JPH0870032A - Semiconductor substrate transport device - Google Patents

Abstract

PURPOSE: To compensate the deviation of the edge of a plurality of semiconductor substrates easily without adding the operation shaft of a semiconductor substrate transfer machine by housing a plurality of semiconductor substrates in a treatment boat while retaining an inclination angle by withdrawing the substrates from a carrier cassette while inclining the substrates. CONSTITUTION: A mount stand 5 is provided with a compensation member 2 for compensating the alignment direction of the edge of the inclination direction of a semiconductor substrate 4 housed in a carrier cassette 3 in vertical direction for a horizontal surface. The compensation member 2 is inserted from a side opposing the opening of the carrier cassette 3 and a plurality of inclined semiconductor substrates 4 are pushed out of the edge from the inclination direction, thus compensating the alignment direction vertically for the horizontal surface while inclining the semiconductor substrates 4. While retaining the state, the carrier cassette 3 is carried to a relay stage 7, thus simultaneously supporting the edges of a plurality of semiconductor substrates 4 at the substrate support part of a semiconductor substrate treatment boat 12.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the field of semiconductor device manufacturing, and is particularly effective when applied to a method of charging a semiconductor substrate into a vertical heat treatment apparatus.

[0002]

2. Description of the Related Art A vertical heat treatment apparatus for a semiconductor substrate, particularly a vertical diffusion furnace for a diffusion apparatus, includes, for example, "VLSI manufacturing
Test Equipment Guidebook 1988 Edition Electronic Materials Separate Volume "
(Published by the Industrial Research Board), page 54, right column, lines 29 to 45. That is, "A vertical diffusion furnace has appeared for several years as one of the methods of increasing the diameter and improving the furnace characteristics. The advantage of the vertical type is that the tube and the boat are not in contact with each other.
Since the gas hitting the wafer is uniform, the uniformity within the wafer surface is good, and the air entrainment from the furnace opening is small. On the other hand, the disadvantages are that the soaking length is short due to the height restriction, the throughput is reduced with respect to the floor area because a multi-stage stack cannot be used like the horizontal type, and there are few actual results. Is stated.

FIG. 7 shows a cassette carrier. The semiconductor substrate 18 is filled in the carrier cassette 17 and placed on the cassette carrier 14. Next, as shown in FIG. 8, the semiconductor substrate is transported to the relay stage 19 by the cassette carrier 14 so as to be horizontal, and the semiconductor substrate transfer machine 21 attracts the plurality of semiconductor substrates 18 from the carrier cassette 17 to the suction means 23. The semiconductor substrate transfer machine 21
By rotating the rotary table 24, the wafer is horizontally transported and set on the semiconductor substrate processing boat 25 of the vertical diffusion furnace shown in FIG. The semiconductor substrate processing boat 25 in which the semiconductor substrate 18 is set is inserted into the heat treatment furnace, gas is supplied into the treatment chamber, and the semiconductor substrate 18 is heat-treated.

In this technique, since the semiconductor substrate is set horizontally on the processing boat, the atmosphere between the semiconductor substrates cannot be sufficiently replaced, which adversely affects the electrical characteristics of the semiconductor device.

Regarding this problem and the solution, Japanese Patent Laid-Open No. 61-61
No. 27625/1989, for example, in the left upper column, lines 14 to 20 of page 2 of the publication, "for example,
Conventionally, a large number of semiconductor wafers are horizontally stacked and arranged in a processing tube, and a processing gas is caused to flow from the bottom to the top of the processing tube or from the top to the bottom. However, in such a configuration, it is difficult for the processing gas flow to come into contact with the semiconductor wafers stacked in the middle part of the wafer boat, so that the diffusion process is uneven in the upper part or the lower part and the middle part. In addition, there is a problem that "the surface to be processed of the semiconductor article is at a predetermined angle with respect to a surface perpendicular to the longitudinal axis of the processing tube," And the heat treatment is performed while inclining and in this state rotating the semiconductor article substantially along the vertical plane. "

[0006]

However, in the conventional semiconductor substrate transfer system of the vertical heat treatment apparatus, there is a problem in inclining and transferring the semiconductor substrate, that is, the cassette carrier, the relay stage, the semiconductor. When the substrate transfer machine and the semiconductor substrate processing boat are tilted, the edge of the semiconductor substrate is displaced between the uppermost semiconductor substrate and the lowermost semiconductor substrate in the cassette. That is, the edges of a plurality of semiconductor substrates are not simultaneously supported in a part. In order to solve this by mechanically changing the semiconductor substrate transfer machine, it is necessary to add one operating axis to the semiconductor substrate transfer machine. The addition of the operation axis not only makes the system expensive, but also increases the equipment size and the failure rate.

Therefore, an object of the present invention is to easily correct the deviation of the edges of a plurality of semiconductor substrates without adding an operation axis of the semiconductor substrate transfer machine and tilt the semiconductor substrates to the semiconductor substrate processing boat. It is to provide a technology that can be stored in a state.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0009]

The outline of the typical inventions among the inventions disclosed in the present application will be briefly described as follows. That is, a semiconductor substrate transfer device for accommodating a plurality of semiconductor substrates to be heat-treated contained in a carrier cassette in a tilted state in a processing boat of a vertical heat treatment device, the carrier containing the plurality of semiconductor substrates. The cassette is mounted so as to be tilted with respect to a horizontal plane, and a correction member is provided for correcting the edges of the plurality of tilted semiconductor substrates in the carrier cassette in a direction perpendicular to the horizontal plane. And a semiconductor substrate transfer means for taking out a plurality of tilted semiconductor substrates from the carrier cassette in a tilted state and accommodating the tilted angle in the processing boat.

[0010]

In the carrier transfer means, the deviation of the edges of the plurality of semiconductor substrates when the carrier cassette is tilted is corrected by the correction member and arranged in the direction perpendicular to the horizontal plane, and then the tilted state is maintained to process the boat. Since the semiconductor substrates are accommodated in the semiconductor substrate transfer boat, it is possible to easily correct the deviation of the edges of the plurality of semiconductor substrates without adding the operation axis of the semiconductor substrate transfer machine, and to incline the semiconductor substrates while the substrates of the semiconductor substrate processing boat are being tilted. The edges of a plurality of semiconductor substrates can be simultaneously supported by the supporting portion.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is a diagram showing a cassette carrier of a semiconductor substrate carrier of the present invention. The cassette carrier 1
The transport mechanism 6 mainly transports the semiconductor substrate 4 together with the carrier cassette 3, and the mounting table 5 on which the carrier cassette 3 is mounted. The mounting table 5 is inclined on the transport mechanism 6 by an angle θ with respect to the horizontal plane. This angle θ is determined by the semiconductor substrate 4
Is set to the same angle as the tilt angle in the heat treatment apparatus. In the present invention, the mounting table 5 is provided with the correction member 2 that corrects the arrangement direction of the edges of the semiconductor substrate 4 housed in the carrier cassette 3 in the direction perpendicular to the horizontal plane. The correction member 2 is inserted from the side facing the opening of the carrier cassette 3, and the edges of the plurality of inclined semiconductor substrates 4 are pushed out from the inclination direction, so that the arrangement direction of the semiconductor substrates 4 can be changed while the semiconductor substrates 4 are inclined. Correct perpendicular to the horizontal plane. While maintaining that state, the carrier cassette 3 is transported to the relay stage 7.

At the relay stage 7, as shown in FIG.
A plurality of semiconductor substrates 4 are unloaded from the carrier cassette 3 while the tilt angle is maintained by the semiconductor substrate transfer mechanism 8. The carry-out is performed by the suction means 1 provided in the transfer machine 9.
It is performed by adsorbing the semiconductor substrate 4 by using 0. Semiconductor substrate transfer machine 8 that adsorbs a plurality of semiconductor substrates 4
Rotates while maintaining the inclination angle, as shown in FIG.
It faces the semiconductor substrate processing boat 12 of the semiconductor substrate heat treatment apparatus. After that, the transfer machine 9 moves on the rotary table 11, and the plurality of semiconductor substrates 4 are simultaneously inserted into the semiconductor substrate processing boat 12. The edge of the plurality of semiconductor substrates 4 in the tilt direction is
Since the arrangement direction has already been corrected so as to be perpendicular to the horizontal plane, a mechanical correction mechanism for adding an operation axis by tilting the semiconductor substrate transfer machine 8 and fixing the angle. It is possible to transfer the semiconductor substrate 4 without providing the semiconductor substrate transfer machine 8 with. As a result, the edges of the plurality of semiconductor substrates 4 are simultaneously removed from the semiconductor substrate processing boat 12
It can be supported by the substrate supporting part.

The semiconductor substrate processing boat 12 containing the semiconductor substrates is inserted into the heat treatment furnace, gas is supplied into the treatment chamber, and the semiconductor substrates 18 are heat-treated.

The operation and effect of the present invention will be described below.

(1) In the carrier transfer means, the deviation of the edges of the plurality of semiconductor substrates when the carrier cassette is tilted is corrected by the correction member so that the carrier cassettes are arranged in the direction perpendicular to the horizontal plane, and then the tilted state is maintained. Since the semiconductor substrate is accommodated in the processing boat, the deviation of the edges of the plurality of semiconductor substrates can be easily corrected without adding an operation axis of the semiconductor substrate transfer means, and the semiconductor substrate can be tilted. The edge of a plurality of semiconductor substrates can be simultaneously supported by the substrate support portion of the processing boat.

(2) The carrier cassette is mounted on a mounting table which is inclined with respect to the horizontal plane, and a plurality of semiconductor substrates accommodated in the carrier cassette are pushed onto the mounting table from the inclination direction of the carrier cassette. Since the correction member that is arranged vertically to the horizontal direction is provided, it is possible to correct the arrangement direction of the semiconductor substrates simply by mounting the carrier cassette.

(3) The semiconductor substrate transfer means is composed of a rotary table and a transfer machine movable on the rotary table.
It is fixed at the same inclination angle as the inclination angle of the semiconductor substrate housed in the semiconductor substrate processing boat in an inclined state, and the operation axis of the semiconductor substrate transfer means is added by rotating while holding the inclination angle. Without doing so, the semiconductor substrate can be easily accommodated in the semiconductor substrate processing boat while being inclined.

Although the present invention has been concretely described based on the embodiments by the present inventor, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. Needless to say. For example, by using the cassette carrier 1 shown in FIG. 1, the carrier cassettes 3 corrected so that the plurality of semiconductor substrates 4 are inclined and arranged in the direction perpendicular to the horizontal plane are shown in FIG.
As shown in FIG. 5, the semiconductor substrate is transferred to the relay stage 19 that does not have a conventional inclination angle, and the semiconductor substrate transfer machine 20 that does not have a conventional inclination transfers the plurality of semiconductor substrates 4 from the carrier cassette 3 in the horizontal direction. To do. At this time, since the arrangement direction of the plurality of semiconductor substrates 4 is maintained in the corrected state, the edge portion is displaced in the horizontal state. Next in FIG.
As shown in FIG. 3, the turntable of the semiconductor substrate transfer machine 20 is rotated so that the semiconductor substrate 4 faces the semiconductor substrate processing boat 12. At this time, the semiconductor substrate processing boat 12 is tilted at an angle θ so that the semiconductor substrate 4 can be inserted horizontally.
By doing so, the edge portion of the semiconductor substrate 4 is supported by the supporting groove or the supporting projection (not shown) of the substrate supporting portion 13 of the semiconductor substrate processing boat 12, and the inclination of the semiconductor substrate processing boat 12 is prevented. When restored, the edge portions of the plurality of semiconductor substrates 4 are charged without shifting in the state as shown in FIG.

According to this method, the semiconductor substrate can be tilted and charged into the semiconductor substrate processing boat without changing the mechanism of the semiconductor substrate transfer machine.

[0020]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.

That is, in the carrier transporting means, the deviation of the edges of the plurality of semiconductor substrates when the carrier cassette is tilted is corrected by the correction member and arranged in the direction perpendicular to the horizontal plane, and then the tilted state is maintained. Since the semiconductor substrate is accommodated in the processing boat, it is possible to easily correct the deviation of the edges of the plurality of semiconductor substrates without adding the operation axis of the semiconductor substrate transfer means, and to process the semiconductor substrate in a state where the semiconductor substrates are tilted. The substrate supporting portion of the boat can simultaneously support the edges of the plurality of semiconductor substrates. Therefore, it is possible to inexpensively provide the semiconductor substrate transfer apparatus which does not increase the equipment size and avoids the cause of failure.

[0022]

[Brief description of drawings]

FIG. 1 is a diagram showing a cassette carrier of a semiconductor substrate carrier of the present invention.

FIG. 2 is a diagram showing a method of taking out a semiconductor substrate from a carrier cassette transported to an inclined relay stage of the semiconductor substrate transport device of the present invention.

FIG. 3 is a diagram showing a method of inserting a semiconductor substrate into the semiconductor substrate processing boat from the semiconductor substrate transfer mechanism of the semiconductor substrate transfer apparatus of the present invention.

FIG. 4 is a diagram showing a state in which a semiconductor substrate is tilted and accommodated in a semiconductor substrate processing boat of a vertical heat treatment apparatus.

FIG. 5 is a diagram showing a semiconductor substrate transfer method of a semiconductor substrate transfer apparatus according to another embodiment of the present invention.

FIG. 6 is a diagram showing a semiconductor substrate transfer method of a semiconductor substrate transfer apparatus according to another embodiment of the present invention.

FIG. 7 is a diagram showing a conventional cassette carrier.

FIG. 8 is a diagram showing a method of taking out a semiconductor substrate from a carrier cassette transported to a relay stage of a conventional semiconductor substrate transport apparatus.

FIG. 9 is a diagram showing a method of inserting a semiconductor substrate into a semiconductor substrate processing boat from a semiconductor substrate transfer mechanism of a conventional semiconductor substrate transfer device.

[Explanation of symbols]

1 ... Cassette carrier, 2 ... Correction member, 3 ... Carrier cassette, 4 ... Semiconductor substrate, 5 ... Mounting table, 6 ...
Transport mechanism, 7 ... Relay stage, 8 ... Semiconductor substrate transfer mechanism, 9 ... Transfer device, 10 ... Adsorption means, 11 ... Rotation table, 12 ... Semiconductor substrate processing boat, 13 ... Substrate support Part, 14 ... cassette carrier, 15 ... carrier mechanism, 16
…… Mounting table, 17 …… Carrier cassette, 18 …… Semiconductor substrate, 19 …… Relay stage, 20 …… Semiconductor substrate transfer mechanism, 21 …… Transfer machine, 22 …… Suction means, 23 ……
Rotating table, 24 ... Semiconductor substrate processing boat, 25 ... Substrate support,

Claims (4)

[Claims] 1. A semiconductor substrate transfer apparatus for accommodating a plurality of semiconductor substrates to be heat-treated contained in a carrier cassette in a tilted state in a semiconductor substrate processing boat of a vertical heat treatment apparatus, wherein the plurality of semiconductor substrates are provided. The carrier cassette in which is stored is tilted with respect to the horizontal plane, and the edges in the tilt direction of the plurality of semiconductor substrates tilted in the carrier cassette are corrected so as to be arranged in a direction perpendicular to the horizontal plane. And a semiconductor substrate transfer means for taking out a plurality of tilted semiconductor substrates from the carrier cassette in a tilted state and accommodating them in the semiconductor substrate processing boat while maintaining a tilt angle. And a semiconductor substrate transfer apparatus. 2. The carrier cassette is mounted on a mounting table which is inclined with respect to a horizontal plane, and a plurality of semiconductor substrates housed in the carrier cassette are mounted on the mounting table in a tilt direction of the carrier cassette. 2. The semiconductor substrate transfer apparatus according to claim 1, further comprising a correction member that is arranged to be vertically arranged with respect to the horizontal direction by being pushed out. 3. The semiconductor substrate transfer means is composed of a rotary table and a transfer machine movable on the rotary table, and the rotary table is accommodated in the semiconductor substrate processing boat in a tilted state. The semiconductor substrate transfer apparatus according to claim 1 or 2, wherein the substrate is fixed at an inclination angle equal to the inclination angle of the substrate and is rotated while maintaining the inclination angle. 4. A semiconductor substrate transfer apparatus for accommodating a plurality of semiconductor substrates to be heat-treated contained in a carrier cassette in a tilted state in a semiconductor substrate processing boat of a vertical heat treatment apparatus, wherein the plurality of semiconductor substrates are accommodated. The carrier cassette in which is stored is tilted with respect to the horizontal plane, and the edges in the tilt direction of the plurality of semiconductor substrates tilted in the carrier cassette are corrected so as to be arranged in a direction perpendicular to the horizontal plane. Carrier transporting means having a correcting member for carrying out the semiconductor substrate transfer means for carrying out the plurality of semiconductor substrates whose alignment has been corrected from the carrier cassette in a horizontal state and storing the semiconductor substrate in the semiconductor substrate processing boat, In the semiconductor substrate processing boat, the plurality of semiconductor substrates are inserted horizontally, and the semiconductor substrate processing boat is mounted on the substrate supporting portion provided in the semiconductor substrate processing boat. The semiconductor substrate transfer device, wherein the edge portion of the semiconductor substrate can be inclined so as to be supported simultaneously.