JPH09181496A - Back-up mechanism - Google Patents
Back-up mechanismInfo
- Publication number
- JPH09181496A JPH09181496A JP7339515A JP33951595A JPH09181496A JP H09181496 A JPH09181496 A JP H09181496A JP 7339515 A JP7339515 A JP 7339515A JP 33951595 A JP33951595 A JP 33951595A JP H09181496 A JPH09181496 A JP H09181496A
- Authority
- JP
- Japan
- Prior art keywords
- backup
- pin
- mounting board
- height
- pins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、板を水平に支える
バックアップ機構に関し、特に、電子部品を実装した基
板のような下面（支える面）に凹凸部を有する板を均一
に支えるバックアップ機構に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a backup mechanism for horizontally supporting a plate, and more particularly to a backup mechanism for uniformly supporting a plate having an uneven portion on its lower surface (supporting surface) such as a board on which electronic components are mounted.
【０００２】[0002]
【従来の技術】従来、この種のバックアップ機構は、例
えば、実開平４−１２７６８０号公報に示されるよう
に、実装基板を部品実装工程において、実装基板を下側
から支持している。2. Description of the Related Art Conventionally, a backup mechanism of this type supports a mounting board from below in a component mounting process, as disclosed in Japanese Utility Model Laid-Open No. 4-127680.
【０００３】この従来のバックアップ機構について図面
を参照して説明する。This conventional backup mechanism will be described with reference to the drawings.
【０００４】図３は従来のバックアップ機構の一例を示
す正面図である。FIG. 3 is a front view showing an example of a conventional backup mechanism.
【０００５】バックアッププレート１１に均一に開けら
れた穴１７にバックアップピン１２を挿入する。バック
アップピン１２は長さが一定の場合、実装基板１６の下
側に実装されている部品１８を避けて挿入する。そし
て、このバックアップピン１２によって実装基板１６が
支持される。The backup pin 12 is inserted into the holes 17 formed uniformly in the backup plate 11. When the backup pin 12 has a constant length, it is inserted while avoiding the component 18 mounted on the lower side of the mounting board 16. The mounting board 16 is supported by the backup pins 12.
【０００６】[0006]
【発明が解決しようとする課題】上述した従来の従来の
バックアップ機構の、第１の問題点は、実装基板１６の
上側からの搭載部品１９の搭載時に、実装基板１６が大
きくたわみ、部品搭載が安定せず、搭載精度を確保でき
ないことである。The first problem with the conventional backup mechanism described above is that the mounting board 16 is largely deflected when the mounting board 19 is mounted from the upper side of the mounting board 16, and the mounting of the mounting board 16 is difficult. It is not stable and the mounting accuracy cannot be secured.
【０００７】その理由は、実装基板１６の下側に実装済
の部品１８を避けた箇所にバックアップピン１２を設置
する必要があり、部品１８の上側に部品搭載する場合、
支えられないためである。仮に部品１８の厚みに合わせ
た長さのバックアップピンを用意すれば、部品１８を避
けずに設置できるが、多様な部品種に対し、様々な長さ
のバックアップピンが必要となり、それを設置すること
は工数と費用がかかるという問題がある。The reason is that it is necessary to install the backup pin 12 on the lower side of the mounting board 16 at a position avoiding the mounted component 18, and when mounting the component on the upper side of the component 18,
This is because it cannot be supported. If a backup pin with a length that matches the thickness of the component 18 is prepared, the component 18 can be installed without avoiding it, but backup pins of various lengths are required for various component types, and it is necessary to install the backup pin. The problem is that it takes man-hours and costs.
【０００８】[0008]
【課題を解決するための手段】本発明の目的は、実装基
板等の下側が凹凸な板の全ての箇所を均一に支持し、上
側からの搭載の安定性を図ると共に、段取り時のバック
アップピン位置変更を必要としないようにすることにあ
る。SUMMARY OF THE INVENTION An object of the present invention is to uniformly support all parts of a plate having a concave and convex lower side such as a mounting board to ensure stability of mounting from the upper side and a backup pin at the time of setup. There is no need to change the position.
【０００９】そのため、本発明のバックアップ機構は、
下面に凹凸部を有する板の下側から、凹凸部を避けず
に、板全体を均一に支えている。Therefore, the backup mechanism of the present invention is
The entire plate is uniformly supported from the lower side of the plate having the uneven portion on the lower surface without avoiding the uneven portion.
【００１０】本発明のバックアップ機構は、下面に凹凸
部を有する板の凹凸部の高さに合わせ凹凸部も支持し下
面全体を均一に支持するバックアップ手段（図１の２，
３）と、このバックアップ手段の高さを保持する保持手
段（図１の４，５）とを有している。The backup mechanism of the present invention is a backup means for supporting the uneven portion in accordance with the height of the uneven portion of the plate having the uneven portion on the lower surface and for uniformly supporting the entire lower surface (2 in FIG. 1).
3) and holding means (4, 5 in FIG. 1) for holding the height of the backup means.
【００１１】本発明のバックアップ機構は、下面に高さ
の異なる複数の部品を実装した実装基板と、この実装基
板を支持する複数のバックアップピン（図１の２）と、
この複数のバックアップピンを挿入するための複数の穴
を有するバックアッププレートと、この穴の底とバック
アップピンの底面の間に設置されたバネ（図１の３）
と、このバネにより上下に自由に移動するバックアップ
ピンをはさみ込みバックアップピンの各々の高さを保持
するバックアップピン押え（図１の４）と、このバック
アップピン押えをバックアップピンに押つけるエアシリ
ンダ（図１の５）とから構成されている。The backup mechanism of the present invention comprises a mounting board on which a plurality of parts having different heights are mounted on the lower surface, and a plurality of backup pins (2 in FIG. 1) for supporting the mounting board.
A backup plate having a plurality of holes for inserting the plurality of backup pins, and a spring installed between the bottom of the holes and the bottom of the backup pin (3 in FIG. 1).
And a backup pin retainer (4 in Fig. 1) that holds the backup pin that moves freely up and down by this spring and holds each height of the backup pin, and an air cylinder that presses this backup pin retainer to the backup pin ( 1) and 5) of FIG.
【００１２】[0012]
【発明の実施の形態】板の凹凸部の高さに合わせたバッ
クアップ手段により、バックアップの位置が均一とな
り、また、バックアップの位置に合わせた高さを保持す
る手段により、上側からの力を支える。これにより、様
々な凹凸部の高さにバックアップ手段を合わせることが
でき、様々な長さのバックアップピンが不必要となり、
そのための段取りの必要が無くなる。BEST MODE FOR CARRYING OUT THE INVENTION The backup means adapted to the height of the uneven portion of the plate makes the backup position uniform, and the means for maintaining the height adapted to the backup position supports the force from the upper side. . This makes it possible to adapt the backup means to the heights of various irregularities, making backup pins of various lengths unnecessary.
There is no need for setup for that.
【００１３】次に、本発明の実施の形態について図面を
参照して説明する。Next, an embodiment of the present invention will be described with reference to the drawings.
【００１４】図１は本発明のバックアップ機構の一実施
の形態を示す正面図、図２は図１のＡ部の斜視図であ
る。FIG. 1 is a front view showing an embodiment of a backup mechanism of the present invention, and FIG. 2 is a perspective view of a portion A of FIG.
【００１５】下側に部品８の実装された実装基板６（下
側に凹凸部のある板）をバックアップピン２で支持す
る。バックアップピン２は、バックアッププレート１に
均一な位置に開けられた穴７に挿入され、穴７の底とバ
ックアップピン２の底面はバネ３によって接続され、こ
のバネ３によりバックアップピン２は上下に自由に移動
できる。実装基板６の下側の部品８の高さ（厚み）によ
りバックアップピン２の高さが調整され、エアシリンダ
５によってバックアップピン押え４がバックアップピン
２をはさみ込む。これによりバックアップピン２の各々
の高さを保持する。図２は、このエアシリンダ５によっ
てバックアップピン押え４がバックアップピン２をはさ
み込むところを示している。A mounting board 6 (a board having an uneven portion on the lower side) on which a component 8 is mounted on the lower side is supported by a backup pin 2. The backup pin 2 is inserted into a hole 7 formed in the backup plate 1 at a uniform position, and the bottom of the hole 7 and the bottom surface of the backup pin 2 are connected by a spring 3, and the spring 3 allows the backup pin 2 to move up and down. You can move to. The height of the backup pin 2 is adjusted by the height (thickness) of the component 8 below the mounting board 6, and the backup pin retainer 4 sandwiches the backup pin 2 by the air cylinder 5. Thereby, the height of each backup pin 2 is maintained. FIG. 2 shows the backup pin retainer 4 sandwiching the backup pin 2 by the air cylinder 5.
【００１６】次に、本発明の動作について図面を参照し
て詳細に説明する。Next, the operation of the present invention will be described in detail with reference to the drawings.
【００１７】実装基板６が位置決めされた後、バックア
ップピン２が挿入されたバックアッププレート１が、実
装基板６に向かって上昇する。上昇の限界は任意のバッ
クアップピン２が実装基板６の下面（部品８の無い箇
所）に接触する高さである。部品８が存在する箇所のバ
ックアップピン２は部品８の厚み分だけ押し下げられ
る。バックアッププレート１の上昇完了後エアシリンダ
５が動作し、連結されているバックアップピン押え４
（２枚）によりバックアップピン２がはさみ込まれる。
そして、はさみ込みが完了してバックアップ動作の完了
となる。After the mounting board 6 is positioned, the backup plate 1 into which the backup pins 2 are inserted rises toward the mounting board 6. The limit of the rise is the height at which the arbitrary backup pin 2 comes into contact with the lower surface of the mounting substrate 6 (where there is no component 8). The backup pin 2 where the component 8 exists is pushed down by the thickness of the component 8. After the backup plate 1 has been lifted, the air cylinder 5 operates and the backup pin retainer 4 is connected.
The backup pin 2 is sandwiched by (2 pieces).
Then, the pinching is completed and the backup operation is completed.
【００１８】以上により、バックアップが終了すると、
実装基板６の下側は均一な位置で支持されるため、実装
基板６の上側から搭載部品９を搭載しても、実装基板６
はたわまなくなる。When the backup is completed,
Since the lower side of the mounting board 6 is supported at a uniform position, even if the mounting component 9 is mounted from the upper side of the mounting board 6, the mounting board 6
Will not bend.
【００１９】[0019]
【発明の効果】以上説明したように、本発明の第１の効
果は、実装基板全体を下面から均一に支持できるという
ことである。これにより上面〔上側？〕のあらゆる位置
での部品搭載が安定する。As described above, the first effect of the present invention is that the entire mounting board can be uniformly supported from the lower surface. This allows the top surface [upper? ] The mounting of parts at all positions is stable.
【００２０】その理由は、実装基板下面の凹凸に合わせ
た高さにバックアップピンを固定でき、それによってバ
ックアップピンの設置箇所に偏りが生じないからであ
る。The reason is that the backup pins can be fixed to the height corresponding to the unevenness of the lower surface of the mounting board, and thus the installation positions of the backup pins are not biased.
【００２１】第２の効果は、段取り時のバックアップピ
ンの設置を省略できることである。The second effect is that the installation of the backup pin at the time of setup can be omitted.
【００２２】その理由は、予め多数のバックアップピン
を設置しておくことであらゆる種類の凹凸に対応できる
からである。The reason is that by installing a large number of backup pins in advance, it is possible to deal with all kinds of unevenness.
【図１】本発明のバックアップ機構の一実施の形態を示
す正面図である。FIG. 1 is a front view showing an embodiment of a backup mechanism of the present invention.
【図２】図１のＡ部の斜視図である。FIG. 2 is a perspective view of a portion A in FIG.
【図３】従来のバックアップ機構の一例を示す正面図で
ある。FIG. 3 is a front view showing an example of a conventional backup mechanism.
１，１１ バックアッププレート ２，１２ バックアップピン ３ バネ ４ バックアップピン押え ５ エアシリンダ ６，１６ 実装基板 ７，１７ 穴 ８，１８ 部品 ９，１９ 搭載部品 1,11 Backup plate 2,12 Backup pin 3 Spring 4 Backup pin retainer 5 Air cylinder 6,16 Mounting board 7,17 Hole 8,18 Parts 9,19 Mounting parts
Claims (3)
記凹凸部を避けずに、前記板全体を均一に支えることを
特徴とするバックアップ機構。1. A backup mechanism which supports the entire plate uniformly from the lower side of a plate having an uneven portion on its lower surface without avoiding the uneven portion.
高さに合わせ前記凹凸部も支持し前記下面全体を均一に
支持するバックアップ手段と、このバックアップ手段の
高さを保持する保持手段とを有することを特徴とするバ
ックアップ機構。2. A backup means for supporting the uneven portion to evenly support the entire lower surface according to the height of the uneven portion of a plate having an uneven surface on the lower surface, and a holding means for holding the height of the backup means. A backup mechanism comprising:
た実装基板と、この実装基板を支持する複数のバックア
ップピンと、この複数のバックアップピンを挿入するた
めの複数の穴を有するバックアッププレートと、この穴
の底と前記バックアップピンの底面の間に設置されたバ
ネと、このバネにより上下に自由に移動する前記バック
アップピンをはさみ込み前記バックアップピンの各々の
高さを保持するバックアップピン押えと、このバックア
ップピン押えを前記バックアップピンに押つけるエアシ
リンダとから構成されることを特徴とするバックアップ
機構。3. A mounting board on which a plurality of parts having different heights are mounted on a lower surface, a plurality of backup pins for supporting the mounting board, and a backup plate having a plurality of holes for inserting the plurality of backup pins. , A spring installed between the bottom of this hole and the bottom surface of the backup pin, and a backup pin retainer that holds the height of each of the backup pins by inserting the backup pin that moves freely up and down by the spring. And a backup mechanism comprising an air cylinder for pressing the backup pin retainer against the backup pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7339515A JPH09181496A (en) | 1995-12-26 | 1995-12-26 | Back-up mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7339515A JPH09181496A (en) | 1995-12-26 | 1995-12-26 | Back-up mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09181496A true JPH09181496A (en) | 1997-07-11 |
Family
ID=18328219
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7339515A Pending JPH09181496A (en) | 1995-12-26 | 1995-12-26 | Back-up mechanism |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09181496A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001006823A1 (en) * | 1999-07-16 | 2001-01-25 | Siemens Aktiengesellschaft | Method and device for supporting substrates in automated machines implanting components, base plate and support rod |
| KR100629912B1 (en) * | 2004-03-27 | 2006-09-28 | 서용식 | Device for supporting printed circuit board |
| KR100709672B1 (en) * | 2006-09-06 | 2007-04-19 | 유성엠티에스 주식회사 | Printed circuit board jig |
| JP2007185919A (en) * | 2006-01-16 | 2007-07-26 | Sharp Corp | Surface plate for printing |
| KR101156902B1 (en) * | 2010-09-01 | 2012-06-21 | 삼성전기주식회사 | The clamp for board clamping |
| CN111555137A (en) * | 2020-05-27 | 2020-08-18 | 广东电网有限责任公司东莞供电局 | Power distribution cabinet installation equipment |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04176200A (en) * | 1990-11-07 | 1992-06-23 | Matsushita Electric Ind Co Ltd | Printed board holding device |
| JPH04293300A (en) * | 1991-03-22 | 1992-10-16 | Fuji Mach Mfg Co Ltd | Printed substrate supporting device |
| JPH04322917A (en) * | 1991-04-17 | 1992-11-12 | Tokico Ltd | Substrate support device |
-
1995
- 1995-12-26 JP JP7339515A patent/JPH09181496A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04176200A (en) * | 1990-11-07 | 1992-06-23 | Matsushita Electric Ind Co Ltd | Printed board holding device |
| JPH04293300A (en) * | 1991-03-22 | 1992-10-16 | Fuji Mach Mfg Co Ltd | Printed substrate supporting device |
| JPH04322917A (en) * | 1991-04-17 | 1992-11-12 | Tokico Ltd | Substrate support device |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001006823A1 (en) * | 1999-07-16 | 2001-01-25 | Siemens Aktiengesellschaft | Method and device for supporting substrates in automated machines implanting components, base plate and support rod |
| US6775904B1 (en) | 1999-07-16 | 2004-08-17 | Siemens Aktiengesellschaft | Supporting pin for supporting substrates in automatic equipment units |
| KR100629912B1 (en) * | 2004-03-27 | 2006-09-28 | 서용식 | Device for supporting printed circuit board |
| JP2007185919A (en) * | 2006-01-16 | 2007-07-26 | Sharp Corp | Surface plate for printing |
| KR100709672B1 (en) * | 2006-09-06 | 2007-04-19 | 유성엠티에스 주식회사 | Printed circuit board jig |
| KR101156902B1 (en) * | 2010-09-01 | 2012-06-21 | 삼성전기주식회사 | The clamp for board clamping |
| CN111555137A (en) * | 2020-05-27 | 2020-08-18 | 广东电网有限责任公司东莞供电局 | Power distribution cabinet installation equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH11505667A (en) | Board matching nested structural support fixture | |
| JPH09181496A (en) | Back-up mechanism | |
| CN219695219U (en) | Test fixture of SMT processing formed circuit board | |
| JP4647686B2 (en) | Temporary fixing device | |
| JPH0377679B2 (en) | ||
| JPS6324244Y2 (en) | ||
| CN212336489U (en) | Spring type clamping and pressing connecting piece | |
| WO2022095550A1 (en) | Single-module multi-position switching mechanism suitable for automobile trim strip | |
| KR101970925B1 (en) | Clinching device for terminal block | |
| KR200205139Y1 (en) | Guide device in hot plate | |
| JPH09138257A (en) | Apparatus and method for inspection of printed-circuit board | |
| US6259607B1 (en) | Ejector device for a mobile module | |
| JP2001166006A (en) | Fixture and method for connecting it to mounting substrate | |
| CN219055706U (en) | Device for improving uniformity of copper die arrangement positions | |
| CN215036706U (en) | Clamp inclined top | |
| CN215768878U (en) | A test jig for circuit board detects | |
| US5252099A (en) | Method for assembling a monitor tube on a frame, the monitor thus obtained, and assembly machine | |
| CN221363204U (en) | Quick-change module structure for laser welding | |
| JPH1065080A (en) | Apparatus and method for forming outer leads of ic | |
| JP3775960B2 (en) | Electronic component crimping apparatus and crimping method | |
| JPH06310900A (en) | Board rear pressing equipment | |
| TWM568426U (en) | Quick release briquetting base and wafer burning device with quick release briquetting base | |
| US5122736A (en) | Apparatus for and method of pressing pins of an IC for testing | |
| JPH11224983A (en) | Jig for forming module device | |
| JP2628501B2 (en) | Manufacturing method of unit tile |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 19980127 |