JPH10233571A - Manufacturing method for wiring board, and manufacturing device - Google Patents

Manufacturing method for wiring board, and manufacturing device

Info

Publication number
JPH10233571A
JPH10233571A JP3402697A JP3402697A JPH10233571A JP H10233571 A JPH10233571 A JP H10233571A JP 3402697 A JP3402697 A JP 3402697A JP 3402697 A JP3402697 A JP 3402697A JP H10233571 A JPH10233571 A JP H10233571A
Authority
JP
Japan
Prior art keywords
resist
wiring board
pattern
wiring
permanent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP3402697A
Other languages
Japanese (ja)
Inventor
Mutsusada Itou
睦禎 伊藤
Original Assignee
Sony Corp
ソニー株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp, ソニー株式会社 filed Critical Sony Corp
Priority to JP3402697A priority Critical patent/JPH10233571A/en
Publication of JPH10233571A publication Critical patent/JPH10233571A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452Solder masks

Abstract

PROBLEM TO BE SOLVED: To provide the manufacture of a wiring board which is so arranged that spare solder is made without fail, even if the pattern of the wring to be provided with spare solder is fine, and its manufacturing device. SOLUTION: This manufacture comprises a first process which forms a permanent resist 13 and a resist 14 for requential pattern formation over the entire surface, to a wiring board 10 provided with wiring 12 by conductive pattern, a second process which positions and fixes and retains a pattern mask 15 from above the permanent resist 13 and the resist 14 for pattern formation being formed, to the surface of the wiring board 10, a third process which forms an opening piercing it to one region of the wiring, in the permanent resist 13 and the resist 14 for pattern formation, using the fixed and retained pattern mask 15, and a fourth process which forms spare solder soldered to one region of the wiring, in the opening of the permanent resist 13 and the resist 14 for pattern formation.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method and an apparatus for manufacturing a wiring board.

[0002]

2. Description of the Related Art Conventionally, a so-called wiring substrate in which solder is provided at a predetermined position on a wiring formed by a conductive pattern formed on the surface of a substrate is manufactured as shown in FIGS. 14 to 22, for example. It has become so.

First, in FIG. 14, a wiring board 1 has a wiring 3 formed of a conductive pattern on a flat surface of a base material 2 by a known method. Subsequently, as shown in FIG. 15, a permanent resist 4 is applied over the entire surface of the wiring board 1 by, for example, a printing method. Permanent resist 4
After drying, as shown in FIG. 16, a glass mask 5 is disposed above the wiring substrate 1 at intervals, and light is irradiated from above, so that the portions other than the mask portion 5 a of the glass mask 5 are formed. Exposure of the permanent resist 4 is performed in the corresponding region, and the unexposed portion of the permanent resist 4 is removed by development. Thereby, the permanent resist 4 has
An opening 4a is formed. This opening 4a
Are located near the inner ends of the wirings 3 in the case of FIG.

[0004] Next, as shown in FIG.
A dry film resist 6 for pattern formation is laminated on the permanent resist 4 over the entire surface. Subsequently, as shown in FIG. 18, the glass mask 5 is disposed above the wiring board 1 with an interval therebetween, and light is irradiated from above the glass mask 5, thereby excluding the mask portion 5 a of the glass mask 5. Exposure of the dry film resist 6 is performed in a corresponding region, and unexposed portions of the dry film resist 6 are removed by development. As a result, an opening 6a is formed in the dry film resist 6. Here, the opening 6 a is aligned with the opening 4 a of the permanent resist 4 by accurately positioning the glass mask 5 with respect to the wiring substrate 1.

[0005] Thereafter, as shown in FIG.
On the surface of the dry film resist 6,
The solder cream 7 is squeezed by the squeegee 8. As a result, as shown in FIG.
The opening 4a of the permanent resist 4 and the opening 6a of the dry film resist 6 are filled with the solder cream 7. Subsequently, in a reflow step (not shown), the solder cream 7 is melted and comes into contact with regions corresponding to the openings 4a and 6a of the wiring 3 formed on the base material 2, as shown in FIG. Then, the preliminary solder 7a is formed. Finally, as shown in FIG.
By removing the dry film resist 6 by, for example, melting, the wiring board 1 with the preliminary solder is completed.

[0006]

However, in such a method of manufacturing the wiring board 1, the permanent resist 4
When the openings 4a and 6a of the dry film resist 6 are formed, the same glass mask 5 is used. However, after the exposure for forming the openings 4a of the permanent resist 4 is performed, the glass mask 5 is removed. The glass mask 5 is temporarily retracted and positioned again with respect to the wiring substrate 1 during exposure for forming the opening 6a of the dry film resist 6. Therefore, the openings 4a, 6
When a is a fine pitch, there is a problem that it is difficult to accurately align the opening 4a of the permanent resist 4 with the opening 6a of the dry film resist 6.

For this reason, as shown in FIG. 23, the opening 4a of the permanent resist 4 and the opening 6a of the dry film resist 6 are slightly shifted from each other, and the opening to be filled with the solder cream 7 is required. Part 4a,
A space 9 is formed in a part of 6a. Therefore,
Even if the solder cream 7 is melted by the reflow process, the solder cream 7 with respect to the volume of the openings 4a and 6a
Is relatively small, the amount of the preliminary solder 7a formed on the wiring 3 is not sufficient. Thus, when the wiring 3 has a fine pitch of, for example, 200 μm or less, the wiring board 1 provided with the preliminary solder 7a
However, there has been a problem that it cannot be reliably manufactured.

In view of the above, the present invention provides a method and an apparatus for manufacturing a wiring board which can reliably form a spare solder even when a wiring pattern to be provided with a spare solder is fine. It is intended to provide.

[0009]

According to the present invention, there is provided a first step of sequentially forming a permanent resist and a resist for forming a pattern on a surface of a wiring board provided with wiring by a conductive pattern. On the surface of the wiring board, from the top of the formed permanent resist and the resist for pattern formation, the second step of positioning and fixing and holding the pattern mask, using this fixed and held pattern mask, A third step of forming an opening in the permanent resist and the resist for pattern formation to penetrate a part of the wiring, and soldering a part of the wiring in the opening of the permanent resist and the resist for pattern formation. And a fourth step of forming an attached preliminary solder.

Further, according to the present invention, there is provided a stage for supporting a wiring board on which a permanent resist and a resist for forming a pattern are sequentially formed on a wiring on the surface, and A glass mask fixedly held at predetermined intervals, a sealing member that seals a space between the stage and the glass mask, and an exposure unit disposed on the opposite side of the wiring substrate with respect to the glass mask, Inject the developer into the space formed by the sealing member
This is also achieved by a wiring board manufacturing apparatus provided with a developer supply unit for discharging.

According to the above structure, the resist for pattern formation and the opening of the permanent resist are formed simultaneously or sequentially in a state in which the glass mask is fixedly held on the wiring substrate. The openings of the resist and the resist for pattern formation do not shift from each other, and are formed in a state of being completely coincident with each other. Therefore, a sufficient amount of the preliminary solder is formed in each opening when the preliminary solder is subsequently formed. Thus, even when the pitch of the wiring on the wiring board is fine, the spare solder is reliably formed in a partial region of each wiring.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to FIGS.
The embodiment described below is a preferred specific example of the present invention, and thus various technically preferable limitations are added. However, the scope of the present invention particularly limits the present invention in the following description. The embodiment is not limited to these embodiments unless otherwise stated.

FIGS. 1 to 11 sequentially show the steps in one embodiment of the method for manufacturing a wiring board according to the present invention. First, in FIG. 1, a wiring substrate 10 is formed by forming a wiring 12 with a conductive pattern on a flat surface of a substrate 11 by a known method. Subsequently, as shown in FIG. 2, a permanent resist 13 (for example, a liquid solder paste) is applied over the entire surface of the wiring board 10 by, for example, a printing method.

After the permanent resist 13 is dried, a dry film resist 14 for pattern formation is laminated over the permanent resist 13 over the entire surface of the wiring board 10. Here, the permanent resist 13 and the resist 14 for forming a pattern have different developing methods, and are developed by different developing solutions, and the developing solution for one resist does not act on the other resist. Has become.

Thereafter, as shown in FIG. 4, a glass mask 15 is disposed above the wiring substrate 10 at intervals in an exposure apparatus (not shown), and the glass mask 15 is irradiated with light from above the glass mask. Mask part 15 of mask 15
Exposure of the dry film resist 14 for pattern formation is performed in areas corresponding to areas other than a. In this case, the glass mask 15 is fixed and held in an exposure apparatus, and the exposure is performed by a so-called off-contact method in which a gap is provided at a predetermined interval between the dry film resist 14 and the glass mask 15. Is being done.

After the exposure, a developer for the dry film resist 15 is injected between the glass mask 15 and the wiring substrate 10 as shown by an arrow in FIG. Development takes place,
The exposed portions of the dry film resist 14 are removed, and the openings 14a are formed. This opening 14a
Are located near the inner end of each wiring 12 in the case of the drawing. The developer for the dry film resist 15 is as follows.
As described above, since it does not act on the permanent resist 13,
No change occurs in the permanent resist 13.

Next, as shown in FIG. 6, by irradiating light from above in the same exposure apparatus, the off-contact method is similarly applied to a region other than the mask portion 15a of the glass mask 15. Exposure is performed. In this case, the glass mask 15 remains fixed and held in the exposure apparatus, and the relative position with respect to the wiring substrate 10 does not change at all. Therefore, the light is irradiated into the opening 14a of the dry film 14 by the above exposure, and the permanent resist 13 located below the opening 14a is exposed through the opening 14a.

After the exposure, as shown by the arrow in FIG.
5 and the wiring substrate 10, the permanent resist 13 is developed, and the exposed portion of the permanent resist 13, that is, the opening 14 of the dry film resist 14 is
The portion corresponding to a is removed, and the opening 13a is formed. Here, the openings 13a and 14a are
Since the glass mask 15 is formed while being fixedly held on the wiring board 10, it can be accurately aligned with each other. Since the developer for the permanent resist 13 does not act on the dry film resist 14 as described above, the dry film resist 14 has no influence.

Thereafter, the glass mask 15 is removed,
The wiring board 10 is taken out of the exposure apparatus, but the glass mask 15 only needs to be fixed and held relatively to the wiring board 10 until after the second exposure shown in FIG. May be processed by a conventional developing process.

Next, as shown in FIG. 8, in a preliminary solder printing step, a solder cream 16 is squeezed on the surface of the wiring board 10 from above the dry film resist 14 by a squeegee 17. As a result, as shown in FIG. 9, the solder cream 16 fills the opening 13a of the permanent resist 13 and the opening 14a of the dry film resist 14 in the wiring board 10. Subsequently, in a reflow step (not shown), the solder cream 16 is melted and comes into contact with regions corresponding to the openings 13 a and 14 a of the wiring 12 formed on the base material 11, as shown in FIG. Thus, the preliminary solder 18 is formed. Finally, as shown in FIG. 11, the dry film resist 14 is removed by, for example, melting, so that the wiring board 10 with the preliminary solder is completed.

In this case, the opening 13 of the permanent resist 13
a and the opening 14a of the dry film resist 14
Since the pattern is formed by the glass mask 15 fixed and held relatively to the wiring substrate 10, there is no possibility that mutual positional deviation occurs, and the relative position is completely formed. Become.

FIGS. 12 and 13 show an embodiment of a manufacturing apparatus for performing the exposure step and the development step shown in FIGS. 4 to 7 described above. 12 and 13, the manufacturing apparatus 20 is a wiring board 1 on which the permanent resist 13 and the dry film resist 14 shown in FIG. 3 are formed.
0, a glass mask 22 fixed and held above the stage 21, a sealing member 23 for sealing a space between the stage 21 and the glass mask 22,
And an exposure means disposed above the glass mask 22. Here, the exposure means is not shown,
For example, an exposure apparatus provided with an ultraviolet irradiation means or the like is used.

The stage 21 is formed in a flat plate shape and has a plurality of through holes 21a opened in a region corresponding to the bottom surface of the wiring board 10 mounted on the upper surface. The through hole 21a is connected to a vacuum evacuation system (not shown) so that the stage 21 vacuum-adsorbs and holds the wiring substrate 10 in place.

The glass mask 22 is the same as the glass mask 15 shown in FIGS. 4 to 6, is formed of a flat glass plate, and has a permanent resist 13 and a dry film resist of the wiring substrate 10 on the lower surface thereof. Fourteen pattern forming masks 22a are provided.

The sealing member 23 extends along the peripheral area of the stage 21 and the glass mask 22, as shown in FIG. 12, so as to seal the space formed by the stage 21 and the glass mask 22. Further, the sealing member 23 includes an inlet 23a for introducing a developer for the permanent resist 13 or the dry film resist 14 into the internal space, and an outlet 23b for discharging the developer from the internal space. ing.

According to the manufacturing apparatus 20 configured as described above, the wiring substrate 10 is transported onto the stage 21, and the wiring substrate 10 is moved to the stage 2 by a vacuum exhaust system (not shown).
1 is vacuum-sucked on the upper surface of the device 1 and fixedly held.
Subsequently, the glass substrate 22 is placed on the wiring substrate 10 by using, for example, a CCD camera or the like.
Is accurately positioned with respect to
It is fixed and held on the stage 21.

The dry film resist 14 on the wiring substrate 10 is exposed by irradiating light, for example, ultraviolet rays, from above the glass mask 22 by an exposure device (not shown). Thereafter, a developer for the dry film resist 14 is injected into the internal space from the injection port 23a, and the dry film resist 14 is developed.
After the development is completed, the developer is discharged from the discharge port 23b to the outside.

Next, the permanent resist 13 on the wiring substrate 10 is exposed by irradiating light from above the glass mask 22 again by an exposure device (not shown).
Thereafter, a developer for the permanent resist 13 is injected into the internal space from the injection port 23a, and the permanent resist 13 is developed. After the development is completed, the developer is discharged from the discharge port 23b to the outside. Thus, the dry film resist 14 and the permanent resist 1
3 are formed, and the openings 14a and 13a are formed.

Finally, the glass mask 22 and the sealing member 2
3 is retracted, and the wiring board 10 is taken out of the stage 21. By repeating the above operation, the permanent resists 13 and the dry film resists 14 of the plurality of wiring boards 10 are sequentially patterned. In this case, since the glass mask 22 is relatively fixedly held with respect to the wiring substrate 10 during two exposures and developments, the openings 13a and 14a of the permanent resist 13 and the dry film resist 14 are They will be completely identical to each other.

As described above, according to the above-described embodiment, while the glass mask is fixedly held on the wiring board,
Since the openings for the resist for pattern formation and the openings for the permanent resist are formed simultaneously or sequentially, the openings for the permanent resist and the resist for the pattern formation do not deviate from each other, and are completely It will be formed in the same state. Therefore, a sufficient amount of the preliminary solder is formed in each opening when the preliminary solder is subsequently formed. Thus, even when the pitch of the wiring on the wiring board is fine, the spare solder is reliably formed in a partial region of each wiring.

In the above-described embodiment, a liquid solder paste is used as the permanent resist 13 and a dry film resist is used as the resist 14 for pattern formation. However, the present invention is not limited to this. Clearly, it could be used. In this case, the permanent resist and the resist for pattern formation may be selected to be developed by different developing solutions, or may be developed by the same developing solution. When the permanent resist and the resist for pattern formation are developed by the same developer, the openings of each resist are formed by simultaneous exposure and development.
In the above embodiment, the glass masks 15 and 2 are used.
2, the relative position with respect to the wiring substrate 10 is fixed and held during two exposures and developments of the permanent resist 13 and the pattern forming resist 14 of the wiring substrate 10,
In order for the openings of the respective resists to coincide with each other, the openings need only be fixed and held at least until the second exposure.

[0032]

As described above, according to the present invention, a method of manufacturing a wiring board is provided in which even when a wiring pattern to be provided with a preliminary solder is fine, the preliminary solder is formed reliably. And a manufacturing apparatus can be provided.

[Brief description of the drawings]

FIG. 1 is a plan view and a cross-sectional view illustrating a configuration of a wiring board according to an embodiment of a method of manufacturing a wiring board according to the present invention.

2A and 2B are a plan view and a cross-sectional view illustrating a step of forming a permanent resist on the wiring board of FIG. 1;

3A and 3B are a plan view and a cross-sectional view illustrating a step of forming a pattern forming resist on the wiring board of FIG. 2;

4A and 4B are a plan view and a cross-sectional view showing a step of exposing a resist for pattern formation on the wiring board of FIG. 3;

5A and 5B are a plan view and a cross-sectional view illustrating a step of developing a resist for pattern formation on the wiring board of FIG. 4;

6A and 6B are a plan view and a cross-sectional view illustrating a step of exposing a permanent resist on the wiring board of FIG. 5;

7A and 7B are a plan view and a cross-sectional view illustrating a step of developing a permanent resist on the wiring board of FIG. 6;

8A and 8B are a plan view and a cross-sectional view illustrating a step of squeezing solder cream on the wiring board of FIG. 7;

9A and 9B are a plan view and a cross-sectional view illustrating a state where solder cream is squeezed on the wiring board of FIG. 8;

10A and 10B are a plan view and a cross-sectional view illustrating a state where solder cream is reflowed on the wiring board of FIG. 9;

11A and 11B are a plan view and a cross-sectional view showing a state where a resist for forming a pattern is removed from the wiring board of FIG. 10;

FIG. 12 is a schematic plan view showing one embodiment of a manufacturing apparatus for performing exposure and development of a wiring board according to the present invention.

FIG. 13 is a schematic sectional view showing the manufacturing apparatus of FIG.

14A and 14B are a plan view and a cross-sectional view illustrating a configuration of a wiring board in an example of a conventional method for manufacturing a wiring board.

15A and 15B are a plan view and a cross-sectional view illustrating a step of forming a permanent resist on the wiring board of FIG.

16A and 16B are a plan view and a cross-sectional view showing a step of exposing a permanent resist on the wiring board of FIG.

17A and 17B are a plan view and a cross-sectional view illustrating a step of forming a pattern forming resist on the wiring board of FIG. 16;

18A and 18B are a plan view and a cross-sectional view illustrating a step of exposing a resist for pattern formation on the wiring substrate of FIG. 17;

19A and 19B are a plan view and a cross-sectional view illustrating a step of squeezing solder cream on the wiring board of FIG. 18;

20A and 20B are a plan view and a cross-sectional view illustrating a state where solder cream is squeezed on the wiring board of FIG. 19;

21 is a plan view and a cross-sectional view showing a state where solder cream is reflowed on the wiring board of FIG. 20;

22A and 22B are a plan view and a cross-sectional view showing a state where a resist for forming a pattern is removed from the wiring board of FIG. 21;

FIG. 23 is a partially enlarged cross-sectional view showing displacement of openings of a permanent resist and a resist for pattern formation in the wiring board of FIG. 22;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 ... wiring board, 11 ... base material, 12 ... wiring, 13 ... permanent resist, 13a ... opening part, 1
4 ... Dry film resist (resist for pattern formation), 14a ... Opening, 15 ... Glass mask, 15a ... Mask part, 16 ... Solder cream, 17 ... Squeegee, 18 · ..Preparatory soldering, 20
... Manufacturing apparatus, 21 ... Stage, 21a ... Through hole, 22 ... Glass mask, 22a ... Mask part, 23 ... Sealing member, 23A ... Injection port, 23b
···Vent.

Claims (5)

    [Claims]
  1. A first step of sequentially forming a permanent resist and a resist for forming a pattern on a surface of a wiring board provided with wiring by a conductive pattern; and a permanent resist formed on the surface of the wiring board. And a second step of positioning and fixing the pattern mask from above the resist for pattern formation, and using the fixed and held pattern mask, forming a part of the wiring on the permanent resist and the resist for pattern formation. A third step of forming an opening penetrating to the area of the permanent resist and a fourth step of forming preliminary solder soldered to a partial area of the wiring in the opening of the permanent resist and the resist for pattern formation. A method for manufacturing a wiring board, comprising:
  2. 2. The method according to claim 1, wherein the exposure of the permanent resist and the resist for forming a pattern in the third step is performed by an off-contact method.
  3. 3. The method according to claim 1, wherein in the third step, an opening pattern is first formed on a resist for pattern formation, and then an opening pattern is formed on a permanent resist. 3. The method for manufacturing a wiring board according to claim 1.
  4. 4. A developing solution for removing an unexposed portion of the resist for pattern formation does not act on the permanent resist, and a developing solution for removing the unexposed portion of the permanent resist is formed by a pattern forming method. 2. The method for manufacturing a wiring board according to claim 1, wherein the method does not act on a resist for use.
  5. 5. A stage for supporting a wiring board on which a permanent resist and a resist for pattern formation are sequentially formed from above the wiring on the surface, and glass fixedly held at predetermined intervals on the surface side of the wiring board. A mask, a sealing member that seals a space between the stage and the glass mask, an exposure unit disposed on a side opposite to the wiring substrate with respect to the glass mask, and a space formed by the sealing member. And a developing solution supply means for injecting and discharging the developing solution.
JP3402697A 1997-02-18 1997-02-18 Manufacturing method for wiring board, and manufacturing device Withdrawn JPH10233571A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3402697A JPH10233571A (en) 1997-02-18 1997-02-18 Manufacturing method for wiring board, and manufacturing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3402697A JPH10233571A (en) 1997-02-18 1997-02-18 Manufacturing method for wiring board, and manufacturing device

Publications (1)

Publication Number Publication Date
JPH10233571A true JPH10233571A (en) 1998-09-02

Family

ID=12402867

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3402697A Withdrawn JPH10233571A (en) 1997-02-18 1997-02-18 Manufacturing method for wiring board, and manufacturing device

Country Status (1)

Country Link
JP (1) JPH10233571A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7285734B2 (en) 2003-04-28 2007-10-23 Matsushita Electric Industrial Co., Ltd. Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7285734B2 (en) 2003-04-28 2007-10-23 Matsushita Electric Industrial Co., Ltd. Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same
US7288729B2 (en) 2003-04-28 2007-10-30 Matsushita Electric Industrial Co., Ltd. Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same
US7294532B2 (en) 2003-04-28 2007-11-13 Matsushita Electric Industrial Co., Ltd. Method for manufacturing semiconductor device

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Legal Events

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A300 Withdrawal of application because of no request for examination

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Effective date: 20040511