of the insulating substrate on which the wavelength conversion means is formed are combined with a phosphor layer. Alternatively, the wavelength conversion means may be attached so as to cover the image detection area. Thus, the plurality of array substrates are fixed, and an exposed area not covered with the insulating substrate is formed on the outer peripheral portion of the surface of the image detection substrate on which the pixel array is formed. In the exposed area, the scanning line of the pixel array and the scanning line driving circuit are
The signal lines of the pixel array and the signal line driver circuit can be connected. For connection, for example, a film-shaped flat cable and an ACF (anisotropic conductive film) may be used. Further, an IC such as a sense amplifier may be mounted on a film-shaped flat cable connecting the scanning line driver circuit and the signal line driver circuit to the pixel array.

It is preferable that the portion of the array substrate to be joined to the adjacent array substrate be as close as possible to the edge of the pixel array and the edge of the array substrate. In order to obtain such an array substrate, for example, a frame portion where the pixel array is not formed on the array substrate formed by the thin film transistor process may be cut off. In recent years, cutting with an accuracy of about 75 to 100 μm is possible, which is a cutting accuracy corresponding to a size of approximately one pixel or smaller. In addition, if wirings such as scanning lines and signal lines exist on the outer periphery of the pixel array, the pitch of the pixel array at the junction increases,
Further, there is a possibility that disconnection may occur when the frame is cut. Therefore, an array substrate having no wiring on the outermost periphery of the pixel array may be prepared. For example, in an array substrate having pixels arranged in a matrix of i rows and j columns on an insulating substrate, the first signal line is
What is necessary is just to arrange | position between the pixel of a column, and to arrange | position the i-th signal line between the pixel of the (i-1) -th column and the pixel of the i-th column. By using such an array substrate,
When a plurality of array substrates are combined, the gap of the arrangement pitch between pixels formed on different array substrates and adjacent to each other is reduced. Further, disconnection of scanning lines and signal lines is prevented.

By the way, when a plurality of array substrates are combined, a mismatch may occur in the formed image detection area. For example, even if there is no problem in the arrangement pitch of pixels in the row direction of the pixel array adjacent in the row direction, displacement may occur in the column direction. Further, even if there is no problem in the arrangement pitch of the pixels in the column direction of the pixel array adjacent in the column direction, displacement may occur in the row direction.

The image detecting apparatus according to the present invention can cope with such a mismatch between combinations of pixel arrays. That is, such a mismatch in the arrangement of the pixel arrays is determined when a plurality of array substrates are combined and fixed. The image detection apparatus of the present invention measures the determined mismatch between the pixel arrays as the amount of displacement of the pixels, and drives the scanning lines of the pixel arrays according to the amount of time required to drive the number of pixels, or a signal. The timing for reading out the detection signal by driving the line is shifted.
For this reason, as described above, in the image detection device of the present invention, the scanning line driving unit or the signal line driving unit includes the first array substrate and the second array substrate that constitute the image detection substrate in the first pixel array. Is combined with the i-th row of the second pixel array shifted by the number of pixels Δy, or the j-th column of the first pixel array and the j-th column of the second pixel array When combined by shifting by the number Δx, the scanning line driving timing or the signal line driving timing of the first pixel array and the second pixel array is shifted according to the amount of time required for driving the pixel number Δx or Δy. By providing a timing shift means for correcting the mismatch, a mismatch between a plurality of pixel arrays constituting an image detection area is corrected and output.

For example, when the pixels in the first row of the first array substrate are combined correspondingly to the pixels in the second row of the second array substrate, the pixel array of the first array substrate and the pixel array of the second substrate are combined. A displacement of one pixel in the column direction (Δy
= 1) exists. In such a case, for example, by making the drive timing of the second pixel array one row earlier than the drive timing of the first pixel array,
The mismatch of the output image signals can be eliminated.
Since the displacement amount of the pixel may be an integer, the displacement amount to a real number may be an integer value closest to the displacement value as the displacement amount.

By providing such a timing correcting means for correcting the drive timing of the scanning lines or signal lines, the image detecting apparatus of the present invention provides an image free from mismatching even if there is a mismatch in the combination of array substrates. Data can be output to an external circuit. Such an image mismatch can be corrected by software after being output from the image detection device. However, since the misalignment of the array substrates differs depending on the image detection substrates, it is necessary to rewrite the program for each image detection device, which poses a problem in terms of compatibility of the image detection devices.

As described above, in the image detecting device of the present invention, a large-screen image detecting device is formed by laminating a plurality of array substrates on a supporting substrate. Even when the array substrate is smaller than the image detection substrate to be created, an image detection device of a target size can be configured. In addition, by configuring a plurality of array substrates in combination, it is only necessary to prepare a plurality of small-sized image detection substrates as compared with a case where an image detection device is created with one image detection substrate, so that productivity is improved. .

Further, in the image detecting apparatus of the present invention, the length of the scanning wiring and the length of the readout signal wiring do not change depending on the size of each array substrate even if the size of the entire image detecting substrate becomes large. Therefore, noise that is unavoidably mixed into the detection signal is greatly reduced, and a high-quality two-dimensional detection device with an improved S / N ratio can be configured. Further, since the size of the entire image detection substrate including a plurality of array substrates is larger than that of the substrate on which the phosphor layer is formed, the connection between the wiring of the pixel array and the driving circuit is facilitated.

[0039]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An image detecting apparatus according to the present invention comprises an array substrate having a pixel array in which pixels having photoelectric conversion elements are formed in a matrix of i rows and j columns. And an image detection board which is combined so as to form a continuous rectangular image detection area.

FIG. 1 is a view schematically showing an example of the configuration of an image detection board 101 provided in the image detection apparatus 100 of the present invention. The image detection substrate 101 includes an array substrate 102a in which a pixel array is formed on each of four insulating substrates,
102b, 102c, and 102d are combined. Then, each of the array substrates 102a, 102b, 1
02c and 102d are the pixel arrays 103a and 103
b, 103c and 103d are combined to form a substantially continuous rectangular image detection area 104.

Here, an example in which four array substrates are combined will be described. However, the number of array substrates to be combined is not limited to this, and may be any number as long as it is two or more.

FIG. 2 shows the image detecting substrate 101 and the supporting substrate 10.
FIG. 5 is a diagram schematically showing a relationship with the fifth embodiment. The plurality of array substrates 102 are fixed to each other by being attached to a support substrate 105. Image detection area 1
A plurality of combined array substrates 102 of a support substrate 105 greater than 04 and smaller than the image detection substrate 101
That is, a wavelength conversion unit such as a phosphor layer is formed on the surface facing the image detection substrate 101 so as to cover the image detection region 104. Therefore, the image detection board 1
In the surface having the pixel array 103 of No. 01, an exposed area not covered with the support substrate is formed. In this area, a scanning line for driving pixels is connected to a scanning line driving circuit, and a similar manner is applied. You may make it connect the signal line which reads out a detection signal, and signal line drive means.

FIG. 3 is a diagram schematically showing a configuration of a pixel constituting a pixel array of the image detecting apparatus according to the present invention.

As shown in FIG. 3, the unit detection circuit 201, which is a pixel, is a photoelectric conversion element that, when it receives electromagnetic wave radiation in a state where a bias is applied, changes resistance according to the energy of the received electromagnetic wave. Photodiode 2
02, and a thin film transistor 203 which is a switching element for switching the output of the photodiode 202. Here, the thin film transistor 203 is used as a switching element, but the MIM (Metal Insulator) can be obtained by partially changing the circuit configuration.
Metal) may be used.

The unit detection circuit 201 includes a driving power supply 204 for applying a voltage to the photodiode 202.
And a scanning signal line 210 for controlling on / off of a switch of the thin film transistor, and a reading signal line 211 for reading out an electric signal accumulated in the photodiode 202 via the thin film transistor 203. The read signal wiring 211 is connected to an output circuit 213 for sampling and outputting the output of the photodiode 202. And a plurality of unit detection circuits are, for example, shown in FIG.
The pixel array 103 which is an image detection surface of each array substrate 102 is formed by arranging the pixel array 103 in a matrix as shown in FIG.

In the plurality of unit detection circuits 201 arranged in a matrix, the scanning signal lines 210 are arranged in the row direction, and the readout lines 211 are arranged in the column direction. A control line (gate electrode) for opening / closing control of the thin film transistor 203 of each unit detection circuit 201 is connected to the scanning signal wiring 210 belonging to the unit detection circuit, and each detection line belonging to the row is collectively provided in a row unit. Circuit thin film transistor 20
3 on / off control.

Each unit detection circuit 20 constituting a pixel
1 is connected to the readout signal wiring 211 corresponding to each column to which each unit belongs, and each unit detection circuit 2
The configuration is such that an output signal of the photodiode 202 output via the thin film transistor 203 of No. 01 is guided. Further, each read signal wiring 211 is provided with a sense amplifier 213 which is an output circuit for obtaining a detection output by accumulating and outputting a signal guided through the read signal wiring 211 for a predetermined time.

When an optical image is formed on the pixel array having such a configuration, light of an image portion at a corresponding position enters each pixel. A bias voltage is applied to the photodiode 202 from a power supply 204, and charges corresponding to the amount of incident light are accumulated or released over time. When the gate electrode of the thin film transistor 203 is turned on, this charge output is output to the thin film transistor 2.
03 to the sense amplifier which is the output circuit 213 through the source / drain electrode 03 and the signal line 211.
11 and is integrated there to become a detection output signal (pixel signal).

As described above, each pixel is connected to one corresponding scanning signal line 210 in a row unit, and is connected to one corresponding reading signal line 211 in a column unit. Therefore, by sequentially scanning the scanning line wirings 210 in the row direction, the thin film transistors 203 constituting each pixel can be turned on / off in row units, and the photodiode 202 of each pixel for which the thin film transistor 203 is turned on. Can be detected by the column-based sense amplifiers 213, respectively.

Therefore, each scanning signal line 210 is sequentially turned on by a predetermined time unit, and prior to this turning-on operation, the residual charge (previous measured value) of the integrating circuit section of each sense amplifier 213 is cleared every time. By doing so, it becomes possible to sequentially scan the pixel array of the image detection device and the line width in the scanning line direction of the unit detection circuit 201 and output the output of each pixel as an image detection signal.

The image detection apparatus of this system can output unit detection circuit signals composed of the line at a time, one line at a time, in parallel, so that image data can be obtained at high speed. (1 line parallel output). Serial output is also possible.

FIG. 5 is a diagram schematically showing the configuration of the image detecting apparatus 100 of the present invention, and FIG.
FIG. 2 is a cross-sectional view in the MN direction schematically showing the structure of No. 0. Here, an example in which the image detection device of the present invention is applied to an X-ray image detection device will be described.

The support substrate 105 includes a plurality of array substrates 1
An image detection substrate 101 including 02a, 102b, 102c, and 102d is attached. On the surface of the support substrate 105 on the image detection substrate 101 side, the image detection device 10
A phosphor layer 106 for converting X-rays incident on 0 into visible light is formed. Since a material that transmits light having a wavelength to be detected may be used for the support substrate 105, for example, when X-ray detection is performed, a metal substrate may be used for the purpose of shielding visible light. . On the other hand, the support substrate 105 on which the phosphor layer 106 is formed also has a function of supporting the image detection substrate 101 in which a plurality of array substrates 102a, 102b, 102c, and 102d are combined. Therefore, as the material of the support substrate 105, a material having the same or a value close to the coefficient of thermal expansion of the image detection substrate 101 may be used. When the image detection substrate 101 is formed by a process using a glass substrate, a glass substrate may be used as the support substrate 105. In this case, a metal thin film 107 may be formed on the support substrate 105 as a means for shielding visible light in order to shield visible light. Alternatively, instead of a glass material, for example, Ko
The support substrate 105 may be formed using a metal material such as an Fe—Ni—Co-based alloy such as var or Fernico, which has substantially the same expansion coefficient as a glass substrate. In this case, it is not necessary to form the metal thin film 107.

As described above, the phosphor layer 106 for converting the wavelength of the incident electromagnetic wave into a wavelength detectable by the photodiode 202 as a photoelectric conversion element is formed on the support substrate 105, for example, on a glass substrate or the like. . The phosphor layer 106 may be formed, for example, by coating.
Alternatively, the phosphor layer 106 may be formed by spin coating a solution obtained by diluting the phosphor material with an appropriate organic solvent and a linking agent, by screen printing, or by pulling up by dipping after covering one surface with a protective film. It may be performed. By employing such a method, the phosphor layer 106 can be formed more uniformly, and the phosphor layer 10
6 also makes the wavelength conversion efficiency of electromagnetic waves more uniform.

Further, after forming and drying the phosphor layer 106, a protective layer 108 made of an elastic material such as silicone may be formed on the phosphor layer 106. By forming such a protective layer 108, the phosphor layer 10
6 is protected from the influence of humidity and the like, and the image detecting substrate 10 is protected.
The stress at the time of attaching 1 is also reduced. Further, it functions as a buffer layer against thermal expansion due to temperature change.
The protective layer 108 may be formed by a method similar to that for the phosphor layer 106. Further, the protective layer 108 is preferably formed so as to cover the entire surface including the end face of the phosphor layer 106. Therefore, for example, if the outer peripheral portion of the phosphor layer 106 is formed to have a tapered shape spreading toward the support substrate 105, the coverage of the phosphor layer 106 with the protective layer 108 is further improved. Even when the outer peripheral end surface of the phosphor layer 106 is not tapered, for example, the phosphor layer 106 is formed up to the end of the support substrate 105, and the protective layer 108 is covered so as to cover the entire phosphor layer 106 (including the end surface). What is necessary is just to form it.

Next, the support substrate 105 on which the phosphor layer 106 is formed and the plurality of array substrates 102a, 102b, 102c, and 102d constituting the image detection substrate 101 are bonded. By forming at least two or more alignment marks and referring to the alignment marks, the alignment can be performed without causing any displacement at the joint. In the example of FIG. 5, the mark for positioning is the image detection board 1.
On the 01 side, alignment marks are formed at corners of the outer peripheral portion other than the pixel array and the lead-out wiring forming portion. The mark may be formed outside the pattern of the pixel array and the lead wiring. Further, in order to reduce the area of the outer peripheral portion of the image detection substrate 101 other than the pixel array, the alignment mark is formed by using the readout signal line 211 or the wiring pattern for leading the scanning line 210 to an external circuit. You may.
Of course, alignment marks may be formed independently of the wiring.

As the counterpart of the alignment marks of the image detection substrate 101, a total of 12 alignment marks are formed on the support substrate 105 for four image detection substrates in the example of FIG. Regarding the mark, in the case of an X-ray detection device, a method of performing marking by irradiating a formed metal film for shielding visible light with a laser is simple. In addition to laser, mark formation by mechanical polishing is also possible. When a laser is used for marking, even if a metal film is not formed, the phosphor layer 106 and the substrate itself can be marked by melting or sublimation by heat.

FIG. 7 shows a plurality of array substrates 102a, 102b, 102c and 102d constituting the image detection substrate 101.
FIG. 5 is an enlarged view showing a joint portion where adjacent array substrates come into contact with each other in the lamination. Image detection device 1 of the present invention
In 00, tapered end faces of the array substrate 102 adjacent to each other are formed in order to bond the array substrate 102 with high accuracy. The first surface of the array substrate 102 on which the pixel array 103 is formed is the array substrate 102
And has an opposing surface for adjoining the adjacent array substrate while maintaining the strength. When the thickness of the contact surface is large, it is difficult to flatten the contact surface, and the joining accuracy is reduced. For example, when cutting the end surface of the array substrate, it is difficult to make the cut portion completely perpendicular to the main surface of the array substrate. In the array substrate that constitutes the image detection device of the present invention, more accurate bonding is realized by reducing the area where the adjacent array substrates are in contact with each other. That is, as illustrated in FIG. 7, by forming a reverse taper on the side of the attachment surface, misalignment due to the influence of the accuracy of the cut portion is reduced. This reverse taper does not need to be tapered to the surface on the side where the detection circuit is formed, and an end surface of about half may be left. The taper angle is desirably 45 degrees, but this is not a problem unless it is too large or too small.

Now, a plurality of array substrates 102a, 102b, 102c, 102d constituting the image detection substrate 101 will be described.
As a method of bonding, for example, the support substrate 105 may be used as a base, and the array substrates 102 may be sequentially positioned one by one and bonded.

After the alignment of part or all of the array substrate 102 to be bonded is performed, the array substrate 102 may be bonded to the support substrate 105. At this time, the plurality of aligned array substrates 102 are sequentially fixed using, for example, a vacuum chuck or the like.
May be attached. According to this method,
Compared to the case where the array substrates are bonded one by one, the displacement of the array substrates can be prevented, and very efficient assembly can be performed.

The plurality of array substrates 10 are prepared in the manner described above.
After combining with the support substrate 105 and bonding to the support substrate 105, the scanning line and the signal line are connected to a wiring scanning driver 116 on a tape carrier film or a film 117 (TAB film) on which an IC such as a sense amplifier is mounted, respectively.

As a mounting method of each IC, in addition to the connection using the TAB film, a COG (chip on chip) is used.
However, when the circuit on the detection substrate side is formed of non-single-crystal crystalline silicon (poly-Si) material, peripheral circuits, that is, a shift register for driving a scan line, a sense for a read signal line, and the like. An amplifier and the like can be formed at the same time, and the circuit peripheral portion can be further miniaturized (peripheral portion and frame can be reduced).

The connection between such a peripheral circuit and the pixel array is performed at an exposed portion of the outer peripheral portion of the image detection substrate obtained by making the entire size of the image detection substrate 101 larger than that of the support substrate 105. What should I do? In the example of FIG. 5, the scanning line 210 and the scanning line driving circuit 120 of the pixel array of each array substrate are used by using the exposed area.
a, 120b, 120c, and 120d, and the signal line 2
11, and signal line drive circuits 130a, 130b, 130c,
130d.

With such a structure, the connectivity between the pixel array and the scanning lines and signal lines is improved. Also, when a peripheral circuit is formed in this portion by a thin film semiconductor process, the reliability of the formed circuit is improved.

As described above, the image detection apparatus of the present invention can be manufactured by bonding the plurality of array substrates 102 constituting the image detection substrate 101 and the support substrate 105 and connecting them to peripheral circuits. If the strength is insufficient when the plurality of array substrates 102 and the supporting substrate 105 are bonded to each other, the array substrate 102 and the supporting substrate 105 may be fixed to the surface plate 110 having high flatness. Surface plate 110 and image detection board 1
The surface opposite to the surface on which the pixel array No. 01 is formed may be adhered by an appropriate method. However, in order to maintain flatness and to reduce deformation due to thermal expansion, for example, A protective layer 111 may be formed by applying a thin layer of silicon rubber or the like to the panel 110, and the surface plate 110 and the image detection substrate 101 may be pressed through the protective layer 111. After the image detection substrate 101 is fixed to the surface plate 110, the periphery of the image detection substrate may be filled with silicon rubber or the like. In the examples of FIGS. 5 and 6, the ICs connected to the scanning wiring and the readout signal wiring are fixed to the surface plate 110 after connection, but after fixing the image detection board 101 to the surface plate 110, each IC is connected. Alternatively, a circuit board for data processing may be connected.

On the surface plate 110, a circuit board 11 on which various ICs such as the sense amplifier 213 and a driving circuit are formed.
3 are fixed, but these circuit boards 113 are exposed to X-rays when they are exposed. Therefore, a protective cover 114 made of metal or the like may be formed so that X-rays do not enter the peripheral circuit. Reference numeral 115 denotes a terminal for outputting image data to an external circuit.

Next, the image detection board 101 will be described in more detail.

First, the configuration of the circuit pattern of the pixel array 103 of the image detection substrate 101 formed by laminating a plurality of array substrates 102 is as follows. The shape of the circuit pattern forming the pixel is the same in all pixels. Preferably, the same pattern is formed. FIG. 8 is a diagram schematically showing one example of a combination of array substrates constituting an image detection substrate. For example, in order to avoid a mirror symmetric pattern or the like, as shown in FIG.
1 may be formed, and unnecessary lead-out lines may be cut off according to the position where the lead-out lines are stuck. The cut-off unit 182 performs a taper process as described above to create a combined image detection board (FIG. 8).
(B), FIG. 8 (c)).

When an image detection substrate is formed by combining four array substrates as in the image detection devices illustrated in FIGS. 5 and 6, they may be combined with a rotational symmetry of 90 degrees or 180 degrees ( (A and C of FIG.8 (c), B and D).

The positional relationship between the array substrates is precisely bonded so that the pixel arrays are aligned by the above-described method. For example, due to the effect of expansion due to a temperature difference at the time of bonding, a plurality of array substrates may be bonded to each other. Misalignment may occur. Such a displacement can be corrected by software after being output from the image detection device. However, since the misalignment of the array substrates differs depending on the image detection substrates, it is necessary to rewrite the program for each image detection device, which poses a problem in terms of compatibility of the image detection devices.

When a displacement occurs in a combination of a plurality of array substrates, for example, one
When a line shift occurs, all of the imaging detection signals are output one line at a time. The deviation of one line can be set to a level that does not cause a problem by increasing the arrangement density of pixels per unit imaging area and achieving high definition. However, when processing such as image recognition is performed by digital signal processing, the deviation of lines complicates the processing as inherent noise.

When such a displacement occurs, the detection signal of the imaging may be shifted by the amount of displacement of the array substrate, but after the detection signal obtained for the imaging is output from the image detection device. Adding a shift process to the detection signal is complicated.

When an image detection substrate is prepared by laminating a plurality of array substrates, the amount of displacement between the array substrates is determined. Therefore, it is preferable to provide the image detection device itself with a function of correcting positional displacement between the array substrates. For example, when a shift occurs in parallel with the scanning line direction, the connection destination of the read signal of the sense amplifier of the array substrate that is shifted may be shifted by the shift amount to perform signal processing. When the parallel data is sent to an external image processing apparatus as it is, the wiring connection to the processing system may be connected so as to correct the deviation amount.

On the other hand, when sequentially transmitting data as serial data, it is possible to obtain a signal whose positional deviation has been corrected by appropriately shifting the output timing of a shift register for creating serial data. As a reference for the correction timing, a timing at which the output start timing of the image data obtained for each scan is the earliest may be used as a reference. Alternatively, the maximum value of the shift amount may be provisionally predicted in advance, and the shift amount may be used as the output start timing of each scan data. The output timing corresponding to the shift amount of each scan line may be corrected. be able to. Further, for a deviation in the signal line direction, for example, a buffer memory may be connected after the output of the sense amplifier. By correcting the timing by the buffer memory, it is possible to correct the deviation of the readout position of the detection data due to the displacement of the array substrate.

In the above example, the case where the number of array substrates to be bonded is four is taken as an example. However, the number of array substrates to be bonded may be two or more. When five or more array substrates are bonded, it is necessary to use an array substrate in which lead wires must be arranged on only one of the four sides around the pixel array. It can be implemented by devising it. For example, a scanning line driving circuit and a signal line driving circuit are arranged on the same side of an array substrate,
The scanning lines may be bent and wired. In such a case, since the detection signal of imaging is weaker than the scanning signal, it is preferable that the scanning wiring be bent and wired. FIG. 9 is a diagram schematically showing a circuit configuration of an array substrate in which scanning lines and signal lines are drawn out to the same side by bending the scanning lines.

[0076]

According to the present invention, a highly reliable two-dimensional image detection device having a large detection area can be provided without being restricted by the size of the substrate on which the detection element is formed.

According to the image detecting apparatus of the present invention, a high-definition full-size image can be obtained on a large screen. Further, according to the image detection device of the present invention, it is possible to prevent the attenuation of the detection signal and the superposition of noise, and obtain a high-quality image on a large screen. Further, according to the image detection device of the present invention, a highly reliable image suitable for medical use can be obtained on a large screen.
Further, according to the array substrate of the present invention, the arrangement gap of pixels at the bonding surface of the substrate can be reduced, and a high-quality image can be detected even when a plurality of pixels are used in combination.

Further, according to the method of manufacturing an image detection device of the present invention, array substrates can be combined with high accuracy, and high-definition imaging can be obtained on a large screen.

[Brief description of the drawings]

FIG. 1 is a diagram schematically showing a configuration of an image detection substrate of an image detection device according to the present invention.

FIG. 2 is a diagram schematically showing a relationship between an image detection substrate and a support substrate.

FIG. 3 is a diagram schematically showing a configuration of a pixel forming a pixel array.

FIG. 4 is a diagram schematically showing a configuration of a pixel array.

FIG. 5 is a diagram schematically showing a configuration of an image detection device of the present invention.

FIG. 6 is a cross-sectional view schematically showing a configuration of an image detection device according to the present invention.

FIG. 7 is a diagram schematically showing a state of a bonding portion of an array substrate.

FIG. 8 is a diagram schematically showing an example of a combination of array substrates.

FIG. 9 is a diagram schematically showing one example of an array substrate.

FIG. 10 is a diagram schematically showing an example of the configuration of a conventional image detection device.

[Explanation of symbols]

100 image detection device 101 image detection substrate 102a, 102b, 102c, 102d array substrate 103a, 103b, 103c, 103d pixel array 104 image detection region 105 support substrate 106
... Phosphor layer 107 metal thin film 108 protective layer 110 surface plate 111 protective layer 113 circuit board 114 protective cover 115
... Output terminal 116... Wiring scanning driver 117... TAB film 120... Scanning line driving circuit 130... Signal line driving circuit 201... Unit detection circuit (pixel) 202... Photodiode 203. , 204... Drive power supply 2
04 210 scanning line, 211 signal line, 213 output circuit

Claims (5)

[Claims] 1. A pixel array in which pixels having photoelectric conversion elements are formed in a matrix of i rows and j columns, a scanning line for driving the pixel array in rows, and a detection signal from the pixel array in columns. An image detection substrate in which a first array substrate and a second array substrate having signal lines to be read are combined so that a pixel array of each substrate forms a substantially continuous rectangular image detection region; A wavelength conversion unit that is disposed to face the surface of the detection substrate having the pixel array and that is formed to cover the image detection region on the surface that faces the image detection substrate, and that the image detection area is larger than the image detection region. An insulating substrate smaller than the substrate, a scanning line driving unit connected to the scanning line in a region outside a region facing the insulating substrate on a surface of the image detection substrate having the pixel array, and Image detecting apparatus being characterized in that includes a signal line driving means connected with the serial signal line. 2. The end faces of the first array substrate and the second array substrate that are adjacent to each other have a first portion formed on the first surface side, which is in contact with each other, and a second portion formed on the second surface side. The image detection device according to claim 1, further comprising a second portion formed and separated from each other. 3. The scanning line driving unit and the signal line driving unit, wherein a first array substrate and a second array substrate constituting the image detection substrate are arranged such that the first array substrate and the second array substrate When the i-th row of the second pixel array is combined with a shift of the number of pixels Δy, or the j-th column of the first pixel array and the j-th column of the second pixel array are combined with a shift of the number of pixels Δx. And timing correction means for correcting the scan line drive timing or the signal line drive timing of the first pixel array and the second pixel array according to the amount of time required to drive the number of pixels Δx or Δy when The image detection device according to claim 1, wherein: 4. A photoelectric conversion element formed in a matrix of i rows and j columns on an insulating substrate, a pixel having a nonlinear switching element connected to the photoelectric conversion element, and a drive signal applied to the nonlinear switching element. An array substrate having i scanning lines and j signal lines for reading detection signals from the photoelectric conversion elements via the non-linear switching elements, wherein the pixels in the first column and the pixels in the second column Said 1 that is disposed between
A signal line for reading out the detection signal from the pixel in the column or (i-
1) An array substrate including a signal line disposed between a pixel in a column and a pixel in an i-th column for reading out a detection signal from the pixel in the i-th column. 5. A first array substrate and a second array substrate each having a pixel array in which pixels having photoelectric conversion elements are formed in a matrix on a plane, and a pixel array of the first array substrate and a second array substrate. Arranging the pixel array of the array substrate so as to form a substantially continuous rectangular image detection region, and fixing a mutual positional relationship; and a first larger than the image detection region on the insulating substrate. Forming a phosphor layer in a region of the above, and laminating the first and second array substrates and the insulating substrate so that the phosphor layer covers the image detection region. A method for manufacturing an image detection device.