JPH09181467A - Communication equipment shelf structure - Google Patents

Communication equipment shelf structure

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Publication number
JPH09181467A
JPH09181467A JP33848995A JP33848995A JPH09181467A JP H09181467 A JPH09181467 A JP H09181467A JP 33848995 A JP33848995 A JP 33848995A JP 33848995 A JP33848995 A JP 33848995A JP H09181467 A JPH09181467 A JP H09181467A
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JP
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Application
Patent type
Prior art keywords
shelf
packages
small
functional
large
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP33848995A
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Japanese (ja)
Other versions
JP2731776B2 (en )
Inventor
Tatsusaburo Kawamoto
Kazunori Nakamura
和規 中村
竜三郎 川元
Original Assignee
Nec Corp
Nec Miyagi Ltd
宮城日本電気株式会社
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

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Abstract

PROBLEM TO BE SOLVED: To provide a shelf structure capable of mounting large and small electronic circuit packages different in substrate height exchangeably in one or many stages.
SOLUTION: A shelf 1 contains partition plates 2 which divides a package housing of the shelf into several functional blocks and intermediate guides 4 which are vertically supported between the plates 2 and provided with mutually opposed substrate guide grooves 4a at the upper and lower faces. Connectors on back boards at the functional block's back faces are disposed so as to be commonly used among large and small packages. Intermediate guide supporting pins 3 and fixing members 5 are provided on the plates 2 to mount and fix the guides 4 from and to the front of the shelf whereby the large and small packages 7 and 8 are exchangeably mounted in one or many stages in specified functional blocks.
COPYRIGHT: (C)1997,JPO

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【発明の属する技術分野】本発明は複数のプラグイン式電子回路パッケージを実装する通信装置シェルフ構造に関し、特に基板高さの異なる大小の電子回路パッケージを同一シェルフ内に混在して実装する通信装置シェルフ構造に関する。 The present invention relates to the plurality of relates to a communication equipment shelf structure for mounting a plug-in electronic circuit packages, a communication device implementing in particular a mix of electronic circuit packages having different sizes of substrate height on the same shelf on the shelf structure.

【0002】 [0002]

【従来の技術】従来、この種の通信装置シェルフ構造として図3に示す特開昭62−022500号公報(シート多段実装ユニット構造)の例がある。 Conventionally, there is an example in JP 62-022500 discloses shown in FIG. 3 as the communication equipment shelf structure of this type (sheet multistage mounting unit structure). この従来例においては、基板高さの異なる大小の電子回路パッケージ2 In this conventional example, an electronic circuit of a different magnitude of substrate height Package 2
5は中間ガイド23を一段または多段に備えたユニットケース22と称する板状部材を介して、それぞれブロック21なるシェルフに実装する構成となっている。 5 through the plate-like member called a unit case 22 having an intermediate guide 23 in one stage or multiple stages, respectively is configured to be mounted on the block 21 becomes shelf. ユニットケース22及び中間ガイド23は、それぞれブロック21とユニットケース22に係止爪24あるいは突起により、嵌め込んで固定される。 The unit case 22 and the intermediate guide 23, the respective locking claws 24 or protrusions in the block 21 and the unit case 22 is fixed by fitting.

【0003】 [0003]

【発明が解決しようとする課題】この従来例においては、大きなパッケージと同じ大きさのユニットケースなる板状の部材を別途に設けてあり、基板高さの異なる大小のパッケージは、予めこのユニットケース内の決められた位置に実装した後、ブロック内に挿入される構成である。 In THE INVENTION Problems to be Solved The conventional example is provided with the same size of the unit case becomes plate-like member and larger packages separately, large and small packages of different substrate height in advance the unit case after mounting the determined position of the inner, it is configured to be inserted into the block. 従って、大小パッケージ間相互の同一実装位置での自由な入れ替えができない欠点があり、さらに大パッケージのみを実装する際にも必ずユニットケースを介してブロック内に挿入実装しなければならないという欠点がある。 Therefore, there is a drawback that can not be freely interchanged in the same mounting position of the mutual magnitude package, there is a drawback that it must be inserted mounting in the block via the always unit case even when further implement only large package .

【0004】本発明の目的は、上記従来の欠点を解消し、基板高さの異なる大小の電子回路パッケージを一段あるいは多段に入れ替え自在に実装できる通信装置シェルフ構造を提供することにある。 An object of the present invention is to provide a communication device shelf structure capable aforementioned conventional drawbacks and overcome, freely mounted interchange electronic circuit packages having different sizes of substrate height one stage or multiple stages.

【0005】 [0005]

【課題を解決するための手段】本発明は基板高さの異なるプラグイン式の大小の電子回路パッケージを複数実装する通信装置シェルフ構造において、シェルフ内のパッケージ収容部をいくつかの機能ブロックに分割する複数の仕切板と、隣接する前記仕切板間において前記仕切板の高さ方向の所定位置に支持手段により垂設して支持され且つ前記シェルフの前面から前記支持手段に対し着脱自在であり表裏両面それぞれに所定の間隔で相対向する基板案内溝を設けた中間ガイドとを有してなり、前記機能ブロック背面のバックボード上のコネクターを前記大小の電子回路パッケージ間相互で共用可能に配置し、前記大小の電子回路パッケージを前記機能ブロック内へ一段あるいは多段にそれぞれ入れ替え自在に実装すべく構成したものである The present invention SUMMARY OF] In communication equipment shelf structure for mounting a plurality of electronic circuit packages large and small different plug-in of the substrate height, divide the package accommodating portion in the shelf into several functional blocks a plurality of partition plates that are detachable from the support means from the front of the adjacent said at partition plates are supported by vertically by supporting means at a predetermined position in the height direction of the partition plate and the shelf front and back becomes an intermediate guide provided with a substrate guide grooves facing each other at a predetermined interval in each of both sides, the connectors on the functional blocks back of backboard and shareable disposed in mutual electronic circuit package of the magnitude , which is constituted so as to interchange freely mounted respectively one stage or multiple stages to the electronic circuit package of the magnitude the functional block

【0006】この通信装置シェルフ構造において、前記支持手段は前記仕切板に着脱自在なピン部材からなり、 [0006] In this communication device shelf structure, said supporting means comprises a movable pin member detachably attached to the partition plate,
また前記中間ガイドは前記支持手段に支持された後、固定用部材によって前記仕切板に対する動きが阻止される。 Also after the intermediate guide, which is supported by the supporting means, movement relative to the partition plate is blocked by the fixing member.

【0007】 [0007]

【発明の実施の形態】次に、本発明について図面を参照して説明する。 DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, description with reference to the drawings the present invention.

【0008】図1は本発明の実施の形態を示す斜視図、 [0008] Figure 1 is a perspective view showing an embodiment of the present invention,
図2はこの実施の形態における中間ガイド部の着脱状態を詳細に示す側面図である。 Figure 2 is a side view showing a detachment state of the intermediate guide section in this embodiment in detail.

【0009】図に示すように、電子回路パッケージをプラグイン式に複数実装するシェルフ構造において、シェルフ本体1は上下内面にそれぞれ所定の間隔で相対向して複数の基板案内溝1aを有し、上下の相対する基板案内溝1a間には大型パッケージ7が実装できる。 [0009] As shown, the shelf structure for mounting a plurality of electronic circuit packages to the plug-in, the shelf body 1 has a plurality of substrate guide grooves 1a above and below the inner surface to face at a predetermined interval, large package 7 can be implemented between the upper and lower opposing substrate guide groove 1a. また、 Also,
大型パッケージ7と同じ大きさ・形状の板状の仕切板2 Of the same size and shape as the large package 7 plate-shaped partition plate 2
が相対する基板案内溝1a間に実装でき、この仕切板2 There can be implemented between the opposing substrate guide groove 1a, the partition plate 2
を任意位置に実装することにより、シェルフ本体1内のパッケージ収容部をいくつかの機能ブロックに分割することできる。 The by implemented in any position, can be split package accommodating portion of the shelf body 1 into several functional blocks. なお、シェルフ本体1の後部面にはコネクター10を有するバックボード9が実装されている。 Note that the rear surface of the shelf body 1 backboard 9 having a connector 10 is mounted.

【0010】機能ブロックに分割した隣接する2枚の仕切板2の前面側の上下の中間位置には、中間ガイド支持用ピン3が仕切板2の板に直角方向にそれぞれねじ込んで止められており、またこれと同位置の仕切板2の後部側、即ちバックボード9に近い部分には中間ガイド支持用ピン13がねじ込まれる。 [0010] an intermediate position of the upper and lower front-side features two partition plates 2 adjacent divided into blocks, the intermediate guide supporting pin 3 has stopped screwed respectively in a direction perpendicular to the plates of the partition plate 2 , the rear side of the partition plate 2 in which the same position, i.e. the intermediate guide supporting pin 13 in a portion close to the back board 9 is screwed. この中間ガイド支持用ピン13は、仮に大型パッケージ7が実装されても支障がないような位置に設けられる。 The intermediate guide supporting pins 13 are provided to temporarily such as large packages 7 there is no problem even if the mounting position. これら前後の中間ガイド支持用ピン3,13間に、この実施の形態のポイントとなる中間ガイド4が設置される。 Between these front and rear intermediate guide supporting pins 3,13, the intermediate guide 4 is provided as a point of this embodiment.

【0011】中間ガイド4は、機能ブロック内に大型パッケージ7の1/2の高さの小型パッケージ8を実装するためのものであり、上下両面それぞれにシェルフ本体1の基板案内溝1aと同じ所定の間隔で相対向する基板案内溝4aを有し、また前部及び後部には中間ガイド支持用ピン3,13に支持されるような溝11及び溝12 [0011] Intermediate guide 4 is intended for mounting the half of the height of the small package 8 large packages 7 to the functional block, the same predetermined substrate guide groove 1a of the shelf body 1 on both upper and lower surfaces, respectively It has opposing substrate guide groove 4a at intervals and the grooves 11 and the groove 12 as the front and rear is supported by the intermediate guide supporting pins 3, 13
を設けてなり、機能ブロック内の上下の中間位置に仕切板2と直角な状態で着脱自在に挿入・支持されるようになっている。 The result is provided, it is adapted to be freely inserted and supported detachably in a perpendicular state and the partition plate 2 and below the middle position of the functional block. なお、中間ガイド4の前面には、中間ガイド用支持ピン3及び溝11と相まって、中間ガイド4の動きを固定するための中間ガイド固定用部材5がねじ止めされる。 Note that the front surface of the intermediate guide 4, together with intermediate guide supporting pins 3 and the groove 11, is intermediate guide fixing member 5 screwed for fixing the movement of the intermediate guide 4.

【0012】このような構成からなる本実施の形態の使用状況について、以下に説明する。 [0012] The usage of the embodiment having such a configuration will be described below.

【0013】機能ブロック単位に挿入・実装された仕切板2を有するシェルフ本体1のパッケージ収容部へのパッケージ実装において、中間ガイド4を着脱自在とすることにより、2種類の大きさのパッケージを実装させる。 [0013] In packaging of the package accommodating portion of the shelf body 1 having a partition plate 2 that is inserted and mounted to the functional blocks, by detachable intermediate guide 4, implement two different sizes of packages make. まず、基板高さが1/2の小型パッケージ8を実装する場合、図2に示すように、2枚の仕切板2の前面側へ中間ガイド支持用ピン3をねじ込んで取付けた後、中間ガイド4をシェルフ前面側から挿入し、予じめねじ込み固定されている後部側の中間ガイド支持用ピン13へ中間ガイド4の溝12を差し込み、次に前面側の中間ガイド支持用ピン3へ中間ガイド4の溝11を落とし込むようにして差込む。 First, if the substrate height implements small package 8 1/2, as shown in FIG. 2, after mounting by screwing the intermediate guide supporting pins 3 into two partitions 2 on the front side, the intermediate guide 4 inserted from the shelf front side, insert the groove 12 of the intermediate guide 4 to the rear side of the intermediate guide supporting pins 13 that are 予Jime screwed, then the intermediate guide on the front side to the intermediate guide supporting pins 3 plugged so as dropping the grooves 11 of 4.

【0014】その後、中間ガイド4の前面に中間ガイド固定用部材5をねじ6で固定すれば、中間ガイド4は仕切板2に対する動きが阻止されて取付は完了し、小型パッケージ8の実装が可能となる。 [0014] Thereafter, when fixing the intermediate guide fixing member 5 to the front surface of the intermediate guide 4 by a screw 6, the intermediate guide 4 moves is blocked attachment is completed for the partition plate 2, it can be mounted in small packages 8 to become. 中間ガイド4ならびに中間ガイド固定用部材5には、上下面それぞれに基板案内溝1aと同じく所定の間隔で相対向する基板案内溝4 Intermediate guide 4 and the intermediate guide the fixing member 5, the substrate guide groove 4 which faces with same predetermined distance between the substrate guide grooves 1a respectively upper and lower surfaces
a,5aを有しているため、基板案内溝1aと基板案内溝4a,5a間に小型パッケージ8が実装できる。 a, because it has a 5a, substrate guide groove 1a and the substrate guide grooves 4a, small package 8 between 5a can implement. またバックボード9上のコネクター10は、大小パッケージ間相互で共用可能に配置されている。 The connector 10 on the backboard 9 is shareable disposed in mutual magnitude package. 従って大型パッケージ7を実装させる場合、既に取付けられた中間ガイド支持用ピン3及び中間ガイド4を取外した状態の機能ブロック、もしくは中間ガイド4の取付けられていない機能ブロックに対して、そのまま実装される。 Therefore case of implementing large package 7, to an already mounted intermediate guide supporting pins 3 and functional blocks in a state of removed intermediate guide 4 functional blocks or unattached in intermediate guide 4, it is directly mounted .

【0015】このような本実施の形態によれば、一度装置を運用させた後においても、機能ブロック単位での中間ガイド4の着脱により、他の機能ブロックの運用を停止させることなく、大小パッケージの入れ替えを行うことが可能となる。 According to the present embodiment, even after once by operating the device, the attachment and detachment of the intermediate guide 4 in the functional block, without stopping the operation of the other functional blocks, large and small packages replacing it is possible to perform the.

【0016】なお上述した実施の形態においては、2種類の大きさのパッケージ、即ち大型パッケージ7に対し高さが1/2の小型パッケージ8とを用い、中間ガイド支持用ピン3,中間ガイド4を仕切板2の上下の中間(中央)位置に設けるように例示したが、これに限らず小型パッケージに1/3高さ、2/3高さなどのものを用い、それに対応して中間ガイド支持用ピン3,中間ガイド4の位置も仕切板2の上下方向の対応する任意位置に設けて、さらに多段にパッケージの入れ替え実装ができるようにしてもよい。 [0016] In the above-described embodiment, two sizes of packages, i.e. using a small package 8 of height with respect to the large package 7 1/2, intermediate guide supporting pins 3, the intermediate guide 4 the Although illustrated as provided on the intermediate (middle) position of the upper and lower partition plate 2, which limited without small package to 1/3 height, used as such 2/3 the height, correspondingly intermediate guide supporting pins 3, the position of the intermediate guide 4 be provided on any corresponding position in the vertical direction of the partition plate 2 may be able to further package replacement implementation of the multi-stage.

【0017】 [0017]

【発明の効果】以上説明したように本発明は、中間ガイドを通信装置シェルフ前面より容易に着脱自在にできる構成とすることにより、回路機能及び基板寸法の異なる複数の電子回路パッケージ群を客先等の要求に応じ、装置の運用後においても、所定の位置に選択して実装することができる。 The present invention described above, according to the present invention, by a configuration capable intermediate guide freely easily detachable from the communication apparatus shelf front, customer's multiple electronic circuit package groups of different circuit functions and substrate dimensions depending on the requirements of equal, even after operation of the apparatus may be implemented by selecting a predetermined position. また基板寸法の異なる電子回路パッケージ毎に固定された実装棚を設ける必要がない為、装置の小型化,低価格化を図ることができる。 Also since it is not necessary to provide a fixed mounted shelves different for each electronic circuit package of the substrate size, it is possible to reduce the size of the apparatus, the cost reduction.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】本発明の実施の形態の通信装置シェルフ構造の斜視図である。 1 is a perspective view of a communication device shelf structure according to the embodiment of the present invention.

【図2】図1に示した実施の形態における中間ガイド部の着脱状態を詳細に示す側面図である。 2 is a side view showing a detachment state of the intermediate guide section in detail in the embodiment shown in FIG.

【図3】従来のシート多段実装ユニット構造の斜視図である。 3 is a perspective view of a conventional sheet multistage mounting unit structure.

【符号の説明】 DESCRIPTION OF SYMBOLS

1 シェルフ本体 2 仕切板 3,13 中間ガイド支持用ピン 4 中間ガイド 5 中間ガイド固定用部材 6 ねじ 7 大型パッケージ 8 小型パッケージ 9 バックボード 10 コネクター 11,12 溝 1a,4a,5a 基板案内溝 1 shelf body 2 partition plates 3 and 13 intermediate guide supporting pins 4 intermediate guide 5 intermediate guide fixing member 6 screw 7 Large package 8 small package 9 backboard 10 connectors 11 and 12 grooves 1a, 4a, 5a board guide grooves

Claims (3)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 基板高さの異なるプラグイン式の大小の電子回路パッケージを複数実装する通信装置シェルフ構造において、シェルフ内のパッケージ収容部をいくつかの機能ブロックに分割する複数の仕切板と、隣接する前記仕切板間において前記仕切板の高さ方向の所定位置に支持手段により垂設して支持され且つ前記シェルフの前面から前記支持手段に対し着脱自在であり表裏両面それぞれに所定の間隔で相対向する基板案内溝を設けた中間ガイドとを有してなり、前記機能ブロック背面のバックボード上のコネクターを前記大小の電子回路パッケージ間相互で共用可能に配置し、前記大小の電子回路パッケージを前記機能ブロック内へ一段あるいは多段にそれぞれ入れ替え自在に実装すべく構成したことを特徴とする通信装置シェルフ構 1. A communication apparatus shelf structure for mounting a plurality of electronic circuit packages large and small different plug-in of the substrate height, and a plurality of partition plates for dividing the package accommodating portion in the shelf into several functional blocks, in the said height direction is supported by vertically by supporting means at a predetermined position and a predetermined distance freely in and both sides respectively removable with respect to the support means from the front of the shelf partition plate in the partition plates adjacent opposing becomes an intermediate guide provided with a substrate guide groove, and disposed to be shared connector on the function block back of backboard mutual electronic circuit package of the large and small electronic circuit package of the magnitude the communication equipment shelf structure, characterized by being configured so as to respectively interchange freely implemented in one step or multiple stages to the functional block 造。 Elephants.
  2. 【請求項2】 前記支持手段は前記仕切板に着脱自在なピン部材からなることを特徴とする請求項1記載の通信装置シェルフ構造。 Wherein said support means is communication equipment shelf structure according to claim 1, characterized in that it consists of freely pin member detachably attached to the partition plate.
  3. 【請求項3】 前記中間ガイドは前記支持手段に支持された後、固定用部材によって前記仕切板に対する動きが阻止されることを特徴とする請求項1または2に記載の通信装置シェルフ構造。 Wherein said intermediate guide after being supported by the supporting means, the communication equipment shelf structure according to claim 1 or 2, characterized in that the movement is prevented with respect to the partition plate by a fixing member.
JP33848995A 1995-12-26 1995-12-26 Communication equipment shelf structure Expired - Fee Related JP2731776B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33848995A JP2731776B2 (en) 1995-12-26 1995-12-26 Communication equipment shelf structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33848995A JP2731776B2 (en) 1995-12-26 1995-12-26 Communication equipment shelf structure

Publications (2)

Publication Number Publication Date
JPH09181467A true true JPH09181467A (en) 1997-07-11
JP2731776B2 JP2731776B2 (en) 1998-03-25

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Family Applications (1)

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JP33848995A Expired - Fee Related JP2731776B2 (en) 1995-12-26 1995-12-26 Communication equipment shelf structure

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8184442B2 (en) 2008-10-29 2012-05-22 Fujitsu Limited Case of an electronic device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0295288U (en) * 1989-01-13 1990-07-30
JPH0340496A (en) * 1989-07-07 1991-02-21 Fujitsu Ltd Printed board mounting structure
JPH0555766A (en) * 1991-08-22 1993-03-05 Fujitsu Ltd Structure for mounting printed boards
JPH0626291U (en) * 1992-06-25 1994-04-08 岩崎通信機株式会社 Electronic equipment structure
JPH07106781A (en) * 1993-09-30 1995-04-21 Nec Corp Case for mounting electronic component package
JPH07212063A (en) * 1994-01-20 1995-08-11 Fujitsu Acs Kk Printed circuit board mounting shelf

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0295288U (en) * 1989-01-13 1990-07-30
JPH0340496A (en) * 1989-07-07 1991-02-21 Fujitsu Ltd Printed board mounting structure
JPH0555766A (en) * 1991-08-22 1993-03-05 Fujitsu Ltd Structure for mounting printed boards
JPH0626291U (en) * 1992-06-25 1994-04-08 岩崎通信機株式会社 Electronic equipment structure
JPH07106781A (en) * 1993-09-30 1995-04-21 Nec Corp Case for mounting electronic component package
JPH07212063A (en) * 1994-01-20 1995-08-11 Fujitsu Acs Kk Printed circuit board mounting shelf

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8184442B2 (en) 2008-10-29 2012-05-22 Fujitsu Limited Case of an electronic device

Also Published As

Publication number Publication date Type
JP2731776B2 (en) 1998-03-25 grant

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