JPH098191A - Power semiconductor device - Google Patents

Abstract

PURPOSE: To make it possible to selectively set an external lead electrode even at any position of a case corresponding to an electrode pad, to largely standardize the case and to largely save a casting mold expense. CONSTITUTION: In the power semiconductor device having one or more semiconductor elements in a case member, the member 10 has a square-shaped opening 10A at the upper surface, a plurality of cutouts 10B are formed at substantially predetermined interval at one pair of opposed sides of the opening, the terminal members 15 for carrying external lead terminals 14 connected to the elements have toothed parts 15C penetrating a plurality of cutouts, and the toothed parts of the terminal members are inserted into the corresponding cutouts in response to the connecting positions of the external lead electrodes and positioned.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a power semiconductor device, and more particularly to a structure in which the position of an external lead electrode terminal can be freely set with respect to a case member.

[0002]

2. Description of the Related Art Generally, a power semiconductor device is disclosed in Japanese Patent Publication No.
As disclosed in Japanese Patent Publication No. 49541, there are many cases in which a resin case is combined with a metal base as a bottom and various external lead electrode terminals are drawn from the case. An example of incorporating a pair of power semiconductor elements will be described with reference to FIG. 5. A ceramic substrate 2 is soldered on a metal base 1, and a pair of copper electrode plates 3 is further soldered on it. A molybdenum plate 4 is soldered on each copper electrode plate 3, and a power MOSFET element 5 is placed and fixed on each molybdenum plate 4. Further, a drain electrode 7, a source electrode 8, a gate electrode 9 and the like are provided on the copper electrode plate 3 via a ceramic plate 6.

External lead-out electrode terminals 11, 12 and 13 respectively connected to the drain electrode pad 7, the source electrode pad 8 and the gate electrode pad 9 are fixed in advance to the resin case 10, and the case 10 is assembled to a metal base. The external extraction electrode terminals 11, 12 and 13 are soldered to the drain electrode pad 7, the source electrode pad 8 and the gate electrode pad 9, respectively, by covering 1 and performing heat treatment. Regarding the soldering of the drain electrode pad 7, the source electrode pad 8, the gate electrode pad 9 and the external lead electrode terminals 11, 12, and 13, respectively,
In this way, the external lead electrode terminals 11, 12, 1 are attached to the case.
External lead-out electrode terminal 1 without fixing 3 in advance
External lead electrode terminals 11, 12, 13 are preliminarily soldered to the drain electrode pad 7, the source electrode pad 8, and the gate electrode pad 9, respectively.
The method of covering the case by passing it through the rectangular hole of the case is also widely used.

[0004]

However, in the power semiconductor device having such a structure, all of the external extraction electrodes are selected depending on the current capacity of the mounted semiconductor elements, the number of the semiconductor elements, or the type of connection that determines the circuit configuration. The position is different. Also, from the relationship of incorporation into the applicable circuit,
There are quite a few cases where the position of the external lead electrode terminal must be changed even with the same structure. Therefore, depending on the current capacity of the semiconductor element, the number of wires, the type of wiring that determines the circuit configuration, etc., the position of the slit for drawing out the external extraction electrode from the inside of the case to the outside must be set for each case, and all cases have to be changed. It was For this reason, there are many types of cases, and the cost of the mold for making the cases is very high.

The main object of the present invention is to provide a power semiconductor device which solves the above-mentioned conventional problems and has a special case and a terminal member in which an external extraction electrode can be set at any position. .

[0006]

In order to solve the above-mentioned problems, the first invention is a power semiconductor device having one or more semiconductor elements in a case member, wherein the case member has a top surface. A terminal member having a shaped opening and having a plurality of cuts formed at substantially constant intervals on a pair of opposite sides of the opening, and the terminal member carrying an external lead electrode connected to the semiconductor element is in the plurality of cuts. There is provided a power semiconductor device comprising a tooth portion, wherein the tooth portion of the terminal member is inserted into a corresponding notch and positioned according to a connection position of the external extraction electrode.

In order to solve the above-mentioned problems, the second invention is a power semiconductor device having one or more semiconductor elements in a case member, wherein the case member has a rectangular opening on the upper surface. A plurality of holes are formed at a substantially constant interval along a pair of opposite sides of the opening, and a terminal member carrying an external lead electrode connected to the semiconductor element is a plurality of engaging with the plurality of holes. And a projection part of the terminal member corresponding to a connection part of the external extraction electrode, the projection part of the terminal member being engaged and positioned. It is a thing.

In order to solve the above-mentioned problems, the third invention is a power semiconductor device having one or more semiconductor elements in a case member, wherein the case member has a rectangular opening on the upper surface. , A plurality of protrusions are formed at substantially constant intervals along a pair of opposite sides of the opening, and a terminal member carrying an external lead electrode connected to the semiconductor element has a recess or hole for receiving the plurality of protrusions. According to another aspect of the present invention, there is provided a power semiconductor device, characterized in that the protrusion is inserted into a corresponding concave portion or hole portion of the terminal member and positioned according to a connection position of the external lead electrode.

In order to solve the above-mentioned problems, a fourth aspect of the present invention relates to a method of assembling a power semiconductor device having one or more semiconductor elements in a case member, wherein the power semiconductor devices are mutually related at predetermined intervals. A case member that can be fitted,
A terminal member carrying an external extraction electrode connected to the semiconductor element is prepared, and after housing the semiconductor element in the case member, an external extraction electrode connected to the semiconductor element from the outside of the case member. A method for assembling a power semiconductor device, characterized in that the tip portion is inserted into the case member, and then the case member and the terminal member are engaged with each other to align the connection terminals. .

[0010]

Embodiments of the present invention will be described below with reference to the drawings. In FIG. 1, the same symbols as those shown in FIG. 5 indicate corresponding members. A case 10 made of synthetic resin, which is combined with an electrically insulating substrate (not shown) fixed on the metal substrate 1 which also serves as a heat sink, has a rectangular opening 10A on its upper surface. A large number of notches 10B are formed in the pair of opposing longitudinal sides of the opening 10A at right angles from the opening 10A at regular intervals.
The notch 10B has a width of 1 mm and an interval of 1 m, for example.
m, and the depth is about 4 mm. Here, although the cut 10B will be described later, it also functions as a scale for positioning the external extraction electrode.

Next, a description will be given of the terminal members 15 carrying the respective external extraction electrodes 14 which can be engaged with the cuts 10B. These are substantially rectangular parallelepiped-shaped and have the same structure as the case 10. Often made of the same material. Each terminal member 15 has a dimension longer than the distance between the cuts 10B so as to bridge the cuts 10B on both sides of the opening 10A of the case 10, and the external extraction electrodes 14 are inserted on both sides in the longitudinal direction. Each has a pair of slits 15A that can be formed. The central portion has a hole 15B for a bolt (not shown). On the lower surface of each terminal member 15, a pair of tooth portions 15C that can be engaged with the cuts 10B are provided at both ends in the longitudinal direction.

Here, each external extraction electrode 14 is similar to a normal one, and has a connecting electrode portion 14A soldered to an electrode pad (not shown) at its tip, and the tip on the opposite side thereof. The portion has a mounting hole 14B. The external extraction electrode 14 has a mounting hole 14B.
After inserting the slit 15A of the terminal member 15 from the side,
It can be bent at a right angle at a predetermined place. When bent in this manner, the mounting hole 14B coincides with the hole 15B for the bolt (not shown) of the terminal member 15.

Therefore, the external extraction electrode 14 and the terminal member 15 are assembled with each other as shown before being attached to the case 10, and thereafter, the terminal member 15 is inserted into a predetermined N-th cut 10B from the right or left side. The tooth portion 15C is fitted and inserted. The tooth portion 15C of the other terminal member 15 is also fitted into the notch 10B of the case 10 in the same manner. The position of the notch 10B into which the tooth portion 15C of the terminal member 15 is fitted is determined by the position on an electrode pad (not shown).

That is, in this embodiment, after the case 10 is covered with the electrically insulating substrate to which the semiconductor element is fixed, the external lead electrode 14 is formed by utilizing the notch 10B of the case 10.
It is characterized in that the terminal member 15 is fixed to the case 10, and the position of the electrode pad can be dealt with only by aligning the terminal member 15 according to the position of the electrode pad.

Next, a method of assembling this power semiconductor device will be described with reference to FIG. Electrode pads 8'are formed on an electrically insulating substrate 2 such as a ceramic substrate which is previously fixed to a metal fin 1 such as a copper material,
The semiconductor element 5 is fixed on the electrode pad 8 '. The case 10 having the above-described structure is placed on the metal fin 1. Although not shown,
The metal fin 1, the electrically insulating substrate 2 and the case 10 are structured to maintain a fixed positional relationship. Further, on the upper surface of the case 10, a symbol 16 such as a mark or a number is attached to each of the five or ten cuts 10B in order to make it easy to understand where the cuts 10B are located.

On the other hand, each external extraction electrode 14 is bent in advance through the slit 15A of the terminal member 15 along the dotted line as shown in FIG.
Solder paste is formed on 4A. Here, when the case 10 is covered with the metal fin 1 and the electrically insulating substrate 2 and is in a fixed positional relationship, the position to which each connection electrode portion 14A of the electrode pad 8 ′ or the like is connected is predetermined, and for example, First external extraction electrode 1
The connection electrode portions 14A of No. 4 are positioned such that the left or right elongated tooth portions 15C of the terminal member 15 are inserted into the notches 10B of the number symbols 16 and the notches 10B.
The same applies to the connection electrode portion 14A of the other external extraction electrode 14.

Therefore, by inserting the tooth portion 15C of each terminal member 15 into each predetermined notch 10B, the connection electrode portion 14A of the external extraction electrode 14 supported by each terminal member 15 is predetermined. Will be located on the electrode pad of. By performing heat treatment in this state, the connection electrode portion 14A of each external extraction electrode 14 is soldered to the electrode pad. Then, if necessary, the semiconductor element 5 is made of a gel-like electrically insulating material.
Etc. are protected, and mold resin is further injected into the case 10 to be cured. After the molding resin is hardened, a bolt (not shown) is attached to the mounting hole 14B for the external extraction electrode 14.
Then, the external lead-out electrode 14 is fixed to the terminal member 15 by screwing it into the bolt hole 15B of the terminal member 15 for completion.

Next, another embodiment of the terminal member 15 will be described with reference to FIG. This terminal member 15A is provided with three holes 15B for bolts (not shown) for attaching the external extraction electrodes 14 shown in FIG. 1 along a straight line along the central longitudinal direction. Three slits 15A for inserting the external extraction electrode 14 are provided on both sides in the longitudinal direction of the three bolt holes 15B, and one slit 15A is provided at both longitudinal end portions. Figure 1 on the back
As described above, the pair of tooth portions 15C fitted into the notches 10B of the case 10 are provided at both ends in the longitudinal direction. The hole 15B for the bolt is formed by a metal nut screwed with a bolt (not shown), and the metal nut is the terminal member 1
5 is embedded in the terminal member 15 at the time of molding, and the slit 15A and the tooth portion 15C are simultaneously formed at the time of molding the terminal member 15.

In the terminal member 15 having such a structure, the holes 15B for the three bolts located on the outermost side are provided with the slits 15A on three sides around the holes 15B, so that the holes 15B for the bolts are formed. The external extraction electrode 14 that can be inserted through any of the three slits 15A surrounding the
4B (FIG. 1) can be aligned and mounted. Further, in the case of the bolt hole 15B located in the center, the slits 15A are present on both sides, and it is possible to correspond to the external extraction electrode 14 which is inserted through any of the slits 15A. Therefore, according to the terminal member of this embodiment, it is possible to cope with various electrode pads (not shown) only by selecting the slit 15A, and it is not necessary to prepare many kinds of terminal members.

Next, another embodiment of the present invention will be described with reference to FIG. In this embodiment, in place of the cuts 10B of the case 10, a plurality of recesses or holes 10C are provided at the same positions as the cuts 10B. On the other hand, the terminal member 15 includes, instead of the tooth portion, a protrusion 15D capable of receiving the concave portion or the hole portion 10C of the case 10. The protrusion 10D has a length of about several mm to 5 mm, and has a structure in which it becomes thicker from the tip to the root. Therefore, the recessed portion or hole portion 1 of the case 10 is fitted to the predetermined protrusion 10D of the terminal member 15.
By aligning and pushing 5C, it is possible to align and engage as in the embodiment shown in FIG.

Although not shown, as another embodiment, a portion having a width of about several mm, for example, about 5 mm thicker than the other upper surface is formed on the upper surface along the periphery of the opening 10A of the case 10, and FIG. A structure having a cut similar to the above is also conceivable.

As another embodiment, the reverse of the embodiment shown in FIG. 4, that is, the upper surface of the case 10 along the periphery of the opening 10A is provided with a protrusion, and a recess or hole into which the protrusion is fitted is formed in the terminal member 15.
A structure provided on the lower surface of is also conceivable.

In the above embodiment, when the mold resin is injected until it reaches the lower surface of the terminal member 15, there is no creeping surface between the mold resin and the terminal member 15.
On the exposed surface, irregularities are formed by the terminal member 15 and the surface of the mold resin, and the creeping distance between the adjacent external extraction electrodes 14 can be increased. This is further achieved by making the case 10 as thin as possible and making the thickness of the terminal member 15 thicker, and makes the electric insulation between the adjacent external extraction electrodes 14 on the exposed surface larger.

Further, in the above embodiment, the tooth portion 15C of the terminal member 15 is formed of the same material at the same time when the main body portion is molded, but the tooth portion 15C of the terminal member 15 may of course be formed of a metal plate. In this case, one metal plate is provided at the center of each end of the terminal member 15, and the desired mechanical strength can be obtained even with the teeth.

Further, when the terminal members 15 are separated as shown in FIG. 1, the terminal members 15 can be made of a metal material, and a metal having good conductivity such as copper can be used to form the external extraction electrode. If the 14 and the terminal member 15 are integrally molded, the assembly is further simplified. Note that depending on the thickness of the ceiling of the case, the notch of the case shown in FIG. 1 does not necessarily have to penetrate to the bottom, and if the lower side is closed, it acts as a stopper for the tooth portion of the terminal member.

[0027]

As described above, according to the present invention, it is possible to provide a power semiconductor device in which the external lead electrode can be selectively set at any position of the case corresponding to the electrode pad. This allows for significant standardization of the case and significant savings in mold cost.

Further, the external extraction electrodes can be set in any number and at any position, and the case also serves as a solder jig for the external extraction electrodes, so that the solder jig can be omitted. Is big.

[Brief description of drawings]

FIG. 1 is a diagram showing an embodiment of a power semiconductor device according to the present invention.

FIG. 2 is a diagram for explaining assembly and the like of the power semiconductor device according to the present invention.

FIG. 3 is a diagram showing an example of a terminal member used in the power semiconductor device of the present invention.

FIG. 4 is a diagram for explaining another embodiment of the present invention.

FIG. 5 is a diagram for explaining an example of a conventional semiconductor device.

[Explanation of symbols]

 1 ... Metal fin 2 ... Electrically insulating substrate 5 ... Semiconductor element 10 ... Case 10A ... Opening 10B ... Slit 14 ... External extraction electrode 15 ...・ Terminal member 15A ・ ・ ・ Slit 15C ・ ・ ・ Tooth portion 16 ・ ・ ・ ・ Symbol

Claims (4)

[Claims] 1. A power semiconductor device including one or more semiconductor elements in a case member, wherein the case member has a rectangular opening on an upper surface, and the pair of opposite sides of the opening are provided at substantially regular intervals. A terminal member having a plurality of cuts and carrying an external lead electrode connected to the semiconductor element includes a tooth portion that enters the plurality of cuts, and a tooth of the terminal member is provided according to a connection position of the external lead electrode. A power semiconductor device characterized in that parts are inserted into corresponding notches and positioned. 2. A power semiconductor device including one or more semiconductor elements in a case member, wherein the case member has a rectangular opening on an upper surface thereof, and the opening is substantially constant along a pair of opposite sides of the opening. A plurality of recesses or holes are formed at intervals, and a terminal member carrying an external extraction electrode connected to the semiconductor element has a projection that engages with the plurality of recesses or holes. A power semiconductor device, characterized in that the projection is engaged with a corresponding recess or hole of the terminal member to be positioned in accordance with a connection position. 3. A power semiconductor device including one or more semiconductor elements in a case member, wherein the case member has a rectangular opening on an upper surface, and is substantially constant along a pair of opposite sides of the opening. A terminal member having a plurality of protrusions formed at intervals and carrying an external lead electrode connected to the semiconductor element includes a recess or a hole for receiving the plurality of protrusions, and the protrusion is formed according to a connection position of the external lead electrode. A power semiconductor device is characterized in that the power semiconductor device is inserted into a corresponding recess of the terminal member and positioned. 4. A method of assembling a power semiconductor device, comprising one or more semiconductor elements in a case member, wherein the case member is engageable with each other at preset intervals, and is connected to the semiconductor element. A terminal member carrying an external extraction electrode is prepared, and the semiconductor element is housed in the case member, and then the tip portion of the external extraction electrode connected to the semiconductor element from the outside of the case member is placed inside the case member. A method for assembling a power semiconductor device, characterized in that the case member and the terminal member are engaged with each other to align the connection terminals.