JPH0973740A - Magnetic head assembly and magnetic disk device using the same - Google Patents
Magnetic head assembly and magnetic disk device using the sameInfo
- Publication number
- JPH0973740A JPH0973740A JP22873495A JP22873495A JPH0973740A JP H0973740 A JPH0973740 A JP H0973740A JP 22873495 A JP22873495 A JP 22873495A JP 22873495 A JP22873495 A JP 22873495A JP H0973740 A JPH0973740 A JP H0973740A
- Authority
- JP
- Japan
- Prior art keywords
- arm
- fpc
- head assembly
- magnetic head
- magnetic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、磁気ディスク装置
で使用される磁気ヘッド組立体と磁気ディスク装置に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a magnetic head assembly used in a magnetic disk device and a magnetic disk device.
【0002】[0002]
【従来の技術】磁気ディスク装置の磁気ヘッド組立体に
は、スライダとサスペンション、およびそれを保持し、
所定の位置へ輸送するアームとが含まれる。スライダに
は、磁気媒体上の磁気記録を電気信号に変換する電磁変
換素子が含まれる。電気信号はフレキシブルプリントサ
ーキット(FPC)を介し伝達される。FPCは、アー
ム上に接着剤層を介し固着され、FPCの導電パターン
のうちGNDパターン(接地パターン)とアームはネジ
またはピンを介して電気的に接続され、FPCのGND
パターンとアームを同電位に保つことにより磁気回路お
よび電気回路の信頼性を高めている。2. Description of the Related Art A magnetic head assembly of a magnetic disk device holds a slider, a suspension, and a suspension,
An arm for transporting to a predetermined position. The slider includes an electromagnetic conversion element that converts magnetic recording on the magnetic medium into an electric signal. The electric signal is transmitted via a flexible printed circuit (FPC). The FPC is fixed on the arm via an adhesive layer, and the GND pattern (ground pattern) of the conductive pattern of the FPC and the arm are electrically connected via a screw or a pin, and the GND of the FPC is connected.
By keeping the pattern and the arm at the same potential, the reliability of the magnetic circuit and the electric circuit is improved.
【0003】[0003]
【発明が解決しようとする課題】この従来技術では、磁
気ディスク装置操作時に、磁気ヘッド組立体を取り巻く
雰囲気温度が60〜80度に上昇するため、磁気ヘッド
組立体の誤動作および磁気媒体上への磁気記録の誤情報
の書き込みなど、信頼性の低下を招いていた。In this prior art, since the ambient temperature surrounding the magnetic head assembly rises to 60 to 80 degrees during the operation of the magnetic disk device, the magnetic head assembly malfunctions and the magnetic medium is exposed to the magnetic medium. This leads to a decrease in reliability such as writing incorrect information in magnetic recording.
【0004】その理由を以下に記す。磁気ディスク装置
内部は操作時にかなりの高温下となるため、FPCとア
ームとを固着している接着剤層が溶融、流れ出す。その
結果、接着剤が導通媒体としているネジまたはピンとア
ーム穴との隙間を埋めてしまい、両者間が導通不良とな
る。The reason will be described below. Since the inside of the magnetic disk device is exposed to a considerably high temperature during the operation, the adhesive layer fixing the FPC and the arm is melted and flows out. As a result, the adhesive fills the gap between the screw or pin used as the conduction medium and the arm hole, resulting in poor conduction between the two.
【0005】本発明は、以上のような問題がなく、高温
環境下においても、FPCとアームとの電気的接続を確
実に図ることが可能な磁気ヘッド組立体を提供すること
を目的とする。SUMMARY OF THE INVENTION It is an object of the present invention to provide a magnetic head assembly which does not have the above-mentioned problems and is capable of ensuring electrical connection between an FPC and an arm even under a high temperature environment.
【0006】[0006]
【課題を解決するための手段】本発明の磁気ヘッド組立
体は、フレキシブルプリントサーキット(FPC)と;
前記FPCに形成された導電パターンのうちGNDパタ
ーンにネジまたはピンを介して電気的に接続され、前記
FPCを接着剤層を介して固着されるアームと;前記ア
ームに保持されるサスペンションと;前記サスペンショ
ンに保持される磁気ヘッドとを備え、前記接着剤層およ
び前記アームに、ネジまたはピンを挿入する穴が設けら
れ、接着剤層の穴径はアーム側の穴径よりも大きいこと
を特徴とする。SUMMARY OF THE INVENTION A magnetic head assembly of the present invention comprises a flexible printed circuit (FPC);
An arm electrically connected to a GND pattern of the conductive patterns formed on the FPC via a screw or a pin and fixing the FPC via an adhesive layer; a suspension held by the arm; A magnetic head held by a suspension, wherein holes for inserting screws or pins are provided in the adhesive layer and the arm, and the hole diameter of the adhesive layer is larger than the hole diameter on the arm side. To do.
【0007】本発明の以下の実施態様は、以上の構成の
効果をより顕著なものとするために、接着剤層の穴径は
アーム側の穴径の少なくとも2倍以上であること、また
は2倍より小さい領域に接着剤層が貼り付けられないよ
うに、磁気ヘッド組立体が構成される。In the following embodiments of the present invention, in order to make the effect of the above constitution more remarkable, the hole diameter of the adhesive layer is at least twice the hole diameter on the arm side, or 2 The magnetic head assembly is configured so that the adhesive layer is not attached to the area smaller than double.
【0008】また、前記アーム側の穴に塗布した導電性
接着剤によって、前記アームと前記FPCとを導通した
ことを特徴とする。Further, the arm and the FPC are electrically connected by a conductive adhesive applied to the hole on the arm side.
【0009】また、本発明の磁気ディスク装置は前記磁
気ヘッド組立体を搭載することを特徴とする。Further, a magnetic disk device of the present invention is equipped with the magnetic head assembly.
【0010】磁気ディスク装置の内部は操作時にかなり
の高温下となり、FPCとアームとを固着している接着
剤層が溶融、流れ出す。しかし本発明の磁気ヘッド組立
体においては、接着剤層の穴径がアーム側穴径よりも大
きいように構成されているため、接着剤が導通媒体とし
ているネジまたはピンとアーム穴との隙間を埋めること
なく、両者間の電気的接続を確実に図ることが可能であ
る。During operation, the inside of the magnetic disk device is exposed to a considerably high temperature, and the adhesive layer fixing the FPC and the arm is melted and flows out. However, in the magnetic head assembly of the present invention, since the hole diameter of the adhesive layer is configured to be larger than the hole diameter on the arm side, the adhesive fills the gap between the screw or pin used as the conductive medium and the arm hole. It is possible to surely achieve electrical connection between the two.
【0011】[0011]
【発明の実施の形態】次に、図面を参照して本発明の第
1の実施の形態を説明する。BEST MODE FOR CARRYING OUT THE INVENTION Next, a first embodiment of the present invention will be described with reference to the drawings.
【0012】図1は第1の実施の形態の磁気ヘッド組立
体を示す斜視図である。FIG. 1 is a perspective view showing a magnetic head assembly according to the first embodiment.
【0013】図1の発明の磁気ヘッド組立体は、スライ
ダ1、サスペンション2、アーム3およびFPC5を含
む。スライダ1は弾性を有するサスペンション2に取り
付けられ、磁気媒体上に弾性的に保持される。サスペン
ション2は、それを保持または所定の位置へ輸送するた
めにアーム3に保持される。スライダ1は電磁変換素子
を備え、磁気情報が電気信号に変換され、微細線4およ
びFPC5を介して伝達される。The magnetic head assembly of the invention of FIG. 1 includes a slider 1, a suspension 2, an arm 3 and an FPC 5. The slider 1 is attached to a suspension 2 having elasticity and is elastically held on a magnetic medium. The suspension 2 is held by the arm 3 to hold or transport it to a predetermined position. The slider 1 includes an electromagnetic conversion element, and magnetic information is converted into an electric signal and transmitted through the fine line 4 and the FPC 5.
【0014】図2は、FPC5とアーム3との接続部分
の断面を図示したものである。電気回路の静電位を一定
に保つため、FPC5の導電パターンのうちGNDパタ
ーンとアーム3はネジ6を介して電気的に接続されてい
る。FPC5は、接着剤層としてのシート状接着剤9
(通常の接着剤でも良いがこれを使う方が作業性が良
い)を介しアーム3に固着されている。FPC5はネジ
6を媒体としてアーム3に電気的に接続されている。ネ
ジ6はFPC5のGNDパターンに半田付けされ、アー
ム3に対してはネジ止めされ、固定および接続されてい
る。FIG. 2 shows a cross section of a connecting portion between the FPC 5 and the arm 3. In order to keep the electrostatic potential of the electric circuit constant, the GND pattern of the conductive patterns of the FPC 5 and the arm 3 are electrically connected via the screw 6. The FPC 5 is a sheet adhesive 9 as an adhesive layer.
It is fixed to the arm 3 via (an ordinary adhesive may be used, but it is better to use this adhesive). The FPC 5 is electrically connected to the arm 3 with the screw 6 as a medium. The screw 6 is soldered to the GND pattern of the FPC 5 and fixed to and fixed to the arm 3 with a screw.
【0015】FPC5は3層構造を有しており、導体
(銅)8をポリイミド7で挟んだ構造となっている。こ
こで、ネジ6の通過穴として設けられたシート状接着剤
9の穴径をアーム3側のネジ穴よりも大きくすることを
特徴としている。この穴径は、少なくとも、アーム側の
ネジ穴径の2倍以上あることが好ましい。The FPC 5 has a three-layer structure in which a conductor (copper) 8 is sandwiched between polyimides 7. Here, the hole diameter of the sheet-shaped adhesive 9 provided as a passage hole for the screw 6 is larger than that of the screw hole on the arm 3 side. This hole diameter is preferably at least twice as large as the screw hole diameter on the arm side.
【0016】また、図3は、第2の実施の形態における
FPC5とアーム3との接続部分を示す断面図である。
この場合はより信頼性を高めるために、上記磁気ヘッド
組立体のアーム3側のネジ穴に導電性接着剤10を塗布
し、ネジ止めされる。FIG. 3 is a sectional view showing a connecting portion between the FPC 5 and the arm 3 in the second embodiment.
In this case, the conductive adhesive 10 is applied to the screw hole on the arm 3 side of the magnetic head assembly and screwed in order to improve reliability.
【0017】それ以外の部分は第1の実施の形態の構造
と同様である。The other parts are the same as the structure of the first embodiment.
【0018】磁気ディスク装置の操作時には、磁気ヘッ
ド組立体を取り巻く雰囲気温度が60〜80度に上昇
し、この温度上昇はシート状接着剤9の粘度を低下さ
せ、接着剤9の溶融、および流れ出しが生じる。しかし
ながら、本発明の第1及び第2の実施の形態の磁気ヘッ
ド組立体を用いれば、図2又は図3から分るように接着
剤9は、FPC5とアーム3に囲まれる構造になるた
め、この流出した接着剤9はアーム3側ネジ穴に流れ込
むことができないので、FPC5上の導通パターンとア
ーム3との電気的接続を確実に保持し続け、磁気回路お
よび電気回路の高信頼性を維持することが可能である。During operation of the magnetic disk device, the ambient temperature surrounding the magnetic head assembly rises to 60 to 80 degrees, and this rise in temperature lowers the viscosity of the sheet-like adhesive 9, melts the adhesive 9, and flows out. Occurs. However, when the magnetic head assemblies according to the first and second embodiments of the present invention are used, the adhesive 9 has a structure surrounded by the FPC 5 and the arm 3 as can be seen from FIG. 2 or 3. The adhesive 9 that has flowed out cannot flow into the screw hole on the arm 3 side, so that the electrical connection between the conductive pattern on the FPC 5 and the arm 3 can be reliably maintained, and high reliability of the magnetic circuit and the electric circuit can be maintained. It is possible to
【0019】又第2の実施の形態の場合はネジとアーム
の間隙には既に導電性接着剤が埋められているので万一
シート状接着剤9がネジ穴に流れてきたとしても、電気
的接続が切断されることを防止することができる。Further, in the case of the second embodiment, since the conductive adhesive is already filled in the gap between the screw and the arm, even if the sheet adhesive 9 flows into the screw hole, it is electrically connected. It is possible to prevent the connection from being disconnected.
【0020】[0020]
【発明の効果】本発明の効果は、磁気ディスク装置内の
厳しい高温下において、FPCとアームとの間の確実な
電気的接続を図ることができ、磁気回路および電気回路
の高信頼性を維持できることである。The effect of the present invention is that the FPC and the arm can be surely electrically connected to each other under a severe high temperature in the magnetic disk device, and the high reliability of the magnetic circuit and the electric circuit is maintained. It is possible.
【0021】その理由は、本発明の磁気ヘッド組立体に
よれば、アーム側ネジ穴よりも接着剤層の穴径を大きく
(アーム側ネジ穴径の2倍以上)した構成又はそれに加
え更にアーム側ネジ穴に導電性接着剤を塗布した構成と
したことによる。The reason for this is that, according to the magnetic head assembly of the present invention, the hole diameter of the adhesive layer is larger than the screw holes on the arm side (at least twice the screw hole diameter on the arm side), or in addition to this, the arm is further provided. This is because the side screw holes are coated with a conductive adhesive.
【図1】第1及び第2の実施の形態の磁気ヘッド組立体
を示す斜視図。FIG. 1 is a perspective view showing a magnetic head assembly according to first and second embodiments.
【図2】第1の実施の形態のFPCとアームとの接続部
分を示す断面図。FIG. 2 is a cross-sectional view showing a connecting portion between the FPC and the arm according to the first embodiment.
【図3】第2の実施の形態のFPCとアームとの接続部
分を示す断面図。FIG. 3 is a cross-sectional view showing a connecting portion between an FPC and an arm according to the second embodiment.
1 スライダ 2 サスペンション 3 アーム 4 微細線 5 FPC 6 ネジ(グランドスクリュー) 7 ポリイミド 8 銅 9 接着剤層(シート状接着剤) 10 導電性接着剤 1 Slider 2 Suspension 3 Arm 4 Fine Wire 5 FPC 6 Screw (Grand Screw) 7 Polyimide 8 Copper 9 Adhesive Layer (Sheet Adhesive) 10 Conductive Adhesive
Claims (4)
C)と、 前記FPCに形成された導電パターンにネジまたはピン
を介して電気的に接続され、前記FPCを接着剤層を介
して固着されるアームと、 前記アームに保持されるサスペンションと、 前記サスペンションに保持される磁気ヘッドとを備える
磁気ヘッド組立体において、 前記接着剤層および前記アームに、ネジまたはピンを挿
入する穴が設けられ、接着剤層の穴径がアーム側の穴径
よりも大きいことを特徴とする磁気ヘッド組立体。1. A flexible printed circuit (FP)
C), an arm electrically connected to a conductive pattern formed on the FPC via a screw or a pin, and fixing the FPC via an adhesive layer, a suspension held by the arm, In a magnetic head assembly including a magnetic head held by a suspension, a hole for inserting a screw or a pin is provided in the adhesive layer and the arm, and the hole diameter of the adhesive layer is larger than the hole diameter on the arm side. A magnetic head assembly characterized by being large.
剤によって、前記アームと前記FPCとを導通したこと
を特徴とする請求項1記載の磁気ヘッド組立体。2. The magnetic head assembly according to claim 1, wherein the arm and the FPC are electrically connected by a conductive adhesive applied to the hole on the arm side.
することを特徴とする磁気ディスク装置。3. A magnetic disk drive comprising the magnetic head assembly according to claim 1.
することを特徴とする磁気ディスク装置。4. A magnetic disk drive comprising the magnetic head assembly according to claim 2.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7228734A JP2783211B2 (en) | 1995-09-06 | 1995-09-06 | Magnetic head assembly and magnetic disk drive using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7228734A JP2783211B2 (en) | 1995-09-06 | 1995-09-06 | Magnetic head assembly and magnetic disk drive using the same |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0973740A true JPH0973740A (en) | 1997-03-18 |
JP2783211B2 JP2783211B2 (en) | 1998-08-06 |
Family
ID=16880986
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7228734A Expired - Fee Related JP2783211B2 (en) | 1995-09-06 | 1995-09-06 | Magnetic head assembly and magnetic disk drive using the same |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2783211B2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6700748B1 (en) | 2000-04-28 | 2004-03-02 | International Business Machines Corporation | Methods for creating ground paths for ILS |
US6771470B1 (en) | 1999-11-17 | 2004-08-03 | Tdk Corporation | Magnetic head assembly having a rotational arm for electrically connecting the magnetic head to an external circuit and methods of manufacturing the same |
JP2011210361A (en) * | 2011-05-11 | 2011-10-20 | Toshiba Corp | Electronic apparatus and hard disk drive |
JP2011210307A (en) * | 2010-03-29 | 2011-10-20 | Toshiba Corp | Electronic apparatus and hard disk drive |
-
1995
- 1995-09-06 JP JP7228734A patent/JP2783211B2/en not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6771470B1 (en) | 1999-11-17 | 2004-08-03 | Tdk Corporation | Magnetic head assembly having a rotational arm for electrically connecting the magnetic head to an external circuit and methods of manufacturing the same |
US6700748B1 (en) | 2000-04-28 | 2004-03-02 | International Business Machines Corporation | Methods for creating ground paths for ILS |
JP2011210307A (en) * | 2010-03-29 | 2011-10-20 | Toshiba Corp | Electronic apparatus and hard disk drive |
US9007779B2 (en) | 2010-03-29 | 2015-04-14 | Kabushiki Kaisha Toshiba | Electronic apparatus and hard disk drive |
JP2011210361A (en) * | 2011-05-11 | 2011-10-20 | Toshiba Corp | Electronic apparatus and hard disk drive |
Also Published As
Publication number | Publication date |
---|---|
JP2783211B2 (en) | 1998-08-06 |
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