JPH09171127A - Optical communication module - Google Patents

Optical communication module

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Publication number
JPH09171127A
JPH09171127A JP33143895A JP33143895A JPH09171127A JP H09171127 A JPH09171127 A JP H09171127A JP 33143895 A JP33143895 A JP 33143895A JP 33143895 A JP33143895 A JP 33143895A JP H09171127 A JPH09171127 A JP H09171127A
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JP
Japan
Prior art keywords
light
emitting element
receiving element
circuit board
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP33143895A
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Japanese (ja)
Inventor
Tsuyoshi Yoshimoto
強 吉本
Original Assignee
Matsushita Electric Ind Co Ltd
松下電器産業株式会社
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Publication date
Application filed by Matsushita Electric Ind Co Ltd, 松下電器産業株式会社 filed Critical Matsushita Electric Ind Co Ltd
Priority to JP33143895A priority Critical patent/JPH09171127A/en
Publication of JPH09171127A publication Critical patent/JPH09171127A/en
Application status is Pending legal-status Critical

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0296Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298Multilayer circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components

Abstract

PROBLEM TO BE SOLVED: To provide an optical communication module having an excellent receiving characteristic without affecting the receiving side by a transmitting noise.
SOLUTION: A light receiving element 1 and a receiving circuit 6 are mounted on one side of a multilayered circuit board 5, a light emitting element 3 and a transmitting circuit 7 are mounted on the other side of the multilayered circuit board 5 and a shielding layer having more than two layers is arranged in a part located between the light receiving element 1 and the light emitting element 3 of the multilayered circuit board 5.
COPYRIGHT: (C)1997,JPO

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【発明が属する技術分野】本発明は、デジタル光通信において、光信号と電気信号の相互変換を行う光通信モジュールに関する。 The present invention relates], in digital optical communication, an optical communication module for performing conversion between optical and electrical signals.

【0002】 [0002]

【従来の技術】デジタル光通信においては2値論理の電気信号を光送信器により光に変換したのち光ファイバを用いて光を伝送し、光受信器にて再び2値化電気信号に変換することにより、電気信号の直接伝送では困難な高速長距離通信を可能としている。 Transmitted light using an optical fiber after converted to light by the optical transmitter a binary electric signal logic BACKGROUND ART In digital optical communication, again converted into binary electrical signal by the optical receiver by, thereby enabling difficult fast long-distance communications in direct transmission of an electrical signal.

【0003】光通信モジュールは通常光送信器と光受信器の両方を備えており、一方の光通信モジュールの送信側と他方のモジュールの受信側とを光ファイバで相互に結合する。 [0003] The optical communication module is provided with both regular optical transmitter and the optical receiver is coupled to each other and the receiving side of the transmission side and the other module of one of the optical communication module in optical fiber. そのため2本の光ファイバが対になったものを使用し、挿抜可能なコネクタを備えている。 Therefore two optical fibers using those paired, and a pluggable connector.

【0004】以下、従来の光通信モジュールについて説明する。 [0004] The following describes a conventional optical communication module. 図3は従来の光通信モジュールの構造を示し、 Figure 3 shows the structure of a conventional optical communication module,
図3(a)は上面図、図3(b)は側面図である。 3 (a) is a top view, FIG. 3 (b) is a side view.

【0005】図3において、構成要素として1は受光素子、2は前記光受素子1を端部に保持する受光素子ホルダ、3は発光素子、4は前記発光素子3を端部に保持する発光素子ホルダ、14は前記光受素子1と発光素子3 [0005] In FIG. 3, 1 is a light receiving element as a component, a light receiving element holder 2 for holding the light 受素Ko 1 to the end, 3 light-emitting device, 4 emission which holds the light-emitting element 3 to the end element holder 14 is the light 受素Ko 1 and the light-emitting element 3
の端子ピンを同一端部に接続した回路基板、6は前記回路基板14の面に設けられた受信回路、7は同じく前記回路基板14の面に設けられた送信回路、15は前記回路基板14に設けられ、光通信モジュールと図示せぬ母基板とを接続する電気コネクタである。 Circuit board of the terminal pins connected to the same end, the receiving circuit is provided on the surface of the circuit board 14 6, a transmission circuit also provided on the surface of the circuit board 14 7, 15 the circuit board 14 It provided an electrical connector for connecting a mother board (not shown) and an optical communication module. 9は光通信モジュールに装着される光ファイバコネクタであり、2本の光ファイバの端がそれぞれ受光素子ホルダ2および発光素子ホルダ4に挿入される。 9 is an optical fiber connector to be attached to the optical communication module, the end of the two optical fibers are inserted into the light receiving element holder 2 and the light emitting element holder 4, respectively.

【0006】以下、前記各構成要素の関係と動作について説明する。 [0006] The following describes the relation between the operation of the respective components. 母基板上の回路より光通信モジュールに送られたデジタル電気信号は送信回路7に送られ、送信回路7は発光素子3に電流を流し、デジタル電気信号に応じた光を発光させる。 Digital electrical signals sent to the optical communication module from the circuit on the mother board is transmitted to the transmission circuit 7, the transmission circuit 7 supplying a current to the light-emitting element 3, emit light corresponding to a digital electrical signal. この光は発光素子ホルダ4の内部に固定されているレンズにより集光されて、挿入された送信用の光ファイバに送られる。 This light is focused by a lens which is fixed to the inside of the light emitting element holder 4, it is sent to the inserted optical fiber for transmission. 一方、受光素子ホルダ2に挿入された光ファイバより出射された光は受光素子1により電気信号へ変換され、受信回路6により増幅、 Meanwhile, light emitted from the inserted optical fiber to the light receiving element holder 2 is converted into an electrical signal by the light receiving element 1, amplified by the receiving circuit 6,
2値化されてデジタル電気信号として母基板に伝送される。 Is binarized is transmitted to the mother board as a digital electric signal. 以上のように光通信モジュールは光による情報の送信と受信を全く同時に行うことができる。 Or optical communication module as may be performed simultaneously send and receive information by light at all.

【0007】 [0007]

【発明が解決しようとする課題】ところが送信回路7は比較的大電流を扱うために、同一回路基板14上に実装された受信回路6へ電磁的ノイズとして影響を及ぼす。 To handle However transmission circuit 7 [0008] relatively large current, it influences the electromagnetic noise to the receiver circuit 6 which is mounted on the same circuit board 14.
受光素子1および受信回路6は極めて高い周波数の微弱な信号を扱うため、ノイズの影響を受けやすく、受信信号にエラーを引き起こす可能性が高くなる。 Since the light receiving element 1 and the receiving circuit 6 for handling weak signals of very high frequencies, susceptible to noise, it can cause errors is high in the received signal.

【0008】また、受光素子1および発光素子3は回路基板14の同一端より突出して実装され、それぞれの端子ピンを回路基板14にはんだ付けにより固定している箇所はシールド層の面外におかれており、遮蔽効果が無くなっている。 Further, the light receiving element 1 and the light-emitting element 3 is mounted to protrude from the same end of the circuit board 14, the text is fixed by soldering to respective terminal pins to the circuit board 14 to the outside surface of the shield layer contact and it has no shielding effect. 端子ピンのシールド層より突出した長さはわずかであるとはいえ、発光素子3の端子ピンは高速大電流が流れて電磁輻射を発生しやすい部分であり、受光素子1の端子ピンは増幅前の微弱な電流が流れる部分であるために、両者が平行に近接していることが電磁干渉を起こしやすい状態にある。 Although the length protruding from the shielding layer of the terminal pin is only the terminal pins of the light-emitting element 3 is an easy portion to generate electromagnetic radiation with high-speed and large current flows, the terminal pins of the light receiving element 1 preamplification to be weak current flows portion of it is in a state prone to electromagnetic interference both are parallel and proximate to. そのため常にノイズによる受信エラーが発生しやすい状態にあり、特に受信光のレベルが低くなると相対的にノイズが増大し、受信エラーが多発するという課題を有していた。 Therefore always ready to receive error-prone due to noise, and noise is relatively increased and especially the level of the received light is low, the receiving error has been a problem that frequently.

【0009】さらに、受光素子ホルダ2および発光素子ホルダ4はそれぞれ受光素子1と発光素子3の1本の端子によってのみ接地されており、端子ピンのもつインダクタンス成分によって容易に電位変動を起こしやすい。 Furthermore, and only the ground by each of the light receiving element holder 2 and the light emitting element holder 4 one terminal of the light receiving element 1 and the light-emitting element 3, prone to easily potential fluctuation by the inductance component having a terminal pin.
特に受光素子ホルダ2は周囲の電磁界ノイズの誘導によって電位変動し、受光素子1の信号線にノイズを誘導し、信号品質を低下させていた。 In particular the light receiving element holder 2 is variable potential by the induction of ambient electromagnetic field noise induces noise to the signal line of the light receiving element 1, which decreases the signal quality.

【0010】そこで本発明は上記従来の課題を解決するもので、送信部と受信部を電磁的に分離して送信ノイズが受信側へ影響を及ぼさず、受信特性が良好な光通信モジュールを提供することを目的としている。 [0010] The present invention is intended to solve the above-providing a transmitter a receiver without affecting transmission noise electromagnetically separated to the receiving, reception characteristics good optical communication module It is intended to be.

【0011】 [0011]

【課題を解決するための手段】本発明は上記目的を達成するために、内側にシールド層を有する多層回路基板と、受信光を電気信号に変換する受光素子と、前記受光素子に接続された受信回路と、送信光を発生する発光素子と、前記発光素子を駆動する送信回路とを備え、前記受光素子と受信回路は前記多層回路基板の一方の面に実装され、前記発光素子と送信回路は前記多層回路基板の他方の面に実装する構成とする。 Means for Solving the Problems The present invention to achieve the above object, a multilayer circuit board having a shielding layer on the inside, a light receiving element for converting the received light into an electrical signal, which is connected to said light receiving element a receiving circuit, a light emitting element for generating the transmission light, and a transmitting circuit for driving the light emitting element, the light receiving element and the receiving circuit are mounted on one surface of the multilayer circuit board, the light emitting element and the transmission circuit It is configured to be mounted on the other surface of the multilayer circuit board.

【0012】この発明によれば、送信部と受信部が電磁的に分離され、送信ノイズが受信側へ影響を及ぼさず、 According to the present invention, the transmitter and receiver are electromagnetically separated, without affecting transmission noise to the receiver,
受信特性が良好な光通信モジュルを提供する。 Reception characteristics provide a good optical communication Mojuru.

【0013】 [0013]

【発明の実施の形態】本発明の請求項1に記載の発明は、シールド層を有する多層回路基板と、受信光を電気信号に変換する受光素子と、前記受光素子に接続された受信回路と、送信光を発生する発光素子と、前記発光素子を駆動する送信回路とを備え、前記受光素子と受信回路は前記多層回路基板の一方の面に実装され、前記発光素子と送信回路は前記多層回路基板の他方の面に実装された光通信モジュールの構成としたものであり、平面状のシールド層が受光素子と発光素子との間において電磁的に両者を分離するために、送信側で発生した電磁ノイズが受信側へ伝わることがなく、受信特性が良好となる。 DETAILED DESCRIPTION OF THE INVENTION According to a first aspect of the present invention, a multilayer circuit board having a shielding layer, a light receiving element for converting the received light into an electrical signal, a receiving circuit connected to said light receiving element a light emitting element for generating transmission light, and a transmitting circuit for driving the light emitting element, the light receiving element and the receiving circuit are mounted on one surface of the multilayer circuit board, the light emitting element and the transmission circuit wherein the multilayer is obtained by the configuration of an optical communication module mounted on the other surface of the circuit board, for planar shield layer separates the electromagnetically both between the light emitting element and the light receiving element, generated at the transmitting end without electromagnetic noise is transmitted to the receiving side that the reception characteristic is improved.

【0014】本発明の請求項2に記載の発明は、請求項1に記載の光通信モジュールにおいて、多層回路基板は、受光素子と前記発光素子の間に位置する部分に配置された少なくとも2層以上のシールド層を有する構成としたものであり、同じく、2層以上のシールド層が受光素子と発光素子との間において電磁的に両者を分離するために、送信側で発生した電磁ノイズが受信側へ伝わることがなく、受信特性が良好となる。 [0014] The invention according to claim 2 of the present invention, in the optical communication module according to claim 1, the multilayer circuit board, at least two layers disposed in a portion located between the light emitting element and the light receiving element is obtained by the structure having the above shield layer, similarly, to two or more layers of the shield layers to separate them electromagnetically between the light emitting element and the light receiving element, the electromagnetic noise received generated at the transmitting end without being transmitted to the side, the reception characteristic is improved.

【0015】本発明の請求項3に記載の発明は、シールド層を有する多層回路基板と、受信光を電気信号に変換する受光素子と、前記受光素子に受信光を送る光ファイバと前記受光素子との両者を支持する受光素子ホルダと、前記受光素子に接続された受信回路と、送信光を発生する発光素子と、前記発光素子からの送信光を受ける光ファイバと前記発光素子との両者を支持する発光素子ホルダと、前記発光素子を駆動する送信回路とを備え、 [0015] The invention described in claim 3 of the present invention, a multilayer circuit board having a shielding layer, a light receiving element for converting the received light into an electrical signal, an optical fiber for sending the received light to said light receiving element and the light receiving element a light receiving element holder which supports both a, and the reception circuit connected to said light receiving element, a light emitting element for generating a transmission light, both the optical fiber and the light emitting element which receives the transmitted light from the light emitting element comprising a light emitting element holder for supporting and a transmitting circuit for driving the light emitting element,
前記受光素子と受信回路は前記多層回路基板の一方の面に実装され、前記受光素子ホルダは前記多層回路基板のシールド層と直接接続され、前記発光素子と送信回路は前記多層回路基板の他方の面に実装されており、前記発光素子ホルダは前記多層回路基板のシールド層と直接接続された光通信モジュールの構成としたものであり、シールド層が受光素子と発光素子との間において電磁的に両者を分離するために、送信側で発生した電磁ノイズが受信側へ伝わることがなくなることはもとより、受光素子ホルダと受光素子のパッケージが有する接地電位に対するインピーダンスを低下させ、外部の電磁界ノイズの誘導を防ぎ、受光素子を流れる信号電流の信号対雑音比を向上させる。 Said light receiving element and the receiving circuit are mounted on one surface of the multilayer circuit board, the light receiving element holder which is connected multilayer circuit directly to the substrate of the shielding layer, wherein the light emitting element transmitting circuit of the other of the multi-layer circuit board faces are mounted in the light emitting element holder is for the construction of the multilayer circuit board shield layer and directly connected optical communication module, electromagnetically between shield layer between the light emitting element and the light receiving element to separate them, not only does it electromagnetic noise generated on the transmission side is no longer transmitted to the receiving side, to lower the impedance to ground with the package of the light receiving element holder and the light receiving element, the external electromagnetic field noise It prevents induction, enhancing the signal-to-noise ratio of the signal current flowing through the light-receiving element. また、発光素子のパッケージおよび発光素子ホルダが有するインピーダンスを低減し、駆動電流による電位変動を防止して電磁誘導ノイズの外部への輻射を防止し、ノイズの発生量そのものを低減させ、受信特性が良好となる。 Further, to reduce the impedance of the package and the light emitting element holder of the light emitting element, to prevent potential variation due to the driving current to prevent the radiation to the outside of the electromagnetic induction noise, reduce the generation amount itself of the noise, reception characteristics good as made.

【0016】以下、本発明の実施の形態について図面を参照して説明する。 [0016] Hereinafter, will be explained with reference to the drawings, embodiments of the present invention. (実施の形態1)図1は本発明の実施例における光通信モジュールの構成を示し、図1(a)は側面図であり、 Embodiment 1 FIG. 1 shows the configuration of an optical communication module in the embodiment of the present invention, FIG. 1 (a) is a side view,
図1(b)は上面図である。 1 (b) is a top view.

【0017】図1において1は受光素子、2は受光素子ホルダ、3は発光素子、4は発光素子ホルダである。 [0017] 1 in FIG. 1 is a light receiving element, 2 is a light receiving element holder, the third light emitting element, reference numeral 4 denotes a light-emitting element holder. 5
は多層回路基板、6は受信回路、7は送信回路、8は光通信モジュールと母基板と接続するコネクタであり、以上が光通信モジュールを構成する主要な要素である。 The multilayer circuit board, the receiver circuit 6, 7 is a transmission circuit, 8 denotes a connector for connecting the optical communication module and the mother board, a key element of or constituting the optical communication module. 9
は光通信モジュールに装着される光ファイバコネクタであり、2本の光ファイバの端がそれぞれ受光素子ホルダ2および発光素子ホルダ4に挿入される。 Is an optical fiber connector to be attached to the optical communication module, the end of the two optical fibers are inserted into the light receiving element holder 2 and the light emitting element holder 4, respectively. 図1および図3において同一符号で示されるものは同一の要素である。 The same elements shall be indicated by the same reference numerals in FIGS.

【0018】図2に多層回路基板5の銅箔パターンの概略図を示す。 [0018] shows a schematic view of a copper foil pattern of the multilayer circuit board 5 in FIG. 多層回路基板5は4層構成であり、受信回路6を実装する側より第1層、第2層、第3層、第4層とにより構成される。 Multilayer circuit board 5 is 4-layer structure, the first layer than a side of mounting the receiving circuit 6, the second layer, the third layer composed of a fourth layer. 図2(a)は同光通信モジュールにおける回路基板の第1層の銅箔パターンを示す概略図であり、図2(b)は同光通信モジュールにおける回路基板の第4層の銅箔パターンを示す概略図であり、いずれも受信回路6を実装する側から見たパターンになっている。 2 (a) is a schematic view showing a copper foil pattern of the first layer of the circuit board in the optical communication module, a copper foil pattern of FIG. 2 (b) fourth layer of the circuit board in the same optical communication module It is a schematic view showing both has a pattern as viewed from the side of mounting the receiving circuit 6. 図2は説明のため端子間の配線パターンを省略している。 Figure 2 is omitted wiring pattern between terminals for explanation. 第2層は受信回路6の接地電位に接続されるベタのシールド層であり、第3層は送信回路7の接地電位に接続されるベタのシールド層であり、第2層および第3層については図示を省略する。 The second layer is a shield layer of a solid which is connected to the ground potential of the receiver circuit 6, the third layer is a shield layer of a solid which is connected to the ground potential of the transmission circuit 7, the second and third layers It omitted from the drawing.

【0019】第1層のパターンには、受光素子ホルダ2 [0019] The pattern of the first layer, the light-receiving element holder 2
が対向する位置に、受光素子ホルダ2の大きさよりも十分大きい面積を有するシールド面10があり、受光素子ホルダ2と電気的導通をとるために導電面を露出させている。 There at opposing has shield surface 10 having a sufficiently larger area than the size of the light receiving element holder 2, thereby exposing the conductive surface to provide electrical conduction and the light receiving element holder 2. 同様に第4層のパターンには、発光素子ホルダ4 Similarly, the pattern of the fourth layer, the light emitting element holder 4
が対向する位置に、発光素子ホルダの大きさよりも十分大きい面積を有するシールド面11があり、発光素子ホルダ4と電気的導通をとるために導電面を露出させている。 There at opposing has shield surface 11 having a sufficiently larger area than the size of the light emitting element holder, and to expose the conductive surface to provide electrical conductivity and light emitting element holder 4.

【0020】以下、本実施の形態1の光通信モジュールの構造について説明する。 [0020] Hereinafter, a description is given of the structure of the optical communication module of the first embodiment. 光通信モジュールは、図1 Optical communication module, as shown in FIG. 1
(a)に示した矢印の方向にコネクタ8を介して図示せぬ母基板と接続される。 It is connected to the mother board (not shown) through a connector 8 in the direction of the arrow shown in (a). 光ファイバコネクタ9は、図1 Optical fiber connectors 9, FIG. 1
(b)に示した矢印の方向に光通信モジュールに挿入される。 It is inserted in the optical communication module in the direction of the arrow shown in (b). 多層回路基板5は母基板との接続方向および光ファイバコネクタ9の挿入方向に垂直に配置される。 Multilayer circuit board 5 is arranged perpendicular to the connecting direction and the insertion direction of the optical fiber connector 9 with the base substrate. 多層回路基板5の第1層には受信回路6、コネクタ8および受光素子1が実装され、反対側の第4層には送信回路7 Receiving circuit 6 in the first layer of the multilayer circuit board 5, the connector 8 and the light receiving element 1 is mounted, transmitted to the fourth layer opposite the circuit 7
および発光素子3が実装されている。 And the light emitting element 3 is mounted.

【0021】受光素子1は信号端子、バイアス電圧端子、パッケージに直結した端子の3本の端子ピンを有しており、いずれも多層回路基板5の第1の面上にはんだにより表面実装されている。 The light receiving element 1 is a signal terminal, the bias voltage terminal, has a three terminal pins of the terminal directly connected to the package, either be surface mounted by solder on the first surface of the multilayer circuit board 5 there. その内パッケージに直結した接地端子ピンはA点において受信回路6の接地端子に接続されている。 Its ground terminal pins directly connected to the inner package is connected to the ground terminal of the receiving circuit 6 in the point A. 金属製の受光素子ホルダ2も受光素子1と溶接により結合されているために、同様に受信回路6の接地端子に接続されている。 For the light receiving element holder 2 made of metal it is also coupled by welding and the light receiving element 1 is connected to a ground terminal of the reception circuit 6 as well. 多層回路基板5の第1 The first multi-layer circuit board 5
層の受光素子ホルダ2に対向する領域には受信回路6の接地電位に接続されたシールド面10があり、受光素子ホルダ2の側面はシールド面10のB点においてはんだ接合され電気的導通を保っている。 The region facing to the light receiving element holder second layer may shield surface 10 connected to the ground potential of the receiver circuit 6, the side surface of the light receiving element holder 2 are soldered at the point B of the shield surface 10 keeping the electrical conduction ing.

【0022】この受光素子ホルダ2、受光素子1のパッケージ、受光素子1の接地端子ピンがA点およびB点において受信回路6の接地電位に接続していることによって、受光素子ホルダ2と受光素子1のパッケージが有する接地電位に対するインピーダンスを低下させ、外部の電磁界ノイズの誘導を防ぎ、受光素子を流れる信号電流の信号対雑音比を向上させている。 [0022] The light receiving element holder 2, the package light-receiving element 1, by which the ground terminal pin of the light receiving element 1 is connected to the ground potential of the receiver circuit 6 at points A and B, the light receiving element holder 2 and the light receiving element reducing the impedance to ground potential one package has to prevent the induction of external electromagnetic noise, thereby improving the signal-to-noise ratio of the signal current flowing through the light-receiving element.

【0023】発光素子3は駆動電流を流す駆動端子、発光量をモニタするモニタ端子、およびパッケージに直結した接地端子の3本の端子ピンを有する。 [0023] The light-emitting element 3 having a driving terminal, the three terminal pins of the ground terminal directly connected to the monitor terminal, and a package for monitoring the light emission amount to flow a driving current. この3本の端子ピンは多層回路基板5の第2の面上にはんだにより実装され、その内パッケージに直結している接地端子ピンはC点において送信回路7の接地電位に接続されている。 Terminal pins of the three is implemented by solder on the second surface of the multilayer circuit board 5, the ground terminal pin connected directly to the inner package is connected to the ground potential of the transmission circuit 7 at point C. 金属製の発光素子ホルダ4は発光素子3と溶接により結合されているために、送信回路7の接地電位に接続されている。 Emitting element holder 4 made of metal because they are joined by welding and the light-emitting element 3 is connected to a ground potential of the transmission circuit 7. 多層回路基板5の第4層の発光素子ホルダ4に対向する領域には送信回路7の接地電位に接続されたシールド面11があり、発光素子ホルダ4の側面はシールド面11のD点においてはんだ接合され電気的導通を保っている。 The region opposite to the light emitting element holder 4 of the fourth layer multilayer circuit board 5 has a shield surface 11 connected to the ground potential of the transmission circuit 7, a side of the light emitting element holder 4 is solder in point D of the shield surface 11 are joined is maintained electrical continuity.

【0024】この発光素子ホルダ4、発光素子3のパッケージ、発光素子3の端子ピンの1本が2点において送信回路7の接地電位に接続していることによって、発光素子3のパッケージおよび発光素子ホルダ4が有するインピーダンスを低減し、駆動電流による電位変動を防止して電磁誘導ノイズの外部への輻射を防止し、ノイズの発生量そのものを低減させている。 [0024] The light emitting element holder 4, the package light emitting device 3, by being connected to the ground potential of the transmission circuit 7 in one two-point terminal pins of the light-emitting element 3, the light-emitting element 3 package and the light emitting element holder 4 to reduce the impedance of the, to prevent potential variation due to the driving current to prevent the radiation to the outside of the electromagnetic induction noise, thereby reducing the generation amount itself of the noise.

【0025】さらに、受光素子1と発光素子3は、多層回路基板5の第1層より第4層までの4層におよぶシールド面により相互の電磁界干渉を妨げられている。 Furthermore, the light receiving element 1 and the light-emitting element 3 has been hampered electromagnetic field interference each other by the shield surface spanning four layers to the fourth layer than the first layer of the multilayer circuit board 5. 受信回路6と送信回路7は多層回路基板5の第2層と第3層により遮蔽されており、送信回路7が発生するノイズが受信回路6に及ぶのを防いでいる。 Receiving circuit 6 and the transmission circuit 7 is prevented from being shielded by the second and third layers of the multilayer circuit board 5, the noise transmission circuit 7 generates spans the receiving circuit 6.

【0026】以上のように、この実施の形態1によれば、多層回路基板5に設けられた4層のシールドにより発光素子3の駆動電流による電磁界ノイズが受光素子1 [0026] As described above, according to the first embodiment, the electromagnetic field noise receiving element 1 by the drive current of the light-emitting element 3 by 4 layers of shielding provided on the multilayer circuit board 5
に及ぶのを防ぐとともに、発光素子3のパッケージおよび発光素子ホルダ4の電位変動を抑えてノイズの発生を低減し、受光素子1のパッケージおよび受光素子ホルダ2の電位変動を抑えて受光素子1の信号線に対する外部電磁ノイズの進入を防ぐことができる。 Together prevent the spans, to suppress the package and the potential fluctuation of the light emitting element holder 4 of the light-emitting element 3 to reduce generation of noise, the light receiving element 1 suppresses the package and the potential fluctuation of the light receiving element holder 2 of the light receiving element 1 it is possible to prevent the entry of external electromagnetic noise against the signal line.

【0027】 [0027]

【発明の効果】以上の説明から明らかなように、本発明によれば、平面状のシールド層が受光素子と発光素子との間において電磁的に両者を分離するために、送信側で発生した電磁ノイズが受信側へ伝わることがなく、また外部へのノイズ発生および外部からのノイズの進入がなくなり、受信特性が良好な光通信モジュールを実現することができる。 As it is clear from the description above, according to the present invention, according to the present invention, in order planar shield layer separating them electromagnetically between the light emitting element and the light receiving element, generated in the transmission side without electromagnetic noise is transmitted to the receiving side, there is no noise and the noise from the outside entering the outside, the reception characteristics can be realized a good optical communication module.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】(a)は本発明の実施の形態1の光通信モジュールの側面図 (b)は同光通信モジュールの上面図 Figure 1 (a) is a side view of the optical communication module of the first embodiment of the present invention (b) is a top view of the optical communication module

【図2】(a)は同光通信モジュールにおける回路基板の第1層の銅箔パターンを示す概略図 (b)は同光通信モジュールにおける回路基板の第4層の銅箔パターンを示す概略図 2 (a) is a schematic view showing a copper foil pattern of the same optical communication schematic diagram illustrating a copper foil pattern of the first layer of the circuit board in the module (b) the fourth layer of the circuit board in the optical communication module

【図3】(a)は従来の光通信モジュールの上面図 (b)は同光通信モジュールの側面図 3 (a) is a top view of a conventional optical communication module (b) is a side view of the optical communication module

【符号の説明】 DESCRIPTION OF SYMBOLS

1 受光素子 2 受光素子ホルダ 3 発光素子 4 発光素子ホルダ 5 多層回路基板 6 受信回路 7 送信回路 8 コネクタ 9 光ファイバコネクタ 1 light receiving element 2 receiving element holder 3 emitting element 4 emitting element holder 5 multilayer circuit board 6 receiving circuit 7 the transmitting circuit 8 connector 9 optical fiber connector

Claims (3)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】シールド層を有する多層回路基板と、受信光を電気信号に変換する受光素子と、前記受光素子に接続された受信回路と、送信光を発生する発光素子と、前記発光素子を駆動する送信回路とを備え、前記受光素子と受信回路は前記多層回路基板の一方の面に実装され、 A multilayer circuit board having a 1. A shielding layer, a light receiving element for converting the received light into an electrical signal, a receiving circuit connected to said light receiving element, a light emitting element for generating the transmission light, the light emitting element and a transmitting circuit for driving the receiving circuit and the light receiving element is mounted on one surface of the multilayer circuit board,
    前記発光素子と送信回路は前記多層回路基板の他方の面に実装されたことを特徴とする光通信モジュール。 The optical communication module wherein the light emitting element and the transmission circuit, characterized in that mounted on the other surface of the multilayer circuit board.
  2. 【請求項2】多層回路基板は、受光素子と前記発光素子の間に位置する部分に配置された少なくとも2層以上のシールド層を有することを特徴とする請求項1記載の光通信モジュール。 2. A multi-layer circuit board, the optical communication module according to claim 1, characterized in that it comprises at least two layers of the shield layer disposed portion located between said light emitting element and the light receiving element.
  3. 【請求項3】シールド層を有する多層回路基板と、受信光を電気信号に変換する受光素子と、前記受光素子に受信光を送る光ファイバと前記受光素子との両者を支持する受光素子ホルダと、前記受光素子に接続された受信回路と、送信光を発生する発光素子と、前記発光素子からの送信光を受ける光ファイバと前記発光素子との両者を支持する発光素子ホルダと、前記発光素子を駆動する送信回路とを備え、前記受光素子と受信回路は前記多層回路基板の一方の面に実装され、前記受光素子ホルダは前記多層回路基板のシールド層と直接接続され、前記発光素子と送信回路は前記多層回路基板の他方の面に実装されており、前記発光素子ホルダは前記多層回路基板のシールド層と直接接続されていることを特徴とする光通信モジュール。 A multilayer circuit board having a 3. A shield layer, a light receiving element for converting the received light into an electrical signal, and a light-receiving element holder for supporting both the optical fiber and the light receiving element sends the received light to said light receiving element a receiving circuit connected to said light receiving element, a light emitting element for generating a transmission light, a light emitting element holder for supporting both the optical fiber and the light emitting element which receives the transmitted light from the light emitting element, the light emitting element and a transmitting circuit for driving the light receiving element and the receiving circuit is the mounted on one side of the multilayer circuit board, the light receiving element holder is directly connected to the shield layer of the multilayer circuit board, transmitting the light emitting element optical communication module circuit, wherein the being mounted on the other surface of the multilayer circuit board, wherein the light emitting element holder is connected directly to the shield layer of the multilayer circuit board.
JP33143895A 1995-12-20 1995-12-20 Optical communication module Pending JPH09171127A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33143895A JPH09171127A (en) 1995-12-20 1995-12-20 Optical communication module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33143895A JPH09171127A (en) 1995-12-20 1995-12-20 Optical communication module

Publications (1)

Publication Number Publication Date
JPH09171127A true JPH09171127A (en) 1997-06-30

Family

ID=18243671

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33143895A Pending JPH09171127A (en) 1995-12-20 1995-12-20 Optical communication module

Country Status (1)

Country Link
JP (1) JPH09171127A (en)

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EP1196799A1 (en) * 1999-05-26 2002-04-17 E20 Communications, Inc. Method and apparatus for vertical board construction of fiber optic transmitters, receivers and transceivers
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US6369924B1 (en) 1998-04-20 2002-04-09 Stratos Lightwave, Inc. Optical transceiver with enhanced shielding and related methods
US6597484B1 (en) 1998-12-25 2003-07-22 Nec Corporation Two-way combination optical system unit
EP1196799A1 (en) * 1999-05-26 2002-04-17 E20 Communications, Inc. Method and apparatus for vertical board construction of fiber optic transmitters, receivers and transceivers
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US8459881B2 (en) 2008-05-20 2013-06-11 Finisar Corporation Electromagnetic radiation containment in an optoelectronic module
US8057109B2 (en) 2008-05-20 2011-11-15 Finisar Corporation Transceiver module with dual printed circuit boards
US8328435B2 (en) 2008-05-20 2012-12-11 Finisar Corporation Printed circuit board positioning spacers in an optoelectronic module
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US8113723B2 (en) 2009-10-05 2012-02-14 Finisar Corporation Communications module integrated boot and release slide
US8391667B2 (en) 2009-10-05 2013-03-05 Finisar Corporation Latching mechanism for a module
US8934752B2 (en) 2009-10-05 2015-01-13 Finisar Corporation Latching mechanism for a module
US9081156B2 (en) 2009-10-05 2015-07-14 Finisar Corporation Simplified and shortened parallel cable
JP2011085268A (en) * 2009-10-13 2011-04-28 Mitsubishi Electric Corp Transmitter-receiver for remote controller and air conditioner including the same
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