JPH0855752A - Method for mounting layered capacitor and layered capacitor - Google Patents
Method for mounting layered capacitor and layered capacitorInfo
- Publication number
- JPH0855752A JPH0855752A JP18818494A JP18818494A JPH0855752A JP H0855752 A JPH0855752 A JP H0855752A JP 18818494 A JP18818494 A JP 18818494A JP 18818494 A JP18818494 A JP 18818494A JP H0855752 A JPH0855752 A JP H0855752A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- multilayer capacitor
- substrate
- mounting
- vibration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 81
- 239000000758 substrates Substances 0.000 claims abstract description 57
- 238000003860 storage Methods 0.000 claims description 7
- 239000011358 absorbing materials Substances 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 abstract description 10
- 239000000919 ceramics Substances 0.000 description 12
- 230000001629 suppression Effects 0.000 description 9
- 230000000875 corresponding Effects 0.000 description 6
- 230000002093 peripheral Effects 0.000 description 6
- 239000003989 dielectric materials Substances 0.000 description 5
- 239000006072 pastes Substances 0.000 description 5
- 239000004020 conductors Substances 0.000 description 4
- 238000000605 extraction Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000000463 materials Substances 0.000 description 3
- 239000002184 metals Substances 0.000 description 3
- 229910052751 metals Inorganic materials 0.000 description 3
- 280000911705 Taiyo Denki companies 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000011347 resins Substances 0.000 description 2
- 229920005989 resins Polymers 0.000 description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N Barium titanate Chemical compound 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- 238000007598 dipping method Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000001151 other effects Effects 0.000 description 1
- 239000000843 powders Substances 0.000 description 1
- 230000001105 regulatory Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
Abstract
Description
[0001]
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of mounting a multilayer capacitor in which a plurality of internal electrodes are arranged to face each other in a chip, and a multilayer capacitor.
[0002]
2. Description of the Related Art FIG. 3 is a perspective view of a conventional multilayer capacitor of this type, and FIG. 4 is a sectional view thereof.
The multilayer capacitor 1 shown in FIG. 1 has a rectangular parallelepiped chip 2 made of a ceramic dielectric and a chip 2
It is composed of a plurality of internal electrodes 3 embedded inside and a pair of external electrodes 4 provided at both ends of the chip 2, and has a predetermined width w, thickness t and length l.
The internal electrodes 3 each have the same rectangular shape,
They are arranged so as to face each other in parallel in the thickness direction, one side thereof is alternately exposed to the chip end surface on the opposite side, and the exposed end is joined to the terminal electrode 4. Each external electrode 4 is formed so as to extend from the end face in the chip longitudinal direction to the four side faces at the peripheral edge of the end face.
[0005]
In the conventional multilayer capacitor 1 described above, generally, as shown in FIGS. 3 and 4, one surface in the thickness direction is parallel to the substrate surface, in other words, the internal electrode 3 is formed. It is mounted so that its surface is parallel to the upper surface of the substrate Z.
However, in the above-mentioned mounting state, the voltage between the external electrodes 4, especially the audible frequency band (about 20 Hz)
When an AC voltage of up to 20 kHz) or a DC voltage on which an AC component in the audible frequency band is superimposed is applied, the chip 2 made of a ceramic dielectric expands in the thickness direction due to the piezoelectric phenomenon.
There is a problem that vibration is caused by repeated return, and this is directly transmitted to the substrate Z to cause abnormal noise, so-called squeal. Even if a slight vibration occurs in the capacitor itself, when it is transmitted to the substrate Z, it is amplified by the increase of the vibration area and reaches an audible level.
The present invention has been made in view of the above problems, and an object of the present invention is to provide a method of mounting a multilayer capacitor and a multilayer capacitor which can reduce the squeal volume when a voltage is applied.
[0008]
In order to achieve the above object, the invention of claim 1 provides a multilayer capacitor in which a plurality of internal electrodes are arranged to face each other in a chip, and the surfaces of the internal electrodes are oriented non-parallel to the substrate surface. The feature is that it is implemented as follows.
According to a second aspect of the present invention, a multilayer capacitor having a plurality of internal electrodes facing each other in a chip is housed in a recess of a component housing tape, and the multilayer capacitor is taken out from the tape and mounted on a substrate. In the mounting method,
It is characterized in that the multilayer capacitor is housed in the concave portion of the component housing tape in such a manner that the surface of the internal electrode is vertical.
According to a third aspect of the present invention, in a multilayer capacitor in which a plurality of internal electrodes are arranged facing each other in a chip and external electrodes are provided at both ends of the chip, the facing direction of the internal electrodes is made to coincide with the direction connecting the external electrodes. It is characterized by that.
According to a fourth aspect of the present invention, in a multilayer capacitor in which a plurality of internal electrodes are arranged facing each other in a chip and external electrodes are provided at both ends of the chip, a mounting surface that is not parallel to the internal electrode surface is used as the external electrode. It is characterized by being formed.
According to a fifth aspect of the present invention, in a multilayer capacitor in which a plurality of internal electrodes are arranged to face each other in a chip and external electrodes are provided at both ends of the chip, an exterior is attached around the chip and intersects the surface of the internal electrodes. It is characterized in that it is formed in the non-parallel outer casing.
According to a sixth aspect of the present invention, in a multilayer capacitor in which a plurality of internal electrodes are arranged to face each other in a chip and external electrodes are provided at both ends of the chip, a case having a mounting surface that is not parallel to the surface of the internal electrode is provided. The feature is that it is provided.
The invention according to claim 7 is the multilayer capacitor according to claim 5 or 6, characterized in that a vibration absorbing material is used for the exterior or the case.
[0015]
According to the first aspect of the present invention, since a multilayer capacitor having a plurality of internal electrodes arranged to face each other in a chip is mounted so that the surfaces of the internal electrodes are not parallel to the substrate surface, a voltage is applied. At this time, even if vibration is generated in the opposite direction of the internal electrodes,
The vibration is not directly transmitted to the substrate.
According to the second aspect of the present invention, since the multilayer capacitor is housed in the concave portion of the component housing tape in such a direction that the surface of the internal electrode is vertical, the surface of the internal electrode must be mounted on the board surface at the time of mounting. It becomes vertical, and the direction of the multilayer capacitor with respect to the substrate surface as described above can be regulated at the stage of taking out the multilayer capacitor from the component storage tape.
According to the third aspect of the present invention, since the facing direction of the internal electrodes is made to coincide with the direction connecting the external electrodes, the surface of the internal electrodes is always perpendicular to the substrate surface during mounting. Therefore, even if a vibration is generated in the opposite direction of the internal electrode when a voltage is applied, the vibration is not directly transmitted to the substrate.
According to the fourth aspect of the present invention, since the mounting surface that is not parallel to the surface of the internal electrode is formed on the external electrode, the surface of the internal electrode is always inclined with respect to the substrate surface during mounting. Therefore, even if a vibration is generated in the opposite direction of the internal electrode when a voltage is applied, the vibration is not directly transmitted to the substrate.
According to the fifth aspect of the present invention, since the exterior is provided around the chip and the mounting surface that is not parallel to the surface of the internal electrode is formed on the exterior, the surface of the internal electrode is on the substrate surface during mounting. On the other hand, it is always diagonal. Therefore, even if a vibration is generated in the opposite direction of the internal electrode when a voltage is applied, the vibration is not directly transmitted to the substrate.
According to the sixth aspect of the present invention, since the case having the mounting surface that is not parallel to the surface of the internal electrode is provided, the surface of the internal electrode is always inclined with respect to the substrate surface during mounting. Therefore, even if a vibration is generated in the opposite direction of the internal electrode when a voltage is applied, the vibration is not directly transmitted to the substrate.
According to the invention of claim 7, since the vibration absorbing material is used for the exterior or the case, the vibration can be damped by the exterior or the case itself. Other functions are similar to those of the invention of claim 5 or 6.
[0022]
FIG. 1 shows a first embodiment of the present invention.
The multilayer capacitor 1 shown in the figure has the same structure as the conventional one shown in FIGS. 3 and 4, that is, a rectangular parallelepiped chip 2 made of a ceramic dielectric material and embedded in the chip 2. And a pair of external electrodes 4 provided at both ends of the chip 2.
The internal electrodes 3 each have the same rectangular shape,
They are arranged so as to face each other in parallel in the thickness direction, one side thereof is alternately exposed to the chip end surface on the opposite side, and the exposed end is joined to the terminal electrode 4. Each external electrode 4 is formed so as to extend from the end face in the chip longitudinal direction to the four side faces at the peripheral edge of the end face.
In this embodiment, the multilayer capacitor 1 is mounted such that the surface of the internal electrode 3 is oriented vertically to the upper surface of the substrate Z, and the upper surface of the substrate Z is arranged so that the multilayer capacitor 1 is inverted in its width direction. And one side of each external electrode 4 that contacts the conductor pattern (not shown) on the substrate Z is soldered.
That is, since the surface of the internal electrode 4 is perpendicular to the substrate surface in the above-mentioned mounted state, an AC voltage in the audio frequency band or a DC voltage in which an AC component in the audio frequency band is superimposed is placed between the external electrodes 4. Even if the chip 2 made of a ceramic dielectric material vibrates by repeatedly expanding and returning in the thickness direction due to a piezoelectric phenomenon when applied, the vibration is not directly transmitted to the substrate Z, and the vibration is transmitted to the substrate Z. Can be suppressed to reduce the squeal volume.
By the way, the width t, the thickness, and the length l are 2.5 mm, 1.6 mm, and 3.2 mm, respectively, and the F characteristic is 1 μF.
This is a sample of the multilayer capacitor, and an ac voltage is applied to it to measure the volume of the noise.
-500), it was possible to reduce the volume of squeal that was 71 dB in the mounting direction of FIGS. 3 and 4 to 62 dB in the mounting direction of FIG.
The above multilayer capacitor has a component storage tape T as shown in FIG. 2, that is, a large number of concave portions Ta, and the concave portions T.
Since a is often stored and handled in the component storage tape T closed by the cover tape Ta, if the multilayer capacitor 1 is stored in advance in the recess Ta with the surface of the internal electrode 3 oriented vertically, At the stage of taking out the multilayer capacitor 1 from the recess Ta while peeling off the cover tape Ta, it is possible to regulate the direction of the multilayer capacitor 1 with respect to the substrate surface as described above.
FIGS. 5 and 6 show a second embodiment of the present invention.
The multilayer capacitor 11 shown in the figure has a rectangular parallelepiped chip 12 made of a ceramic dielectric, a plurality of internal electrodes 13 embedded in the chip 12, and a chip 1
2 and a pair of external electrodes 14 provided at both ends.
Each of the internal electrodes 13 has the same rectangular shape and is arranged so as to face each other in parallel in the lengthwise direction, and one side of each of the pair of extraction electrodes 13a exposing one end of each of the chip end faces. Are joined alternately. Also,
Each external electrode 14 is formed to extend from the end face in the chip longitudinal direction to the four side faces at the peripheral edge of the end face, and is joined to the exposed end of the extraction electrode 13a.
Now, a method of manufacturing the multilayer capacitor 11 of this embodiment will be described. First, through holes are formed on a dielectric green sheet containing barium titanate or the like as a main component by a method such as die punching or laser light irradiation so as to be line symmetrical and a conductor containing a metal powder such as Ag is formed. Using a paste, a rectangular internal electrode 13 is formed by screen printing or the like on one of the through-hole rows so that one end thereof overlaps, and the other through-hole row is also filled with the same paste to lead electrode 13a. Form part of. Further, one through hole row is formed on the same dielectric green sheet as described above by a method such as die punching or laser light irradiation, and the through hole row is filled with the same paste to form a part of the extraction electrode 13a. .
Next, a predetermined number of the dielectric green sheets of the former are stacked so that the through holes are aligned with each other and the internal electrodes are alternately displaced, and the dielectric green sheets of the latter are through holes on both sides. They are stacked and pressed so that the rows match, and the laminate is fired at a temperature corresponding to the metal component of the conductor paste. Each of the actual dielectric green sheets has a size corresponding to the multi-piece production, and is cut into the component size after lamination and pressure bonding. Then
The same conductor paste as described above is applied to the end of the chip after firing, which is on the exposed side of the extraction electrode, from the end face to the four side faces of the peripheral edge of the end face by a method such as a dipping method, and this is baked at a temperature lower than the firing temperature. The external electrode 14 is formed.
In the multilayer capacitor 11 of this embodiment, since the facing direction of the internal electrodes 13 is aligned with the connecting direction of the external electrodes 14, the surface of the internal electrodes 13 is always perpendicular to the substrate surface during mounting. . Therefore, when an AC voltage in the audible frequency band or a DC voltage in which an AC component in the audible frequency band is superimposed is applied between the external electrodes 14, the chip 12 made of a ceramic dielectric material expands and returns in the thickness direction by a piezoelectric phenomenon. Even if the vibration is repeated, the vibration is not directly transmitted to the substrate Z, and the vibration transmission to the substrate Z can be suppressed to reduce the squeal volume.
Incidentally, the width t, the thickness and the length 1 corresponding to the second embodiment are 2.5 mm, 1.6 mm and 3.2 m, respectively.
Using a 1μF multilayer capacitor with F characteristics at m as a sample,
When an AC voltage was applied to this and the squealing volume was measured in the same manner as above, the squealing volume could be reduced to almost the same level as in the first embodiment.
7 and 8 show a third embodiment of the present invention.
The multilayer capacitor 21 shown in the figure has a rectangular parallelepiped chip 22 made of a ceramic dielectric, a plurality of internal electrodes 23 embedded in the chip 22, and a chip 2
2 and a pair of external electrodes 24 provided at both ends.
The internal electrodes 23 each have the same rectangular shape and are arranged so as to face each other in parallel in the thickness direction, and one side thereof is alternately exposed to the chip end surface on the opposite side. In addition, each external electrode 24 is formed of a metal cap in the shape of a rectangular cylinder with a bottom, and has an angle difference of 45 ° with the side surface of the chip 22 at both ends of the chip 22 so that the ridgelines of the chip 22 are located in the center of the inner surface. The inner bottom surface is joined to the exposed end of the internal electrode 23.
In the multilayer capacitor 21 of this embodiment, since the mounting surface having an angle difference of 45 ° with the surface of the internal electrode 23 is formed on the external electrode 24, the internal electrode 2 is mounted at the time of mounting.
The surface 3 is always oblique to the substrate surface. Therefore, when an AC voltage in the audible frequency band or a DC voltage in which an AC component in the audible frequency band is superimposed is applied between the external electrodes 24, the chip 22 made of a ceramic dielectric material expands and returns in the thickness direction by a piezoelectric phenomenon. Even if it vibrates repeatedly,
The vibration is not directly transmitted to the substrate Z, and the vibration transmission to the substrate Z can be suppressed to reduce the squeal volume.
By the way, the width t, the thickness and the length l corresponding to the third embodiment are 2.5 mm, 1.6 mm and 3.2 m, respectively.
Using a 1μF multilayer capacitor with F characteristics at m as a sample,
When an AC voltage was applied to this and the squealing volume was measured in the same manner as above, the squealing volume could be reduced to a level (59 dB) lower than that in the first example.
The angle difference between the side surface of the chip 22 and the mounting surface of the external electrode 24 in the third embodiment is not limited to 45 °, and similar effects can be obtained if they are not parallel to each other.
9 and 10 show a fourth embodiment of the present invention.
The multilayer capacitor 31 shown in the figure has a rectangular parallelepiped chip 32 made of a ceramic dielectric, a plurality of internal electrodes 33 embedded in the chip 32, and a chip 3.
2 and a pair of external electrodes 34 provided at both ends of the electrode 2.
The internal electrodes 33 each have the same rectangular shape and are arranged so as to face each other in parallel in the thickness direction, and one side thereof is alternately exposed to the chip end surface on the opposite side, and the exposed end is exposed. It is joined to the terminal electrode 34. Further, each external electrode 34 is formed in a rectangular shape as a whole from the end face in the chip longitudinal direction to the four side faces of the peripheral edge of the end face, and has a face (mounting face) having an angle difference of 45 ° with each side face of the chip 32. Have around it.
In the multilayer capacitor 31 of this embodiment, the mounting surface having an angle difference of 45 ° with the surface of the internal electrode 33 is formed on the external electrode 34.
The surface 3 is always oblique to the substrate surface. Therefore, when an AC voltage in the audible frequency band or a DC voltage in which an AC component in the audible frequency band is superimposed is applied between the external electrodes 34, the chip 32 made of a ceramic dielectric expands and returns in the thickness direction due to the piezoelectric phenomenon. Even if it vibrates repeatedly,
The vibration is not directly transmitted to the substrate Z, and the vibration transmission to the substrate Z can be suppressed to reduce the squeal volume.
By the way, the width t, the thickness and the length l corresponding to the fourth embodiment are 2.5 mm, 1.6 mm and 3.2 m, respectively.
Using a 1μF multilayer capacitor with F characteristics at m as a sample,
When an AC voltage was applied to this and the squealing volume was measured in the same manner as above, the squealing volume could be reduced to almost the same level as in the third embodiment.
The angle difference between the side surface of the chip 32 and the mounting surface of the external electrode 34 in the fourth embodiment is not limited to 45 °, and similar effects can be obtained if they are not parallel to each other.
11 and 12 show a fifth embodiment of the present invention.
The multilayer capacitor 41 shown in the same figure has a rectangular parallelepiped chip 42 made of a ceramic dielectric, a plurality of internal electrodes 43 embedded in the chip 42, and a chip 4
It is composed of a pair of external electrodes 44 provided at both ends of No. 2 and a resin sheath 45 provided around the chip 42.
Each of the internal electrodes 43 has the same rectangular shape and is arranged so as to face each other in parallel in the thickness direction, and one side thereof is alternately exposed to the chip end surface on the opposite side, and the exposed end is exposed. It is joined to the terminal electrode 44. Further, each external electrode 34 is formed from the end face in the chip longitudinal direction to the four side faces at the peripheral edge of the end face. Further, the outer package 45 has a rectangular outer shape, and has a surface (mounting surface) that is flush with the ridgeline of the angular position of the external electrode 44 and has an angle difference of 45 ° with each side surface of the chip 42. Have around.
In the multilayer capacitor 41 of this embodiment, the outer package 45 is attached around the chip 42, and the mounting surface having an angle difference of 45 ° from the surface of the internal electrode 43 is formed on the outer package 45. At the time of mounting, the surface of the internal electrode 43 is always inclined with respect to the substrate surface. Therefore, when an AC voltage in the audible frequency band or a DC voltage in which an AC component in the audible frequency band is superimposed is applied between the external electrodes 44, the chip 42 made of a ceramic dielectric material expands and returns in the thickness direction by a piezoelectric phenomenon. Even if the vibration is repeated, the vibration is not directly transmitted to the substrate Z, and the vibration transmission to the substrate Z can be suppressed to reduce the squeal volume.
By the way, the width t, the thickness and the length 1 corresponding to the fifth embodiment are 2.5 mm, 1.6 mm and 3.2 m, respectively.
Using a 1μF multilayer capacitor with F characteristics at m as a sample,
When an AC voltage was applied to this and the squealing volume was measured in the same manner as above, the squealing volume could be reduced to a level (56 dB) lower than in the first to fourth examples.
The angle difference between the side surface of the chip 32 and the mounting surface of the external electrode 34 in the fourth embodiment is not limited to 45 °, and similar effects can be obtained if they are not parallel to each other. Further, if a material having excellent vibration absorption, such as a soft resin or rubber, is used as the material of the exterior 45, vibration can be attenuated by the exterior itself to further reduce the squeal volume.
Further, the outer casing 45 is a case having the same outer shape as the outer casing 45,
More specifically, a rectangular tube or prismatic case having a hole having the same shape as the outer shape of the chip 42 on the longitudinal end surface may be used as a substitute, and if a vibration absorbing material is used as the case material, the case itself attenuates vibration. The ringing volume can be similarly reduced.
[0054]
As described above in detail, according to the first aspect of the present invention, a multilayer capacitor in which a plurality of internal electrodes are arranged to face each other in a chip is arranged so that the surfaces of the internal electrodes are not parallel to the substrate surface. Since it is mounted on the board, even if vibration is generated in the opposite direction of the internal electrodes when a voltage is applied, the vibration is not directly transmitted to the board, and vibration transmission to the board is suppressed to reduce the squeal volume. can do.
According to the second aspect of the present invention, since the multilayer capacitor is housed in the concave portion of the component housing tape in such a direction that the surface of the internal electrode is vertical, the surface of the internal electrode faces the substrate surface during mounting. On the other hand, it is always in the vertical direction, and there is an advantage that the direction regulation of the multilayer capacitor with respect to the substrate surface as described above can be performed at the stage of taking out the multilayer capacitor from the component storage tape.
According to the third aspect of the invention, since the facing direction of the internal electrodes is made to coincide with the direction connecting the external electrodes, the surface of the internal electrodes is always perpendicular to the substrate surface during mounting, and the voltage is Even if vibration is generated in the direction opposite to the internal electrode when applied, the vibration is not directly transmitted to the substrate, and similarly to the invention of claim 1, the vibration transmission to the substrate is suppressed to reduce the squeal volume. be able to.
According to the fourth aspect of the present invention, since the mounting surface that is not parallel to the surface of the internal electrode is formed on the external electrode, the surface of the internal electrode is always oblique to the substrate surface during mounting. Even if a vibration is generated in the opposite direction of the internal electrode when a voltage is applied, the vibration is not directly transmitted to the substrate, and the vibration transmission to the substrate is suppressed similarly to the invention of claim 1, and the squeal volume is increased. Can be reduced.
According to the fifth aspect of the present invention, since the exterior is provided around the chip and the mounting surface that is not parallel to the surface of the internal electrode is formed on the exterior, the surface of the internal electrode is mounted on the substrate during mounting. The surface is always inclined with respect to the surface, and even if vibration is generated in a direction opposite to the internal electrode when a voltage is applied, the vibration is not directly transmitted to the substrate, and the vibration to the substrate is the same as in the invention of claim 1. Vibration transmission can be suppressed to reduce the squeal volume.
According to the sixth aspect of the invention, since the case having the mounting surface that is not parallel to the surface of the internal electrode is provided, the surface of the internal electrode is always inclined with respect to the substrate surface during mounting. Even if a vibration is generated in the direction opposite to the internal electrode when a voltage is applied, the vibration is not directly transmitted to the substrate,
As in the first aspect of the invention, it is possible to suppress vibration transmission to the substrate and reduce the squeal volume.
According to the seventh aspect of the invention, since the vibration absorbing material is used for the exterior or the case, the exterior or the case itself can damp the vibration to further reduce the squeal volume. Other effects are the same as those of the invention of claim 5 or 6.
FIG. 1 is a mounting perspective view of a multilayer capacitor according to a first embodiment of the present invention.
FIG. 2 is a diagram showing a component storage tape.
FIG. 3 is a mounting perspective view of a multilayer capacitor according to a conventional example.
FIG. 4 is a sectional view of the multilayer capacitor shown in FIG.
FIG. 5 is a perspective view of a multilayer capacitor according to a second embodiment of the present invention.
6 is a cross-sectional view of the multilayer capacitor shown in FIG.
FIG. 7 is a perspective view of a multilayer capacitor according to a third embodiment of the present invention.
8 is a sectional view of the multilayer capacitor shown in FIG. 7 taken along the line AA.
FIG. 9 is a perspective view of a multilayer capacitor according to a fourth embodiment of the present invention.
10 is a cross-sectional view taken along line BB of the multilayer capacitor shown in FIG.
FIG. 11 is a perspective view of a multilayer capacitor according to a fifth embodiment of the present invention.
FIG. 12 is a sectional view taken along line CC of the multilayer capacitor shown in FIG.
1 ... Multilayer capacitor, 2 ... Chip, 3 ... Internal electrode, 4 ...
External electrode, Z ... Substrate, T ... Component storage tape, Ta ... Recessed portion, 11 ... Multilayer capacitor, 12 ... Chip, 13 ... Internal electrode, 14 ... External electrode, 21 ... Multilayer capacitor, 22 ...
Chip, 23 ... Internal electrode, 24 ... External electrode, 31 ... Multilayer capacitor, 32 ... Chip, 33 ... Internal electrode, 34 ... External electrode, 41 ... Multilayer capacitor, 42 ... Chip, 43 ...
Internal electrodes, 44 ... External electrodes, 45 ... Exterior.
─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Sadaaki Kurata 6-16-20 Ueno, Taito-ku, Tokyo Within Taiyo Electric Co., Ltd. (72) Shinichi Ishida 6-16-20 Ueno, Taito-ku, Tokyo In Taiyo Denki Co., Ltd. (72) Minor Takahashi 6-16-20 Ueno, Taito-ku, Tokyo In Taiyo Denki Co., Ltd.
Claims (7)
In a method of mounting a multilayer capacitor, which is taken out from a tape and mounted on a substrate, a multilayer capacitor is stored in a recess of a component storage tape in a direction in which a surface of an internal electrode is vertical. How to mount a capacitor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18818494A JPH0855752A (en) | 1994-08-10 | 1994-08-10 | Method for mounting layered capacitor and layered capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18818494A JPH0855752A (en) | 1994-08-10 | 1994-08-10 | Method for mounting layered capacitor and layered capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0855752A true JPH0855752A (en) | 1996-02-27 |
Family
ID=16219241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18818494A Pending JPH0855752A (en) | 1994-08-10 | 1994-08-10 | Method for mounting layered capacitor and layered capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0855752A (en) |
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1994
- 1994-08-10 JP JP18818494A patent/JPH0855752A/en active Pending
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