JPH10228608A - Manufacture of alternate arrangement type multichannel magnetic head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make a gap depth in zero line relation between a reproducing element and a recording element in the same substrate and between lots a prescribed value for the manufacture of the magnetic head arranged alternately with the reproducing element and the recording element. SOLUTION: This magnetic head is so constituted that a recording thin film magnetic head having a lower core 2, an upper core 10, a recording coil 5, a recording magnetic gap and an organic insulating films 4 and 6 for insulating the lower core, the upper core and the coil and a reproducing magneto- resistance effect head having a lower shield 12, an upper shield 20, a magneto- resistance effect element 7 and a reproducing magnetic gap for insulating the magneto-resistance effect element, the lower shield and the upper shield are alternately arranged. In this case, a position of a gap depth Gd=0 of the recording thin film magnetic head and a position of a height of the magneto-resistance effect element MRh=0 are formed in the same process under the same conditions by using the same mask.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates generally to the field of magnetic recording, and more particularly to a magnetic head for use in a storage device having a magnetic medium having multiple parallel channels of data.

[0002]

2. Description of the Related Art Bi-directionally traveling magnetic tape storage devices are already well known. As described in JP-A-4-358307, a magnetic head employed in such a magnetic tape storage device has recording elements and reproducing magnetoresistive elements alternately arranged on a magnetic substrate. 2. Description of the Related Art A magnetic head formed by bonding magnetic blocks is known. As the recording density of the magnetic head increases, it is expected that the magnetic substrate and the magnetic block will be considered to be replaced with magnetic thin films having high magnetic permeability in the future. In this case, the recording thin-film element structure adopted is a structure as described in JP-A-59-79414, and the gap depth of the recording head is such that the gap length of the recording thin-film element is increased from the medium floating surface. Up to the part. Therefore, the gap depth Gd = 0 of the recording head
The position (hereinafter, Gd = 0 position is described as a gap depth zero line of the recording head) is determined by the end face of the insulating film for insulating the coil from the upper magnetic thin film on the medium flying surface side. . The magnetoresistive element for reproduction has a structure in which a magnetoresistive element as described in Japanese Patent Application Laid-Open No. 50-59023 is sandwiched by a shield film via an insulating film that determines a gap length for reproduction. In the reproducing head having such a structure, the reproducing characteristics are largely influenced by the element height MRh of the magnetoresistive element from the air bearing surface. (Hereinafter, the element height MR of the magnetoresistive element from the air bearing surface of the medium)
h is described as the gap depth of the reproducing head, and MRh = 0
The position is described as a gap depth zero line of the reproducing head. )

[0003]

When a recording thin film element and a reproducing magnetoresistive element are formed on the same plane,
If the conventional method is directly used as a method for determining each gap depth zero line, the following problem occurs. The first problem is that the step of forming the zero gap depth line of the recording head and the step of forming the zero gap depth line of the reproducing head in the same substrate are different, and the gap depth between the recording head and the reproducing head is different. Due to the misalignment of the mask in the zero line forming step and the pattern expansion / contraction during the formation of each pattern for determining the zero gap depth line, the gap depth between the recording head and the reproducing head is several μm. Variations occur. When the substrate on which the recording thin-film element and the reproducing magnetoresistive element are completed on the same surface is subjected to gap depth processing by machining or the like, the gap depth of the recording head is set to a predetermined value. When the value is set to a value, the gap depth of the reproducing head does not reach a predetermined value due to the variation of the zero line of the gap depth between the recording head and the reproducing head, and the variation occurs. Further, when the gap depth of the reproducing head is set to a predetermined value, the gap depth of the recording head does not reach the predetermined value due to the variation of the gap depth zero line between the recording head and the reproducing head. Will occur. Further, the second problem is that, for each substrate and each lot, for the same reason as described above, the gap depth zero line of the recording head and the gap depth zero line of the reproducing head vary. Occurs. Then, when gap depth processing is performed by mechanical processing or the like on the substrate, which has varied between substrates and lots, when the gap depth of the recording head is set to a predetermined value, the recording head Due to the variation of the zero line of the gap depth of the reproducing head, the gap depth of the reproducing head does not become a predetermined value and varies. Further, when the gap depth of the reproducing head is set to a predetermined value, the gap depth of the recording head does not reach the predetermined value due to the variation of the gap depth zero line between the recording head and the reproducing head. Will occur. Due to the above two problems, the gap depth of the recording head or the reproducing head greatly differs from a predetermined value, which causes variation in recording characteristics and reproducing characteristics.

[0004]

The above object can be attained by employing a manufacturing method in which a gap depth zero line between a recording head and a reproducing head is formed in the same step. As a specific method, an insulating film forming step of determining a zero gap depth line of the reproducing head and a zero gap depth line of the recording head is performed by using a manufacturing method in which the insulating film is formed using the same conditions and the same mask. is there. This makes it possible to form the relationship between the gap depth zero line between the recording head and the reproducing head, which is determined at the time of element formation, within a range of several tens to several hundreds of nm with respect to a predetermined value with high accuracy. Thus, it is possible to reduce the deviation of the gap depth zero line between the recording head and the reproducing head in the substrate and for each lot during element formation.

[0005]

FIG. 1 is a plan view of a completed interleaved magnetic head according to the present invention. 2 to 7 show a plan view and a cross-sectional view of the present invention in the course of manufacturing.

FIG. 3 is a sectional view taken along lines AA and BB in FIG. A magnetic material (permalloy, etc.) is placed on the substrate 1 shown in FIG.
Is formed on the entire surface to a thickness of several μm by sputtering or plating. Thereafter, as shown in FIG. 2, a photolithographic technique or a photolithography technique is used so that the magnetic shield of the reproducing element has the shape of the lower shield 12 and the magnetic core of the recording element has the shape of the lower core 2. It is formed by ion milling or the like. In order to form a first gap 3 for reproduction and recording as shown in FIG. 3, alumina, silicon oxide, or the like is formed over the entire surface by sputtering to a thickness of several hundred nm. Next, in order to insulate the lead-out conductor 15 for reproduction from the lower shield 12 and to insulate the recording coil 5 from the lower core 2, the organic insulating film 4 is formed into a shape as shown in FIG. Is formed to a thickness of several hundred nm using a photolithography technique. After a good electric conductor (gold or copper, etc.) is formed on the entire surface with a thickness of several μm by sputtering or plating or the like, the reproducing element portion has a shape similar to the lead conductor 15 as shown in FIG. The recording element portion is formed by a photolithography technique or ion milling so as to have a shape like the coil 5. Next, the lead conductor 15 for reproduction is used.
And an insulating layer for isolating the recording coil 5 from the upper shield 20 or the upper core 10 and determining the gap depth zero line of the reproducing element and the gap depth zero line of the recording element. The insulating film 6 is coated on the entire surface to a thickness of several μm to several tens μm by a method such as spin coating, and is formed into a shape as shown in FIG. In FIG. 2, the zero gap depth line between the reproducing element and the recording element is formed as the same. However, in order to secure the recording / reproducing characteristics, the zero gap depth line between the reproducing element and the recording element is set in advance. In the case where it is necessary to shift, a mask having a shape in consideration of the amount is used. Next, only in the reproducing element part,
Permalloy or the like having a magnetoresistance effect is several tens of nm, and a bias film for applying a bias thereto is several tens of nm.
After forming a film over the entire surface to a thickness of several hundred nm, the magnetoresistive element 7 having a shape as shown in FIG. 2 is formed. Further, as shown in FIGS. 2 and 3, a protective film 8 (alumina or silicon oxide or the like) for removing the organic insulating film 6 only in the reproducing element portion and leaving the organic insulating film 6 only in the recording element portion. An insulating film or a high-resistance film such as titanium, niobium, molybdenum or chromium) is formed on the entire surface by sputtering or the like to a thickness of several nm to several tens of nm, and then a photolithographic technique is formed into a shape as shown in FIG. And an ion milling technique or a sputter etching technique.

In this step, it is necessary to prevent damage to the magnetoresistance effect element 7 formed earlier. As a method therefor, for example, there is a lift-off method using a photolithography technique, a method using an ion milling technique or a sputter etching technique. When using an ion milling technique or a sputter etching technique, it is effective means to employ a reactive etching method using a reactive gas. After forming the protective film 8 only on the recording element portion by the above method,
By dissolving the organic insulating film 6 of only the reproducing element portion with a solvent, a removing solution, or the like, several tens nm to several hundreds nm formed on the organic insulating film 6 of several μm to several tens μm.
Is removed at the same time as the organic insulating film 6.

Next, as an effective means for reliably and accurately removing the magnetoresistive element 7 on the organic insulating film 6 shown in FIG. 3, the following method can be considered. The first plan is
In this method, the substrate formed up to the protective film 8 is put into an ultrasonic layer containing a solvent or a removing solution for dissolving the organic insulating film 6, and the organic insulating film 6 is dissolved while applying physical force. The second plan is a method of dissolving the organic insulating film 6 while rotating the substrate on which the protective film 8 is formed and spraying a solvent or a removing liquid or the like for dissolving the organic insulating film 6 thereon. . FIGS. 4 and 5 show the organic insulating film 6 and the magnetoresistive element 7 on the organic insulating film 6 removed at the same time as described above. FIG. 5 shows AA and B- in FIG.
It is sectional drawing of B.

Next, in order to form a second gap 9 for reproduction and recording, as shown in FIG.
m. And the lower shield 12 of the reproducing element.
, A back gap 21 for connecting the upper shield 20, a back gap 11 for connecting the lower core 2 of the recording element and the upper core 10, and a photolithography technique and an ion milling technique. Is used to simultaneously etch the second gap 9, the organic insulating film 4, and the first gap 3. On top of this, a magnetic material (permalloy, etc.)
After forming a film having a thickness of several μm over the entire surface by sputtering or plating, the upper shield 20 of the reproducing element and the recording element are formed by photolithography or ion milling in order to obtain the shape shown in FIG. The upper core 10 is formed. FIG. 7 is a sectional view of AA and BB in FIG.

Finally, although not shown in the figure, an alumina film for protecting the reproducing element and the recording element is provided with a thickness of several tens of μm thereon to eliminate a step between the reproducing element and the recording element. Therefore, in the substrate state, the surface of the protective alumina film is wrapped to complete an alternately arranged magnetic head substrate.

As described above, the completed substrate is cut by machining, and after attaching the protection block 30,
The medium air bearing surface is ground and lapped to perform gap depth processing to complete an interleaved magnetic head as shown in FIG.

[0012]

By using the above-described manufacturing method, it is possible to simultaneously form a zero gap depth line between the reproducing element and the recording element. As a result, the gap depth between the reproducing head and the recording head can be set to the same or a predetermined shift amount, and the gap depth can be precisely formed as designed. Therefore, the influence of the gap depth between the reproducing head and the recording head is small,
An alternately arranged magnetic head having stable reproduction and recording characteristics can be provided.

[Brief description of the drawings]

FIG. 1 is a plan view of an alternating magnetic head element.

FIG. 2 is a plan view of a reproducing element and a recording element during a manufacturing process 1;

FIG. 3 is a cross-sectional view of a reproducing element and a recording element during a manufacturing process 1;

FIG. 4 is a plan view of a reproducing element and a recording element during a manufacturing process 2;

FIG. 5 is a cross-sectional view of a reproducing element and a recording element during a manufacturing process 2;

FIG. 6 is a plan view of a reproducing element and a recording element during a manufacturing process 3;

FIG. 7 is a cross-sectional view of a reproducing element and a recording element during a manufacturing process 3;

FIG. 8 is a perspective view of an alternate arrangement type magnetic head.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Substrate, 2 ... Lower core, 3 ... 1st gap, 4, 6 ...
Organic insulating film, 5 ... Coil, 7 ... Magnetoresistance effect element, 8 ...
Protective film, 9 second gap, 10 upper core, 11
Back gap for recording, 12 lower shield, 15 lead conductor, 20 upper shield, 21 back gap for reproduction, 30 protection block

Claims (6)

[Claims] 1. A recording thin-film magnetic head having an organic insulating film for insulating the lower core, the upper core, the recording coil, the recording magnetic gap, the lower core, the upper core, and the coil, A reproducing magnetoresistive head having a reproducing magnetic gap for insulating the shield, upper shield, and magnetoresistive element, and insulating the magnetoresistive element from the lower shield and the upper shield. In the magnetic heads arranged alternately, the position of the gap depth Gd = 0 of the recording thin film magnetic head and the position of the magnetoresistive element height MRh = 0 of the reproducing magnetoresistive head are formed in the same step. A method for manufacturing an alternately arranged multi-channel magnetic head, characterized by the following. 2. The method of manufacturing a magnetic head according to claim 1, wherein the gap depth Gd of the recording thin-film magnetic head is adjusted.
= 0 position and the MRh = 0 position of the magnetoresistive element of the magnetoresistive head for reproduction use an organic insulating film for insulating the upper core of the thin-film magnetic head for recording from the coil. A method for manufacturing an alternating arrangement type multi-channel magnetic head. 3. The method of manufacturing a magnetic head according to claim 2, wherein said organic insulating film of said recording thin-film magnetic head is simultaneously formed on said recording thin-film element portion and said reproducing magneto-resistance effect element portion under the same conditions and simultaneously. It is formed using a mask, the thin film element for recording leaves the organic insulating film, determines the position of the gap depth Gd = 0 of the thin film magnetic head for recording, and the magnetoresistive element for reproducing reads the organic insulating film. A method for manufacturing an interleaved multi-channel magnetic head, wherein the position of the magnetoresistive element height MRh = 0 of the reproducing magnetoresistive head is determined by removing the magnetic head. 4. The method of manufacturing a magnetic head according to claim 2, wherein the gap depth Gd of the recording thin-film magnetic head is set.
Forming a protective film for protecting the organic insulating film of the recording thin-film magnetic head, which is used for determining the position of the magnetoresistive element of the reproducing magnetoresistive head and the height MRh of the magnetoresistive element of the reproducing magnetoresistive head. A method for manufacturing an alternately arranged multi-channel magnetic head, comprising: 5. The method of manufacturing a magnetic head according to claim 4, wherein an inorganic insulating film is employed as a protective film material for protecting the organic insulating film. A method for manufacturing a magnetic head. 6. A method for manufacturing a magnetic head according to claim 4, wherein a high-resistance conductive film is used as a protective film material for protecting said organic insulating film. A method for manufacturing a channel magnetic head.