JPH09207367A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPH09207367A JPH09207367A JP8040597A JP4059796A JPH09207367A JP H09207367 A JPH09207367 A JP H09207367A JP 8040597 A JP8040597 A JP 8040597A JP 4059796 A JP4059796 A JP 4059796A JP H09207367 A JPH09207367 A JP H09207367A
- Authority
- JP
- Japan
- Prior art keywords
- head cover
- base
- screw
- insulating substrate
- thermal head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 238000010438 heat treatment Methods 0.000 claims description 12
- 230000001681 protective effect Effects 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 20
- 229910052782 aluminium Inorganic materials 0.000 abstract description 20
- 230000005489 elastic deformation Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、感熱,熱転写記録
装置等に用いられるサーマルヘッドに関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermal head used in a heat-sensitive or thermal transfer recording device or the like.
【0002】[0002]
【従来の技術】図4は、この種のサーマルヘッドの構成
を示す図であり、図において1はサーマルヘッドの基台
であり且つ放熱部材としてのアルミベース、2はセラミ
ック等よりなる絶縁基板、3は絶縁基板2上に形成され
る発熱抵抗体31,個別電極32,共通電極33,接続
端子34よりなる導体部、4は駆動IC、5は封止材、
6はフレキシブル基板、7は押圧部材、8はヘッドカバ
ー、9は固定部材である。2. Description of the Related Art FIG. 4 is a view showing the structure of a thermal head of this type. In FIG. 4, 1 is a base of the thermal head and an aluminum base as a heat radiating member, 2 is an insulating substrate made of ceramic or the like, Reference numeral 3 denotes a conductor portion formed on the insulating substrate 2, which includes a heating resistor 31, an individual electrode 32, a common electrode 33, and a connection terminal 34, 4 is a drive IC, 5 is a sealing material,
6 is a flexible substrate, 7 is a pressing member, 8 is a head cover, and 9 is a fixing member.
【0003】個別電極32は、ライン状に形成される発
熱抵抗体31および駆動IC4に接続され、駆動IC4
は、個別電極32に区切られることにより形成される発
熱抵抗素子を選択的に通電して発熱させる。駆動IC4
は、ボンディングワイヤBWにより個別電極32および
接続端子34に接続されている。The individual electrode 32 is connected to the heating resistor 31 and the driving IC 4 formed in a line, and the driving IC 4
Generates heat by selectively energizing the heating resistance element formed by being divided into the individual electrodes 32. Drive IC4
Are connected to the individual electrodes 32 and the connection terminals 34 by the bonding wires BW.
【0004】この接続端子34上には、その接続端子パ
ターンに応じた導電パターンを有するフレキシブル基板
6が重ねられ、このフレキシブル基板6は、弾性体であ
る押圧部材7により絶縁基板2に圧接されて接続されて
いる。この押圧部材7は、ヘッドカバー8が押圧部材7
を弾性変形させたままアルミベース1に取り付けられる
ことにより、フレキシブル基板6を絶縁基板2に常時圧
接している。A flexible substrate 6 having a conductive pattern corresponding to the connection terminal pattern is superposed on the connection terminal 34, and the flexible substrate 6 is pressed against the insulating substrate 2 by a pressing member 7 which is an elastic body. It is connected. In this pressing member 7, the head cover 8 has the pressing member 7
The flexible substrate 6 is constantly pressed against the insulating substrate 2 by being attached to the aluminum base 1 while being elastically deformed.
【0005】図示しない記録装置の制御部は、このフレ
キシブル基板6およびコネクタを介して記録データを駆
動IC4に送信し、発熱抵抗体31を駆動制御するよう
構成されている。The control unit of the recording apparatus (not shown) is configured to transmit recording data to the drive IC 4 via the flexible substrate 6 and the connector to drive and control the heating resistor 31.
【0006】[0006]
【発明が解決しようとする課題】この種のサーマルヘッ
ドを用いる記録装置において、被記録媒体として記録紙
等を用いる場合は、円筒形のプラテンローラの一部周面
に記録紙を巻回して、プラテンローラのこの記録紙が巻
回されている部分にサーマルヘッドの発熱抵抗体部を押
圧し、プラテンローラを回転することにより記録紙を搬
送するとともに、発熱抵抗体を選択的に発熱駆動するこ
とにより記録を行うよう構成されている。In a recording apparatus using this type of thermal head, when recording paper or the like is used as the recording medium, the recording paper is wound around a part of the peripheral surface of a cylindrical platen roller, The heating resistor part of the thermal head is pressed against the portion of the platen roller around which the recording paper is wound, and the recording paper is conveyed by rotating the platen roller, and the heating resistor is selectively driven to generate heat. Is configured to record.
【0007】また、可撓性を有さない或いは剛性の大き
い被記録媒体や、スクリーン印刷の版下作成用の紗のよ
うにテンションを付与して展張される被記録媒体に、こ
のサーマルヘッドを用いて記録を行う装置の場合は、プ
ラテンローラに巻回さずに被記録媒体に直接サーマルヘ
ッドの発熱抵抗体31を押圧し、サーマルヘッドと被記
録媒体とを相対的に移動させるとともに発熱抵抗体を選
択的に駆動して記録を行うよう構成されている。このよ
うな記録装置の場合、発熱抵抗体31以外の部分が被記
録媒体に接触しないように、ヘッドカバー8および固定
部材9はできるだけ絶縁基板2上より突出しない方が望
ましい。しかしながら、従来のサーマルヘッドの場合、
固定部材9のネジ91が被記録媒体側であるヘッドカバ
ー8の表面部分より突出してしまうので、剛性の大きい
或いは可撓性を有さない被記録媒体を用いる記録装置に
適用することができないという不具合を生じていた。ま
た、ネジ部材91がヘッドカバー8の表面より突出する
のを防ぐために、ヘッドカバー8の表面に所定の深さの
溝を形成し、この溝部分よりネジ部材91を取り付ける
という方法があるが、この場合、ヘッドカバー8に溝を
設けることにより、ヘッドカバー8の剛性が低下し、押
圧部材7により絶縁基板2およびフレキシブル基板6を
押圧する力が低下するという問題が生じていた。Further, the thermal head is applied to a recording medium which is not flexible or has a large rigidity, or a recording medium which is stretched by applying tension like a gauze for making a screen printing plate. In the case of an apparatus for recording by using the recording medium, the heating resistor 31 of the thermal head is directly pressed against the recording medium without winding it around the platen roller, and the thermal head and the recording medium are relatively moved and the heating resistance is It is configured to selectively drive the body for recording. In the case of such a recording apparatus, it is desirable that the head cover 8 and the fixing member 9 do not protrude from the insulating substrate 2 as much as possible so that the portions other than the heat generating resistor 31 do not come into contact with the recording medium. However, in the case of a conventional thermal head,
Since the screw 91 of the fixing member 9 protrudes from the surface portion of the head cover 8 on the recording medium side, it cannot be applied to a recording apparatus using a recording medium having high rigidity or inflexibility. Was occurring. Further, in order to prevent the screw member 91 from protruding from the surface of the head cover 8, there is a method of forming a groove having a predetermined depth on the surface of the head cover 8 and attaching the screw member 91 from this groove portion. The provision of the groove in the head cover 8 causes a problem that the rigidity of the head cover 8 is lowered and the force for pushing the insulating substrate 2 and the flexible substrate 6 by the pushing member 7 is lowered.
【0008】本発明は、これらの不具合を解決するため
になされたもので、ヘッドカバーの剛性を損なうことな
く、固定部材がその表面より突出することがないサーマ
ルヘッドを提供することを目的とする。The present invention has been made in order to solve these problems, and an object of the present invention is to provide a thermal head in which the fixing member does not protrude from the surface thereof without impairing the rigidity of the head cover.
【0009】[0009]
【課題を解決するための手段】上記課題を解決するため
に、本発明のサーマルヘッドにおいては、ヘッドカバー
には基台側の面にねじ穴を設け、基台にはねじ貫通穴を
設け、基台側よりヘッドカバーに設けられるねじ穴に係
合するねじによりヘッドカバーを基台に対して固定する
よう構成した。In order to solve the above-mentioned problems, in the thermal head of the present invention, the head cover is provided with a screw hole on the surface on the base side, and the base is provided with a screw through hole. The head cover is fixed to the base by screws that engage with screw holes provided in the head cover from the base side.
【0010】[0010]
【発明の実施の形態】以下図面に基づいて、本発明のサ
ーマルヘッドを説明する。図1は、本発明のサーマルヘ
ッドの各構成を示す分解斜視図であり、上述のサーマル
ヘッドと同等或いは対応する構成については同符号によ
り示されている。DESCRIPTION OF THE PREFERRED EMBODIMENTS The thermal head of the present invention will be described below with reference to the drawings. FIG. 1 is an exploded perspective view showing each structure of the thermal head of the present invention, and the same or corresponding structures as those of the above-mentioned thermal head are denoted by the same reference numerals.
【0011】本発明のサーマルヘッドにおけるヘッドカ
バー8には、アルミベース1側,即ちフレキシブル基板
6に接する面(下側面)にヘッドの長手方向に所定間隔
をおいて、複数のネジ穴92が形成されており、アルミ
ベース1には、このネジ穴92に対応して、複数の貫通
穴93が形成されている。In the head cover 8 of the thermal head of the present invention, a plurality of screw holes 92 are formed on the aluminum base 1 side, that is, the surface (lower side surface) in contact with the flexible substrate 6 at predetermined intervals in the longitudinal direction of the head. The aluminum base 1 has a plurality of through holes 93 corresponding to the screw holes 92.
【0012】本発明のサーマルヘッドも、上述の従来の
サーマルヘッドと同様に、アルミベース1上に絶縁基板
2が載置,位置決めされ、この絶縁基板2上の接続端子
34上に、その接続端子パターンに応じた導電パターン
を有するフレキシブル基板6を重ね、更に押圧部材7を
介してヘッドカバー8を絶縁基板2上の駆動制御回路4
を覆うように載置する。この時、アルミベース1に設け
られた貫通穴93とヘッドカバー8に設けられたネジ穴
92が一致するよう位置づけられる。Also in the thermal head of the present invention, similarly to the above-described conventional thermal head, the insulating substrate 2 is placed and positioned on the aluminum base 1, and the connecting terminal is placed on the connecting terminal 34 on the insulating substrate 2. A flexible substrate 6 having a conductive pattern corresponding to the pattern is overlaid, and a head cover 8 is further attached via a pressing member 7 to the drive control circuit 4 on the insulating substrate 2.
Place it so that it covers. At this time, the through hole 93 provided in the aluminum base 1 and the screw hole 92 provided in the head cover 8 are positioned so as to coincide with each other.
【0013】アルミベース1に対する絶縁基板2,フレ
キシブル基板6,ヘッドカバー8の固定は、アルミベー
ス1側より貫通穴93を介して、ヘッドカバー8のネジ
穴92にネジ91を締め付けることにより行われる。即
ち、アルミベース1側より貫通穴93に嵌入されたネジ
91は、ヘッドカバー8に設けられたネジ穴92に螺合
し、締め付けられる。これによりアルミベース1に対し
てフレキシブル基板6を介してヘッドカバー8が固定さ
れるとともに、ヘッドカバー8に支持される押圧部材7
の弾性変形により絶縁基板2にフレキシブル基板6が押
圧されるとともに、これらがアルミベース1に固定され
る。The insulating substrate 2, the flexible substrate 6, and the head cover 8 are fixed to the aluminum base 1 by tightening screws 91 in the screw holes 92 of the head cover 8 from the aluminum base 1 side through the through holes 93. That is, the screw 91 fitted into the through hole 93 from the aluminum base 1 side is screwed into the screw hole 92 provided in the head cover 8 and is tightened. As a result, the head cover 8 is fixed to the aluminum base 1 via the flexible substrate 6 and the pressing member 7 supported by the head cover 8 is provided.
The flexible substrate 6 is pressed against the insulating substrate 2 by the elastic deformation of, and these are fixed to the aluminum base 1.
【0014】本発明のサーマルヘッドにおいては、図2
に示されるように、ヘッドカバー8を固定する部材を基
台であるアルミベース1側に設けて構成し、また、溝等
を形成する必要がないので、剛性の低下,部品加工費の
上昇を招くことなく、被記録媒体側にネジ等が突出しな
いサーマルヘッドを構成することができる。In the thermal head of the present invention, as shown in FIG.
As shown in FIG. 3, since the member for fixing the head cover 8 is provided on the side of the aluminum base 1 which is the base, and it is not necessary to form a groove or the like, the rigidity is lowered and the cost for processing parts is increased. It is possible to configure a thermal head in which a screw or the like does not project to the recording medium side.
【0015】図3は、本発明の他の実施例を示す図であ
り、上述の実施例との相違点は、アルミベース1のネジ
91を嵌入する部分に、ヘッドの長手方向に延びる溝を
形成した点にある。本実施例によれば、ネジ91がアル
ミベース1より突出することがなく、ヘッド全体を薄型
に形成することができる。FIG. 3 is a diagram showing another embodiment of the present invention. The difference from the above-mentioned embodiment is that a groove extending in the longitudinal direction of the head is formed in the portion of the aluminum base 1 into which the screw 91 is fitted. It is in the point where it was formed. According to this embodiment, the screw 91 does not protrude from the aluminum base 1, and the entire head can be formed thin.
【0016】また、本実施例においては、共通電極33
を設けることにより、発熱抵抗体31をヘッドの端部に
形成した、所謂ニアエッジ型のサーマルヘッドに本発明
の固定部材9を適用した例を示したが、これに限定され
るものではなく、交互リード方式等その他のサーマルヘ
ッドに採用することができることは言うまでもない。Further, in this embodiment, the common electrode 33 is used.
The fixing member 9 of the present invention is applied to a so-called near-edge type thermal head in which the heating resistor 31 is formed at the end portion of the head by providing the above. However, the present invention is not limited to this and alternates. It goes without saying that it can be applied to other thermal heads such as the lead type.
【0017】[0017]
【発明の効果】以上詳述したように、本発明のサーマル
ヘッドにおいては、ヘッドカバーの基台側の面にネジ穴
を設けるとともに、基台にネジ貫通穴を設け、基台側よ
りヘッドカバーに設けられるネジ穴にネジを係合させる
ことによりヘッドカバーを固定するよう構成したので、
固定部材がヘッドカバー表面より突出することがなく、
剛性の大きい被記録媒体に記録を行う記録装置に適用す
ることができるという効果を奏する。As described above in detail, in the thermal head of the present invention, a screw hole is provided on the surface of the head cover on the base side, and a screw through hole is provided on the base so that the head cover is provided from the base side. Since the head cover is fixed by engaging the screw with the screw hole,
The fixing member does not protrude from the surface of the head cover,
The present invention has an effect of being applicable to a recording apparatus that records on a recording medium having high rigidity.
【図1】 本発明のサーマルヘッドの各構成を示す分解
斜視図である。FIG. 1 is an exploded perspective view showing each configuration of a thermal head of the present invention.
【図2】 本発明のサーマルヘッドを示す図である。FIG. 2 is a diagram showing a thermal head of the present invention.
【図3】 本発明の第2実施例を示す図である。FIG. 3 is a diagram showing a second embodiment of the present invention.
【図4】 従来のサーマルヘッドを示す説明図である。FIG. 4 is an explanatory diagram showing a conventional thermal head.
1 アルミベース 2 絶縁基板 3 導体部 4 駆動IC 5 封止材 6 フレキシブル基板 7 押圧部材 8 ヘッドカバー 9 固定部材 1 Aluminum Base 2 Insulating Substrate 3 Conductor 4 Drive IC 5 Sealing Material 6 Flexible Substrate 7 Pressing Member 8 Head Cover 9 Fixing Member
Claims (1)
れる個別電極と、この個別電極に接続され上記発熱抵抗
体を選択的に駆動制御する駆動制御回路が設けられる絶
縁基板と、 上記絶縁基板上の駆動制御回路を覆う保護カバーと、 上記絶縁基板および保護カバーを支持する基台とを有す
るサーマルヘッドにおいて、 上記ヘッドカバーには基台側の面にねじ穴が設けられる
とともに、上記基台にはねじ貫通穴が設けられ、基台側
よりヘッドカバーに設けられるねじ穴に係合するねじに
より、ヘッドカバーを基台に対して固定することを特徴
とするサーマルヘッド。1. A heating resistor, an individual electrode connected to the heating resistor, an insulating substrate connected to the individual electrode and provided with a drive control circuit for selectively driving and controlling the heating resistor, In a thermal head having a protective cover for covering a drive control circuit on an insulating substrate and a base for supporting the insulating substrate and the protective cover, the head cover is provided with a screw hole on the surface on the base side, and A thermal head characterized in that a screw through hole is provided in the base, and the head cover is fixed to the base with a screw engaging with a screw hole provided in the head cover from the base side.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8040597A JPH09207367A (en) | 1996-02-02 | 1996-02-02 | Thermal head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8040597A JPH09207367A (en) | 1996-02-02 | 1996-02-02 | Thermal head |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH09207367A true JPH09207367A (en) | 1997-08-12 |
Family
ID=12584928
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8040597A Pending JPH09207367A (en) | 1996-02-02 | 1996-02-02 | Thermal head |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH09207367A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011136142A1 (en) | 2010-04-26 | 2011-11-03 | 京セラ株式会社 | Thermal head |
JP2012206273A (en) * | 2011-03-29 | 2012-10-25 | Toshiba Hokuto Electronics Corp | Thermal head |
CN107107625A (en) * | 2015-01-16 | 2017-08-29 | 罗姆股份有限公司 | Thermal printing head |
-
1996
- 1996-02-02 JP JP8040597A patent/JPH09207367A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011136142A1 (en) | 2010-04-26 | 2011-11-03 | 京セラ株式会社 | Thermal head |
CN102781674A (en) * | 2010-04-26 | 2012-11-14 | 京瓷株式会社 | Thermal head |
EP2565041A1 (en) * | 2010-04-26 | 2013-03-06 | Kyocera Corporation | Thermal head |
EP2565041A4 (en) * | 2010-04-26 | 2014-03-19 | Kyocera Corp | Thermal head |
JP2012206273A (en) * | 2011-03-29 | 2012-10-25 | Toshiba Hokuto Electronics Corp | Thermal head |
CN107107625A (en) * | 2015-01-16 | 2017-08-29 | 罗姆股份有限公司 | Thermal printing head |
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