JPH0872062A - Porous electroforming mold - Google Patents

Porous electroforming mold

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Publication number
JPH0872062A
JPH0872062A JP23412094A JP23412094A JPH0872062A JP H0872062 A JPH0872062 A JP H0872062A JP 23412094 A JP23412094 A JP 23412094A JP 23412094 A JP23412094 A JP 23412094A JP H0872062 A JPH0872062 A JP H0872062A
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JP
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Patent type
Prior art keywords
porous
backup member
molding
ikara
formed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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JP23412094A
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Japanese (ja)
Inventor
Yasuyoshi Noda
泰義 野田
Original Assignee
Konan Tokushu Sangyo Kk
江南特殊産業株式会社
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C51/00Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
    • B29C51/26Component parts, details or accessories; Auxiliary operations
    • B29C51/30Moulds
    • B29C51/36Moulds specially adapted for vacuum forming, Manufacture thereof
    • B29C51/365Porous moulds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/26Moulds
    • B29C45/34Moulds having venting means
    • B29C45/345Moulds having venting means using a porous mould wall or a part thereof, e.g. made of sintered metal
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/26Moulds
    • B29C45/37Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings

Abstract

PURPOSE: To provide a porous electroforming mold capable of obtaining high strength capable of withstanding high pressure applied at the time of molding though the inner diameter of a through-hole is large on the rear surface side thereof, preventing the colgging of the through-hole with a synthetic resin even when used in injection molding and preventing the release of a backup member from a porous electroforming shell even when heating and cooling are repeated many times at the time of molding. CONSTITUTION: An injection mold 1 is formed from upper and lower molds 2,3 in a split form and each of the split molds 2,3 is equipped with a porous electroforming shell 4, a porous flame spraying backup member 7 and a sub- backup member 8. A large number of through-holes 9 are formed to the porous electroforming shell 4 and the inner diameter of each of them is made as small as about 0.05-0.1mm on the molding surface side of the porous electroforming shell and made as large as about 2.0-4.0mm on the rear surface side thereof. The porous flame spraying backup member 7 is formed by the flame spraying of an Ni-Al alloy and a large number of continuous pores wherein voids are continuous between flame spraying particles are formed in a flame spraying structure.

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【産業上の利用分野】本発明は、合成樹脂の真空成形、 The present invention relates to a vacuum forming synthetic resin,
ブロー成形、射出成形、反応射出成形(RIM成形)、 Blow molding, injection molding, reaction injection molding (RIM molding),
圧縮成形、スタンピング成形、押出成形、その他の各種成形に使用する電鋳金型に関し、詳しくは、ガス抜き、 Compression molding, it relates stamping molding, extrusion molding, metal casting electrodeposition used for various other molding, particularly, degassing,
真空吸引、離型剤の滲出等を行うために通気性又は通液性を備えた多孔質電鋳金型に係るものである。 Vacuum suction, it relates to a porous electroforming die having a breathable or liquid permeability in order to perform the exudation etc. of the release agent.

【0002】 [0002]

【従来の技術及び発明が解決しようとする課題】この種の多孔質電鋳金型は、多孔質電鋳殻とその裏面を補強するバックアップ体とから構成される。 DISCLOSURE OF THE PRIOR ART and to be Solved by the Invention porous electroforming die of this type, comprised of a porous conductive Ikara and backup member for reinforcing the back side. 先に本出願人は、 The applicant has previously,
特公平2−14434号公報及び特公平5−39698 Kokoku 2-14434 and JP fair 5-39698
号公報において、多孔質電鋳殻の新しい製造方法を開示した。 In JP, disclosed a new method for producing a porous conductive Ikara. この製造方法によれば、内径が表面側で小さく且つ裏面側で大きい多数の通孔を効率的に形成でき、通孔の通気抵抗が低いため真空吸引を行い易い、通孔が詰りにくい等の多くの効果を得ることができた。 According to this manufacturing method, the inner diameter can be formed a plurality of through holes greater in the small and the back side surface side efficiently, easily and vacuum suction for ventilation resistance through hole is low, through holes such as hard clogging I was able to get a lot of effect.

【0003】ところが、このように内径が裏面側で大きい通孔は電鋳殻の強度を低下させるという問題がある。 [0003] However, through hole thus having a larger inner diameter at the back side there is a problem of reducing the strength of the electric Ikara.
しかも、従来のバックアップ体は、多孔質電鋳殻の裏面の要所を点又は線当たり的に支持する棒状又は板状の補強材が一般的なので、補強作用が不均一である。 Moreover, traditional backup body, since rod-like or plate-like reinforcing member for supporting the back surface of the key points of the porous conductive Ikara in manner per point or line is generally a reinforcing effect is not uniform. よって、従来の多孔質電鋳金型を例えば射出成形のような高い圧力がかかる成形に使用しようとしても、多孔質電鋳殻が歪んでしまい、実際の使用は困難であった。 Therefore, even if an attempt is used to a higher pressure such compacts, such as a conventional porous electroforming die, for example injection molding, the porous conductive Ikara is distorted, and an actual use difficult.

【0004】また、従来の多孔質電鋳金型を射出成形に使用するとき、しかも合成樹脂の流れが特に良い場合には、たとえ通孔の内径が表面側で小さくても、その通孔の中に合成樹脂が入り込んで詰るおそれがあった。 Further, when using the conventional porous electroforming die in an injection molding, yet if the flow of the synthetic resin is particularly good, even if small inner diameter of the through hole on the surface side, in that hole synthetic resin had penetrated by clogged fear.

【0005】本発明の目的は、上記課題を解決し、貫通孔の内径が裏面側で大きいにも拘らず、成形時にかかる高い圧力に耐え得る高い強度が得られ、射出成形に使用しても貫通孔に合成樹脂が詰ることがなく、成形時に加熱及び冷却が多数回繰り返されても多孔質電鋳殻からバックアップ体が剥離せず、しかも短時間で容易に製造でき、納期の短縮及びコストの低減を図ることができる多孔質電鋳金型を提供することにある。 An object of the present invention is to solve the above problems, despite the inner diameter of the through hole is greater in the back surface side, high strength to withstand the high pressure applied during molding can be obtained, even when used in an injection molding without the through hole synthetic resin clogging, even without the backup member from the porous conductive Ikara peeling repeated heating and cooling many times during molding, yet can be easily manufactured in a short time, shortening and cost of delivery and to provide a porous electroforming die which can be reduced.

【0006】 [0006]

【課題を解決するための手段】上記目的を達成するために、本発明の多孔質電鋳金型は、内径が表面側で小さく且つ裏面側で大きい多数の貫通孔を有する多孔質電鋳殻と、前記貫通孔の内部にも侵入するように前記多孔質電鋳殻の裏面に溶射形成された通気性又は通液性のある多孔質溶射バックアップ体とを備えた構成とした。 To achieve the above object, according to the Invention The porous electroforming die of the present invention, a porous conductive Ikara whose inner diameter has a large number of through-holes larger in small and the back side surface side and configured to include an interior also backside thermal spray forming of the porous conductive Ikara to penetrate the breathable or liquid permeability porous spray backup of the through-hole.

【0007】ここで、「多孔質電鋳殻」の電鋳材料としては、Ni、Cu、Fe又はそれらの合金(例えば硬度の高いNi−Co系合金)等を例示することができ、また、多孔質電鋳殻の厚さの途中で電鋳材料を変えること、例えば表面部を硬度の高い電鋳材料で形成し、残部を別の電鋳材料で形成するようなこともできる。 [0007] Here, as the "porous conductive Ikara" electroforming material can be exemplified Ni, Cu, Fe or an alloy thereof (e.g., high hardness Ni-Co based alloy) or the like, and, altering the way in electroforming material thickness of the porous conductive Ikara, for example the surface portion is formed with high electroforming material hardness, it may be such as to form the remainder in a separate electroforming material. 多孔質電鋳殻の肉厚は2〜6mm程度が好ましい。 The thickness of the porous conductive Ikara about 2~6mm is preferred.

【0008】「貫通孔」の内径(ここでは平均値)は、 [0008] internal diameter of the "through-hole" (average value here), the
表面側で0.01〜0.3mm程度が好ましく、裏面側で1.0〜6.0mm程度が好ましい。 Preferably about 0.01~0.3mm surface side, about 1.0~6.0mm preferably the back side. 貫通孔の形成方法は限定されない。 Method of forming the through hole is not limited. しかし、先に本出願人が特公平2− However, the present applicant earlier KOKOKU 2-
14434号公報又は特公平5−39698号公報において開示したように、電鋳殻の電鋳形成の初期に微小な非電着部を発生させ、電鋳の進行とともに同非電着部を成長させることにより貫通させて形成した貫通孔が好ましい。 As disclosed in the 14434 JP or Kokoku 5-39698 and JP-conductive electroforming initially formed to generate a small electroless portion of Ikara, growing the electroless portions with the progress of electroforming through hole formed by penetration by it is preferred. この貫通孔は、電鋳殻の電鋳形成時に同時形成でき効率的であるとともに、そのままで内径が表面側で小さく且つ裏面側で大きいという条件を満たすからである。 The through hole, with an efficient be simultaneously formed when forming electroformed conductive Ikara inner diameter as such is a condition that large at small and the back side surface side.

【0009】「多孔質溶射バックアップ体」の溶射材料としては、Zn、Ni、Al、Sn、Cu、Fe、それらの合金(例えばZn−Ti系合金、Ni−Al系合金、ステンレス鋼)等の各種金属材料、金属の酸化物・ [0009] The spray material of the "porous thermal sprayed backup member", Zn, Ni, Al, Sn, Cu, Fe, their alloys (e.g. Zn-Ti alloy, Ni-Al alloy, stainless steel), such as various metal material, oxide of metal -
窒化物・炭化物・ホウ化物・ケイ化物等の各種セラミックス材料、又はそれらの組み合わせを例示することができる。 Nitrides, carbides, borides, silicides various ceramic materials, such as, or combinations thereof can be exemplified. 特にNi−Al系合金は、溶射時に多孔質になりやすいので好ましい。 Particularly Ni-Al alloy is preferable because prone to porous during spraying.

【0010】なお、多孔質溶射バックアップ体の裏面には、さらにサブバックアップ体を設けることができる。 [0010] Incidentally, on the back surface of the porous thermal sprayed backup member may further include a sub-backup member.
このサブバックアップ体の形成材料としては、Zn、A As a material for the formation of the sub-backup member, Zn, A
l、Fe、それらの合金等の各種金属材料、エポキシ樹脂等の各種合成樹脂材料、複合材料等を例示することができる。 l, Fe, various metal materials such as alloys thereof, various synthetic resin material such as epoxy resin, may be exemplified composite materials.

【0011】 [0011]

【作用】本発明において、多孔質溶射バックアップ体は多数の貫通孔の内部に侵入するように形成されているので、該貫通孔による多孔質電鋳殻の強度低下を補う作用がある。 [Action] In the present invention, since the porous thermal sprayed backup member is formed so as to penetrate the inside of the large number of through holes, an effect to compensate for the reduction in strength of the porous conductive Ikara by the through hole. しかも、多孔質溶射バックアップ体は多孔質電鋳殻の裏面を面当たり的に補強する。 Moreover, porous spray backup body reinforces the rear surface of the porous conductive Ikara in manner per facet. これらの作用により、本発明の多孔質電鋳金型は、例えば射出成形時にかかる高い圧力に耐え得る高い強度が得られる。 These effects, porous electroforming die of the present invention, a high strength can be obtained which can withstand high pressure applied for example during the injection molding.

【0012】また、多孔質溶射バックアップ体が貫通孔の内部に侵入しているので、本発明の多孔質電鋳金型は射出成形に使用しても、貫通孔の中に合成樹脂が入り込むことがない。 Further, since the porous thermal sprayed backup member is penetrated into the through-hole, a porous electroforming die of the present invention be used in injection molding, that the synthetic resin penetrates into the through hole Absent.

【0013】また、多孔質溶射バックアップ体は、前記貫通孔の内部への侵入によるアンカー効果により、多孔質電鋳殻に対して機械的に強く結合している。 Further, the porous thermal sprayed backup body, the anchor effect of intrusion into the interior of the through hole, and mechanically strong bond to the porous conductive Ikara. 従って、 Therefore,
成形時に加熱及び冷却が多数回繰り返されても、多孔質溶射バックアップ体は多孔質電鋳殻から剥離しない。 Be repeated heating and cooling many times during the molding, the porous thermal sprayed backup member is not detached from the porous conductive Ikara.

【0014】また、多孔質溶射バックアップ体の溶射形成にはさほどの時間も手間もかからないので、本発明の多孔質電鋳金型は短時間で容易に製造でき、納期の短縮及びコストの低減を図ることができる。 Further, since the spraying formation of the porous thermal sprayed backup member in less than time even less time, porous electroforming die of the present invention can be easily produced in a short time, shortening and cost reduction of the delivery be able to.

【0015】 [0015]

【実施例】以下、本発明をガス抜きを確実に行える射出成形用金型に具体化した第一実施例について、図1を参照して説明する。 EXAMPLES Hereinafter, the present invention for the first embodiment embodying the injection mold can be reliably performed venting will be described with reference to FIG. 本実施例の射出成形用金型1は上型2 Injection mold 1 of the present embodiment the upper mold 2
と下型3とに分割形成され、各分割型2,3は、成形部5及びPL面部6を備えた多孔質電鋳殻4と、該多孔質電鋳殻4の裏面に溶射形成された多孔質溶射バックアップ体7と、該多孔質溶射バックアップ体7の裏面に設けられたサブバックアップ体8とを備えている。 And dividedly formed on the lower mold 3, each division type 2 and 3, the porous conductive Ikara 4 with shaped portions 5 and PL face portion 6, which is sprayed formed on the rear surface of the porous conductive Ikara 4 a porous spray backup member 7, and a sub-backup member 8 provided on the back surface of the porous thermal sprayed backup member 7.

【0016】多孔質電鋳殻4は、特公平2−14434 [0016] The porous conductive Ikara 4, KOKOKU 2-14434
号公報又は特公平5−39698号公報に開示した方法によりNiで電鋳形成されたもので、その肉厚は約5m JP or by the methods disclosed KOKOKU 5-39698 discloses one formed electroforming Ni, thickness thereof is about 5m
mである。 A m. 成形部5の成形面は滑面であっても、シボ模様等の微細凹凸模様が付されていてもよい。 Even if the molding surface of the molding portion 5 is a smooth, fine asperity pattern such as grain pattern may also be added. また、多孔質電鋳殻4(特に成形部5)には、前記電鋳形成の初期に微小な非電着部を発生させ、電鋳の進行とともに同非電着部を成長させることにより多数の貫通孔9が形成され、通気性が付与されている。 In addition, the porous conductive Ikara 4 (in particular molding unit 5), a number by growing the electroforming to generate a small electroless portion initially formed of, the electroless portions with the progress of electroforming the through-hole 9 is formed, it is given breathability. 貫通孔9の内径は、多孔質電鋳殻4の成形面側で0.05〜0.1mm程度と小さく、裏面側で2.0〜4.0mm程度に大きく拡径している。 The inner diameter of the through-hole 9, as small as about 0.05~0.1mm the molding surface of the porous conductive Ikara 4 is made larger diameter to 2.0~4.0mm about the back side. その拡径の仕方は滑らかなものも、細かくうねったものもある。 Also the way of the enlarged diameter things smooth, some of which wavy finely.

【0017】多孔質電鋳殻4の電鋳条件の一例を挙げておくと、電鋳液の成分組成は、スルファミン酸ニッケル300〜450g/リットル、塩化ニッケル10〜20 The idea to an example of the electroforming conditions of the porous conductive Ikara 4, the composition of the electroforming solution, nickel sulfamate 300~450G / l, nickel chloride 10 to 20
g/リットル、硼酸30〜45g/リットルであり、ラウリル硫酸ナトリウム等の界面活性剤は実質的に加えない(界面活性作用が実質的に発揮されない程度の微量の界面活性剤を加える場合も包含する。)。 g / liter, a boric acid 30~45G / liter, surfactant such as sodium lauryl sulfate includes also substantially added not (surfactant effect adding a surfactant traces enough to not substantially exhibit .). 電鋳液のpH Electroforming solution pH of
値は3.5〜4.2の範囲に調整し、電鋳液の温度は3 The value is adjusted to the range of 3.5 to 4.2, electroforming liquid temperature 3
0〜50℃に保持する。 Held at 0~50 ℃. 電鋳時のカソード電流密度は0.5〜3.0A/dm 2である。 Cathode current density during electroforming is 0.5~3.0A / dm 2.

【0018】多孔質溶射バックアップ体7は、Ni(約95%)−Al(約5%)系合金で溶射形成されたものである。 The porous spray backup member 7, Ni (about 95%) - Al is obtained is sprayed formed (about 5%) alloy. 多孔質溶射バックアップ体7の溶射組織内には溶射粒子間の気孔が連続してなる多数の連続孔(図示略)が形成されており、通気性を有している。 Porous number of continuous pores which pores between the sprayed particles are sprayed in the organization of the thermal spray backup member 7 is continuously (not shown) is formed, and has air permeability. 前記Ni Said Ni
−Al系合金は、一般的な溶射条件下で、この連続孔が自然に形成されやすい溶射材料である。 -Al alloy is a common spraying conditions, the continuous pores are spray material which is easily formed spontaneously. 多孔質電鋳殻4 The porous conductive Ikara 4
の裏面からの多孔質溶射バックアップ体7の肉厚は0. The thickness of the porous thermal spraying backup body 7 from the rear surface of 0.
5〜2.0mmであるが、多孔質溶射バックアップ体7 It is a 5~2.0mm, porous thermal spraying backup body 7
は貫通孔9の内部にも侵入してこれを充填している。 It fills it penetrates to the interior of the through-holes 9. 従って、多孔質溶射バックアップ体7には、貫通孔9による多孔質電鋳殻4の強度低下を補う作用と、多孔質電鋳殻4の裏面を面当たり的に補強する作用がある。 Therefore, the porous thermal sprayed backup member 7, and the action to compensate for the reduction in strength of the porous conductive Ikara 4 by the through-hole 9, an effect of reinforcing a manner per facet and the rear surface of the porous conductive Ikara 4. また、 Also,
多孔質溶射バックアップ体7は、前記貫通孔9の内部への侵入によるアンカー効果により、多孔質電鋳殻4に対して機械的に強く結合している。 The porous spray backup member 7, the anchor effect of intrusion into the interior of the through hole 9, is mechanically strong bond to the porous conductive Ikara 4.

【0019】サブバックアップ体8は、通気性の無いブロック状の軟鋼から形成されたもので、放電加工によって多孔質溶射バックアップ体7の裏面に合わせられていおり、多孔質溶射バックアップ体7を介して多孔質電鋳殻4の裏面を強力に補強している。 The sub-backup member 8 has been formed from a block-shaped soft steel without ventilation, electrical discharge machining has been matched to the rear surface of the porous thermal sprayed backup member 7 by, through a porous spray backup member 7 the back surface of the porous conductive Ikara 4 are strongly reinforced.

【0020】以上のように構成された射出成形用金型1 The above injection mold constructed as 1
を使用して射出成形を行うと、合成樹脂10中のガス1 Doing injection molding using a gas in the synthetic resin 10 1
1は、多数の貫通孔9を通って多孔質溶射バックアップ体7中に抜けるため、ガス残存による成形欠陥を防ぐことができる。 1, to escape into the porous sprayed backup member 7 through a large number of through-holes 9, can be prevented molding defects due to gases remained. また、多孔質電鋳殻4は、前記の通り多孔質溶射バックアップ体7及びサブバックアップ体8によって効果的に補強されているので、射出成形時にかかる高い圧力にも歪まない。 The porous conductive Ikara 4, because it is effectively reinforced by the street porous spray backup member 7 and the sub-backup member 8 of the, not distorted even higher pressure applied during the injection molding. また、多孔質溶射バックアップ体7が貫通孔9の内部に侵入しているので、貫通孔9の中に合成樹脂10が入り込むことがない。 Further, since the porous thermal sprayed backup member 7 is penetrated into the through-hole 9, the synthetic resin 10 is prevented from entering into the through hole 9. また、成形時に加熱及び冷却が多数回繰り返されても、多孔質溶射バックアップ体7は多孔質電鋳殻4から剥離しない。 Also, be repeated heating and cooling many times during the molding, the porous thermal sprayed backup member 7 is not detached from the porous conductive Ikara 4.

【0021】次に、本発明を合成樹脂シートの真空成形金型に具体化した第二実施例について、図2を参照して説明する。 [0021] Next, a second embodiment embodying the present invention in a vacuum forming mold of a synthetic resin sheet, is described with reference to FIG. 本実施例の真空成形用金型21は、第一実施例と同じく多孔質電鋳殻4、多孔質溶射バックアップ体7及びサブバックアップ体8を備えているが、次の点において第一実施例と相違している。 Vacuum molding die 21 of this embodiment, the first embodiment and the same porous conductive Ikara 4 is provided with the porous thermal sprayed backup member 7 and the sub-backup member 8, the first embodiment in the following points It is different from the.

【0022】多孔質溶射バックアップ体7は、貫通孔9 [0022] The porous sprayed backup body 7, the through-hole 9
の内部にも侵入しているが、貫通孔9の内面に付着しているだけで充填はしていない。 Of but also penetrated inside, not filling just by adhering to the inner surface of the through-holes 9. 多孔質溶射バックアップ体7の裏面とサブバックアップ体8との間には減圧室2 Decompression chamber 2 is provided between the porous back surface and sub-backup member 8 of the spray backup member 7
2が形成され、サブバックアップ体8の一部から突出した支持部23が多孔質溶射バックアップ体7の要所を支持している。 2 is formed, the supporting portion 23 protruding from a portion of the sub-backup member 8 supports the key points of the porous thermal sprayed backup member 7. 真空成形時には射出成形時ほどの高い圧力はかからないため、このような構成でも強度的には十分である。 Since the time of vacuum forming does not take a high enough pressure during the injection molding is sufficient in strength at this structure. サブバックアップ体8には減圧室22に開口する吸引管24が取付けられ、該吸引管24には真空ポンプ等の減圧装置(図示略)が接続されるようになっている。 The sub-backup member 8 suction pipe 24 is attached to the opening to the vacuum chamber 22, pressure reducing device such as a vacuum pump to the suction pipe 24 (not shown) is adapted to be connected.

【0023】以上のように構成された真空成形用金型2 The above-configured vacuum forming mold 2
1を使用し、減圧室22を減圧して合成樹脂シート25 Using the 1, synthesized vacuum chamber 22 and vacuum resin sheet 25
の真空成形を行うと、合成樹脂シート25は多数の貫通孔9から真空吸引され、成形部5の成形面に強く吸着される。 Doing the vacuum forming, the synthetic resin sheet 25 is vacuum suction from a large number of through holes 9, is strongly adsorbed on the molding surface of the molding portion 5. そして、第一実施例と同様に、多孔質電鋳殻4は歪まないし、多孔質溶射バックアップ体7は多孔質電鋳殻4から剥離しない。 Then, as in the first embodiment, the porous conductive Ikara 4 do not distort, the porous thermal sprayed backup member 7 is not detached from the porous conductive Ikara 4.

【0024】次に、本発明をステアリングホイールのR [0024] Next, the present invention of the steering wheel R
IMウレタン成形用金型に具体化した第三実施例について、図3を参照して説明する。 About a third embodiment embodying the IM urethane mold will be described with reference to FIG. 本実施例のRIMウレタン成形用金型31は、第一実施例と同じく上型2と下型3とに分割形成され、各分割型2,3は多孔質電鋳殻4、多孔質溶射バックアップ体7及びサブバックアップ体8を備えているが、次の点において第一実施例と相違している。 RIM urethane molding die 31 of this embodiment is divided similarly formed on the upper mold 2 and lower mold 3 and the first embodiment, the split-type 2,3 porous conductive Ikara 4, porous spray backup is provided with the body 7 and the sub-backup member 8 is different from the first embodiment in the following points.

【0025】多孔質電鋳殻4は環状溝状の成形部5を備えている。 The porous conductive Ikara 4 has a molding portion 5 of the annular groove. 多孔質溶射バックアップ体7は、貫通孔9の内部にも侵入しているが、貫通孔9の内面に付着しているだけで充填はしていない。 The porous spray backup member 7, but also penetrate into the through-hole 9, not filling just by adhering to the inner surface of the through-holes 9. 多孔質電鋳殻4の裏面の要所に溶接されたナット32と、バックアップ体8の要所に凹設された係止部33との間には、多孔質電鋳殻4を押圧し又は引張るためのボルト34が螺着されている。 A nut 32 welded to the rear surface of the key points of the porous conductive Ikara 4 to press the porous conductive Ikara 4 between the locking portion 33 which is recessed in strategic points of the backup member 8 or bolt 34 for pulling is screwed.

【0026】以上のように構成されたRIMウレタン成形用金型31を使用し、ステアリングホイール35のR [0026] Using the RIM urethane molding die 31 configured as described above, the steering wheel 35 R
IMウレタン成形を行うと、ウレタン材料中のガスは多数の貫通孔9を通って多孔質溶射バックアップ体7中に抜けるため、ガス残存による成形欠陥を防ぐことができる。 Doing IM urethane molding, gas in the urethane material to escape into the porous sprayed backup member 7 through a large number of through-holes 9, can be prevented molding defects due to gases remained. そして、第一実施例と同様に、多孔質電鋳殻4は歪まないし、多孔質溶射バックアップ体7は多孔質電鋳殻4から剥離しない。 Then, as in the first embodiment, the porous conductive Ikara 4 do not distort, the porous thermal sprayed backup member 7 is not detached from the porous conductive Ikara 4.

【0027】次に、本発明をステアリングホイールのR [0027] Next, the present invention of the steering wheel R
IMウレタン成形用金型に具体化した第四実施例について、図4を参照して説明する。 For the fourth embodiment embodying the IM urethane mold will be described with reference to FIG. 本実施例のRIMウレタン成形用金型41はバックアップ体の構成において第三実施例と相違している。 RIM urethane molding die 41 of this embodiment differs from the third embodiment in the configuration of the backup member.

【0028】本実施例では、多孔質溶射バックアップ体7が第三実施例より厚く形成されている。 [0028] In this embodiment, the porous thermal sprayed backup member 7 is formed thicker than the third embodiment. 多孔質溶射バックアップ体7とサブバックアップ体8との間にはエポキシ樹脂製の中間バックアップ体42が注入形成され、 Between the porous thermal sprayed backup member 7 and the sub-backup body 8 intermediate backup member 42 made of epoxy resin is injected form,
その内部に冷却管43が埋設されている。 Cooling pipe 43 is embedded therein. また、サブバックアップ体8及び中間バックアップ体42には多孔質溶射バックアップ体7に開口する離型剤の供給管44が取付けられ、該供給管44には離型剤供給装置(図示略)が接続されるようになっている。 The supply pipe 44 of the releasing agent which is open to the porous spray backup member 7 is attached to the sub-backup member 8 and the intermediate backup member 42, a release agent supply device to the supply pipe 44 (not shown) is connected It is adapted to be.

【0029】以上のように構成されたRIMウレタン成形用金型41を使用し、ステアリングホイール35のR [0029] Using the RIM urethane mold 41 configured as described above, the steering wheel 35 R
IMウレタン成形を行うとき、供給管44から多孔質溶射バックアップ体7に離型剤を加圧供給すれば、この離型剤を貫通孔9を通して多孔質電鋳殻4の成形面に滲出させることができ、成形されたステアリングホイール3 When performing an IM urethane molding, if the pressure supplied to the release agent to the porous spray backup member 7 from the supply pipe 44, thereby exuding the molding surface of the porous conductive Ikara 4 the release agent through the through-hole 9 can be, steering wheel 3 which is molded
5を容易に離型できる。 5 can be easily release.

【0030】次に、本発明を高密度ポリエチレン樹脂のラム押出成形用金型に具体化した第五実施例について、 Next, the present invention in ram extrusion molding die of a high density polyethylene resin for the fifth embodiment embodying,
図5及び図6を参照して説明する。 Referring to FIG. 5 and FIG. 6 will be described. 本実施例のラム押出成形用金型51は、円筒状の多孔質電鋳殻4と、該多孔質電鋳殻4の裏面を囲むように設けられた多孔質溶射バックアップ体7と、該多孔質溶射バックアップ体7の裏面を囲むように設けられたサブバックアップ体8とを備えている。 Ram extrusion molding die 51 of this embodiment includes a cylindrical porous conductive Ikara 4, a porous spray backup member 7 provided so as to surround the back surface of the porous conductive Ikara 4, porous and a sub-backup member 8 provided so as to surround the back surface quality spray backup member 7. これら各部4,7,8の両端面には多孔質電鋳殻4の内周面と連続する内周面を備えた穴明き円板状の端板52がOリング53を介して当てられ、ボルト5 They both end surfaces of each section 4, 7, 8 devoted porous conductive Ikara end plate 52 of the inner peripheral surface hole having an inner peripheral surface continuous with the perforated disc-shaped 4 through the O-ring 53 , bolt 5
4によりサブバックアップ体8に螺着されている。 It is screwed to the sub-backup member 8 by 4. サブバックアップ体8には多孔質溶射バックアップ体7に開口する離型剤の供給管55が取付けられ、該供給管55 Supply tube 55 of the releasing agent which is open to the porous spray backup member 7 is attached to the sub-backup member 8, the feed pipe 55
には離型剤供給装置(図示略)が接続されるようになっている。 So that the release agent supply device (not shown) is connected to.

【0031】多孔質電鋳殻4の寸法例を挙げると、内径は20mm、外径は約32mm、肉厚は約6mm、長さは約600mmである。 The porous conductive dimensions Ikara 4 example, an inner diameter of 20 mm, an outer diameter of about 32 mm, a wall thickness of about 6 mm, a length of about 600 mm. 多孔質電鋳殻4の内周面は滑面である。 The inner peripheral surface of the porous conductive Ikara 4 is a smooth surface. 多孔質溶射バックアップ体7はTi−Zn系合金により溶射形成されたものである。 The porous spray backup member 7 are those which are thermally sprayed formed by Ti-Zn alloy. サブバックアップ体8は、Zn−Al−Cu−Mg系合金により注型形成されたものである。 Sub backup member 8 are those which are cast formed by Zn-Al-Cu-Mg-based alloy.

【0032】以上のように構成されたラム押出成形用金型51を使用し、供給管55から多孔質溶射バックアップ体7に加圧供給した離型剤を、貫通孔9を通して多孔質電鋳殻4の内周面に少量ずつ滲出させながら、高密度ポリエチレン樹脂のラム押出成形を行えば、多孔質電鋳殻4とその内部を移動する高密度ポリエチレン樹脂との間の滑り抵抗が小さくなり、高速でラム押出成形を行うことができる。 [0032] Using the ram extrusion molding die 51 configured as described above, the pressure supplied to the release agent to the porous spray backup member 7 from the supply pipe 55, the porous electroconductive Ikara through the through-hole 9 while exudative portionwise to the inner peripheral surface of the 4, by performing ram extrusion of high density polyethylene resin, sliding resistance between the high-density polyethylene resin that moves a porous conductive Ikara 4 its internal decreases, it can be carried out ram extrusion at high speed.

【0033】なお、本発明は前記実施例の構成に限定されるものではなく、発明の趣旨から逸脱しない範囲で適宜変更して具体化することもできる。 [0033] The present invention is not limited to the structure of the embodiment can also be embodied by changing appropriately without departing from the scope of the invention.

【0034】 [0034]

【発明の効果】以上詳述した通り、本発明の多孔質電鋳金型によれば、貫通孔の内径が裏面側で大きいにも拘らず、成形時にかかる高い圧力に耐え得る高い強度が得られ、射出成形に使用しても貫通孔に合成樹脂が詰ることがなく、成形時に加熱及び冷却が多数回繰り返されても多孔質電鋳殻からバックアップ体が剥離せず、しかも短時間で容易に製造でき、納期の短縮及びコストの低減を図ることができる、という優れた効果を奏する。 As detailed above, according to the present invention, according to a porous electroforming die of the present invention, although the inner diameter of the through hole is larger on the back side, a high strength can be obtained which can withstand high pressure applied during molding , without also synthetic resin in the through hole is clogged by using the injection molding, even without the backup member from the porous conductive Ikara peeling repeated heating and cooling many times during molding, and easily in a short time can be produced, can be shortened and cost reduction of the delivery time, exhibits the excellent effect that.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】本発明の第一実施例に係る射出成形用金型の断面図である。 1 is a cross-sectional view of an injection mold according to the first embodiment of the present invention.

【図2】本発明の第二実施例に係る真空成形用金型の断面図である。 2 is a cross-sectional view of a vacuum forming die according to the second embodiment of the present invention.

【図3】本発明の第三実施例に係るRIMウレタン成形用金型の断面図である。 3 is a cross-sectional view of a RIM urethane molding die according to a third embodiment of the present invention.

【図4】本発明の第四実施例によるRIMウレタン成形用金型の断面図である。 Is a cross-sectional view of a RIM urethane molding die according to the fourth embodiment of the present invention; FIG.

【図5】本発明の第五実施例によるラム押出成形用金型の断面図である。 5 is a cross-sectional view of the extrusion molding die ram according to the fifth embodiment of the present invention.

【図6】図5のVI−VI線断面図である。 6 is a sectional view taken along line VI-VI of Figure 5.

【符号の説明】 DESCRIPTION OF SYMBOLS

1 射出成形用金型 4 多孔質電鋳殻 7 多孔質溶射バックアップ体 9 貫通孔 21 真空成形用金型 31 RIMウレタン成形用金型 41 RIMウレタン成形用金型 51 ラム押出成形用金型 1 injection mold 4 porous conductive Ikara 7 porous spray backup member 9 through hole 21 vacuum forming mold 31 RIM urethane mold 41 RIM urethane mold 51 ram extrusion molding die

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl. 6識別記号 庁内整理番号 FI 技術表示箇所 C25D 1/00 361 1/08 ────────────────────────────────────────────────── ─── front page continued (51) Int.Cl. 6 in identification symbol Agency Docket No. FI art display portion C25D 1/00 361 1/08

Claims (1)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 内径が表面側で小さく且つ裏面側で大きい多数の貫通孔を有する多孔質電鋳殻と、前記貫通孔の内部にも侵入するように前記多孔質電鋳殻の裏面に溶射形成された通気性又は通液性のある多孔質溶射バックアップ体とを備えた多孔質電鋳金型。 1. A porous conductive Ikara whose inner diameter has a large number of through-holes larger in small and the back side surface side, on the back surface of the porous conductive Ikara to also penetrate into the interior of the through hole spraying porous electroforming die having a porous spray backup body is formed breathable or liquid permeability.
JP23412094A 1994-09-02 1994-09-02 Porous electroforming mold Pending JPH0872062A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23412094A JPH0872062A (en) 1994-09-02 1994-09-02 Porous electroforming mold

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23412094A JPH0872062A (en) 1994-09-02 1994-09-02 Porous electroforming mold

Publications (1)

Publication Number Publication Date
JPH0872062A true true JPH0872062A (en) 1996-03-19

Family

ID=16965952

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23412094A Pending JPH0872062A (en) 1994-09-02 1994-09-02 Porous electroforming mold

Country Status (1)

Country Link
JP (1) JPH0872062A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002043942A1 (en) * 2000-11-30 2002-06-06 Ceram Research Limited Injection mould having a porous surface and method of using it
GB2376204A (en) * 2001-06-05 2002-12-11 Inoac Packaging Group Inc Injection blow moulded articles
WO2006011878A1 (en) * 2004-06-28 2006-02-02 Ex One Corporation Gas permeable molds

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002043942A1 (en) * 2000-11-30 2002-06-06 Ceram Research Limited Injection mould having a porous surface and method of using it
GB2376204A (en) * 2001-06-05 2002-12-11 Inoac Packaging Group Inc Injection blow moulded articles
WO2006011878A1 (en) * 2004-06-28 2006-02-02 Ex One Corporation Gas permeable molds
JP2008504159A (en) * 2004-06-28 2008-02-14 ザ エクス ワン カンパニー Gas permeable mold

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