JPH0890612A - Submarine gate-type mold for molding resin and resin molding method - Google Patents

Submarine gate-type mold for molding resin and resin molding method

Info

Publication number
JPH0890612A
JPH0890612A JP23334994A JP23334994A JPH0890612A JP H0890612 A JPH0890612 A JP H0890612A JP 23334994 A JP23334994 A JP 23334994A JP 23334994 A JP23334994 A JP 23334994A JP H0890612 A JPH0890612 A JP H0890612A
Authority
JP
Japan
Prior art keywords
mold
gate
plate
product
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23334994A
Other languages
Japanese (ja)
Other versions
JP2616568B2 (en
Inventor
Hiroshi Matsuo
弘 松尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP6233349A priority Critical patent/JP2616568B2/en
Publication of JPH0890612A publication Critical patent/JPH0890612A/en
Application granted granted Critical
Publication of JP2616568B2 publication Critical patent/JP2616568B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

PURPOSE: To release a product from a mold separately from a machining boss in a submarine gate-system mold for molding a resin. CONSTITUTION: A submarine gate-system mold, in which a resin material flows into a cavity for molding a product through a runner 11, a gate 12 provided in a lower mold 17, and a groove provided in an outer peripheral surface of a gate pin 1 for molding a machining boss 10, and a molded resin product 13 is removed by the gate pin 1, comprises a plate 7 provided with a bush 3 engaging with a spiral groove 19 provided in the outer peripheral surface of the gate pin, a spring 8 constantly pressing up the plate 7, and a support pin 6 pressing down the plate 7 at the time of closing a mold.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、サブマリーンゲート方
式の樹脂成形用金型および樹脂成形方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a submarine gate type resin molding die and a resin molding method.

【0002】[0002]

【従来の技術】従来のサブマリーンゲート方式の樹脂成
形用金型は、日刊工業新聞社出版の「射出成形用金型」
(第2版)に記載されている。
2. Description of the Related Art A conventional submarine gate type resin molding die is known as "Injection molding die" published by Nikkan Kogyo Shimbun.
(2nd edition).

【0003】図3において、下型取付け板14にスペー
サブロック15を介して下型17が取り付けられ、上型
取付け板16に上型18が取り付けられている。下型取
付け板14と下型17との間にはエジェクタプレート
4,5が配置され、下型17に設けられた穴に摺動可能
に先端が嵌合するゲートピン1の後端がエジェクタプレ
ート4,5に固定されている。下型17と上型18との
間に製品13が成形され、樹脂材料は下型17と上型1
8との間のランナー11から下型17に設けられたゲー
ト12およびゲートピン1の外周面に設けられた溝の捨
てボス10が成形される部分を通り製品10が成形され
るキャビティに流れ込む。型開きの際にエジェクタプレ
ート4,5が下型17の方向へ移動させられ、ゲートピ
ン1の先端が下型17から突き出て製品13を離型さ
せ、またランナー11で成形された樹脂も図示しない突
き出しピンにより離型される。また、この時にゲート部
12の樹脂と捨てボス10間は切断分離され、ランナー
11およびゲート12の樹脂と捨てボス10および製品
13とに別れて離型される。捨てボス10と製品13と
は離形後、別工程にてニッパー等を用いて分離(カッ
ト)されている。
In FIG. 3, a lower die 17 is mounted on a lower die mounting plate 14 via a spacer block 15, and an upper die 18 is mounted on an upper die mounting plate 16. Ejector plates 4 and 5 are arranged between the lower die mounting plate 14 and the lower die 17, and the rear end of the gate pin 1 whose tip is slidably fitted in a hole provided in the lower die 17 is the ejector plate 4 , 5 fixed. The product 13 is molded between the lower mold 17 and the upper mold 18, and the resin material is the lower mold 17 and the upper mold 1.
8 from the runner 11 to the lower mold 17 and the groove provided in the outer peripheral surface of the gate pin 1 through the portion where the discard boss 10 is formed and flows into the cavity where the product 10 is formed. At the time of mold opening, the ejector plates 4 and 5 are moved in the direction of the lower mold 17, the tip of the gate pin 1 projects from the lower mold 17 to release the product 13, and the resin molded by the runner 11 is also not shown. It is released by the ejector pin. At this time, the resin of the gate portion 12 and the waste boss 10 are cut and separated, and the resin of the runner 11 and the gate 12 and the waste boss 10 and the product 13 are separated. After the discarding boss 10 and the product 13 are separated, they are separated (cut) using a nipper or the like in a separate process.

【0004】[0004]

【発明が解決しようとする課題】この従来のサブマリー
ンゲート方式の樹脂成形金型では、金型から成形品が離
型される時に捨てボス部と製品部が分離されない。この
捨てボスと製品との分離を成形後に別工程にて行なわな
ければならないという問題点があった。
In this conventional resin molding die of the submarine gate system, when the molded product is released from the mold, the waste boss portion and the product portion are not separated. There is a problem that the separation between the discarded boss and the product must be performed in a separate process after the molding.

【0005】[0005]

【課題を解決するための手段】本発明は、下型に設けら
れた穴に嵌合し後端がエジェクタプレートに固定され金
型開時に前記エジェクタプレートの押し出しにより先端
が前記下型から突出して樹脂成形された製品を離型させ
るゲートピンを有し、樹脂材料がランナーから前記下型
内に設けられたゲートおよび前記ゲートピンの外周面に
設けられた溝を通って前記製品が成形されるキャビティ
に流れ込むサブマリーンゲート方式の樹脂成形用金型に
おいて、前記ゲートピンの外周面に設けられた螺旋溝
と、この螺旋溝に係合するブッシュが設けられ前記エジ
ェクタプレート上に配置されたプレートと、このプレー
トを常に前記下型へ向けて押し上げるスプリングと、前
記下型に設けられた穴に嵌合して金型が開閉する方向に
設けられ後端が前記プレートに固定され金型閉時に先端
が上型に当接する支持ピンとを備えている。
According to the present invention, a rear end is fixed to an ejector plate which is fitted in a hole provided in a lower mold, and when the mold is opened, the front end projects from the lower mold by pushing the ejector plate. A gate pin for releasing the resin-molded product from the mold, and a resin material is passed from a runner through a gate provided in the lower mold and a groove provided on an outer peripheral surface of the gate pin to a cavity in which the product is molded. In a resin molding die of a submarine gate type that flows in, a spiral groove provided on an outer peripheral surface of the gate pin, a bush that is engaged with the spiral groove, a plate disposed on the ejector plate, A spring that always pushes up toward the lower mold, and a rear end is provided in a direction in which the mold is opened and closed by fitting into a hole provided in the lower mold. Tip fixed mold closing is provided with a support pin abutting the upper die to the rate.

【0006】本発明は、下型に設けられた穴に嵌合し後
端がエジェクタプレートに固定され金型開時に前記エジ
ェクタプレートの押し出しにより先端が前記下型から突
出して樹脂成形された製品を離型させるゲートピンを有
し、樹脂材料がランナーから前記下型内に設けられた溝
を通って前記製品が成形されるキャビティに流れ込むサ
ブマリーンゲート方式の樹脂成形用金型において、前記
ゲートピンの外周面に設けられた螺旋溝と、この螺旋溝
に係合するブッシュが設けられ前記エジェクタプレート
上に配置されたプレートと、金型開時に前記プレートを
金型が開閉する方向に移動させる手段とを備えている。
According to the present invention, there is provided a product, which is resin-molded such that the rear end is fixed to the ejector plate by being fitted in the hole provided in the lower mold and the front end is projected from the lower mold by pushing the ejector plate when the mold is opened. An outer periphery of the gate pin in a sub-marine gate type resin molding die, which has a gate pin for releasing the mold, and in which a resin material flows from a runner into a cavity in which the product is molded through a groove provided in the lower mold. A spiral groove provided on the surface, a plate provided on the ejector plate with a bush engaging with the spiral groove, and means for moving the plate in a direction in which the mold opens and closes when the mold is opened. I have it.

【0007】本発明は、下型に設けられた穴に嵌合し後
端がエジェクタプレートに固定され金型開時に前記エジ
ェクタプレートの押し出しにより先端が前記下型から突
出するゲートピンにより樹脂成形された製品を離型さ
せ、樹脂材料をランナーから前記下型内に設けられたゲ
ートおよび前記ゲートピンの外周面に設けられた溝を通
して前記製品が成形されるキャビティに流し込むサブマ
リーンゲート方式の樹脂成形方法において、金型開時に
前記ゲートピンを回転させることを特徴とする。
According to the present invention, the rear end is fixed to the ejector plate by being fitted in the hole provided in the lower mold, and the front end is resin-molded by the gate pin protruding from the lower mold when the ejector plate is pushed out when the mold is opened. In a resin molding method of a submarine gate method, the product is released from the mold, and a resin material is poured from a runner into a cavity in which the product is molded through a groove provided in a gate provided in the lower mold and a peripheral surface of the gate pin. The gate pin is rotated when the mold is opened.

【0008】[0008]

【実施例】次に本発明について図面を参照して説明す
る。
The present invention will be described below with reference to the drawings.

【0009】ゲートピン1には螺旋溝19が成形された
回転ゴマ2が設けられ、エジェクタプレート4上に配置
されたプレート7に固定されたブッシュ3に回転ゴマ2
が挿通し、ブッシュ3の内面に設けられた凸球部20が
螺旋溝19に摺動自在に係合している。エジェクタプレ
ート4に設けられた穴を通ってエジェクタプレート5と
プレート7との間に設けられたコイルスプリング8によ
りプレート7は下型17へ向う力を受けるが、下型17
に設けられた穴を摺動自在に嵌合し型が閉じられた状態
では先端が上型18に当接し後端がプレート7に固定さ
れた支持ピン6によってプレート7はエジェクタプレー
ト4上に押え付けられている。また、プレート7の下面
にはエジェクタプレート4に設けられた穴に摺動自在に
嵌合し、型が閉じられた状態でこの穴の嵌合部より下側
に突出した先端にフランジを有するストッパーボルト9
が設けられている。
The gate pin 1 is provided with a rotary sesame 2 having a spiral groove 19 formed therein, and the rotary sesame 2 is attached to a bush 3 fixed to a plate 7 arranged on an ejector plate 4.
Is inserted, and the convex spherical portion 20 provided on the inner surface of the bush 3 is slidably engaged with the spiral groove 19. The plate 7 receives a force directed to the lower mold 17 by a coil spring 8 provided between the ejector plate 5 and the plate 7 through a hole provided in the ejector plate 4.
The plate 7 is pressed onto the ejector plate 4 by the support pin 6 whose front end is in contact with the upper die 18 and whose rear end is fixed to the plate 7 in a state where the hole provided in the hole is slidably fitted and the mold is closed. It is attached. In addition, a stopper having a flange at the tip protruding downward from the fitting portion of the hole, which is slidably fitted in the hole provided in the ejector plate 4 on the lower surface of the plate 7 and has the mold closed. Bolt 9
Is provided.

【0010】金型開時には支持6が下型17の上面より
突出し支持ピン6の押えがなくなり、コイルスプリング
8により、プレート7が上方へ押し出される。(ただ
し、ストッパーボルトによりある一定の位置で止まる)
この時にブッシュ3の凸球部20が回転ゴマ2の螺旋溝
19を通って上向き直線移動することによりゲートピン
1が回転し、図2の状態になる。ゲートピン1の回転に
より、捨てボス10が図2のように移動し、製品10か
らカットされる。このあと従来の金型と同様にエジェク
タプレート4,5の押し出しにより製品13,ランナー
11,ゲート12が離型される。捨てボス10は自重に
より落下しゲートピン1より離型される。
When the mold is opened, the support 6 protrudes from the upper surface of the lower mold 17 so that the support pin 6 is not pressed, and the plate 7 is pushed upward by the coil spring 8. (However, it stops at a certain position with a stopper bolt)
At this time, the convex spherical portion 20 of the bush 3 moves upward linearly through the spiral groove 19 of the rotary sesame 2, whereby the gate pin 1 rotates, and the state shown in FIG. 2 is obtained. By rotating the gate pin 1, the discarding boss 10 moves as shown in FIG. 2 and is cut from the product 10. Thereafter, the product 13, the runner 11, and the gate 12 are released by extruding the ejector plates 4 and 5, as in the conventional mold. The discard boss 10 falls by its own weight and is released from the gate pin 1.

【0011】金型閉時は、上型18により支持ピン6が
押し戻され、プレート7もエジェクタプレート4上に押
し戻され、回転ゴマ2,ゲートピン1および捨てボス1
0の部分も図1に示す元の状態に戻る。
When the mold is closed, the support pin 6 is pushed back by the upper mold 18 and the plate 7 is also pushed back onto the ejector plate 4 to rotate the sesame 2, the gate pin 1 and the disposal boss 1.
The part of 0 also returns to the original state shown in FIG.

【0012】なお、螺旋溝19とブッシュ3との係合は
凸球部20によるものに限られず、螺旋溝19を雄ねじ
の谷の部分とし、これにブッシュ3に設けた雌ねじを螺
合させるものでもよい。
The engagement between the spiral groove 19 and the bush 3 is not limited to that by the convex spherical portion 20, but the spiral groove 19 is used as the valley portion of the male screw, and the female screw provided on the bush 3 is screwed into this. But it's okay.

【0013】また、ストッパーボルト9は必ずしも必要
ではなく、代わりに下型17の下面またはプレート7の
上面に所定の長さの棒を固定してストッパーとしてもよ
い。
Further, the stopper bolt 9 is not always necessary. Instead, a rod having a predetermined length may be fixed to the lower surface of the lower die 17 or the upper surface of the plate 7 to serve as a stopper.

【0014】また、プレート7をコイルスプリング8の
力で押し上げる代わりに、油圧シリンダ等で動かすよう
にしてもよい。
Further, instead of pushing up the plate 7 by the force of the coil spring 8, it may be moved by a hydraulic cylinder or the like.

【0015】[0015]

【発明の効果】以上説明したように本発明のサブマリン
ゲート方式の樹脂成形用金型および樹脂成形方法は、離
型時にゲートピンを回転させることにより、樹脂成形し
た製品の離型と同時にゲートピン上の樹脂材料の供給流
路に成形された捨てボスを製品から分離するため、製品
の成形終了後、別工程にて製品から捨てボスを分離する
必要がなくなるという効果を有する。
As described above, the resin molding die and the resin molding method of the submarine gate system according to the present invention rotate the gate pin at the time of mold release, thereby simultaneously releasing the resin molded product from the gate pin. Since the waste boss formed in the resin material supply flow path is separated from the product, there is an effect that it is not necessary to separate the waste boss from the product in another process after the completion of the product molding.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例のサブマリーンゲート方式の
樹脂成形用金型の金型閉時の断面図である。
FIG. 1 is a sectional view of a submarine gate type resin molding die according to an embodiment of the present invention when the die is closed.

【図2】図1に示した実施例の金型開時の断面図であ
る。
FIG. 2 is a cross-sectional view of the embodiment shown in FIG. 1 when a mold is opened.

【図3】従来のサブマリーンゲート方式の樹脂成形用金
型の金型閉時の断面図である。
FIG. 3 is a cross-sectional view of a conventional submarine gate type resin molding die when the die is closed.

【符号の説明】[Explanation of symbols]

1 ゲートピン 2 回転ゴマ 3 ブッシュ 4 エジェクタプレート(上) 5 エジェクタプレート(下) 6 支持ピン 7 プレート 8 コイルスプリング 9 ストッパーボルト 10 捨てボス 11 ランナー 12 ゲート 13 製品 19 螺旋溝 20 凸球部 DESCRIPTION OF SYMBOLS 1 Gate pin 2 Rotating sesame 3 Bush 4 Ejector plate (upper) 5 Ejector plate (lower) 6 Support pin 7 Plate 8 Coil spring 9 Stopper bolt 10 Discard boss 11 Runner 12 Gate 13 Product 19 Spiral groove 20 Convex ball part

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 下型に設けられた穴に嵌合し後端がエジ
ェクタプレートに固定され金型開時に前記エジェクタプ
レートの押し出しにより先端が前記下型から突出して樹
脂成形された製品を離型させるゲートピンを有し、樹脂
材料がランナーから前記下型内に設けられたゲートおよ
び前記ゲートピンの外周面に設けられた溝を通って前記
製品が成形されるキャビティに流れ込むサブマリーンゲ
ート方式の樹脂成形用金型において、 前記ゲートピンの外周面に設けられた螺旋溝と、この螺
旋溝に係合するブッシュが設けられ前記エジェクタプレ
ート上に配置されたプレートと、このプレートを常に前
記下型へ向けて押し上げるスプリングと、前記下型に設
けられた穴に嵌合して金型が開閉する方向に設けられ後
端が前記プレートに固定され金型閉時に先端が上型に当
接する支持ピンとを含むことを特徴とするサブマリーン
ゲート方式の樹脂成形用金型。
1. A resin-molded product which is fitted into a hole provided in a lower mold and whose rear end is fixed to an ejector plate and whose tip protrudes from the lower mold by extrusion of the ejector plate when the mold is opened. Submarine gate type resin molding in which a resin material flows from a runner into a cavity in which the product is molded through a gate provided in the lower mold and a groove provided on an outer peripheral surface of the gate pin. In the mold, a spiral groove provided on the outer peripheral surface of the gate pin, a bush that engages with the spiral groove is provided, and a plate disposed on the ejector plate, and the plate is always directed toward the lower mold. A spring that is pushed up and is provided in a direction in which the mold is opened and closed by fitting into a hole provided in the lower mold, and a rear end is fixed to the plate and the mold is closed. Resin mold of submarine gate system, characterized in that it comprises a support pin tip comes into contact with the upper die to.
【請求項2】 下型に設けられた穴に嵌合し後端がエジ
ェクタプレートに固定され金型開時に前記エジェクタプ
レートの押し出しにより先端が前記下型から突出して樹
脂成形された製品を離型させるゲートピンを有し、樹脂
材料がランナーから前記下型内に設けられた溝を通って
前記製品が成形されるキャビティに流れ込むサブマリー
ンゲート方式の樹脂成形用金型において、 前記ゲートピンの外周面に設けられた螺旋溝と、この螺
旋溝に係合するブッシュが設けられ前記エジェクタプレ
ート上に配置されたプレートと、金型開時に前記プレー
トを金型が開閉する方向に移動させる手段とを含むこと
を特徴とするサブマリーンゲート方式の樹脂成形用金
型。
2. A product formed by resin molding in which a rear end is fitted to a hole provided in a lower die and a rear end is fixed to an ejector plate, and a tip is projected from the lower die by pushing out the ejector plate when the die is opened. In a mold for resin molding of a submarine gate system, which has a gate pin to be made, and a resin material flows from a runner into a cavity in which the product is molded through a groove provided in the lower mold, in an outer peripheral surface of the gate pin. A spiral groove provided therein; a plate provided with a bush engaging with the spiral groove and arranged on the ejector plate; and means for moving the plate in a direction in which the mold is opened and closed when the mold is opened. A sub-marine gate type resin molding die.
【請求項3】 下型に設けられた穴に嵌合し後端がエジ
ェクタプレートに固定され金型開時に前記エジェクタプ
レートの押し出しにより先端が前記下型から突出するゲ
ートピンにより樹脂成形された製品を離型させ、樹脂材
料をランナーから前記下型内に設けられたゲートおよび
前記ゲートピンの外周面に設けられた溝を通して前記製
品が成形されるキャビティに流し込むサブマリーンゲー
ト方式の樹脂成形方法において、 金型開時に前記ゲートピンを回転させることを特徴とす
るサブマリーンゲート方式の樹脂成形方法。
3. A product molded by a gate pin whose rear end is fixed to an ejector plate and which is pushed out of the ejector plate when the mold is opened and whose front end projects from the lower mold by fitting in a hole provided in the lower mold. In the resin molding method of the sub-marine gate method, the resin material is released from the runner and poured into the cavity in which the product is molded from the runner through the groove provided in the gate provided in the lower die and the outer peripheral surface of the gate pin. A resin molding method of a submarine gate method, wherein the gate pin is rotated when the mold is opened.
JP6233349A 1994-09-28 1994-09-28 Submarine gate type resin molding die and resin molding method Expired - Lifetime JP2616568B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6233349A JP2616568B2 (en) 1994-09-28 1994-09-28 Submarine gate type resin molding die and resin molding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6233349A JP2616568B2 (en) 1994-09-28 1994-09-28 Submarine gate type resin molding die and resin molding method

Publications (2)

Publication Number Publication Date
JPH0890612A true JPH0890612A (en) 1996-04-09
JP2616568B2 JP2616568B2 (en) 1997-06-04

Family

ID=16953760

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6233349A Expired - Lifetime JP2616568B2 (en) 1994-09-28 1994-09-28 Submarine gate type resin molding die and resin molding method

Country Status (1)

Country Link
JP (1) JP2616568B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011050885A1 (en) * 2009-10-30 2011-05-05 Sony Ericsson Mobile Communications Ab Injection molding method for molding a molding part
CN102837402A (en) * 2012-09-28 2012-12-26 东泰精密模具(苏州)有限公司 Spiral angle ejection mechanism and mold with same
CN108580836A (en) * 2018-07-05 2018-09-28 苏州广型模具有限公司 High-pressure casting mold tool is cut off in mould
CN110355948A (en) * 2019-07-27 2019-10-22 肇庆中能创智信息科技有限公司 A kind of injection mold for plastic production

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Publication number Priority date Publication date Assignee Title
JPH0655585A (en) * 1992-05-15 1994-03-01 Nec Corp Gate cut mechanism in submarine gate

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0655585A (en) * 1992-05-15 1994-03-01 Nec Corp Gate cut mechanism in submarine gate

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011050885A1 (en) * 2009-10-30 2011-05-05 Sony Ericsson Mobile Communications Ab Injection molding method for molding a molding part
CN102837402A (en) * 2012-09-28 2012-12-26 东泰精密模具(苏州)有限公司 Spiral angle ejection mechanism and mold with same
CN102837402B (en) * 2012-09-28 2014-07-16 东泰精密模具(苏州)有限公司 Spiral angle ejection mechanism and mold with same
CN108580836A (en) * 2018-07-05 2018-09-28 苏州广型模具有限公司 High-pressure casting mold tool is cut off in mould
CN110355948A (en) * 2019-07-27 2019-10-22 肇庆中能创智信息科技有限公司 A kind of injection mold for plastic production

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