JPH09207367A - Thermal head - Google Patents

Thermal head

Info

Publication number
JPH09207367A
JPH09207367A JP8040597A JP4059796A JPH09207367A JP H09207367 A JPH09207367 A JP H09207367A JP 8040597 A JP8040597 A JP 8040597A JP 4059796 A JP4059796 A JP 4059796A JP H09207367 A JPH09207367 A JP H09207367A
Authority
JP
Japan
Prior art keywords
base
head cover
head
thermal head
screw
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8040597A
Other languages
Japanese (ja)
Inventor
Takeshi Toyosawa
武 豊澤
Original Assignee
Graphtec Corp
グラフテック株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Graphtec Corp, グラフテック株式会社 filed Critical Graphtec Corp
Priority to JP8040597A priority Critical patent/JPH09207367A/en
Publication of JPH09207367A publication Critical patent/JPH09207367A/en
Granted legal-status Critical Current

Links

Abstract

(57) An object of the present invention is to provide a thermal head in which a fixing member does not protrude from the surface thereof without impairing the rigidity of the head cover. SOLUTION: The head cover is provided with a screw hole on the surface of the base side, the base is provided with a screw through hole, and the head cover is attached to the base by a screw engaging with a screw hole provided on the head cover from the base side. Configured to be fixed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermal head used in a heat-sensitive or thermal transfer recording device or the like.

[0002]

2. Description of the Related Art FIG. 4 is a view showing the structure of a thermal head of this type. In FIG. 4, 1 is a base of the thermal head and an aluminum base as a heat radiating member, 2 is an insulating substrate made of ceramic or the like, Reference numeral 3 denotes a conductor portion formed on the insulating substrate 2, which includes a heating resistor 31, an individual electrode 32, a common electrode 33, and a connection terminal 34, 4 is a drive IC, 5 is a sealing material,
6 is a flexible substrate, 7 is a pressing member, 8 is a head cover, and 9 is a fixing member.

The individual electrode 32 is connected to the heating resistor 31 and the driving IC 4 formed in a line, and the driving IC 4
Generates heat by selectively energizing the heating resistance element formed by being divided into the individual electrodes 32. Drive IC4
Are connected to the individual electrodes 32 and the connection terminals 34 by the bonding wires BW.

A flexible substrate 6 having a conductive pattern corresponding to the connection terminal pattern is superposed on the connection terminal 34, and the flexible substrate 6 is pressed against the insulating substrate 2 by a pressing member 7 which is an elastic body. It is connected. In this pressing member 7, the head cover 8 has the pressing member 7
The flexible substrate 6 is constantly pressed against the insulating substrate 2 by being attached to the aluminum base 1 while being elastically deformed.

The control unit of the recording apparatus (not shown) is configured to transmit recording data to the drive IC 4 via the flexible substrate 6 and the connector to drive and control the heating resistor 31.

[0006]

In a recording apparatus using this type of thermal head, when recording paper or the like is used as the recording medium, the recording paper is wound around a part of the peripheral surface of a cylindrical platen roller, The heating resistor part of the thermal head is pressed against the portion of the platen roller around which the recording paper is wound, and the recording paper is conveyed by rotating the platen roller, and the heating resistor is selectively driven to generate heat. Is configured to record.

Further, the thermal head is applied to a recording medium which is not flexible or has a large rigidity, or a recording medium which is stretched by applying tension like a gauze for making a screen printing plate. In the case of an apparatus for recording by using the recording medium, the heating resistor 31 of the thermal head is directly pressed against the recording medium without winding it around the platen roller, and the thermal head and the recording medium are relatively moved and the heating resistance is It is configured to selectively drive the body for recording. In the case of such a recording apparatus, it is desirable that the head cover 8 and the fixing member 9 do not protrude from the insulating substrate 2 as much as possible so that the portions other than the heat generating resistor 31 do not come into contact with the recording medium. However, in the case of a conventional thermal head,
Since the screw 91 of the fixing member 9 protrudes from the surface portion of the head cover 8 on the recording medium side, it cannot be applied to a recording apparatus using a recording medium having high rigidity or inflexibility. Was occurring. Further, in order to prevent the screw member 91 from protruding from the surface of the head cover 8, there is a method of forming a groove having a predetermined depth on the surface of the head cover 8 and attaching the screw member 91 from this groove portion. The provision of the groove in the head cover 8 causes a problem that the rigidity of the head cover 8 is lowered and the force for pushing the insulating substrate 2 and the flexible substrate 6 by the pushing member 7 is lowered.

The present invention has been made in order to solve these problems, and an object of the present invention is to provide a thermal head in which the fixing member does not protrude from the surface thereof without impairing the rigidity of the head cover.

[0009]

In order to solve the above-mentioned problems, in the thermal head of the present invention, the head cover is provided with a screw hole on the surface on the base side, and the base is provided with a screw through hole. The head cover is fixed to the base by screws that engage with screw holes provided in the head cover from the base side.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The thermal head of the present invention will be described below with reference to the drawings. FIG. 1 is an exploded perspective view showing each structure of the thermal head of the present invention, and the same or corresponding structures as those of the above-mentioned thermal head are denoted by the same reference numerals.

In the head cover 8 of the thermal head of the present invention, a plurality of screw holes 92 are formed on the aluminum base 1 side, that is, the surface (lower side surface) in contact with the flexible substrate 6 at predetermined intervals in the longitudinal direction of the head. The aluminum base 1 has a plurality of through holes 93 corresponding to the screw holes 92.

Also in the thermal head of the present invention, similarly to the above-described conventional thermal head, the insulating substrate 2 is placed and positioned on the aluminum base 1, and the connecting terminal is placed on the connecting terminal 34 on the insulating substrate 2. A flexible substrate 6 having a conductive pattern corresponding to the pattern is overlaid, and a head cover 8 is further attached via a pressing member 7 to the drive control circuit 4 on the insulating substrate 2.
Place it so that it covers. At this time, the through hole 93 provided in the aluminum base 1 and the screw hole 92 provided in the head cover 8 are positioned so as to coincide with each other.

The insulating substrate 2, the flexible substrate 6, and the head cover 8 are fixed to the aluminum base 1 by tightening screws 91 in the screw holes 92 of the head cover 8 from the aluminum base 1 side through the through holes 93. That is, the screw 91 fitted into the through hole 93 from the aluminum base 1 side is screwed into the screw hole 92 provided in the head cover 8 and is tightened. As a result, the head cover 8 is fixed to the aluminum base 1 via the flexible substrate 6 and the pressing member 7 supported by the head cover 8 is provided.
The flexible substrate 6 is pressed against the insulating substrate 2 by the elastic deformation of, and these are fixed to the aluminum base 1.

In the thermal head of the present invention, as shown in FIG.
As shown in FIG. 3, since the member for fixing the head cover 8 is provided on the side of the aluminum base 1 which is the base, and it is not necessary to form a groove or the like, the rigidity is lowered and the cost for processing parts is increased. It is possible to configure a thermal head in which a screw or the like does not project to the recording medium side.

FIG. 3 is a diagram showing another embodiment of the present invention. The difference from the above-mentioned embodiment is that a groove extending in the longitudinal direction of the head is formed in the portion of the aluminum base 1 into which the screw 91 is fitted. It is in the point where it was formed. According to this embodiment, the screw 91 does not protrude from the aluminum base 1, and the entire head can be formed thin.

Further, in this embodiment, the common electrode 33 is used.
The fixing member 9 of the present invention is applied to a so-called near-edge type thermal head in which the heating resistor 31 is formed at the end portion of the head by providing the above. However, the present invention is not limited to this and alternates. It goes without saying that it can be applied to other thermal heads such as the lead type.

[0017]

As described above in detail, in the thermal head of the present invention, a screw hole is provided on the surface of the head cover on the base side, and a screw through hole is provided on the base so that the head cover is provided from the base side. Since the head cover is fixed by engaging the screw with the screw hole,
The fixing member does not protrude from the surface of the head cover,
The present invention has an effect of being applicable to a recording apparatus that records on a recording medium having high rigidity.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing each configuration of a thermal head of the present invention.

FIG. 2 is a diagram showing a thermal head of the present invention.

FIG. 3 is a diagram showing a second embodiment of the present invention.

FIG. 4 is an explanatory diagram showing a conventional thermal head.

[Explanation of symbols]

 1 Aluminum Base 2 Insulating Substrate 3 Conductor 4 Drive IC 5 Sealing Material 6 Flexible Substrate 7 Pressing Member 8 Head Cover 9 Fixing Member

Claims (1)

[Claims]
1. A heating resistor, an individual electrode connected to the heating resistor, an insulating substrate connected to the individual electrode and provided with a drive control circuit for selectively driving and controlling the heating resistor, In a thermal head having a protective cover for covering a drive control circuit on an insulating substrate and a base for supporting the insulating substrate and the protective cover, the head cover is provided with a screw hole on the surface on the base side, and A thermal head characterized in that a screw through hole is provided in the base, and the head cover is fixed to the base with a screw engaging with a screw hole provided in the head cover from the base side.
JP8040597A 1996-02-02 1996-02-02 Thermal head Granted JPH09207367A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8040597A JPH09207367A (en) 1996-02-02 1996-02-02 Thermal head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8040597A JPH09207367A (en) 1996-02-02 1996-02-02 Thermal head

Publications (1)

Publication Number Publication Date
JPH09207367A true JPH09207367A (en) 1997-08-12

Family

ID=12584928

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8040597A Granted JPH09207367A (en) 1996-02-02 1996-02-02 Thermal head

Country Status (1)

Country Link
JP (1) JPH09207367A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011136142A1 (en) 2010-04-26 2011-11-03 京セラ株式会社 Thermal head
JP2012206273A (en) * 2011-03-29 2012-10-25 Toshiba Hokuto Electronics Corp Thermal head
CN107107625A (en) * 2015-01-16 2017-08-29 罗姆股份有限公司 Thermal printing head

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011136142A1 (en) 2010-04-26 2011-11-03 京セラ株式会社 Thermal head
CN102781674A (en) * 2010-04-26 2012-11-14 京瓷株式会社 Thermal head
EP2565041A1 (en) * 2010-04-26 2013-03-06 Kyocera Corporation Thermal head
EP2565041A4 (en) * 2010-04-26 2014-03-19 Kyocera Corp Thermal head
JP2012206273A (en) * 2011-03-29 2012-10-25 Toshiba Hokuto Electronics Corp Thermal head
CN107107625A (en) * 2015-01-16 2017-08-29 罗姆股份有限公司 Thermal printing head

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