JPH09330874A - Vibration suppressor and aligner - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance the suppression effect of disturbance vibration regardless of the moving position of a stage. SOLUTION: When an apparatus body 40 is vibrated due to movement of a stage, the vibration is detected by an acceleration sensor 5 and the displacement of the body 40 is detected by a displacement sensor 10. Furthermore, moving position of the stage is measured by interferometers 30x, 30Y. During deceleration of the stage, a CF operating section 66 previously detects the shaking amount of the apparatus body 40 due to positional variation of the stage based on the outputs from the interferometers 30x, 30Y and then feeds forward a command value of counter force optimal to suppress yawing of the body 40 to a vibration control system based on the shaking amount thus predicted. The vibration control system controls driving of actuators 7A-7D, 32A-32C based on the output from each sensor and a command value inputted by feed forward.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an anti-vibration device and an exposure device, and more particularly to a so-called active type anti-vibration device in which an actuator drives the anti-vibration table so as to cancel the vibration of the anti-vibration table. The present invention relates to an exposure apparatus equipped with this vibration isolation device.

[0002]

2. Description of the Related Art With the increase in precision of step-and-repeat type reduction projection type exposure apparatuses, that is, precision equipment such as so-called steppers, micro vibrations that act on the surface plate (vibration isolation table) from the installation floor There is a need to insulate at the level. Various types of vibration-damping pads, such as mechanical dampers or pneumatic dampers containing compression coil springs in the damping liquid, are used as vibration-damping pads for supporting the vibration-damping table of the vibration-damping device. ing. In particular, an air spring anti-vibration device having a pneumatic damper can be set to a small spring constant and insulates vibrations of about 10 Hz or more, and is therefore widely used for supporting precision equipment. Recently, in order to overcome the limitations of conventional passive vibration isolators,
Active vibration isolators have been proposed. This is an anti-vibration device that detects the vibration of the anti-vibration table with a sensor and controls the vibration by driving the actuator based on the output of this sensor. Ideal vibration with no resonance peak in the low frequency control band It can have an insulating effect.

[0003]

In a stepper or the like, an XY stage (wafer stage) that greatly accelerates and decelerates is mounted on a surface plate held by a vibration isolation pad, and when the XY stage moves, the XY stage moves. The reaction force accompanying deceleration vibrates the exposure apparatus main body. In the active vibration isolation device, the same force as the reaction force at the time of stage acceleration / deceleration, and the force in the opposite direction, that is, the counter force is input by feed forward.However, when the stage movement amount, stage acceleration or stage mass becomes large, the stage Excitation of the exposure apparatus main body (mainly the rotation direction around the Z axis) is caused due to the position being different from the initial position. With steppers and the like, it is expected that the amount of stage movement, acceleration, and mass will further increase in the future, and the accuracy will become more severe, and this amount of vibration may cause out-of-specification.

The present invention has been made under such circumstances, and is provided with a vibration isolation device capable of improving the effect of suppressing (damping) disturbance vibrations without being affected by the stage movement position. An object is to provide an exposure apparatus.

[0005]

According to a first aspect of the present invention, there is provided an anti-vibration table that is held horizontally via at least three anti-vibration pads; and at least one stage that moves on the anti-vibration table. A plurality of actuators including at least three actuators that vertically drive the vibration isolation table at different locations; and 1 or 2 that detects displacement of the vibration isolation table
The above displacement sensor; one or two or more vibration sensors that detect the vibration of the vibration isolation table; and the actuators that suppress the vibration of the vibration isolation table based on the outputs of the displacement sensor and the vibration sensor. A vibration control system for driving and controlling; a position measuring means for measuring the moving position of each stage; and a reaction force for preventing vibration of the apparatus main body including the vibration isolation table due to a reaction force associated with the stage acceleration and deceleration. And a vibration compensation system for feed-forward inputting a counter force command value which is a force in the opposite direction to the vibration control system, wherein the vibration compensation system is based on the output of the position measuring means during acceleration / deceleration of the stage. An optimal counterforce command for predicting in advance the amount of vibration of the apparatus body due to fluctuations in the position of the stage, and suppressing yawing of the apparatus body based on this prediction result. The characterized by feedforward input to the vibration control system.

According to this, when the apparatus body vibrates due to the movement of the stage, this vibration is detected by the vibration sensor,
Further, the displacement sensor detects the displacement of the apparatus main body due to this vibration. Further, the moving position of the stage is measured by the position measuring means. At the time of acceleration / deceleration during the movement of the stage, the vibration compensation system predicts in advance the amount of vibration of the apparatus main body due to the change in the position of the stage based on the output of the position measurement means, and based on this prediction result, yawing of the apparatus main body The optimum command value of the counter force to suppress the vibration is fed-forward input to the vibration control system. In the vibration control system, each actuator is drive-controlled so as to suppress the vibration of the vibration isolation table based on the displacement sensor, the output of the vibration sensor, and the feedforward input command value. This effectively suppresses the vibration of the anti-vibration table, cancels the influence of the reaction force due to the acceleration / deceleration of the stage by the counter force generated based on the command value input by the feed forward, and The yawing of the device body due to the change in position is also suppressed. Therefore, the effect of suppressing (damping) the disturbance vibration can be improved without being affected by the movement position of the stage.

The invention according to claim 2 is an exposure apparatus for transferring a pattern formed on a mask onto a photosensitive substrate on a substrate stage via a projection optical system, and the vibration isolator according to claim 1 Is provided as a vibration isolation device for the exposure apparatus main body.

According to this, the vibration isolator can improve the effect of suppressing (damping) the disturbance vibration to the main body of the exposure apparatus without being affected by the movement position of the stage. Controllability is improved, for example, in the case of a scanning exposure apparatus, it is possible to improve the synchronization accuracy between the mask stage and the substrate stage during scanning exposure and shorten the synchronization settling time. Can improve the positioning accuracy of the substrate stage and shorten the positioning settling time. In any case, it is possible to improve the exposure accuracy and the throughput.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described below with reference to FIGS.

FIG. 1 is a schematic perspective view of a step-and-scan type exposure apparatus 100 according to one embodiment. In FIG. 1, a rectangular plate-shaped pedestal 2 is installed on a floor serving as an installation surface, and vibration isolation pads 4A to 4D (however, in FIG.
(D is not shown) is installed, and these vibration isolation pads 4A to
A rectangular surface plate 6 as a vibration isolation table is installed on the 4D. Here, as will be described later, the exposure apparatus 1 of the present embodiment
00 uses the projection optical system PL, the Z axis is taken parallel to the optical axis of the projection optical system PL, and the Y axis is orthogonal to the longitudinal direction of the surface plate 6 in a plane orthogonal to the Z axis. Take the X-axis in the direction you want to. In addition, the direction of rotation around each axis is Z
The directions are θ, Yθ, and Xθ. In the following description, the directions indicated by the arrows indicating the X, Y, and Z axes in FIG. 1 are + X, + Y, and + Z directions, and the opposite directions are -X, -Y, and -Z, as necessary. It shall be used separately from the direction.

The anti-vibration pads 4A-4D are each a surface plate 6
Are arranged near the four vertices on the bottom of the rectangle. In the exposure apparatus 100 of this embodiment, the vibration isolation pads 4A to 4D are used.
Since a pneumatic damper is used as this and the height of the vibration isolation pads 4A to 4D can be adjusted by the pressure of air, the pneumatic damper also serves as a vertical movement mechanism. Of course, a mechanical damper or the like in which a compression coil spring is put in the damping liquid by providing a vertical movement mechanism separately may be used as the vibration isolation pad.

An actuator 7A is installed between the base 2 and the surface plate 6 in parallel with the vibration isolation pad 4A. The actuator 7A is composed of a stator 9A made of a magnetic body fixed on the pedestal 2 and a mover 8A including a coil fixed to the bottom surface of the surface plate 6, and a controller 11 (not shown in FIG. 2), an urging force in the Z direction from the base 2 to the bottom surface of the surface plate 6 or a suction force from the bottom surface of the surface plate 6 toward the base 2 is generated. Other vibration isolation pads 4B ~
In 4D as well, similarly to the vibration isolation pad 4A, the actuators 7B to 7D are installed in parallel (however, in FIG. 1, the actuators 7C and 7D on the back side of the paper surface are not shown),
The urging force or suction force of these actuators 7B to 7D is also set by the control device 11 (not shown in FIG. 1, see FIG. 2). The control method of the actuators 7A to 7D will be described later.

On the side surface of the surface plate 6 on the + X direction side, acceleration sensors 5Z ₁ and 5Z ₂ as vibration sensors for detecting the Z direction acceleration of the surface plate 6 are attached. Also, surface plate 6
Acceleration sensors 5X ₁ and 5X ₂ as vibration sensors for detecting the X direction acceleration of the surface plate 6 are attached to the + X direction end portion of the upper surface, and the Y surface of the surface plate 6 is attached to the + Y direction end portion of the upper surface of the surface plate 6.
An acceleration sensor 5Y as a vibration sensor for detecting the directional acceleration is attached. These acceleration sensors 5Z
For example, semiconductor acceleration sensors are used as ₁ , 5Z ₂ , 5X ₁ , 5X ₂ , and 5Y. The outputs of these acceleration sensors 5Z ₁ , 5Z ₂ , 5X ₁ , 5X ₂ , 5Y are also supplied to the control device 11 (not shown in FIG. 1, see FIG. 2).

Further, rectangular metal plates (conductive materials) 23 ₁ and 23 ₂ having a predetermined area are attached to the side surface of the surface plate 6 on the + X direction side. In the exposure apparatus 100 of this embodiment, a ceramic surface plate made of a non-conductive material is used as the surface plate 6, and the displacement of the surface plate in the X direction is detected at a position facing the metal plates 23 ₁ and 23 _2. Displacement sensor 10X
₁ , 10X ₂ (not shown in FIG. 1 to avoid complexity of the drawing, see FIG. 2) are provided. As the displacement sensors 10X ₁ and 10X ₂ , for example, eddy current displacement sensors are used. According to this eddy current displacement sensor, an AC voltage is applied to a coil wound on an insulator in advance, and when the sensor approaches an object to be measured made of a conductive material (conductive material), the AC magnetic field generated by the coil causes the AC magnetic field to be applied to the conductive material. An eddy current is generated, and the magnetic field generated by the eddy current is in the opposite direction to the magnetic field created by the coil current, and these two magnetic fields overlap to affect the output of the coil, and the current flowing through the coil The intensity and phase change. This change becomes larger as the object is closer to the coil and becomes smaller as the object is farther from the coil. Therefore, by extracting an electric signal from the coil, the position and displacement of the object can be known. In addition, as a displacement sensor, a capacitance-type non-contact displacement that detects the distance between the sensor and the measurement object in a non-contact manner by utilizing that the capacitance is inversely proportional to the distance between the electrode of the sensor and the measurement object A sensor may be used. If the configuration is such that the influence of the background light can be prevented, a PSD (semiconductor optical position detector) can be used as the displacement sensor.

Further, metal plates 23 ₃ and 23 ₄ having a predetermined area are attached to the + X direction end portion of the upper surface of the surface plate 6. Displacement sensor 1 composed of an eddy current displacement sensor that faces the metal plates 23 ₃ and 23 ₄ and detects displacement of the surface plate 6 in the Z direction.
0Z ₁ and 10Z ₂ (not shown in FIG. 1, see FIG. 2) are provided. Further, a metal plate 23 ₅ having a predetermined area is attached to the side surface of the upper surface of the surface plate 6 in the + Y direction, and the eddy current displacement sensor is arranged to face the metal plate 23 ₅ and detect the displacement of the surface plate 6 in the Y direction. A displacement sensor 10Y (not shown in FIG. 1, see FIG. 2) is provided. Displacement sensor 10
The outputs of X ₁ , 10X ₂ , 10Z ₁ , 10Z ₂ , and 10Y are also supplied to the control device 11 (not shown in FIG. 1, see FIG. 2).

On the surface plate 6 is mounted a wafer stage 20 as a substrate stage which is driven in two-dimensional XY directions by a driving means (not shown). The wafer stage 20 includes a wafer Y-axis stage (hereinafter, referred to as “WY stage”) 20Y that moves on the surface plate 6 in the Y-axis direction, and a wafer X-axis stage (which moves on the WY stage 20Y in the X-axis direction). Hereinafter, referred to as "WX stage") 20X. Further, a wafer W as a photosensitive substrate is adsorbed and held on the WX stage 20X via a Z leveling stage, a θ stage (all not shown) and a wafer holder 21. Further, the first column 24 is planted on the surface plate 6 so as to surround the wafer stage 20,
The projection optical system PL is fixed to the central portion of the upper plate of the first column 24, and the second column 26 is planted on the upper plate of the first column 24 so as to surround the projection optical system PL. A reticle R as a mask is placed on the center of the plate via a reticle stage 27.

The moving position of the WX stage 20X in the Y direction due to the movement of the WY stage 20Y is measured by a Y-axis laser interferometer 30Y as a position measuring means, and the moving position of the WX stage 20X in the X direction is measured by the position measuring means. Is measured by an X-axis laser interferometer 30X, and the outputs of these laser interferometers 30Y and 30X are input to the controller 11 (see FIG. 2) and a main controller (not shown). The Z-leveling stage is configured so that the drive in the Z-axis direction and the tilt with respect to the Z-axis can be adjusted, and the θ-stage is configured to be capable of minute rotation about the Z-axis. Therefore, the wafer W can be three-dimensionally positioned by the wafer stage 20, the Z leveling stage, and the θ stage.

The reticle stage 27 is the X of the reticle R.
Fine adjustment in the axial direction and adjustment of the rotation angle are possible. The reticle stage 27 is driven in the Y direction by a driving unit (not shown), and the Y direction position of the reticle stage 27 is measured by a reticle laser interferometer 30R as a position measuring unit. The output of the laser interferometer 30R is also input to the controller 11 (see FIG. 2) and a main controller (not shown).

Further, an illumination optical system (not shown) is arranged above the reticle R, and a main controller (not shown) relatively aligns the reticle R and the wafer W (alignment).
Also, while performing autofocus by a focus detection system (not shown), under the illumination light EL for exposure from the illumination optical system, an image of the pattern of the reticle R through the projection optical system PL is sequentially applied to each shot area of the wafer W. It is designed to be exposed. In this embodiment, during exposure of each shot area, the main control unit relatively scans the wafer stage 20 and the reticle stage 27 along the Y-axis direction (scanning direction) at a predetermined speed ratio via the respective driving means. It

The first column 24 includes four leg portions 24a-2.
4d (however, in FIG. 1, the leg portion 24d on the back side of the paper surface is not shown) is in contact with the surface plate 6. + Y of leg 24b
An acceleration sensor 5Z ₃ for detecting the acceleration of the first column 24 in the Z direction is attached to the side surface in the direction. As the acceleration sensor 5Z _3, for example a piezo-resistive or capacitive semiconductor type acceleration sensor is used. The output of the acceleration sensor 5Z ₃ is also input to the control device 11 (not shown in FIG. 1, see FIG. 2). Also,
A metal plate 2 having a predetermined area is provided at a corner of the upper surface of the upper plate of the first column 24, which is the + Y direction end and the + X direction end.
3 ₆ is attached. Displacement sensor 10Z ₃ (not shown in FIG. 1, not shown in FIG. 1, which is composed of an eddy current displacement sensor which faces the metal plate 23 ₆ and detects displacement of the first column 24 in the Z direction.
2 (see FIG. 2).

Further, a movable shaft 35A is embedded in the side surface of the first column 24 in the -Y direction, and an actuator 32A is attached between the movable shaft 35A and a column (not shown) fixed on the floor. Like the actuator 7A, the actuator 32A is composed of a stator 34A made of a magnetic body fixed to a column (not shown) and a mover 33A including a coil attached to a movable shaft 35A. By adjusting the current flowing through the coil in 33A, a force can be applied to the movable shaft 35A in the ± X directions. Similarly, + Y in the first column 24
The movable shaft 35B is embedded in the side surface in the direction,
An actuator 32B having the same configuration as the actuator 32A is attached between the column and a column (not shown) fixed on the floor, and the movable shaft 35B is instructed by the control device 11.
A force can be applied to the ± X directions with respect to. In addition, the actuator 3 is provided between the central portion of the side surface of the first column 24 in the + Y direction and a column (not shown) on the floor.
An actuator 32C having the same configuration as that of 2A is installed, and a force can be applied in the ± Y direction to the first column 24 via the actuator 32C according to an instruction from the control device 11. Actuator 32A by control device 11
The control method of 32C will also be described later.

Here, the surface plate 6 when the exposure apparatus 100 is installed
Briefly the height and the adjustment of the horizontal level of the displacement sensor 10Z _1, 10Z _2, Z-direction displacement (height) of the base plate 6, which is measured by 10Z ₃ to control the vibration-isolating pad 4A~4D not shown Based on these data transmitted to a system (not shown), the control system of the vibration isolation pads 4A to 4D sets the height of the surface plate 6 to a preset value and maintains each horizontal level. The heights of the vibration isolation pads 4A to 4D are calculated. After that, this control system is operated by the vibration isolation pads 4A-4D.
Set the height of each to that calculated height. Thereafter, the heights of the vibration isolation pads 4A to 4D are respectively maintained at the set values. As a result, the surface plate 6 is not distorted, and the positioning accuracy of the wafer stage 20 on the surface plate 6 is maintained with high accuracy.

In the exposure apparatus 100 of this embodiment, the surface plate 6,
Wafer stage 20, wafer holder 21, first column 2
4, the projection optical system PL, the second column 26, the reticle stage 27, and the like constitute an exposure apparatus main body 40 (see FIG. 2) as an apparatus main body to be subjected to vibration control.

Next, the control system of the actuators 7A to 7D and 32A to 32C for vibration isolation of the exposure apparatus main body 40 will be described based on the block diagram of FIG.

The control device 11 uses the displacement sensors 10Z ₁ , 1
_{0Z 2, 10Z 3, 10X 1} , 10X 2, 10Y and the acceleration sensor _{5Z 1, 5Z 2, 5Z 3} , 5X 1, 5X 2,
Actuators 7A, 7B, 7 are provided to suppress vibration of the exposure apparatus main body 40 including the surface plate 6 based on the output of 5Y.
Vibration control system for driving and controlling C, 7D, 32A, 32B, 32C, wafer stage 20, reticle stage 27
Of the exposure apparatus main body 40 caused by the movement of the center of gravity of the wafer stage 20 for scanning exposure and the reticle stage 27 during scanning.
Vibrations that are predicted in advance based on the outputs of X, 30Y, and 30R, and the optimum counter force command value for the reaction force acting on the exposure apparatus main body 40 accompanying stage acceleration / deceleration is feedforward input to the vibration control system. Counter force calculation unit (CF calculation unit) 6 as a compensation system
6. This counter force calculation unit also serves as a so-called scan counter.

More specifically, the vibration control system includes displacement sensors 10Z ₁ , 10Z ₂ , 10Z ₃ , 10X ₁ , 1
Outputs of 0X ₂ and 10Y are input through A / D converters (not shown) respectively, and the exposure apparatus main rollers VXPI, V
YPI, VZPI, VXθPI, VYθPI, VZθP
I and the decoupling calculation unit 56 that performs decoupling calculation for converting the speed control amount in each direction of 6 degrees of freedom calculated by these controllers into the speed command value to be generated at the position of each actuator. And the decoupling calculator 56
The thrust force gains 58a to 58g for converting the velocity command value to be generated at each actuator position after conversion into the thrust force to be generated at each actuator.

That is, the vibration control system of this embodiment is constructed by including an acceleration sensor, an integrator, a speed controller, etc. as its inner loop inside a position control loop which is composed of a displacement sensor, a position controller and the like. The multi-loop control system has a speed control loop.

Further, the counter force calculation unit 66 as a vibration compensation system includes laser interferometers 30X, 30Y, 30.
The measured value of R is monitored and the wafer stage 2 at this time is monitored.
0, the amount of vibration of the exposure apparatus main body 40 (reaction force generated by the movement of each stage) generated by the movement of the reticle stage 27 (change of each stage position) is predicted by calculation, and the exposure apparatus main body 40 is calculated based on this prediction result. To calculate the command value of the counter force in each direction with 6 degrees of freedom, which is optimal for suppressing the vibration of the robot, especially yawing (rotation around the Z axis), and depending on the positional relationship between the center of gravity G of the device body and each stage. Gains k ₁ , k ₂ , k ₃ , and
multiplied by _{k 4, k 5, k 6} , 6 degrees of freedom of the speed controller VXPI, VYPI, VZPI, VXθPI, V
6 provided in each output stage of YθPI and VZθPI
One adder 60 ₁ , 60 ₂ , 60 ₃ , 60 ₄ , 60 ₅ ,
Feedforward input is made to the vibration control system via 60 ₆ .

Here, the significance of monitoring the measurement value of the laser interferometer, that is, the stage position will be briefly described with reference to FIGS. 3 and 4. FIG. 3 shows an example of the simulation result of the behavior of the exposure apparatus main body 40 (the amount of rotation around the Z axis (yawing)) when the position of the WX stage 20X is not monitored, and FIG. 4 is shown. An example of a simulation result of the behavior (yawing) of the exposure apparatus main body 40 when the 20X position is monitored is shown.
As is clear from the comparison between FIGS. 3 and 4, the yawing component is larger when the position of the WX stage 20X is not monitored than when the position of the WX stage 20X is monitored. This depends on that the center of gravity of the wafer stage 20 (WX stage 20X + WY stage 20Y) changes, that is, eccentricity, as the WX stage 20X moves. However,
By monitoring the WX stage position, as shown in FIG. 4, regardless of the WX stage position, the command value of the counter force during stage acceleration / deceleration can be more effectively given with almost no yawing component being generated. You can

According to the exposure apparatus 100 of the present embodiment configured as described above, the wafer stage 20 and the reticle stage 27 are scanned along the Y-axis direction during, for example, scan exposure, and this stage When the exposure apparatus body 40 vibrates due to the movement, the displacement sensors 10Z ₁ and 10
_{Z 2, 10Z 3, 10X 1} , 10X 2, 10Y, acceleration sensor _{5Z 1, 5Z 2, 5Z 3} , 5X 1, 5X 2, 5Y
The vibration control system of the control device 11 controls the actuators 7A, 7B, 7C, 7D, 32A and 32B based on the output of
32C is driven, and the vibration of the exposure apparatus body 40 is effectively suppressed. In this case, the stage (eg WX
When the stage 20X) moves, the position of the center of gravity of the entire stage changes, that is, it is eccentric, but the counter force calculation unit 66 uses the interferometers 30X, 3X for measuring the stage position.
By monitoring the position of the WX stage 20X in real time via 0Y and considering the amount of eccentricity, a command value of the counter force appropriate for suppressing the vibration of the exposure apparatus main body due to the reaction force accompanying the stage acceleration / deceleration. Is fed to the vibration control system, each actuator is driven by the vibration control system, and a counter force is applied to the exposure apparatus main body 40 so as to cancel the exciting force caused by the change in the position of the stage. Vibration and yawing of the exposure apparatus body 40 are suppressed. Therefore, in the device 100 of the present embodiment, the disturbance vibration is suppressed (damped) without being affected by the change of the stage position.
The effect can be improved. Therefore, according to the exposure apparatus 100 of the present embodiment, the controllability of the stage is improved,
Reticle stage 27 and wafer stage 2 during scanning exposure
It is possible to improve the synchronization accuracy with 0, shorten the synchronization settling time, improve the exposure accuracy, and improve the throughput.

In the above embodiment, the case where the vibration isolator according to the present invention is applied to a step-and-scan type scanning exposure type projection exposure apparatus has been exemplified, but the vibration isolator according to the present invention is a stepper type. The above projection exposure apparatus can be suitably applied because the stage moves on the surface plate.

In the above embodiment, the case where the seven actuators are used to suppress the shake of the exposure apparatus main body in the direction of six degrees of freedom is illustrated, but the present invention is not limited to this, and the surface plate ( Considering the inclination correction of the vibration isolation table), the number of actuators in the Z direction may be at least three.

Further, the exciting force of the main body due to the change in the position of the stage is predicted, and based on this prediction result, the influence is offset by using the command value of the counter force optimum for suppressing the yawing of the main body of the apparatus. The solution principle of the present invention in which the actuator is feed-forward controlled as described above is not applied only when the swing of the apparatus main body in the 6-DOF direction is prevented. For example, when the stage is configured to move on the position of the center of gravity of the apparatus body, the apparatus body does not necessarily swing in the 6-DOF direction even if the stage moves, but even in such a case, This is because it is clear that the solution principle of the invention works effectively.
In this sense, the number of displacement sensors and acceleration sensors (vibration sensors) is not limited to six.

[0034]

As described above, according to the present invention,
There is an unprecedented excellent effect that the effect of suppressing (damping) the disturbance vibration can be improved without being affected by the change in the position of the stage.

[Brief description of drawings]

FIG. 1 is a perspective view showing a projection exposure apparatus according to an embodiment.

FIG. 2 is a control block diagram showing a configuration of a control system of an actuator.

FIG. 3 is a diagram showing an example of a simulation result of the behavior (yawing) of the exposure apparatus main body when the position of the WX stage is not monitored.

FIG. 4 is a diagram showing an example of a simulation result of the behavior (yawing) of the exposure apparatus main body when the position of the WX stage is monitored.

[Explanation of symbols]

4A~4C vibration isolating pads _{5Z 1 ~5Z 3, 5Y 1,} 5Y 2, 5X acceleration sensor (vibration sensor) 6 platen (anti-vibration table) 7A-7D, 32A to 32C actuator 10Z ₁ ~10Z _3, 10Y _1, 10Y ₂ , 10X
Displacement sensor 11 Control device (vibration control system) 20 Wafer stage (substrate stage) 27 Reticle stage 30X, 30Y, 30R Laser interferometer (position measuring means) 40 Exposure device main body 66 Counter force calculation unit (vibration compensation system) 100 Exposure device R reticle (mask) PL projection optical system W wafer (photosensitive substrate)

Claims (2)

[Claims] 1. An anti-vibration table that is held horizontally through at least three anti-vibration pads; at least one stage that moves on the anti-vibration table; and the anti-vibration table in different vertical positions. A plurality of actuators including at least three actuators that are driven; one or more displacement sensors that detect displacement of the vibration isolation table; one or two or more vibration sensors that detect vibration of the vibration isolation table; A vibration control system that drives and controls each actuator so as to suppress the vibration of the vibration isolation table based on the outputs of the displacement sensor and the vibration sensor; a position measuring unit that measures the moving position of each stage; In order to prevent the device body including the vibration isolation table from being vibrated by the reaction force associated with deceleration, a counter force command value, which is a force in the opposite direction to the reaction force, is fed to the vibration control system as a feed forward. And a vibration compensation system for inputting a code, wherein the vibration compensation system predicts in advance the amount of vibration of the apparatus main body due to the change in the position of the stage based on the output of the position measuring means during acceleration / deceleration of the stage. An anti-vibration device characterized in that a command value of a counter force optimum for suppressing yawing of the device body is feed-forward-input to the vibration control system based on the prediction result. 2. An exposure apparatus for transferring a pattern formed on a mask onto a photosensitive substrate on a substrate stage via a projection optical system, wherein the vibration isolation apparatus according to claim 1 is used for vibration isolation of an exposure apparatus main body. An exposure apparatus provided as an apparatus.