JPH0855752A - Method for mounting layered capacitor and layered capacitor - Google Patents

Method for mounting layered capacitor and layered capacitor

Info

Publication number
JPH0855752A
JPH0855752A JP18818494A JP18818494A JPH0855752A JP H0855752 A JPH0855752 A JP H0855752A JP 18818494 A JP18818494 A JP 18818494A JP 18818494 A JP18818494 A JP 18818494A JP H0855752 A JPH0855752 A JP H0855752A
Authority
JP
Japan
Prior art keywords
chip
multilayer capacitor
substrate
mounting
vibration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18818494A
Other languages
Japanese (ja)
Inventor
Osamu Fujii
Shinichi Ishida
Masakazu Koga
Sadaaki Kurata
Shunji Murai
Minoru Takahashi
定明 倉田
昌和 古賀
俊二 村井
晋一 石田
理 藤井
実 高橋
Original Assignee
Taiyo Yuden Co Ltd
太陽誘電株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Yuden Co Ltd, 太陽誘電株式会社 filed Critical Taiyo Yuden Co Ltd
Priority to JP18818494A priority Critical patent/JPH0855752A/en
Publication of JPH0855752A publication Critical patent/JPH0855752A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components

Abstract

(57) [Abstract] [Purpose] To provide a mounting method of a multilayer capacitor capable of reducing the squeal volume when a voltage is applied. [Structure] A multilayer capacitor 1 in which a plurality of internal electrodes 3 are arranged in opposition to each other in a chip 2 is mounted so that the surface of the internal electrodes 3 is not parallel to the surface of a substrate Z. Even if a vibration is generated in the opposite direction of the internal electrode 3, the vibration is not directly transmitted to the substrate Z, and it is possible to suppress the vibration transmission to the substrate Z and reduce the squeal volume.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of mounting a multilayer capacitor in which a plurality of internal electrodes are arranged to face each other in a chip, and a multilayer capacitor.

[0002]

2. Description of the Related Art FIG. 3 is a perspective view of a conventional multilayer capacitor of this type, and FIG. 4 is a sectional view thereof.

The multilayer capacitor 1 shown in FIG. 1 has a rectangular parallelepiped chip 2 made of a ceramic dielectric and a chip 2
It is composed of a plurality of internal electrodes 3 embedded inside and a pair of external electrodes 4 provided at both ends of the chip 2, and has a predetermined width w, thickness t and length l.

The internal electrodes 3 each have the same rectangular shape,
They are arranged so as to face each other in parallel in the thickness direction, one side thereof is alternately exposed to the chip end surface on the opposite side, and the exposed end is joined to the terminal electrode 4. Each external electrode 4 is formed so as to extend from the end face in the chip longitudinal direction to the four side faces at the peripheral edge of the end face.

[0005]

In the conventional multilayer capacitor 1 described above, generally, as shown in FIGS. 3 and 4, one surface in the thickness direction is parallel to the substrate surface, in other words, the internal electrode 3 is formed. It is mounted so that its surface is parallel to the upper surface of the substrate Z.

However, in the above-mentioned mounting state, the voltage between the external electrodes 4, especially the audible frequency band (about 20 Hz)
When an AC voltage of up to 20 kHz) or a DC voltage on which an AC component in the audible frequency band is superimposed is applied, the chip 2 made of a ceramic dielectric expands in the thickness direction due to the piezoelectric phenomenon.
There is a problem that vibration is caused by repeated return, and this is directly transmitted to the substrate Z to cause abnormal noise, so-called squeal. Even if a slight vibration occurs in the capacitor itself, when it is transmitted to the substrate Z, it is amplified by the increase of the vibration area and reaches an audible level.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a method of mounting a multilayer capacitor and a multilayer capacitor which can reduce the squeal volume when a voltage is applied.

[0008]

In order to achieve the above object, the invention of claim 1 provides a multilayer capacitor in which a plurality of internal electrodes are arranged to face each other in a chip, and the surfaces of the internal electrodes are oriented non-parallel to the substrate surface. The feature is that it is implemented as follows.

According to a second aspect of the present invention, a multilayer capacitor having a plurality of internal electrodes facing each other in a chip is housed in a recess of a component housing tape, and the multilayer capacitor is taken out from the tape and mounted on a substrate. In the mounting method,
It is characterized in that the multilayer capacitor is housed in the concave portion of the component housing tape in such a manner that the surface of the internal electrode is vertical.

According to a third aspect of the present invention, in a multilayer capacitor in which a plurality of internal electrodes are arranged facing each other in a chip and external electrodes are provided at both ends of the chip, the facing direction of the internal electrodes is made to coincide with the direction connecting the external electrodes. It is characterized by that.

According to a fourth aspect of the present invention, in a multilayer capacitor in which a plurality of internal electrodes are arranged facing each other in a chip and external electrodes are provided at both ends of the chip, a mounting surface that is not parallel to the internal electrode surface is used as the external electrode. It is characterized by being formed.

According to a fifth aspect of the present invention, in a multilayer capacitor in which a plurality of internal electrodes are arranged to face each other in a chip and external electrodes are provided at both ends of the chip, an exterior is attached around the chip and intersects the surface of the internal electrodes. It is characterized in that it is formed in the non-parallel outer casing.

According to a sixth aspect of the present invention, in a multilayer capacitor in which a plurality of internal electrodes are arranged to face each other in a chip and external electrodes are provided at both ends of the chip, a case having a mounting surface that is not parallel to the surface of the internal electrode is provided. The feature is that it is provided.

The invention according to claim 7 is the multilayer capacitor according to claim 5 or 6, characterized in that a vibration absorbing material is used for the exterior or the case.

[0015]

According to the first aspect of the present invention, since a multilayer capacitor having a plurality of internal electrodes arranged to face each other in a chip is mounted so that the surfaces of the internal electrodes are not parallel to the substrate surface, a voltage is applied. At this time, even if vibration is generated in the opposite direction of the internal electrodes,
The vibration is not directly transmitted to the substrate.

According to the second aspect of the present invention, since the multilayer capacitor is housed in the concave portion of the component housing tape in such a direction that the surface of the internal electrode is vertical, the surface of the internal electrode must be mounted on the board surface at the time of mounting. It becomes vertical, and the direction of the multilayer capacitor with respect to the substrate surface as described above can be regulated at the stage of taking out the multilayer capacitor from the component storage tape.

According to the third aspect of the present invention, since the facing direction of the internal electrodes is made to coincide with the direction connecting the external electrodes, the surface of the internal electrodes is always perpendicular to the substrate surface during mounting. Therefore, even if a vibration is generated in the opposite direction of the internal electrode when a voltage is applied, the vibration is not directly transmitted to the substrate.

According to the fourth aspect of the present invention, since the mounting surface that is not parallel to the surface of the internal electrode is formed on the external electrode, the surface of the internal electrode is always inclined with respect to the substrate surface during mounting. Therefore, even if a vibration is generated in the opposite direction of the internal electrode when a voltage is applied, the vibration is not directly transmitted to the substrate.

According to the fifth aspect of the present invention, since the exterior is provided around the chip and the mounting surface that is not parallel to the surface of the internal electrode is formed on the exterior, the surface of the internal electrode is on the substrate surface during mounting. On the other hand, it is always diagonal. Therefore, even if a vibration is generated in the opposite direction of the internal electrode when a voltage is applied, the vibration is not directly transmitted to the substrate.

According to the sixth aspect of the present invention, since the case having the mounting surface that is not parallel to the surface of the internal electrode is provided, the surface of the internal electrode is always inclined with respect to the substrate surface during mounting. Therefore, even if a vibration is generated in the opposite direction of the internal electrode when a voltage is applied, the vibration is not directly transmitted to the substrate.

According to the invention of claim 7, since the vibration absorbing material is used for the exterior or the case, the vibration can be damped by the exterior or the case itself. Other functions are similar to those of the invention of claim 5 or 6.

[0022]

FIG. 1 shows a first embodiment of the present invention.

The multilayer capacitor 1 shown in the figure has the same structure as the conventional one shown in FIGS. 3 and 4, that is, a rectangular parallelepiped chip 2 made of a ceramic dielectric material and embedded in the chip 2. And a pair of external electrodes 4 provided at both ends of the chip 2.

The internal electrodes 3 each have the same rectangular shape,
They are arranged so as to face each other in parallel in the thickness direction, one side thereof is alternately exposed to the chip end surface on the opposite side, and the exposed end is joined to the terminal electrode 4. Each external electrode 4 is formed so as to extend from the end face in the chip longitudinal direction to the four side faces at the peripheral edge of the end face.

In this embodiment, the multilayer capacitor 1 is mounted such that the surface of the internal electrode 3 is oriented vertically to the upper surface of the substrate Z, and the upper surface of the substrate Z is arranged so that the multilayer capacitor 1 is inverted in its width direction. And one side of each external electrode 4 that contacts the conductor pattern (not shown) on the substrate Z is soldered.

That is, since the surface of the internal electrode 4 is perpendicular to the substrate surface in the above-mentioned mounted state, an AC voltage in the audio frequency band or a DC voltage in which an AC component in the audio frequency band is superimposed is placed between the external electrodes 4. Even if the chip 2 made of a ceramic dielectric material vibrates by repeatedly expanding and returning in the thickness direction due to a piezoelectric phenomenon when applied, the vibration is not directly transmitted to the substrate Z, and the vibration is transmitted to the substrate Z. Can be suppressed to reduce the squeal volume.

By the way, the width t, the thickness, and the length l are 2.5 mm, 1.6 mm, and 3.2 mm, respectively, and the F characteristic is 1 μF.
This is a sample of the multilayer capacitor, and an ac voltage is applied to it to measure the volume of the noise.
-500), it was possible to reduce the volume of squeal that was 71 dB in the mounting direction of FIGS. 3 and 4 to 62 dB in the mounting direction of FIG.

The above multilayer capacitor has a component storage tape T as shown in FIG. 2, that is, a large number of concave portions Ta, and the concave portions T.
Since a is often stored and handled in the component storage tape T closed by the cover tape Ta, if the multilayer capacitor 1 is stored in advance in the recess Ta with the surface of the internal electrode 3 oriented vertically, At the stage of taking out the multilayer capacitor 1 from the recess Ta while peeling off the cover tape Ta, it is possible to regulate the direction of the multilayer capacitor 1 with respect to the substrate surface as described above.

FIGS. 5 and 6 show a second embodiment of the present invention.

The multilayer capacitor 11 shown in the figure has a rectangular parallelepiped chip 12 made of a ceramic dielectric, a plurality of internal electrodes 13 embedded in the chip 12, and a chip 1
2 and a pair of external electrodes 14 provided at both ends.

Each of the internal electrodes 13 has the same rectangular shape and is arranged so as to face each other in parallel in the lengthwise direction, and one side of each of the pair of extraction electrodes 13a exposing one end of each of the chip end faces. Are joined alternately. Also,
Each external electrode 14 is formed to extend from the end face in the chip longitudinal direction to the four side faces at the peripheral edge of the end face, and is joined to the exposed end of the extraction electrode 13a.

Now, a method of manufacturing the multilayer capacitor 11 of this embodiment will be described. First, through holes are formed on a dielectric green sheet containing barium titanate or the like as a main component by a method such as die punching or laser light irradiation so as to be line symmetrical and a conductor containing a metal powder such as Ag is formed. Using a paste, a rectangular internal electrode 13 is formed by screen printing or the like on one of the through-hole rows so that one end thereof overlaps, and the other through-hole row is also filled with the same paste to lead electrode 13a. Form part of. Further, one through hole row is formed on the same dielectric green sheet as described above by a method such as die punching or laser light irradiation, and the through hole row is filled with the same paste to form a part of the extraction electrode 13a. .

Next, a predetermined number of the dielectric green sheets of the former are stacked so that the through holes are aligned with each other and the internal electrodes are alternately displaced, and the dielectric green sheets of the latter are through holes on both sides. They are stacked and pressed so that the rows match, and the laminate is fired at a temperature corresponding to the metal component of the conductor paste. Each of the actual dielectric green sheets has a size corresponding to the multi-piece production, and is cut into the component size after lamination and pressure bonding. Then
The same conductor paste as described above is applied to the end of the chip after firing, which is on the exposed side of the extraction electrode, from the end face to the four side faces of the peripheral edge of the end face by a method such as a dipping method, and this is baked at a temperature lower than the firing temperature. The external electrode 14 is formed.

In the multilayer capacitor 11 of this embodiment, since the facing direction of the internal electrodes 13 is aligned with the connecting direction of the external electrodes 14, the surface of the internal electrodes 13 is always perpendicular to the substrate surface during mounting. . Therefore, when an AC voltage in the audible frequency band or a DC voltage in which an AC component in the audible frequency band is superimposed is applied between the external electrodes 14, the chip 12 made of a ceramic dielectric material expands and returns in the thickness direction by a piezoelectric phenomenon. Even if the vibration is repeated, the vibration is not directly transmitted to the substrate Z, and the vibration transmission to the substrate Z can be suppressed to reduce the squeal volume.

Incidentally, the width t, the thickness and the length 1 corresponding to the second embodiment are 2.5 mm, 1.6 mm and 3.2 m, respectively.
Using a 1μF multilayer capacitor with F characteristics at m as a sample,
When an AC voltage was applied to this and the squealing volume was measured in the same manner as above, the squealing volume could be reduced to almost the same level as in the first embodiment.

7 and 8 show a third embodiment of the present invention.

The multilayer capacitor 21 shown in the figure has a rectangular parallelepiped chip 22 made of a ceramic dielectric, a plurality of internal electrodes 23 embedded in the chip 22, and a chip 2
2 and a pair of external electrodes 24 provided at both ends.

The internal electrodes 23 each have the same rectangular shape and are arranged so as to face each other in parallel in the thickness direction, and one side thereof is alternately exposed to the chip end surface on the opposite side. In addition, each external electrode 24 is formed of a metal cap in the shape of a rectangular cylinder with a bottom, and has an angle difference of 45 ° with the side surface of the chip 22 at both ends of the chip 22 so that the ridgelines of the chip 22 are located in the center of the inner surface. The inner bottom surface is joined to the exposed end of the internal electrode 23.

In the multilayer capacitor 21 of this embodiment, since the mounting surface having an angle difference of 45 ° with the surface of the internal electrode 23 is formed on the external electrode 24, the internal electrode 2 is mounted at the time of mounting.
The surface 3 is always oblique to the substrate surface. Therefore, when an AC voltage in the audible frequency band or a DC voltage in which an AC component in the audible frequency band is superimposed is applied between the external electrodes 24, the chip 22 made of a ceramic dielectric material expands and returns in the thickness direction by a piezoelectric phenomenon. Even if it vibrates repeatedly,
The vibration is not directly transmitted to the substrate Z, and the vibration transmission to the substrate Z can be suppressed to reduce the squeal volume.

By the way, the width t, the thickness and the length l corresponding to the third embodiment are 2.5 mm, 1.6 mm and 3.2 m, respectively.
Using a 1μF multilayer capacitor with F characteristics at m as a sample,
When an AC voltage was applied to this and the squealing volume was measured in the same manner as above, the squealing volume could be reduced to a level (59 dB) lower than that in the first example.

The angle difference between the side surface of the chip 22 and the mounting surface of the external electrode 24 in the third embodiment is not limited to 45 °, and similar effects can be obtained if they are not parallel to each other.

9 and 10 show a fourth embodiment of the present invention.

The multilayer capacitor 31 shown in the figure has a rectangular parallelepiped chip 32 made of a ceramic dielectric, a plurality of internal electrodes 33 embedded in the chip 32, and a chip 3.
2 and a pair of external electrodes 34 provided at both ends of the electrode 2.

The internal electrodes 33 each have the same rectangular shape and are arranged so as to face each other in parallel in the thickness direction, and one side thereof is alternately exposed to the chip end surface on the opposite side, and the exposed end is exposed. It is joined to the terminal electrode 34. Further, each external electrode 34 is formed in a rectangular shape as a whole from the end face in the chip longitudinal direction to the four side faces of the peripheral edge of the end face, and has a face (mounting face) having an angle difference of 45 ° with each side face of the chip 32. Have around it.

In the multilayer capacitor 31 of this embodiment, the mounting surface having an angle difference of 45 ° with the surface of the internal electrode 33 is formed on the external electrode 34.
The surface 3 is always oblique to the substrate surface. Therefore, when an AC voltage in the audible frequency band or a DC voltage in which an AC component in the audible frequency band is superimposed is applied between the external electrodes 34, the chip 32 made of a ceramic dielectric expands and returns in the thickness direction due to the piezoelectric phenomenon. Even if it vibrates repeatedly,
The vibration is not directly transmitted to the substrate Z, and the vibration transmission to the substrate Z can be suppressed to reduce the squeal volume.

By the way, the width t, the thickness and the length l corresponding to the fourth embodiment are 2.5 mm, 1.6 mm and 3.2 m, respectively.
Using a 1μF multilayer capacitor with F characteristics at m as a sample,
When an AC voltage was applied to this and the squealing volume was measured in the same manner as above, the squealing volume could be reduced to almost the same level as in the third embodiment.

The angle difference between the side surface of the chip 32 and the mounting surface of the external electrode 34 in the fourth embodiment is not limited to 45 °, and similar effects can be obtained if they are not parallel to each other.

11 and 12 show a fifth embodiment of the present invention.

The multilayer capacitor 41 shown in the same figure has a rectangular parallelepiped chip 42 made of a ceramic dielectric, a plurality of internal electrodes 43 embedded in the chip 42, and a chip 4
It is composed of a pair of external electrodes 44 provided at both ends of No. 2 and a resin sheath 45 provided around the chip 42.

Each of the internal electrodes 43 has the same rectangular shape and is arranged so as to face each other in parallel in the thickness direction, and one side thereof is alternately exposed to the chip end surface on the opposite side, and the exposed end is exposed. It is joined to the terminal electrode 44. Further, each external electrode 34 is formed from the end face in the chip longitudinal direction to the four side faces at the peripheral edge of the end face. Further, the outer package 45 has a rectangular outer shape, and has a surface (mounting surface) that is flush with the ridgeline of the angular position of the external electrode 44 and has an angle difference of 45 ° with each side surface of the chip 42. Have around.

In the multilayer capacitor 41 of this embodiment, the outer package 45 is attached around the chip 42, and the mounting surface having an angle difference of 45 ° from the surface of the internal electrode 43 is formed on the outer package 45. At the time of mounting, the surface of the internal electrode 43 is always inclined with respect to the substrate surface. Therefore, when an AC voltage in the audible frequency band or a DC voltage in which an AC component in the audible frequency band is superimposed is applied between the external electrodes 44, the chip 42 made of a ceramic dielectric material expands and returns in the thickness direction by a piezoelectric phenomenon. Even if the vibration is repeated, the vibration is not directly transmitted to the substrate Z, and the vibration transmission to the substrate Z can be suppressed to reduce the squeal volume.

By the way, the width t, the thickness and the length 1 corresponding to the fifth embodiment are 2.5 mm, 1.6 mm and 3.2 m, respectively.
Using a 1μF multilayer capacitor with F characteristics at m as a sample,
When an AC voltage was applied to this and the squealing volume was measured in the same manner as above, the squealing volume could be reduced to a level (56 dB) lower than in the first to fourth examples.

The angle difference between the side surface of the chip 32 and the mounting surface of the external electrode 34 in the fourth embodiment is not limited to 45 °, and similar effects can be obtained if they are not parallel to each other. Further, if a material having excellent vibration absorption, such as a soft resin or rubber, is used as the material of the exterior 45, vibration can be attenuated by the exterior itself to further reduce the squeal volume.
Further, the outer casing 45 is a case having the same outer shape as the outer casing 45,
More specifically, a rectangular tube or prismatic case having a hole having the same shape as the outer shape of the chip 42 on the longitudinal end surface may be used as a substitute, and if a vibration absorbing material is used as the case material, the case itself attenuates vibration. The ringing volume can be similarly reduced.

[0054]

As described above in detail, according to the first aspect of the present invention, a multilayer capacitor in which a plurality of internal electrodes are arranged to face each other in a chip is arranged so that the surfaces of the internal electrodes are not parallel to the substrate surface. Since it is mounted on the board, even if vibration is generated in the opposite direction of the internal electrodes when a voltage is applied, the vibration is not directly transmitted to the board, and vibration transmission to the board is suppressed to reduce the squeal volume. can do.

According to the second aspect of the present invention, since the multilayer capacitor is housed in the concave portion of the component housing tape in such a direction that the surface of the internal electrode is vertical, the surface of the internal electrode faces the substrate surface during mounting. On the other hand, it is always in the vertical direction, and there is an advantage that the direction regulation of the multilayer capacitor with respect to the substrate surface as described above can be performed at the stage of taking out the multilayer capacitor from the component storage tape.

According to the third aspect of the invention, since the facing direction of the internal electrodes is made to coincide with the direction connecting the external electrodes, the surface of the internal electrodes is always perpendicular to the substrate surface during mounting, and the voltage is Even if vibration is generated in the direction opposite to the internal electrode when applied, the vibration is not directly transmitted to the substrate, and similarly to the invention of claim 1, the vibration transmission to the substrate is suppressed to reduce the squeal volume. be able to.

According to the fourth aspect of the present invention, since the mounting surface that is not parallel to the surface of the internal electrode is formed on the external electrode, the surface of the internal electrode is always oblique to the substrate surface during mounting. Even if a vibration is generated in the opposite direction of the internal electrode when a voltage is applied, the vibration is not directly transmitted to the substrate, and the vibration transmission to the substrate is suppressed similarly to the invention of claim 1, and the squeal volume is increased. Can be reduced.

According to the fifth aspect of the present invention, since the exterior is provided around the chip and the mounting surface that is not parallel to the surface of the internal electrode is formed on the exterior, the surface of the internal electrode is mounted on the substrate during mounting. The surface is always inclined with respect to the surface, and even if vibration is generated in a direction opposite to the internal electrode when a voltage is applied, the vibration is not directly transmitted to the substrate, and the vibration to the substrate is the same as in the invention of claim 1. Vibration transmission can be suppressed to reduce the squeal volume.

According to the sixth aspect of the invention, since the case having the mounting surface that is not parallel to the surface of the internal electrode is provided, the surface of the internal electrode is always inclined with respect to the substrate surface during mounting. Even if a vibration is generated in the direction opposite to the internal electrode when a voltage is applied, the vibration is not directly transmitted to the substrate,
As in the first aspect of the invention, it is possible to suppress vibration transmission to the substrate and reduce the squeal volume.

According to the seventh aspect of the invention, since the vibration absorbing material is used for the exterior or the case, the exterior or the case itself can damp the vibration to further reduce the squeal volume. Other effects are the same as those of the invention of claim 5 or 6.

[Brief description of drawings]

FIG. 1 is a mounting perspective view of a multilayer capacitor according to a first embodiment of the present invention.

FIG. 2 is a diagram showing a component storage tape.

FIG. 3 is a mounting perspective view of a multilayer capacitor according to a conventional example.

FIG. 4 is a sectional view of the multilayer capacitor shown in FIG.

FIG. 5 is a perspective view of a multilayer capacitor according to a second embodiment of the present invention.

6 is a cross-sectional view of the multilayer capacitor shown in FIG.

FIG. 7 is a perspective view of a multilayer capacitor according to a third embodiment of the present invention.

8 is a sectional view of the multilayer capacitor shown in FIG. 7 taken along the line AA.

FIG. 9 is a perspective view of a multilayer capacitor according to a fourth embodiment of the present invention.

10 is a cross-sectional view taken along line BB of the multilayer capacitor shown in FIG.

FIG. 11 is a perspective view of a multilayer capacitor according to a fifth embodiment of the present invention.

FIG. 12 is a sectional view taken along line CC of the multilayer capacitor shown in FIG.

[Explanation of symbols]

1 ... Multilayer capacitor, 2 ... Chip, 3 ... Internal electrode, 4 ...
External electrode, Z ... Substrate, T ... Component storage tape, Ta ... Recessed portion, 11 ... Multilayer capacitor, 12 ... Chip, 13 ... Internal electrode, 14 ... External electrode, 21 ... Multilayer capacitor, 22 ...
Chip, 23 ... Internal electrode, 24 ... External electrode, 31 ... Multilayer capacitor, 32 ... Chip, 33 ... Internal electrode, 34 ... External electrode, 41 ... Multilayer capacitor, 42 ... Chip, 43 ...
Internal electrodes, 44 ... External electrodes, 45 ... Exterior.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Sadaaki Kurata 6-16-20 Ueno, Taito-ku, Tokyo Within Taiyo Electric Co., Ltd. (72) Shinichi Ishida 6-16-20 Ueno, Taito-ku, Tokyo In Taiyo Denki Co., Ltd. (72) Minor Takahashi 6-16-20 Ueno, Taito-ku, Tokyo In Taiyo Denki Co., Ltd.

Claims (7)

[Claims]
1. A method of mounting a multilayer capacitor, wherein a multilayer capacitor having a plurality of internal electrodes arranged to face each other in a chip is mounted such that the surfaces of the internal electrodes are not parallel to the substrate surface.
2. A multilayer capacitor having a plurality of internal electrodes facing each other in a chip is housed in a recess of a component housing tape,
In a method of mounting a multilayer capacitor, which is taken out from a tape and mounted on a substrate, a multilayer capacitor is stored in a recess of a component storage tape in a direction in which a surface of an internal electrode is vertical. How to mount a capacitor.
3. In a multilayer capacitor in which a plurality of internal electrodes are arranged to face each other in a chip and external electrodes are provided at both ends of the chip, the facing direction of the internal electrodes is made to coincide with the direction connecting the external electrodes. Multilayer capacitor.
4. In a multilayer capacitor in which a plurality of internal electrodes are arranged facing each other in a chip and external electrodes are provided at both ends of the chip, a mounting surface that is not parallel to the surface of the internal electrode is formed on the external electrode. Characteristic multilayer capacitor.
5. In a multilayer capacitor in which a plurality of internal electrodes are arranged to face each other in a chip and external electrodes are provided at both ends of the chip, an exterior is attached around the chip, and a mounting surface that is non-parallel to the surface of the internal electrode is provided. A multilayer capacitor formed on the exterior.
6. A multilayer capacitor in which a plurality of internal electrodes are arranged to face each other in a chip and external electrodes are provided at both ends of the chip, wherein a case having a mounting surface that is not parallel to the surface of the internal electrode is provided. Characteristic multilayer capacitor.
7. The multilayer capacitor according to claim 5, wherein a vibration absorbing material is used for the exterior or the case.
JP18818494A 1994-08-10 1994-08-10 Method for mounting layered capacitor and layered capacitor Pending JPH0855752A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18818494A JPH0855752A (en) 1994-08-10 1994-08-10 Method for mounting layered capacitor and layered capacitor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18818494A JPH0855752A (en) 1994-08-10 1994-08-10 Method for mounting layered capacitor and layered capacitor

Publications (1)

Publication Number Publication Date
JPH0855752A true JPH0855752A (en) 1996-02-27

Family

ID=16219241

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18818494A Pending JPH0855752A (en) 1994-08-10 1994-08-10 Method for mounting layered capacitor and layered capacitor

Country Status (1)

Country Link
JP (1) JPH0855752A (en)

Cited By (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0949642A3 (en) * 1998-03-31 2004-01-02 TDK Corporation Chip-type electronic component
US6807047B2 (en) 2002-10-08 2004-10-19 Tdk Corporation Electronic device and interposer board
JP2009295828A (en) * 2008-06-06 2009-12-17 Panasonic Corp Electronic component
JP2010027976A (en) * 2008-07-23 2010-02-04 Shinko Electric Ind Co Ltd Multilayered capacitor and semiconductor package containing the same, and method for manufacturing the same
JP2010062581A (en) * 2005-03-30 2010-03-18 Samsung Electro-Mechanics Co Ltd Multi-layer ceramic capacitor and production method thereof
US7701696B2 (en) 2007-05-30 2010-04-20 Tdk Corporation Multilayer capacitor
WO2012056873A1 (en) * 2010-10-28 2012-05-03 株式会社日立製作所 Capacitor embedded between busbars, electric power device and electric power conversion device
CN102487600A (en) * 2010-12-02 2012-06-06 三星电机株式会社 Electronic component aligning device, electronic component packaging body, and electronic component mounting board
JP2013038291A (en) * 2011-08-10 2013-02-21 Murata Mfg Co Ltd Chip component structure and manufacturing method of the same
JP2013120927A (en) * 2011-12-06 2013-06-17 Samsung Electro-Mechanics Co Ltd Multilayer ceramic electronic part
CN103456494A (en) * 2012-05-30 2013-12-18 三星电机株式会社 Laminated chip electronic component, board for mounting the same, and packing unit thereof
CN103578743A (en) * 2012-08-09 2014-02-12 株式会社村田制作所 Capacitor component and capacitor component mounting structure
KR20140027454A (en) 2011-07-11 2014-03-06 가부시키가이샤 무라타 세이사쿠쇼 Electronic component
JP2014057046A (en) * 2012-08-10 2014-03-27 Murata Mfg Co Ltd Mounting land structure, and mounting structure of laminated capacitor
CN103779077A (en) * 2012-10-19 2014-05-07 株式会社村田制作所 Method of manufacturing mounting substrate on which monolithic ceramic capacitors are mounted and mounting structure
CN103915254A (en) * 2013-01-02 2014-07-09 三星电机株式会社 Multilayer ceramic capacitor and mounting board therefor
CN104064355A (en) * 2013-03-19 2014-09-24 株式会社村田制作所 Electronic Component And Electronic Component Package
JP2014187315A (en) * 2013-03-25 2014-10-02 Murata Mfg Co Ltd Electronic component
JP2014212295A (en) * 2013-04-16 2014-11-13 サムソン エレクトロ−メカニックス カンパニーリミテッド. Multilayer ceramic electronic component and mounting board therefor
JP2014216643A (en) * 2013-04-22 2014-11-17 サムソン エレクトロ−メカニックス カンパニーリミテッド. Multilayer ceramic electronic component and board for mounting the same
JP2014236215A (en) * 2013-05-31 2014-12-15 サムソン エレクトロ−メカニックス カンパニーリミテッド. Multilayer ceramic electronic component and mounting board of multilayer ceramic electronic component
US8953299B2 (en) 2007-03-22 2015-02-10 Blackberry Limited Capacitors adapted for acoustic resonance cancellation
US9082549B2 (en) 2011-03-25 2015-07-14 Murata Manufacturing Co., Ltd. Electronic component
US9082550B2 (en) 2011-07-11 2015-07-14 Murata Manufacturing Co., Ltd. Electronic component
US9089054B2 (en) 2012-06-12 2015-07-21 Murata Manufacturing Co., Ltd. Chip-component structure
US9142355B2 (en) 2007-03-22 2015-09-22 Blackberry Limited Capacitors adapted for acoustic resonance cancellation
US9241408B2 (en) 2010-12-28 2016-01-19 Murata Manufacturing Co., Ltd. Electronic component
WO2016035590A1 (en) * 2014-09-01 2016-03-10 株式会社 村田製作所 Electronic-component-embedded substrate
US9374901B2 (en) 2012-08-10 2016-06-21 Murata Manufacturing Co., Ltd. Monolithic capacitor mounting structure and monolithic capacitor
US9448207B2 (en) 2012-08-29 2016-09-20 Murata Manufacturing Co., Ltd. Quality evaluation apparatus, quality evaluation method, and evaluation substrate
US9620288B2 (en) 2011-08-05 2017-04-11 Murata Manufacturing Co., Ltd. Chip-component structure
JP2017191866A (en) * 2016-04-14 2017-10-19 太陽誘電株式会社 Capacitor mounting structure
US10249438B1 (en) 2017-12-15 2019-04-02 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor and board having the same
US10356908B2 (en) 2014-09-01 2019-07-16 Murata Manufacturing Co., Ltd. Electronic component containing substrate
CN111295038A (en) * 2019-03-28 2020-06-16 展讯通信(上海)有限公司 Mobile terminal

Cited By (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0949642A3 (en) * 1998-03-31 2004-01-02 TDK Corporation Chip-type electronic component
US6807047B2 (en) 2002-10-08 2004-10-19 Tdk Corporation Electronic device and interposer board
JP2010062581A (en) * 2005-03-30 2010-03-18 Samsung Electro-Mechanics Co Ltd Multi-layer ceramic capacitor and production method thereof
US8953299B2 (en) 2007-03-22 2015-02-10 Blackberry Limited Capacitors adapted for acoustic resonance cancellation
US9269496B2 (en) 2007-03-22 2016-02-23 Blackberry Limited Capacitors adapted for acoustic resonance cancellation
US9142355B2 (en) 2007-03-22 2015-09-22 Blackberry Limited Capacitors adapted for acoustic resonance cancellation
US7701696B2 (en) 2007-05-30 2010-04-20 Tdk Corporation Multilayer capacitor
JP2009295828A (en) * 2008-06-06 2009-12-17 Panasonic Corp Electronic component
JP2010027976A (en) * 2008-07-23 2010-02-04 Shinko Electric Ind Co Ltd Multilayered capacitor and semiconductor package containing the same, and method for manufacturing the same
KR101449883B1 (en) * 2010-10-28 2014-10-10 가부시키가이샤 히타치세이사쿠쇼 Capacitor embedded between busbars, electric power device and electric power conversion device
US9105397B2 (en) 2010-10-28 2015-08-11 Hitachi, Ltd. Capacitor embedded between busbars, electric power device and electric power conversion device
WO2012056873A1 (en) * 2010-10-28 2012-05-03 株式会社日立製作所 Capacitor embedded between busbars, electric power device and electric power conversion device
CN103180921A (en) * 2010-10-28 2013-06-26 株式会社日立制作所 Capacitor embedded between busbars, electric power device and electric power conversion device
JP2012094773A (en) * 2010-10-28 2012-05-17 Hitachi Ltd Built-in capacitor between bus bars, power apparatus and power conversion device
JP2012119660A (en) * 2010-12-02 2012-06-21 Samsung Electro-Mechanics Co Ltd Electronic component aligning device, electronic component packaging body, and electronic component mounting board
CN102487600A (en) * 2010-12-02 2012-06-06 三星电机株式会社 Electronic component aligning device, electronic component packaging body, and electronic component mounting board
US9241408B2 (en) 2010-12-28 2016-01-19 Murata Manufacturing Co., Ltd. Electronic component
US9082549B2 (en) 2011-03-25 2015-07-14 Murata Manufacturing Co., Ltd. Electronic component
US9042114B2 (en) 2011-07-11 2015-05-26 Murata Manufacturing Co., Ltd. Electronic component
KR20140027454A (en) 2011-07-11 2014-03-06 가부시키가이샤 무라타 세이사쿠쇼 Electronic component
US9082550B2 (en) 2011-07-11 2015-07-14 Murata Manufacturing Co., Ltd. Electronic component
US9620288B2 (en) 2011-08-05 2017-04-11 Murata Manufacturing Co., Ltd. Chip-component structure
US8878339B2 (en) 2011-08-10 2014-11-04 Murata Manufacturing Co., Ltd. Chip-component structure and method of producing same
JP2013038291A (en) * 2011-08-10 2013-02-21 Murata Mfg Co Ltd Chip component structure and manufacturing method of the same
JP2013120927A (en) * 2011-12-06 2013-06-17 Samsung Electro-Mechanics Co Ltd Multilayer ceramic electronic part
US9576728B2 (en) 2012-05-30 2017-02-21 Samsung Electro-Mechanics Co., Ltd. Laminated chip electronic component, board for mounting the same, and packing unit thereof
CN103456494A (en) * 2012-05-30 2013-12-18 三星电机株式会社 Laminated chip electronic component, board for mounting the same, and packing unit thereof
US9089054B2 (en) 2012-06-12 2015-07-21 Murata Manufacturing Co., Ltd. Chip-component structure
CN103578743A (en) * 2012-08-09 2014-02-12 株式会社村田制作所 Capacitor component and capacitor component mounting structure
JP2014053588A (en) * 2012-08-09 2014-03-20 Murata Mfg Co Ltd Capacitor component and capacitor component mounting structure
US9867278B2 (en) 2012-08-09 2018-01-09 Murata Manufacturing Co., Ltd. Capacitor component and capacitor component mounting structure
US9374901B2 (en) 2012-08-10 2016-06-21 Murata Manufacturing Co., Ltd. Monolithic capacitor mounting structure and monolithic capacitor
JP2014057046A (en) * 2012-08-10 2014-03-27 Murata Mfg Co Ltd Mounting land structure, and mounting structure of laminated capacitor
US9095073B2 (en) 2012-08-10 2015-07-28 Murata Manufacturing Co., Ltd. Mounting land structure and mounting structure for laminated capacitor
US9448207B2 (en) 2012-08-29 2016-09-20 Murata Manufacturing Co., Ltd. Quality evaluation apparatus, quality evaluation method, and evaluation substrate
CN103779077A (en) * 2012-10-19 2014-05-07 株式会社村田制作所 Method of manufacturing mounting substrate on which monolithic ceramic capacitors are mounted and mounting structure
JP2014099589A (en) * 2012-10-19 2014-05-29 Murata Mfg Co Ltd Method of manufacturing mounting substrate on which multilayer ceramic capacitors are mounted and mounting structure body
US9338889B2 (en) 2012-10-19 2016-05-10 Murata Manufacturing Co., Ltd. Method of manufacturing mounting substrate on which monolithic ceramic capacitors are mounted and mounting structure
JP2014132631A (en) * 2013-01-02 2014-07-17 Samsung Electro-Mechanics Co Ltd Laminated ceramic capacitor and mounting board of the same
TWI616909B (en) * 2013-01-02 2018-03-01 三星電機股份有限公司 Multilayer ceramic capacitor and mounting board therefor
CN103915254A (en) * 2013-01-02 2014-07-09 三星电机株式会社 Multilayer ceramic capacitor and mounting board therefor
KR20140088366A (en) * 2013-01-02 2014-07-10 삼성전기주식회사 Multi-layered ceramic capacitor and mounting circuit having thereon multi-layered ceramic capacitor
US9313892B2 (en) 2013-03-19 2016-04-12 Murata Manufacturing Co., Ltd. Electronic component and electronic component package
CN104064355A (en) * 2013-03-19 2014-09-24 株式会社村田制作所 Electronic Component And Electronic Component Package
JP2014187315A (en) * 2013-03-25 2014-10-02 Murata Mfg Co Ltd Electronic component
JP2014212295A (en) * 2013-04-16 2014-11-13 サムソン エレクトロ−メカニックス カンパニーリミテッド. Multilayer ceramic electronic component and mounting board therefor
US9613752B2 (en) 2013-04-16 2017-04-04 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic electronic component and mounting board therefor
JP2014216643A (en) * 2013-04-22 2014-11-17 サムソン エレクトロ−メカニックス カンパニーリミテッド. Multilayer ceramic electronic component and board for mounting the same
US9978514B2 (en) 2013-04-22 2018-05-22 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic electronic component and board for mounting the same
JP2014236215A (en) * 2013-05-31 2014-12-15 サムソン エレクトロ−メカニックス カンパニーリミテッド. Multilayer ceramic electronic component and mounting board of multilayer ceramic electronic component
US10356908B2 (en) 2014-09-01 2019-07-16 Murata Manufacturing Co., Ltd. Electronic component containing substrate
WO2016035590A1 (en) * 2014-09-01 2016-03-10 株式会社 村田製作所 Electronic-component-embedded substrate
JP2017191866A (en) * 2016-04-14 2017-10-19 太陽誘電株式会社 Capacitor mounting structure
US10249438B1 (en) 2017-12-15 2019-04-02 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor and board having the same
CN111295038A (en) * 2019-03-28 2020-06-16 展讯通信(上海)有限公司 Mobile terminal

Similar Documents

Publication Publication Date Title
KR101983167B1 (en) Laminated chip electronic component, board for mounting the same, packing unit thereof
JP5587443B2 (en) Multilayer ceramic capacitor, circuit board mounting structure of multilayer ceramic capacitor, and package of multilayer ceramic capacitor
KR101434108B1 (en) Multi-layered ceramic capacitor, mounting circuit board thereof and manufacturing method the same
KR101952860B1 (en) Multi-layered ceramic capacitor and board for mounting the same
US8947850B2 (en) Multilayer capacitor
JP6395002B2 (en) Circuit board mounting structure of multilayer ceramic capacitor
KR101504001B1 (en) Laminated chip electronic component, board for mounting the same, packing unit thereof
KR101548771B1 (en) Chip type laminated capacitor
US9313892B2 (en) Electronic component and electronic component package
JP5853976B2 (en) Multilayer capacitor
KR101506256B1 (en) Chip-component structure and method of producing same
US8315035B2 (en) Multilayer capacitor and method of manufacturing same
KR101525666B1 (en) Multi-layered ceramic capacitor and manufacturing method the same
JP5287658B2 (en) Ceramic electronic components
KR100773198B1 (en) Surface-mount capacitor and method of producing the same
US7324325B2 (en) Laminated ceramic electronic component
KR101546916B1 (en) Mounting structure and mounting method
KR102076145B1 (en) Multi-layered ceramic electronic part, board for mounting the same and manufacturing method thereof
US7715172B2 (en) Multilayer capacitor
KR101452054B1 (en) Multi-layered ceramic capacitor and board for mounting the same
US6871388B2 (en) Method of forming an electronic component located on a surface of a package member with a space therebetween
JP5332475B2 (en) Multilayer ceramic electronic component and manufacturing method thereof
KR101127870B1 (en) Ceramic electronic component and method for manufacturing the same
KR101475294B1 (en) Electronic component
JP4752901B2 (en) Electronic components and electronic component built-in substrates

Legal Events

Date Code Title Description
A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20000718