JPH09231252A - Modeling method for three-dimensional electromagnetic field model - Google Patents

Modeling method for three-dimensional electromagnetic field model

Info

Publication number
JPH09231252A
JPH09231252A JP3683096A JP3683096A JPH09231252A JP H09231252 A JPH09231252 A JP H09231252A JP 3683096 A JP3683096 A JP 3683096A JP 3683096 A JP3683096 A JP 3683096A JP H09231252 A JPH09231252 A JP H09231252A
Authority
JP
Japan
Prior art keywords
model
electromagnetic field
dimensional electromagnetic
divided
created
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3683096A
Other languages
Japanese (ja)
Inventor
Yoshihisa Hayakawa
Masao Izumi
Manabu Otsuka
学 大塚
佳寿 早川
正夫 泉
Original Assignee
Oki Business:Kk
Oki Electric Ind Co Ltd
株式会社沖ビジネス
沖電気工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Business:Kk, Oki Electric Ind Co Ltd, 株式会社沖ビジネス, 沖電気工業株式会社 filed Critical Oki Business:Kk
Priority to JP3683096A priority Critical patent/JPH09231252A/en
Publication of JPH09231252A publication Critical patent/JPH09231252A/en
Pending legal-status Critical Current

Links

Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/30Computing systems specially adapted for manufacturing

Abstract

(57) [Abstract] [Problem] There has been a problem that modeling of a three-dimensional electromagnetic field model considering impedance mismatch can be performed with a memory having a small capacity. SOLUTION: Physical information such as the size and material of an object having wiring is acquired to create a three-dimensional electromagnetic field model, and the three-dimensional electromagnetic field model is divided into model patterns in which periodic boundary conditions are satisfied. A model pattern is extracted, the extracted model pattern is divided at the portions where impedance mismatch occurs, and a model file is created for each portion. Based on this model file, impedance (R), inductance (L) ), The equivalent circuit is created by obtaining the capacitance (C), and the circuit simulator is used to simulate the waveform as the characteristic of the object based on the equivalent circuit.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a modeling method of a three-dimensional electromagnetic field model when a connector, a printed wiring board or the like is analyzed and modeled by a three-dimensional electromagnetic field analysis simulator.

[0002]

2. Description of the Related Art In the conventional modeling method of a three-dimensional electromagnetic field model, when a connector or a printed wiring board (hereinafter referred to as a connector) is analyzed and modeled by a three-dimensional electromagnetic field analysis simulator, first, Physical information such as dimensions and materials is acquired, and the acquired physical information is converted into data for the entire modeling, that is, the entire connector and the like.

Next, an electromagnetic field analysis (or also called a finite element method) is performed based on the physical information of the whole, and the overall impedance (R), inductance (L), capacity (C) of the connector etc. , R,
An equivalent circuit is created from L and C, and a waveform as a characteristic of a connector or the like is obtained by a circuit simulator. On the other hand, in the electromagnetic field analysis, the whole is divided into meshes from the physical information of the whole connector and the like, and all of the divided meshes are analyzed for each mesh, so that the impedance mismatch is taken into consideration for modeling. I was doing.

[0004]

However, in the conventional modeling method, since all of the divided meshes are analyzed, the analysis time and the memory capacity increase in proportion to the number of meshes, so that a large amount of meshes are required. There is a problem that a large amount of memory is required for analysis time.

Further, considering the analysis time and the memory capacity, since complicated modeling with a large number of meshes is impossible, the analysis is performed by a simplified model with a small number of meshes, and there is a problem that the analysis accuracy deteriorates. . Therefore, in the analysis using the simplified model, detailed analysis such as impedance mismatch inside the connector or the like cannot be performed, and thus there is a problem that the accuracy of the final circuit analysis deteriorates.

[0006]

Therefore, in the modeling method of the three-dimensional electromagnetic field model of the present invention, physical information such as the size and material of an object having wiring is acquired to create a three-dimensional electromagnetic field model. , The three-dimensional electromagnetic field model is divided into model patterns that satisfy the periodic boundary conditions, the model patterns are extracted, and the extracted model patterns are divided at the parts where impedance mismatch occurs, and a model file is created for each part. Then, impedance (R), inductance (L), by electromagnetic field analysis based on this model file,
An equivalent circuit was created by obtaining the capacitance (C), and a waveform as a characteristic of the object was simulated by a circuit simulator based on this equivalent circuit.

[0007]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a flow chart, FIG.
Is an explanatory diagram of a model excerpt, FIG. 3 is an explanatory diagram of model division, and FIG. 4 is an explanatory diagram of creating an equivalent circuit. Hereinafter, a connector will be described as an example of an object having wiring, but the same can be applied to a printed wiring board or the like. S1: Organize the physical information of the connector. That is, physical information such as the dimensions and materials of the connector, such as the resistivity of the conductor and the permittivity of the insulator, is acquired and arranged. S2: A three-dimensional electromagnetic field model is created based on the acquired physical information, and it is determined whether or not the periodic boundary condition of this three-dimensional electromagnetic field model is satisfied. Here, the periodic boundary condition is a condition that can be divided into patterns in which physical properties appear periodically. If the periodic boundary condition is satisfied, the process proceeds to S3, and if not, the process proceeds to S4. S3: Divide the three-dimensional electromagnetic field model into model patterns and extract the model patterns. For example, as shown in (1) of FIG. 2, ground pins A1 to A4, signal pins S1 to S4, ground pins A5 to A8, and signal pin S5 from the left side in the figure.
~ S8, ground pins A9 to A12, signal pins S9 to S1
2. When the ground pins and the signal pins are arranged alternately with the ground pins A13 to A16, if the pattern is divided like the region X, it is equivalent to the pattern of the region X being arranged. The condition is to divide like the region X. Therefore, here, as shown in (2) of FIG. 2, the model pattern is extracted such that the ground pins A5 to A8 and the ground pins A9 to A12 are provided on each side of the signal pins S5 to S8. S4: The extracted model pattern is divided at the portion where impedance mismatch occurs. Here, the portion where impedance mismatch occurs refers to, for example, a portion where the cross-sectional area of the wiring pattern is abruptly bent and changed, or a portion where the dielectric constant is different. That is, specifically, as shown in FIG. 3, when the connector is composed of the board 1, the connector portion 2 and the backboard 3, the division is performed by the board portion P and the connector in which the dielectric constants of the insulators are different. Part Q and backboard part R, and in the case of the signal line S5, the parts Q1, Q2, Q3, and the part Q in which the shape of the pin is significantly different are defined with the part where the pin is bent in the connector part as a boundary.
Divide into 4. S5: Create a model file. That is, analysis is performed by a three-dimensional electromagnetic field simulator, and a model file used in the three-dimensional electromagnetic field simulator is created for each divided model pattern. S6: RLC is obtained by electromagnetic field analysis. That is, the RLC is calculated for each of the model files using a three-dimensional electromagnetic field simulator. S7: Based on the RLC obtained in S6, for example, as shown in FIG. 4, a divided board portion P and connector portion Q
1, Q2, Q3, Q4, and the backboard portion R are divided and integrated into an equivalent circuit. S8: The equivalent circuit created in S7 is analyzed by a circuit simulator to simulate a waveform as a characteristic.

According to the above embodiment, a part of the connector is modeled by the periodic boundary condition, and
Since the analysis speed of the three-dimensional electromagnetic field simulator has been increased by extracting and dividing the model, the effect of reducing the number of model creation steps and the period can be expected. In addition, when using a small amount of memory, even if a small amount of physical information is acquired, the model is extracted and segmented, so that detailed modeling can be achieved, and the analysis accuracy of the 3D electromagnetic field simulator can be obtained. Can be expected to improve.

Particularly, by dividing at a portion where impedance mismatching is likely to occur, a precise analysis result can be simulated, and the effect of being able to refer to the waveform affected by reflection in the connector is obtained. It is expected that the connector can be designed more accurately.

[0010]

As described above, according to the modeling method of the three-dimensional electromagnetic field model of the present invention, a part of the connector is modeled by the periodic boundary condition, and the three-dimensional electromagnetic field is modeled by extracting and dividing the model. Since the analysis speed of the field simulator has been increased, the effect of reducing the number of model creation steps and the period can be expected. Therefore, even if the memory has a small capacity, the analysis accuracy of the three-dimensional electromagnetic field simulator will not be extremely deteriorated. In addition, when using a small amount of memory, even if a small amount of physical information is acquired, the model is extracted and segmented, so that detailed modeling can be achieved, and the analysis accuracy of the 3D electromagnetic field simulator can be obtained. Can be expected to improve.

In particular, by dividing at a portion where impedance mismatching is likely to occur, a precise analysis result can be simulated, and the effect of being able to refer to the waveform affected by reflection in the connector is obtained. The accuracy of the final circuit analysis will be better than in the conventional case, and the effect that more accurate design of connectors and the like can be expected can be expected.

[Brief description of drawings]

FIG. 1 is a flowchart of an embodiment.

[Figure 2] Illustration of model excerpt

FIG. 3 is an explanatory diagram of model division

FIG. 4 is an explanatory diagram of creating an equivalent circuit.

[Explanation of symbols]

 1 board 2 connector part 3 backboard

Front Page Continuation (72) Inventor Kaju Hayakawa 1-12 Toranomon, Minato-ku, Tokyo Oki Electric Industry Co., Ltd.

Claims (1)

[Claims]
1. A three-dimensional electromagnetic field model is created by acquiring physical information such as the size and material of an object having wiring, and the three-dimensional electromagnetic field model is divided into model patterns satisfying a periodic boundary condition. The model pattern is extracted, the extracted model pattern is divided at the part where impedance mismatch occurs, and a model file is created for each part. Based on this model file, the impedance, inductance, and capacitance are calculated by electromagnetic field analysis. A modeling method for a three-dimensional electromagnetic field model, which is characterized in that an equivalent circuit is obtained and a waveform as a characteristic of an object is simulated by a circuit simulator based on the equivalent circuit.
JP3683096A 1996-02-23 1996-02-23 Modeling method for three-dimensional electromagnetic field model Pending JPH09231252A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3683096A JPH09231252A (en) 1996-02-23 1996-02-23 Modeling method for three-dimensional electromagnetic field model

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3683096A JPH09231252A (en) 1996-02-23 1996-02-23 Modeling method for three-dimensional electromagnetic field model

Publications (1)

Publication Number Publication Date
JPH09231252A true JPH09231252A (en) 1997-09-05

Family

ID=12480672

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3683096A Pending JPH09231252A (en) 1996-02-23 1996-02-23 Modeling method for three-dimensional electromagnetic field model

Country Status (1)

Country Link
JP (1) JPH09231252A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101466879B1 (en) * 2012-03-07 2014-12-01 가부시키가이샤 무라타 세이사쿠쇼 Method and program for creating equivalent circuit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101466879B1 (en) * 2012-03-07 2014-12-01 가부시키가이샤 무라타 세이사쿠쇼 Method and program for creating equivalent circuit

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