JPH0852438A - Brush sweeping type cleaning device - Google Patents

Abstract

PURPOSE:To drastically reduce a running cost and to ameliorate inferior environment by splashing of dust of an abrasive by providing an inexpensive device with lower electric power consumption without the need for considering a remedy for corrosion of machines and post-treatment of water and ending the cleaning stage for a member to be cleaned in a short period of time. CONSTITUTION:This cleaning device has a rotating member 41 which is arranged along a transporting path for transporting the member 60 to be cleaned and brush members B installed to this rotating member 41. These brush members B are formed by bundling base ends Wa of many flexible wire-shaped bodies W. Brush housings 43 are formed at a required rotating angle pitch within the rotating member 41 and the brush members B are disposed within the respective brush housings 43. The rotating member 41 is rotated by a rotation driving means 47, by which the front ends Wb of the brush members B are brought into sliding contact with the member 60 to be cleaned and the member is thus cleaned.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a brush sweep type cleaning device for cleaning lead frames such as ICs, transistors, diodes, LEDs, tantalum capacitors (hereinafter simply referred to as electronic parts) and other members to be cleaned. Regarding

[0002]

2. Description of the Related Art For example, as shown in FIG. 7, the above electronic component is molded on a lead frame 60 with an insulating resin, and is integrally formed with the lead frame 60 from one side of the molded electronic component 61. A plurality of leads 62 are projected through the dam portion 63. By the way, on the lead frame 60, a thin film burr 65 made of a molding resin is formed during the molding process as shown by a broken line. The thin-film burr 65 prevents the leads 62 from being easily soldered or plated. Further, in a later step, the dam portion 63 is press-cut with a dam-removing mold. However, since the mold resin contains a strengthening agent and the like, if the dam portion 63 is cut with the burr 65 still attached, the mold will be cut. Wear early.

Therefore, it is necessary to remove the thin film burrs 65 attached to the leads 62 and the dam portions 63 (hereinafter collectively referred to as lead portions 62a) as a post-process of the molding process. As such a device, a device called a dry deflasher or a wet deflasher has been conventionally known. The dry deflasher uses dried aluminum particles, glass particles, or abrasive particles (hereinafter simply referred to as abrasive particles), and the wet deflasher applies abrasive particles containing a large amount of water to the lead portion 62a. It is configured to strongly eject toward and remove the thin film burr 65.

[0004]

However, in the case of the dry deflasher described above, the particle size distribution of the abrasive particles is likely to be biased, and particles having large particles are likely to be clogged in the lead gap. Particularly recently, the pitch P between the leads of the electronic component 61 has been narrowed to about 0.3 mm (lead width 0.18 mm, gap 0.12 mm), and it is necessary to use particles having small particles. However, an abrasive with small particles cannot obtain a sufficient jet collision force to remove the thin film burr 65. Therefore, it takes time to remove the burr on the lead frame.

On the other hand, in the case of the wet deflasher, there is no such problem as described above, but since a large amount of water is used, the structure of the machine becomes complicated and large-scaled, and the power consumption increases, and The cost is very high due to anti-corrosion measures and post-treatment of water. Further, both of them have a structure in which the abrasive particles are jetted, so that the jetting region of the abrasive particles is expanded and the surface of the molded semiconductor package is roughened. To prevent this, it is necessary to mask and protect the package surface. In addition, the consumption amount of the abrasive particles increases, and the running cost becomes high. Moreover, the abrasion dust of the abrasive particles scatters, which creates a poor environment far from the clean room. For this reason, it was not possible to connect the former molding process and this process (thin film deburring and cleaning process) as a series of processes.

The present invention has been made in view of the above circumstances, and has a simple structure, low power consumption, no need to consider corrosion countermeasures and post-treatment of water, and is inexpensive. A cleaning device capable of finishing the cleaning process such as deburring in a short time, eliminating roughness of the surface of the molded package and eliminating the need for masking the surface of the package, abrasive particles and water. To reduce the running cost drastically, improve the bad environment due to dust scattering of abrasives, and connect the preceding process and thin film deburring and cleaning process as a series of processes in a clean room Is a technical issue.

[0007]

In order to solve the above problems, the present invention is configured as follows. That is, the brush sweep type cleaning device according to the present invention comprises a rotating member 41 arranged along the conveying path R for conveying the member to be cleaned 60, and a brush member B attached to the rotating member 41.
The brush member (B) is configured by bundling the base ends Wa of a large number of flexible linear bodies W, and the brush housing 43 is formed in the rotating member 41 at a required rotation angle pitch. The above-mentioned brush members B are respectively provided in 43,
The tip Wb of the brush member B is attached to the brush housing 43.
The tip end portion Wa of the brush member B is brought into sliding contact with the cleaning target portion 60 by projecting from the above and rotating the rotation member 41 by the rotation driving means 47.

[0008]

According to the present invention, while the member 60 to be cleaned is conveyed along the conveying path R, the burr 65 and the like adhering to the member 60 to be cleaned are removed by the brush sweep type cleaning device 40.
That is, the rotation member 41 of the brush sweeping type cleaning device 40 is rotated by the rotation driving means 47. The brush member B is configured by bundling the base end portions Wa of a large number of flexible linear bodies W, and is provided in each brush housing 43 formed in the rotating member 41 at a required rotation angle pitch. Housing 4
The tip portion Wb protruding from 3 intermittently slidably contacts the member to be cleaned 60 to remove and clean the thin film burr 65 and the like attached to the member to be cleaned 60.

[0009]

The brush sweep type cleaning device according to the present invention comprises:
The following effects are achieved. Since the brush member is provided in the brush housing formed in the rotating member and the tip of the brush member is intermittently slidably contacted with the member to be cleaned for cleaning, the power consumption is remarkably higher than that of the prior art. It is possible to provide an inexpensive cleaning device that does not need to take measures against machine corrosion and post-treatment of water. Since the brush member is configured by bundling the base end portions of a large number of flexible linear members, there is no inconvenience such as roughening the surface of the molded semiconductor package by abrasion with abrasive particles as in the conventional example. It eliminates the need to mask the package surface.

No need to use abrasive particles or water,
The running cost can be significantly reduced. Since the dust of the abrasive particles does not scatter, the poor environment of the conventional example can be improved, and the preceding step and the thin film deburring and cleaning step can be connected as a series of steps in the clean room. Since the rotating member is rotated to intermittently slide the tip of the brush member against the member to be cleaned for cleaning, the unswept residue of burrs and the like is reduced, which is much greater than that of continuous sweeping. The cleaning effect is improved.

[0011]

Embodiments of the present invention will now be described in more detail with reference to the drawings. First, a lead frame cleaning device to which the brush sweep type cleaning device according to the present invention is applied will be described. FIG. 4 shows a cleaning device for the lead frame, FIG. 4A is a schematic plan view showing a state in which an upper cover of the cleaning device is removed, and FIG. 4B is a schematic front view of the cleaning device.

As shown in FIGS. 4 (A) and 4 (B), this cleaning apparatus has a conveying means 5 for conveying a lead frame (reference numeral 60 in FIG. 7), which is a member to be cleaned, in the longitudinal direction, and the conveying means 5. 4 units on the upper side along the formed transport path R,
Brush continuous hammering type cleaning device 20 arranged in three units on the lower side
And a brush sweeping type cleaning device 40 according to the present invention arranged one by one on the downstream side, and a plurality of suction type dust collectors 50 arranged vertically along the conveying path R at appropriate intervals.
And. It should be noted that the brush continuous cleaning device 20
Is constructed in the same manner as that previously disclosed by the present applicant in Japanese Patent Application No. 5-136630.

As shown in FIG. 4 (B), the conveying means 5 includes a conveying drive motor 6 having a speed reducer 7 and a driven roller arranged along the machine frame 1 so as to form a rectangle in a front view. 8a to 8e, an endless belt 9 wound around the driving roller 6a and the driven rollers 8a to 8e, and provided along the upper edge of the machine frame 1 for guiding the endless belt 9, A large number of guide rollers 10 forming R, and a carry-in section 4a and a carry-out section 4b of the lead frame 60.
And the guide member 4 constituting the above, and is configured to convey the lead frame 60 at a required speed.

The guide roller 10 is shown in FIGS.
As shown in FIG. 6 and FIG.
The main rollers 10A and 10B are arranged to face each of the brush tip portions Wb, and the pressing roller 10C that presses the endless belt 9. Main roller 10A
Is a continuous brush type cleaning device 2 arranged above the transport path R
0, and the other main roller 10B faces the continuous brush type cleaning device 20 disposed below the conveyance path R.

As shown in FIG. 5, the main roller 10A has a support shaft 12 pivotally supported by a roller assembly block 11.
And a stepped roller 13 for belt guides and a stepped roller 14 for frame guides, which are fixedly mounted on the support shaft 12, respectively. The small diameter portion 13 of the stepped roller 13 for belts
b supports the endless belt 9, and the inner end surface of the large diameter portion 13a and the claw roller portion 13c guide the endless belt 9 and
The small diameter portion 14b of the frame stepped roller 14 supports the electronic component 51, and the inner end surface of the large diameter portion 14a regulates the electronic component 51, so that the lead frame 60 is prevented from dropping from the transport path R. It is configured. In addition,
The roller assembly block 11 is detachably fixed to the machine table 1A of the machine frame 1.

As shown in FIG. 6, the other main roller 10B holds the lead frame 50 by the small diameter portion 13b of the belt stepped roller 13 and the endless belt 9 and supports the electronic component 51 by the support shaft 12. Frame roller 1
The inner end surface of 4 is configured to regulate the electronic component 51, and the other components are configured similarly to the main roller 10A. Reference numeral 15 in FIGS. 5 and 6 denotes a bearing, 16
Is a retainer of the support shaft 12, and 17 and 18 are block fixing screw holes.

The pressing roller 10C is, as shown in FIGS. 4B, 5 and 6, one of the main rollers 10A.
10A or between the other main rollers 10B and 10B, or a pair of upper and lower parts between the roller assembling blocks 11, and a lead frame together with the main rollers 10A and 10B and the endless belt 9. It is configured so as to sandwich and convey 60. These pressing rollers 10C correspond to the roller assembly block 1 described above.
1 and the machine table 1A. Further, as shown by the phantom line in FIG. 5A, the supporting rollers 10C can change their postures from the horizontal posture to the standing posture by approximately 90 °, and the endless belt 9 Are configured to facilitate replacement of the. The shape and number of the transport rollers 10 can be changed as appropriate by exchanging the roller assembly block 11 according to the form of the lead frame 60.

Next, the brush sweep type cleaning device 4 according to the present invention.
0 will be described. FIG. 1 shows a brush sweep type cleaning device 40.
FIG. 4A is a left side view thereof, FIG. 3B is a front view thereof, and FIG. 3C is a vertical sectional view of the brush member B. The brush sweeping type cleaning device 40 is mounted on the front surface of the elevating / lowering block 23b constituting the mounting block 23, is mounted on the rotating member 41 arranged along the transport path R, and is mounted on the rear surface of the elevating / lowering block 23b to rotate. A drive motor 47 for rotating the member 41 at a required rotation speed, and the rotating member 4
1 is provided with a brush member B. The output shaft 48 of the drive motor 47 is connected to the lifting block 23a.
The shaft support boss portion 42a of the rotating member 41 is fixed to the output shaft 48 to rotatably drive the rotating member 41.

As shown in FIG. 1A, the mounting block 23 includes a tilt block 23a and a tilt block 23a.
The tilting block 23a is supported on the tip of the base block 25 via a support shaft 26 so as to be tiltable.
It is fixed to the base block 25 so that it can be moved forward and backward and the tilt angle can be adjusted. That is, the base block 25 includes a fixed block 25a fixed to the machine table 1A on the machine frame and the fixed block 25a.
a movable block 25b fixed so as to be able to adjust the advancing / retreating position with respect to a. The tilting block 23a is fixed by adjusting the tilting angle of the tilting member 23a and fixing the tilting member 27 and a pair of fixing screws 28a and 28b for fixing both ends thereof.

The elevating block 23b includes a rotating member 41.
The vertical position of the elevating block 23b is adjusted with respect to the tilting block 23a by the vertical position adjusting screw 22a, and is fixed by a fixing screw (not shown). Thereby, the brush member B described later
The tip end portion Wb of the can be adjusted toward the required position of the lead frame 60.

The rotary member 41 comprises a rotary base 42 integrally formed with a shaft support boss 42a, and a lid 44 fixed to the front surface of the rotary base 42 with a screw 44a. The brush housing 43 is recessed at a required rotation angle pitch (36 ° pitch in this embodiment). A brush member B similar to the brush member of the brush continuous cleaning device 20 is detachably loaded in the brush housing 43, and each screw hole 4 formed in the lid body 44.
5 and the fixing screws 46 are screwed into the respective brush members B
The base end side fixing member B ₁ is fixed.

As shown in FIG. 1C, the brush member B is formed by bundling the base end portions Wa of a large number of flexible linear members W with a base end side fixing member B ₁ . By the way, the brush member B of the present embodiment is made of carbon fiber of about 0.1 mmφ or piano wire. Tip Wb of brush member B
Is projected from the tip guide hole 43a of the brush housing 43, and the tip Wb of the brush member B is brought into contact with the lead portion 62a of the lead frame 60 by rotating the rotating member 41 by the drive motor 47. It is configured to sweep and remove the thin film burr 65 attached to the lead portion 62a. When the tip portion Wb of the brush member B is worn, the cover member 44 can be removed and the brush member B can be replaced.

In the brush housing 43,
The flexible space S is formed so that the middle part of the flexible linear body W forming the brush member B can be easily flexed. As shown in FIG. 1B, this bending space S is at least the brush member B with respect to the rotation direction F of the rotating member 41.
It may be formed in a direction in which the flexible linear body W of FIG. By providing the bending space S as described above and projecting the tip end portion Wb of the brush member B from the tip guide hole 43a,
The elastic restoring force of the brush member B can be utilized to enhance the cleaning effect, and the life of the brush member B can be significantly extended to enhance its durability.

It is also possible to rotate the rotating member 41 in the forward and reverse directions. In that case, as shown in FIG. 2, the bending space S is recessed in the front and rear sides with respect to the flexible linear body W. It is good to set up. Further, a flexible space S as shown in FIG. 3 may be formed around the flexible linear body W so that the flexible linear body W of the brush member B can be flexed in an arbitrary direction. In the brush sweep type cleaning device 40, the brush member B
The tip end portion Wb of the brush member intermittently abuts and sweeps the lead frame 60, and when the tip end portion Wb is separated from the lead frame, the elastic restoring force of the brush member B acts, so that the unswept residue of the burr or the like is marked. Less. That is, the cleaning effect is remarkably improved as compared with the case where brushes are planted almost all around the rotating body 41 and continuously swept.

As is apparent from the above description, according to the brush sweep type cleaning device of the present invention, the brush member is provided in the brush housing formed in the rotating member, and the tip of the brush member is intermittently attached to the member to be cleaned. Since it is to be slidably contacted for cleaning, it consumes much less power than the prior art, and there is no need to consider measures against machine corrosion or post-treatment of water, and to provide an inexpensive cleaning device. You can

Furthermore, unlike the conventional example, there is no inconvenience that the surface of a molded semiconductor package is roughened by abrasion with abrasive particles, and it is not necessary to mask the package surface. Moreover, it is not necessary to use abrasive particles or water, and the running cost can be greatly reduced. Further, since the dust of the abrasive particles does not scatter, the poor environment of the conventional example can be improved, and the preceding step and the thin film deburring and cleaning step can be connected as a series of steps in the clean room.

In the above embodiment, the brush housing 43 is described as having the tip end guide holes 43a formed therein, but these tip end guide holes are not always necessary. In addition, the tip portion Wb of the brush member B is guided by the tip portion guide hole.
When the guide wire is not guided, the flexible linear body W flexes freely, so that the flexure space S is also unnecessary. Furthermore, in the above embodiment, the case of cleaning the lead frame of the electronic component has been described, but the present invention is not limited to this, and is widely applicable to the case of cleaning other members to be cleaned.

[Brief description of drawings]

1A and 1B show a brush sweep type cleaning device, FIG. 1A is a left side view thereof, FIG. 1B is a front view thereof, and FIG. 1C is a longitudinal sectional view of a brush member.

FIG. 2 is an enlarged view of an essential part showing a modified example of the bending space of the brush housing.

FIG. 3 is an enlarged sectional view of an essential part showing a modified example of the bending space of the brush housing.

FIG. 4 shows a lead frame cleaning device to which a brush sweep type cleaning device according to the present invention is applied.
Is a schematic plan view showing a state in which the upper cover of the cleaning device is removed, and FIG. 1B is a schematic front view of the cleaning device.

FIG. 5 shows one main roller and one pressing roller,
The figure (A) is the left side view, and the figure (B) is the front view.

FIG. 6 shows the other main roller and the pressing roller,
The figure (A) is the left side view, and the figure (B) is the front view.

FIG. 7 is a plan view of a lead frame for electronic component.

[Explanation of symbols]

R ... Conveyance path, 40 ... Brush sweep type cleaning device, 41 ... Rotating member, 43 ... Brush housing, 43a ... Tip guide hole, 47 ... Rotation drive means, 60 ... Cleaning target member (lead frame), 61 ... Electronic component, 62 ... Lead, 62a ... Lead portion, B ... Brush member, W ... Flexible linear body, Wa ...
Base end of flexible linear member, Wb ... Tip of brush member, S
... The bending space of the flexible linear body.

Claims (2)

[Claims] 1. A transport path (R) for transporting a member (60) to be cleaned.
A brush sweeping type cleaning device (40) arranged along the rotating path (R), and a rotating member (41) arranged along the transport path (R);
This rotating member (41) is provided with a brush member (B) attached thereto, and the brush member (B) is formed by bundling the proximal ends (Wa) of a large number of flexible linear members (W). Then, the brush housing (43) is formed in the rotating member (41) at a required rotation angle pitch, and each brush housing (43) is formed.
Each of the brush members (B) is provided therein, and the tip end (Wb) of the brush member (B) is projected from the brush housing (43), and the rotating member (41) is rotated by the rotation driving means (47). The brush member (B)
A brush sweep type cleaning device, characterized in that the front end (Wb) of the above is brought into sliding contact with the portion to be cleaned (60). 2. A flexure space (S) for the flexible linear member (W) is formed in the brush housing (43), and a brush member is inserted from the tip guide hole (43a) of the brush housing (43).
The brush sweep type cleaning device according to claim 1, wherein the tip portion (Wb) of (B) is configured to project.