JPH09328558A - Method for forming granular epoxy resin product - Google Patents

Method for forming granular epoxy resin product

Info

Publication number
JPH09328558A
JPH09328558A JP14883596A JP14883596A JPH09328558A JP H09328558 A JPH09328558 A JP H09328558A JP 14883596 A JP14883596 A JP 14883596A JP 14883596 A JP14883596 A JP 14883596A JP H09328558 A JPH09328558 A JP H09328558A
Authority
JP
Japan
Prior art keywords
epoxy resin
resin
temperature
melting point
crystalline
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14883596A
Other languages
Japanese (ja)
Other versions
JP3175593B2 (en
Inventor
Noriyuki Arai
規之 新井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Chemical Co Ltd
Original Assignee
Sumitomo Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Abstract

PROBLEM TO BE SOLVED: To improve the productivity and economy by applying an eternal force to a supercooled crystalline epoxy resin while kept at a specified temperature to grow crystal nuclei and then granulating the resin. SOLUTION: An external force is applied to a supercooled crystalline epoxy resin having a mesogen skeleton of the formula [wherein X is -N=N-, -CH=CH-, -C-CO-, -CH=C(CH3 )-, -CH=CH(CN)-, -C≡C-, -CH=CH-CO-, or a single bond; and R7 and R8 are each a 1-6C linear or cyclic alkyl, H or a halogen] while kept in a temperature range from the glass transition temperature to the melting point to grow crystal nuclei, and the resin is then ground.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、接着、塗料、絶縁
材料や積層板等の電気電子材料、特に、電子部品の封止
用として有用なエポキシ樹脂の粒状製品化方法に関す
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a granular product of an electric / electronic material such as an adhesive, a paint, an insulating material and a laminated board, and particularly an epoxy resin useful for sealing an electronic component.

【0002】[0002]

【従来の技術】室温で固体である非晶性エポキシ樹脂は
一般に製法上、溶融状態で取り出され、室温に冷却固化
したのち粉砕され製品にいたる。また、室温以上の融点
を有する結晶性エポキシ樹脂は取り出し後結晶化させて
から粉砕工程を経て製品に至る。しかし、室温以上の融
点を有する結晶性エポキシ樹脂で過冷却性を有するもの
は、合成工程から取り出されたものは、室温にて粘稠な
液体あるいは半固体状態となり、取り扱い性が悪い。一
般に室温以上の融点を持つ結晶性のエポキシ樹脂の製品
形態は、耐ブロッキング性、取り扱い性の面から、結晶
粒状物(粉末状物を含む、以下同じ)とすることが好ま
しい。しかし、結晶性エポキシ樹脂で過冷却性を有する
ものは室温で結晶固体の他に、半結晶性固体、非晶性固
体、非晶性半固体、液体等の様々な形態をとりうる。こ
のため粒状製品化は樹脂を一旦結晶固体にしてから粉砕
等の工程を経て行われ、いかに早く樹脂の結晶核を成長
せしめるかという点が大きなポイントとなる。ここでい
う過冷却性とは、融点以上で溶融させた樹脂を放冷した
際に融点以下になっても結晶化が十分に起こらず、粘稠
な液体、粘着性固体で存在する性質を意味する。
2. Description of the Related Art An amorphous epoxy resin which is solid at room temperature is generally taken out in a molten state in a manufacturing method, cooled to room temperature and solidified, and then ground into a product. Further, a crystalline epoxy resin having a melting point of room temperature or higher is taken out, crystallized, and then subjected to a pulverizing step to reach a product. However, a crystalline epoxy resin having a melting point of room temperature or higher and having a supercooling property, which is taken out from the synthesis step, becomes a viscous liquid or a semi-solid state at room temperature and is not easy to handle. Generally, the product form of a crystalline epoxy resin having a melting point of room temperature or higher is preferably a crystal grain (including a powder, the same applies hereinafter) in terms of blocking resistance and handleability. However, crystalline epoxy resins having supercooling properties can take various forms such as semi-crystalline solid, amorphous solid, amorphous semi-solid, and liquid in addition to crystalline solid at room temperature. For this reason, the granular product is formed by once making the resin into a crystalline solid and then pulverizing the resin, and the major point is how quickly the crystal nuclei of the resin can grow. The term "supercooling" as used herein means the property that crystallization does not occur sufficiently even when the resin melted at a melting point or higher is allowed to cool to a temperature below the melting point, and it exists as a viscous liquid or sticky solid. To do.

【0003】このような樹脂の粒状製品化においてこれ
までは一般に、貧溶媒を用いて晶析するという方法がと
られてきた。しかしながら、この方法ではろ過・乾燥工
程が必須で工程数が増えてしまう上に、溶媒の最適化を
行わないとロス分が多量に発生し収率が低下する恐れが
ある。また、乾燥工程において高温処理が必要となる場
合が多くエポキシ樹脂の安定性が懸念されたり、残留溶
媒も問題となりうる。一方、溶媒を用いない方法として
は、溶融状態で取り出された樹脂を放冷し結晶化するま
で静置しておき、その後、粉砕等の加工を施し粒状製品
化するという方法がとられてきた。この方法によれば前
述のような問題点はないが、結晶化するまでに多大な時
間が必要となり経済的に不利という問題がある。
In the past, a method of crystallizing using a poor solvent has been generally used in the production of such a granular resin product. However, in this method, filtration and drying steps are indispensable and the number of steps is increased. In addition, if the solvent is not optimized, a large amount of loss may occur and the yield may decrease. In addition, a high temperature treatment is often required in the drying step, and the stability of the epoxy resin may be concerned, and the residual solvent may be a problem. On the other hand, as a method that does not use a solvent, a method has been adopted in which the resin taken out in a molten state is allowed to cool and allowed to stand until it is crystallized, and then subjected to processing such as pulverization to make a granular product. . According to this method, there is no problem as described above, but there is a problem that it takes a long time to crystallize and is economically disadvantageous.

【0004】[0004]

【発明が解決しようとする課題】本発明の目的は、生産
性、経済性に優れた、過冷却性を有する結晶性エポキシ
樹脂の粒状製品化方法を提供することにある。
SUMMARY OF THE INVENTION An object of the present invention is to provide a method for producing a granular epoxy resin crystalline product having excellent productivity and economic efficiency and having a supercooling property.

【0005】[0005]

【課題を解決するための手段】このような事情に鑑み本
発明者らは、鋭意検討を行った結果、結晶化工程を工夫
することにより、上記目的を達成しうることを見出し、
本発明を完成するに至った。すなわち、本発明は、過冷
却状態にある結晶性エポキシ樹脂をガラス転移温度以
上、融点未満の温度範囲に保ち、外力を加えて結晶核を
成長せしめる工程および粒状化工程を順に受けさせるこ
とを特徴とするエポキシ樹脂の粒状製品化方法である。
In view of such circumstances, the inventors of the present invention have made earnest studies, and as a result, found that the above object can be achieved by devising a crystallization process,
The present invention has been completed. That is, the present invention is characterized in that the crystalline epoxy resin in a supercooled state is kept in a temperature range of the glass transition temperature or higher and lower than the melting point, and a step of applying external force to grow crystal nuclei and a step of granulating are sequentially performed. This is a method for producing granular products of epoxy resin.

【0006】[0006]

【発明の実施の形態】以下に、本発明を詳細に説明す
る。本発明に用いられるエポキシ樹脂は、過冷却性を有
する結晶性のエポキシ樹脂ならば特に限定されないが、
メソゲン骨格を有するもの、あるいはビスフェノール骨
格を有するもので、かつ分子量が低いもの等が挙げられ
る。これらのものを具体的に例示すると、メソゲン骨格
を有するものとしては一般式(1)
DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail. The epoxy resin used in the present invention is not particularly limited as long as it is a crystalline epoxy resin having supercooling property,
Examples thereof include those having a mesogen skeleton or those having a bisphenol skeleton and having a low molecular weight. Specific examples of these include those represented by the general formula (1) as those having a mesogenic skeleton.

【0007】[0007]

【化1】 で表されるようなエポキシ樹脂が挙げられる。この中
で、特にXの両端にある置換フェニレン基が異なる構造
のものや、自己重合反応が進行しオリゴマー成分を含む
ものなどは、過冷却性が高く本発明方法を適用するのに
好適である。ビスフェノール骨格を有するものでかつ分
子量が低いものの例としては一般式(2)
Embedded image And an epoxy resin represented by Among them, those having a structure in which the substituted phenylene groups at both ends of X are different, or those containing an oligomer component in which the self-polymerization reaction proceeds, and the like are suitable for applying the method of the present invention because they have high supercooling properties. . Examples of those having a bisphenol skeleton and having a low molecular weight are represented by the general formula (2)

【0008】[0008]

【化2】 で表されるようなものが挙げられる。またこれらのエポ
キシ樹脂は2種以上の混合物で用いてもよい。
Embedded image Examples include those represented by. Further, these epoxy resins may be used as a mixture of two or more kinds.

【0009】本発明方法ではまず、過冷却状態にある結
晶性エポキシ樹脂をガラス転移温度以上、融点未満の温
度に保つて、外力を加え結晶核を成長させる。ここでい
うガラス転移温度とは、融点以上で溶融状態にした該エ
ポキシ樹脂を液体窒素温度まで急冷し、昇温モードにて
示差走査熱量分析を行なった際にガラス転移に基づく吸
熱ピークの開始温度を示す。融点とは結晶状態にある樹
脂の融点を示す。外力を加え結晶核を成長させるのは、
分子の運動性を保ちつつ、外力によって結晶性を発現さ
せる部位(例えばメソゲン骨格)を配向させ結晶核を成
長せしめるためである。この時の温度は前述した温度範
囲であれば特に限定されないが、下限としては外力を加
えるのに工業的に実用可能な粘度を有する温度が好まし
い。その粘度とは一つの目安として一万ポイズ以内程度
である。これより粘度が高い領域では、外力を加えるの
に多大なエネルギーを必要とし実用的でない。また、こ
の時の上限温度は好ましくは融点より約10℃低い温度
である。融点に限りなく近い温度では、分子の凝集力が
低下するために結晶化が起こりにくい。ここでいう結晶
核が成長した状態、あるいは結晶化が促進された状態と
は樹脂が不透明になり、かつ、樹脂に粘着性がなくなる
こと、あるいは十分な硬度を発現する状態をいう。本発
明方法において加える外力としては、例えば、剪断力、
振動等があげられ、電動モーター、ミキサー、震盪機、
超音波装置、押し出し機等を用いることができる。
In the method of the present invention, first, the crystalline epoxy resin in a supercooled state is maintained at a temperature not lower than the glass transition temperature and lower than the melting point, and an external force is applied to grow crystal nuclei. The glass transition temperature referred to here is the starting temperature of the endothermic peak based on the glass transition when the epoxy resin in a molten state above the melting point is rapidly cooled to liquid nitrogen temperature and differential scanning calorimetry is performed in the temperature rising mode. Indicates. The melting point refers to the melting point of the resin in a crystalline state. Applying external force to grow crystal nuclei is
This is because the crystal nucleus is grown by orienting the site (for example, mesogen skeleton) where the crystallinity is expressed by an external force while maintaining the mobility of the molecule. The temperature at this time is not particularly limited as long as it is within the above-mentioned temperature range, but the lower limit is preferably a temperature having a viscosity industrially practical for applying an external force. The viscosity is about 10,000 poise or less as one standard. If the viscosity is higher than this range, a large amount of energy is required to apply an external force, which is not practical. The upper limit temperature at this time is preferably about 10 ° C. lower than the melting point. At a temperature as close as possible to the melting point, crystallization is less likely to occur because the cohesive force of the molecules decreases. The state in which the crystal nuclei have grown or the state in which the crystallization is promoted herein means a state in which the resin becomes opaque, the resin loses its tackiness, or a state in which sufficient hardness is exhibited. Examples of the external force applied in the method of the present invention include shearing force,
Vibration, etc., electric motors, mixers, shakers,
An ultrasonic device, an extruder or the like can be used.

【0010】次いで、結晶核が成長した樹脂は、粒状化
工程で、造粒や、粉砕して粒状製品とする。造粒や粉砕
には公知の方法を用いることができるが、例示すると、
造粒法としては二軸押し出し機で結晶化樹脂をストラン
ドとして取り出しその後ペレタイザーを用いて造粒する
方法、粉砕法としてはジョークラッシャー、インペラク
ラッシャー、ハンマーミル、ボールミル、ジェットミ
ル、ピンミル等を用いた粉砕が挙げられる。
Next, the resin in which the crystal nuclei have grown is granulated or pulverized into a granular product in the granulating step. A known method can be used for granulation and pulverization, but if exemplified,
As the granulation method, a method of taking out the crystallized resin as a strand with a twin-screw extruder and then granulating it using a pelletizer, and as the crushing method, a jaw crusher, an impeller crusher, a hammer mill, a ball mill, a jet mill, a pin mill, etc. were used. Examples include crushing.

【0011】本発明方法によって得られるエポキシ樹脂
の粒状製品は、接着、塗料、絶縁材料や積層板等の電気
電子材料、特に、電子部品の封止用として有用である。
The epoxy resin granular product obtained by the method of the present invention is useful as an adhesive, a paint, an electric / electronic material such as an insulating material or a laminated board, and particularly for sealing an electronic component.

【0012】[0012]

【実施例】以下に本発明の実施例を示すが、本発明はこ
れに限定されるものではない。 参考例1 原料フェノールの合成−1 温度計、撹拌機、コンデンサーを備えた2リットル四ツ
口フラスコに2,6−キシレノール(以下26XYと略
す。)195.5g(1.6mol)と2-ターシャリ
ーブチル-5-メチルフェノール(以下3M6Bと略
す。)65.7g(0.4mol)g、クロロアセトア
ルデヒドジメチルアセタール124.5g(1.0mo
l)および酢酸376gを仕込み、撹拌、溶解し、5℃
まで冷却した。次に、濃硫酸122g(1.2mol)
を酢酸84gに混合した溶液を10℃にて3時間かけて
滴下、その後25℃で6時間反応系を保温し、終夜室温
で撹拌を続けた。系の温度を5℃まで冷却し、析出した
結晶を濾別した。結晶を500gの水で6回洗浄し、そ
の後40℃にて8時間真空乾燥し、結晶を得た。
EXAMPLES Examples of the present invention will be shown below, but the present invention is not limited thereto. Reference Example 1 Synthesis of Raw Material Phenol-1 195.5 g (1.6 mol) of 2,6-xylenol (hereinafter abbreviated as 26XY) and 2-tercia were placed in a 2-liter four-necked flask equipped with a thermometer, a stirrer, and a condenser. 65.7 g (0.4 mol) g of l-butyl-5-methylphenol (hereinafter abbreviated as 3M6B) and 124.5 g (1.0 mol) of chloroacetaldehyde dimethyl acetal.
l) and 376 g of acetic acid, and stirred and dissolved.
Cooled down. Next, 122 g (1.2 mol) of concentrated sulfuric acid
Was added dropwise to 84 g of acetic acid over 3 hours at 10 ° C., and then the reaction system was kept at 25 ° C. for 6 hours, and stirring was continued at room temperature overnight. The temperature of the system was cooled to 5 ° C., and the precipitated crystals were separated by filtration. The crystals were washed six times with 500 g of water, and then vacuum dried at 40 ° C. for 8 hours to obtain crystals.

【0013】参考例2 原料フェノールの合成−2 温度計、撹拌機、コンデンサーの付いた2リットル四ツ
口フラスコに48.3%苛性ソーダ水溶液245.2g
とN−メチルピロリドン552gを仕込み、内部を窒素
で置換した。窒素シール下、溶液を140℃まで昇温し
た。参考例1で得られたフェノール中間体225.6g
及びN−メチルピロリドン676gの溶液を140℃×
1.5時間で滴下し、同温度で2時間保温した。その後
反応系を60℃まで冷却し、濃塩酸226gで中和し
た。減圧下に溶媒を回収してから、反応混合物をイオン
交換水1000gに排出し、析出した結晶を濾別した。
結晶をイオン交換水1000g×3回で洗浄後、80℃
で8時間真空乾燥を行い結晶を得た。
Reference Example 2 Synthesis of Raw Material Phenol-2 In a 2 liter four-necked flask equipped with a thermometer, a stirrer, and a condenser, 45.2% aqueous sodium hydroxide solution (245.2 g) was added.
And 552 g of N-methylpyrrolidone, and the inside was replaced with nitrogen. The solution was heated to 140 ° C. under a blanket of nitrogen. 225.6 g of the phenol intermediate obtained in Reference Example 1
And 676 g of N-methylpyrrolidone at 140 ° C.
The solution was added dropwise for 1.5 hours and kept at the same temperature for 2 hours. Thereafter, the reaction system was cooled to 60 ° C. and neutralized with 226 g of concentrated hydrochloric acid. After recovering the solvent under reduced pressure, the reaction mixture was discharged into 1,000 g of ion-exchanged water, and the precipitated crystals were separated by filtration.
After washing the crystals with 1,000 g of ion-exchanged water × 3 times,
For 8 hours to obtain crystals.

【0014】参考例3 エポキシの合成 参考例2で得られた原料フェノール100gを温度計、
撹拌機、滴下漏斗、分離管付きコンデンサーの付いた反
応容器に仕込、エピクロルヒドリン485.6g、ジメ
チルスルホキシド243.1gに溶解した。反応系内を
43torrに保ちながら、温度48℃で、48.3%
苛性ソーダ61.71gを5時間で連続的に滴下した。
この間、温度は48℃に保ちながら、共沸するエピク
ロルヒドリンと水を冷却液化し、有機層を反応系内に戻
しながら反応させた。反応終了後に、未反応エピクロル
ヒドリンを減圧濃縮により除去し、副生塩とジメチルス
ルホキシドを含むグリシジルエーテルをメチルイソブチ
ルケトン644gに溶解させ、副生塩とジメチルスルホ
キシドを水洗により除去した。 その後160℃、10
torrにてメチルイソブチルケトンを減圧留去し目的
物を得た(XMCC-20Eとする)。この樹脂の取り出し直後
の性状は室温にて褐色の粘稠な液体であった。該樹脂を
一旦150℃まで加熱し溶融させてから液体窒素温度ま
で急冷し、10mg秤量し示差走査熱量分析(セイコー電子
(株)製、SSC5000シリーズ・DSC200)を用いて10℃/mi
nの昇温条件でガラス転移温度を測定したところ5℃で
あった。また、該樹脂を放置し結晶状態にしたものの融
点を同様に測定したところ130℃であった。
Reference Example 3 Synthesis of Epoxy 100 g of the raw material phenol obtained in Reference Example 2 was measured with a thermometer,
The reaction solution was charged into a reaction vessel equipped with a stirrer, a dropping funnel and a condenser equipped with a separation tube, and dissolved in epichlorohydrin (485.6 g) and dimethyl sulfoxide (243.1 g). While maintaining the inside of the reaction system at 43 torr, at a temperature of 48 ° C., 48.3%
61.71 g of caustic soda was continuously added dropwise over 5 hours.
During this period, while keeping the temperature at 48 ° C., the azeotropically distilled epichlorohydrin and water were cooled and liquefied, and the reaction was carried out while returning the organic layer into the reaction system. After completion of the reaction, unreacted epichlorohydrin was removed by concentration under reduced pressure, glycidyl ether containing by-product salt and dimethyl sulfoxide was dissolved in 644 g of methyl isobutyl ketone, and the by-product salt and dimethyl sulfoxide were removed by washing with water. After that, 160 ℃, 10
Methyl isobutyl ketone was distilled off under reduced pressure at torr to obtain the desired product (designated as XMCC-20E). The property of this resin immediately after being taken out was a brown viscous liquid at room temperature. The resin was once heated to 150 ° C. and melted, then rapidly cooled to liquid nitrogen temperature, weighed 10 mg, and subjected to differential scanning calorimetry (manufactured by Seiko Denshi KK, SSC5000 series / DSC200) at 10 ° C./mi.
The glass transition temperature was 5 ° C. when measured at a temperature rise condition of n. Further, when the melting point of the resin which had been left in a crystalline state was similarly measured, it was 130 ° C.

【0015】参考例4 エポキシの合成 参考例1の場合で26XY122.2g(1.0mo
l)と3M6B164.3g(1.0mol)gを用い
た他は全く同じ操作を行い、参考例4の場合と同様にエ
ポキシ化を行って目的物を得た(XMCC−50Eとす
る)。このものの取り出し直後の性状は室温にて褐色の
粘稠な液体であった。この樹脂の参考例3と同様にして
測定した過冷却状態でのガラス転移温度、および結晶状
態での融点は、16℃、90℃であった。
Reference Example 4 Synthesis of Epoxy In the case of Reference Example 1, 26XY122.2 g (1.0 mo)
l) and 3M6B164.3 g (1.0 mol) g were used, and the same operation was performed, and epoxidation was performed in the same manner as in Reference Example 4 to obtain the target product (designated as XMCC-50E). The property of this product immediately after taking out was a brown viscous liquid at room temperature. The glass transition temperature in a supercooled state and the melting point in a crystalline state of this resin measured in the same manner as in Reference Example 3 were 16 ° C and 90 ° C.

【0016】実施例1、2 参考例3、4で得られたエポキシ樹脂0.5gを一度、15
0℃に加熱して溶融状態にし、そのまま放冷して室温に
て粘稠な液状の樹脂を得た。該樹脂を予め40〜120
℃に加熱しておいたゲル化試験器(日新科学(株)製)
の凹部に流し込み、ガラス棒を用いて一秒間に2回転の
速度で撹拌した。その時の樹脂が結晶化するまでに要し
た時間を表1に示す。
Examples 1 and 2 0.5 g of the epoxy resin obtained in Reference Examples 3 and 4 was once added to
It was heated to 0 ° C. to be in a molten state and allowed to cool as it was to obtain a viscous liquid resin at room temperature. 40-120 the resin in advance
Gelation tester heated to ℃ (manufactured by Nisshin Kagaku Co., Ltd.)
It was poured into the concave portion of and was stirred at a speed of 2 rotations per second using a glass rod. Table 1 shows the time required for the resin to crystallize at that time.

【0017】[0017]

【表1】 [Table 1]

【0018】実施例3 実施例1、2で結晶化させた樹脂をコーヒーミル型粉砕
機にて粉砕したところ0.5mm以下の粉末が得られた。
Example 3 The resin crystallized in Examples 1 and 2 was ground with a coffee mill grinder to obtain a powder of 0.5 mm or less.

【0019】比較例1 参考例3で得られたエポキシ樹脂0.5gを150℃に加熱
して溶融状態にし、予め140℃に加熱しておいたゲル
化試験器(日新科学(株)製)の凹部に流し込み、ガラ
ス棒を用いて一秒間に2回転の速度で撹拌したが、結晶
化しなかった。
Comparative Example 1 0.5 g of the epoxy resin obtained in Reference Example 3 was heated to 150 ° C. to be in a molten state and preheated to 140 ° C. Gelation tester (manufactured by Nisshin Kagaku Co., Ltd.) It was poured into the concave portion and stirred with a glass rod at a speed of 2 rotations per second, but it did not crystallize.

【0020】比較例2 参考例4で得られたエポキシ樹脂0.5gを150℃に加熱
して溶融状態にし、予め100℃に加熱しておいたゲル
化試験器(日新科学(株)製)の凹部に流し込み、ガラ
ス棒を用いて一秒間に2回転の速度で撹拌したが、結晶
化しなかった。
Comparative Example 2 0.5 g of the epoxy resin obtained in Reference Example 4 was heated to 150 ° C. to be in a molten state, and was preheated to 100 ° C. Gelation tester (manufactured by Nisshin Kagaku Co., Ltd.) It was poured into the concave portion and stirred with a glass rod at a speed of 2 rotations per second, but it did not crystallize.

【0021】比較例4 参考例3、4で得られたエポキシ樹脂0.5gを150℃に
加熱して溶融状態にし、23℃(室温)のゲル化試験器
(日新科学(株)製)の凹部に流し込み、静置した。そ
の時の樹脂が結晶化するまでに要した時間はすべての樹
脂において約1週間であった。
Comparative Example 4 0.5 g of the epoxy resin obtained in Reference Examples 3 and 4 was heated to 150 ° C. to be in a molten state, and a gelling tester (manufactured by Nisshin Kagaku Co., Ltd.) at 23 ° C. (room temperature) was used. It was poured into the recess and left to stand. The time required for the resins to crystallize at that time was about one week for all the resins.

【0022】[0022]

【発明の効果】本発明のエポキシ樹脂の粒状製品化方法
は、生産性、経済性に優れる。
EFFECT OF THE INVENTION The method for producing an epoxy resin granular product of the present invention is excellent in productivity and economy.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】過冷却状態にある結晶性エポキシ樹脂をガ
ラス転移温度以上、融点未満の温度範囲に保ち、外力を
加えて結晶核を成長せしめる工程および粒状化工程を順
に受けさせることを特徴とするエポキシ樹脂の粒状製品
化方法。
1. A crystalline epoxy resin in a supercooled state is maintained in a temperature range of a glass transition temperature or higher and lower than a melting point, and a step of growing crystal nuclei by applying an external force and a step of granulating are sequentially performed. Method for producing granular products of epoxy resin.
【請求項2】過冷却状態にある結晶性エポキシ樹脂がメ
ソゲン骨格を有するもの、あるいはビスフェノール骨格
を有するものである請求項1に記載のエポキシ樹脂の粒
状製品化方法。
2. The method for producing granular epoxy resin according to claim 1, wherein the crystalline epoxy resin in a supercooled state has a mesogenic skeleton or a bisphenol skeleton.
JP14883596A 1996-06-11 1996-06-11 Method of converting epoxy resin into granular products Expired - Lifetime JP3175593B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14883596A JP3175593B2 (en) 1996-06-11 1996-06-11 Method of converting epoxy resin into granular products

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14883596A JP3175593B2 (en) 1996-06-11 1996-06-11 Method of converting epoxy resin into granular products

Publications (2)

Publication Number Publication Date
JPH09328558A true JPH09328558A (en) 1997-12-22
JP3175593B2 JP3175593B2 (en) 2001-06-11

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Country Status (1)

Country Link
JP (1) JP3175593B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7491774B2 (en) 2003-04-08 2009-02-17 Japan Epoxy Resins Co., Ltd. Producing granular epoxy resin by refining and pulverizing solid epoxy resin

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7491774B2 (en) 2003-04-08 2009-02-17 Japan Epoxy Resins Co., Ltd. Producing granular epoxy resin by refining and pulverizing solid epoxy resin

Also Published As

Publication number Publication date
JP3175593B2 (en) 2001-06-11

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