JPH09231252A  Modeling method for threedimensional electromagnetic field model  Google Patents
Modeling method for threedimensional electromagnetic field modelInfo
 Publication number
 JPH09231252A JPH09231252A JP3683096A JP3683096A JPH09231252A JP H09231252 A JPH09231252 A JP H09231252A JP 3683096 A JP3683096 A JP 3683096A JP 3683096 A JP3683096 A JP 3683096A JP H09231252 A JPH09231252 A JP H09231252A
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 Japan
 Prior art keywords
 model
 electromagnetic field
 dimensional electromagnetic
 divided
 created
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 Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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 Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSSSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSSREFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
 Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
 Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
 Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
 Y02P90/30—Computing systems specially adapted for manufacturing
Abstract
Description
[0001]
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a modeling method of a threedimensional electromagnetic field model when a connector, a printed wiring board or the like is analyzed and modeled by a threedimensional electromagnetic field analysis simulator.
[0002]
2. Description of the Related Art In the conventional modeling method of a threedimensional electromagnetic field model, when a connector or a printed wiring board (hereinafter referred to as a connector) is analyzed and modeled by a threedimensional electromagnetic field analysis simulator, first, Physical information such as dimensions and materials is acquired, and the acquired physical information is converted into data for the entire modeling, that is, the entire connector and the like.
Next, an electromagnetic field analysis (or also called a finite element method) is performed based on the physical information of the whole, and the overall impedance (R), inductance (L), capacity (C) of the connector etc. , R,
An equivalent circuit is created from L and C, and a waveform as a characteristic of a connector or the like is obtained by a circuit simulator. On the other hand, in the electromagnetic field analysis, the whole is divided into meshes from the physical information of the whole connector and the like, and all of the divided meshes are analyzed for each mesh, so that the impedance mismatch is taken into consideration for modeling. I was doing.
[0004]
However, in the conventional modeling method, since all of the divided meshes are analyzed, the analysis time and the memory capacity increase in proportion to the number of meshes, so that a large amount of meshes are required. There is a problem that a large amount of memory is required for analysis time.
Further, considering the analysis time and the memory capacity, since complicated modeling with a large number of meshes is impossible, the analysis is performed by a simplified model with a small number of meshes, and there is a problem that the analysis accuracy deteriorates. . Therefore, in the analysis using the simplified model, detailed analysis such as impedance mismatch inside the connector or the like cannot be performed, and thus there is a problem that the accuracy of the final circuit analysis deteriorates.
[0006]
Therefore, in the modeling method of the threedimensional electromagnetic field model of the present invention, physical information such as the size and material of an object having wiring is acquired to create a threedimensional electromagnetic field model. , The threedimensional electromagnetic field model is divided into model patterns that satisfy the periodic boundary conditions, the model patterns are extracted, and the extracted model patterns are divided at the parts where impedance mismatch occurs, and a model file is created for each part. Then, impedance (R), inductance (L), by electromagnetic field analysis based on this model file,
An equivalent circuit was created by obtaining the capacitance (C), and a waveform as a characteristic of the object was simulated by a circuit simulator based on this equivalent circuit.
[0007]
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a flow chart, FIG.
Is an explanatory diagram of a model excerpt, FIG. 3 is an explanatory diagram of model division, and FIG. 4 is an explanatory diagram of creating an equivalent circuit. Hereinafter, a connector will be described as an example of an object having wiring, but the same can be applied to a printed wiring board or the like. S1: Organize the physical information of the connector. That is, physical information such as the dimensions and materials of the connector, such as the resistivity of the conductor and the permittivity of the insulator, is acquired and arranged. S2: A threedimensional electromagnetic field model is created based on the acquired physical information, and it is determined whether or not the periodic boundary condition of this threedimensional electromagnetic field model is satisfied. Here, the periodic boundary condition is a condition that can be divided into patterns in which physical properties appear periodically. If the periodic boundary condition is satisfied, the process proceeds to S3, and if not, the process proceeds to S4. S3: Divide the threedimensional electromagnetic field model into model patterns and extract the model patterns. For example, as shown in (1) of FIG. 2, ground pins A1 to A4, signal pins S1 to S4, ground pins A5 to A8, and signal pin S5 from the left side in the figure.
~ S8, ground pins A9 to A12, signal pins S9 to S1
2. When the ground pins and the signal pins are arranged alternately with the ground pins A13 to A16, if the pattern is divided like the region X, it is equivalent to the pattern of the region X being arranged. The condition is to divide like the region X. Therefore, here, as shown in (2) of FIG. 2, the model pattern is extracted such that the ground pins A5 to A8 and the ground pins A9 to A12 are provided on each side of the signal pins S5 to S8. S4: The extracted model pattern is divided at the portion where impedance mismatch occurs. Here, the portion where impedance mismatch occurs refers to, for example, a portion where the crosssectional area of the wiring pattern is abruptly bent and changed, or a portion where the dielectric constant is different. That is, specifically, as shown in FIG. 3, when the connector is composed of the board 1, the connector portion 2 and the backboard 3, the division is performed by the board portion P and the connector in which the dielectric constants of the insulators are different. Part Q and backboard part R, and in the case of the signal line S5, the parts Q1, Q2, Q3, and the part Q in which the shape of the pin is significantly different are defined with the part where the pin is bent in the connector part as a boundary.
Divide into 4. S5: Create a model file. That is, analysis is performed by a threedimensional electromagnetic field simulator, and a model file used in the threedimensional electromagnetic field simulator is created for each divided model pattern. S6: RLC is obtained by electromagnetic field analysis. That is, the RLC is calculated for each of the model files using a threedimensional electromagnetic field simulator. S7: Based on the RLC obtained in S6, for example, as shown in FIG. 4, a divided board portion P and connector portion Q
1, Q2, Q3, Q4, and the backboard portion R are divided and integrated into an equivalent circuit. S8: The equivalent circuit created in S7 is analyzed by a circuit simulator to simulate a waveform as a characteristic.
According to the above embodiment, a part of the connector is modeled by the periodic boundary condition, and
Since the analysis speed of the threedimensional electromagnetic field simulator has been increased by extracting and dividing the model, the effect of reducing the number of model creation steps and the period can be expected. In addition, when using a small amount of memory, even if a small amount of physical information is acquired, the model is extracted and segmented, so that detailed modeling can be achieved, and the analysis accuracy of the 3D electromagnetic field simulator can be obtained. Can be expected to improve.
Particularly, by dividing at a portion where impedance mismatching is likely to occur, a precise analysis result can be simulated, and the effect of being able to refer to the waveform affected by reflection in the connector is obtained. It is expected that the connector can be designed more accurately.
[0010]
As described above, according to the modeling method of the threedimensional electromagnetic field model of the present invention, a part of the connector is modeled by the periodic boundary condition, and the threedimensional electromagnetic field is modeled by extracting and dividing the model. Since the analysis speed of the field simulator has been increased, the effect of reducing the number of model creation steps and the period can be expected. Therefore, even if the memory has a small capacity, the analysis accuracy of the threedimensional electromagnetic field simulator will not be extremely deteriorated. In addition, when using a small amount of memory, even if a small amount of physical information is acquired, the model is extracted and segmented, so that detailed modeling can be achieved, and the analysis accuracy of the 3D electromagnetic field simulator can be obtained. Can be expected to improve.
In particular, by dividing at a portion where impedance mismatching is likely to occur, a precise analysis result can be simulated, and the effect of being able to refer to the waveform affected by reflection in the connector is obtained. The accuracy of the final circuit analysis will be better than in the conventional case, and the effect that more accurate design of connectors and the like can be expected can be expected.
FIG. 1 is a flowchart of an embodiment.
[Figure 2] Illustration of model excerpt
FIG. 3 is an explanatory diagram of model division
FIG. 4 is an explanatory diagram of creating an equivalent circuit.
1 board 2 connector part 3 backboard
Front Page Continuation (72) Inventor Kaju Hayakawa 112 Toranomon, Minatoku, Tokyo Oki Electric Industry Co., Ltd.
Claims (1)
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JP3683096A JPH09231252A (en)  19960223  19960223  Modeling method for threedimensional electromagnetic field model 
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JP3683096A JPH09231252A (en)  19960223  19960223  Modeling method for threedimensional electromagnetic field model 
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JPH09231252A true JPH09231252A (en)  19970905 
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JP (1)  JPH09231252A (en) 
Cited By (1)
Publication number  Priority date  Publication date  Assignee  Title 

KR101466879B1 (en) *  20120307  20141201  가부시키가이샤 무라타 세이사쿠쇼  Method and program for creating equivalent circuit 

1996
 19960223 JP JP3683096A patent/JPH09231252A/en active Pending
Cited By (1)
Publication number  Priority date  Publication date  Assignee  Title 

KR101466879B1 (en) *  20120307  20141201  가부시키가이샤 무라타 세이사쿠쇼  Method and program for creating equivalent circuit 
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