JPH08293253A - Manufacture of plasma display panel - Google Patents

Manufacture of plasma display panel

Info

Publication number
JPH08293253A
JPH08293253A JP9670695A JP9670695A JPH08293253A JP H08293253 A JPH08293253 A JP H08293253A JP 9670695 A JP9670695 A JP 9670695A JP 9670695 A JP9670695 A JP 9670695A JP H08293253 A JPH08293253 A JP H08293253A
Authority
JP
Japan
Prior art keywords
electrodes
discharge
space
substrate
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9670695A
Other languages
Japanese (ja)
Other versions
JP3526650B2 (en
Inventor
Hiroyuki Nakahara
裕之 中原
Shige Hara
樹 原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP9670695A priority Critical patent/JP3526650B2/en
Publication of JPH08293253A publication Critical patent/JPH08293253A/en
Application granted granted Critical
Publication of JP3526650B2 publication Critical patent/JP3526650B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE: To stabilize the characteristics of a plasma display panel by covering electrode ends with conductive layers, then introducing a discharge gas during evacuation of an internal space, then causing a discharge within the space by application of voltages to the electrodes through the conductive layers, then re-evacuating the space, and then introducing and sealing the discharge gas inside the space. CONSTITUTION: A plurality of electrodes Y are arranged on a glass substrate 11 and entirely covered with heat-resisting protective layers 17, 50. The substrate 11 and another substrate 21 are opposed to each other with the ends 43 of the electrodes Y projecting from the edge of the substrate 21, and are integrated together to form an internal space 30. The space 30 is connected to an evacuation device to effect evacuation and baking. A current-carrying probe is attached to the conductive heat-resisting layer 50 at the ends 43, and when the temperature of the substrate 11 reaches 350 deg.C the evacuation is stopped, a discharge gas is introduced, and a discharge is caused by application of voltages to the electrodes Y to purify the space 30. After evacuation is performed again to expel impurities, the discharge gas is newly introduced and the space 30 is sealed.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、PDP(プラズマディ
スプレイパネル)の製造方法に関する。PDPは、高速
表示の可能な薄型表示デバイスであり、ハイビジョン映
像用の大型カラー表示デバイスとして注目されている。
PDPの市場が拡がるにつれて、特性の安定した高品質
のPDPを製造する技術の重要性が増している。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a PDP (plasma display panel). The PDP is a thin display device capable of high-speed display, and is attracting attention as a large color display device for high-definition video.
As the PDP market expands, the importance of technology for manufacturing PDPs with stable characteristics and high quality is increasing.

【0002】[0002]

【従来の技術】図5はPDPの外観を示す切欠き斜視図
である。図5において、PDP1は、放電空間30を挟
んで対向する一対の基板(通常はガラス板)11,21
を基体とする構造の表示パネルである。
2. Description of the Related Art FIG. 5 is a cutaway perspective view showing the appearance of a PDP. In FIG. 5, the PDP 1 is a pair of substrates (usually glass plates) 11 and 21 facing each other with the discharge space 30 in between.
It is a display panel having a structure based on.

【0003】一方又は両方の基板11,21の内面上に
図示しない複数の電極が所定ピッチで配列されており、
これらの電極によって表示領域EHが画定される。ま
た、電極は放電空間から基板の端縁部まで導出され、フ
レキシブル配線板によって外部の駆動回路と接続され
る。駆動回路との接続を可能とするため、各基板11,
21は、それぞれの両端縁が他方の基板の端縁より外側
に張り出すように、その大きさ及び対向配置位置が設定
される。
A plurality of electrodes (not shown) are arranged at a predetermined pitch on the inner surfaces of one or both of the substrates 11 and 21.
The display area EH is defined by these electrodes. Further, the electrodes are led out from the discharge space to the edge portion of the substrate and connected to an external drive circuit by a flexible wiring board. In order to enable connection with the drive circuit, each substrate 11,
The size and the facing arrangement position of 21 are set such that both end edges of each of the pieces 21 project outward from the end edge of the other substrate.

【0004】PDP1の製造に際しては、前面側の基板
11及び背面側のガラス基板21について別個に電極及
び他の構成部材を設けた後、一方の基板の表面に封止材
として枠状の低融点ガラス層40を設けておく。そし
て、両基板11,21を重ね合わせ、互いに押し当てた
状態で400〜450℃程度に加熱する。これにより、
基板11,21が融着により一体化されて放電空間30
が形成される。
In manufacturing the PDP 1, electrodes and other constituent members are separately provided on the front substrate 11 and the rear glass substrate 21, and then a frame-shaped low melting point is used as a sealing material on the surface of one substrate. The glass layer 40 is provided. Then, the two substrates 11 and 21 are overlapped and heated to about 400 to 450 ° C. while being pressed against each other. This allows
The substrates 11 and 21 are integrated by fusion to form the discharge space 30.
Is formed.

【0005】ガラス基板11,21の一体化に続いて、
放電空間30の排気を行って放電ガスを充填する。この
ため、あらかじめ一方の基板(通常は背面側)21には
直径5mm程度の貫通孔25が設けられており、排気に
先立ってガラス基板21の外面に数cm程度の長さのガ
ラス管(チップ管)60が融着される。つまり放電空間
30と真空ポンプ(又は放電ガスボンベ)とを接続する
ための配管の一部としてチップ管60が取付けられ、貫
通孔25とチップ管60とを介して排気及びガス充填が
行われる。チップ管60は、放電ガスを充填した後に通
気路を塞ぐように溶断され、その時点で放電空間30が
完全に密閉される。
Following the integration of the glass substrates 11 and 21,
The discharge space 30 is evacuated and filled with discharge gas. For this reason, one substrate (usually the back side) 21 is provided with a through hole 25 having a diameter of about 5 mm in advance, and a glass tube (chip having a length of about several cm) is provided on the outer surface of the glass substrate 21 prior to evacuation. The tube 60 is fused. That is, the tip tube 60 is attached as a part of the pipe for connecting the discharge space 30 and the vacuum pump (or the discharge gas cylinder), and exhaust and gas filling are performed through the through hole 25 and the tip tube 60. After filling the discharge gas, the tip tube 60 is melted and cut so as to close the ventilation passage, and at that time, the discharge space 30 is completely sealed.

【0006】このようにして製造されるPDPの内、放
電に壁電荷を利用するAC型PDPでは、電極が放電空
間30に対して誘電体(通常は低融点ガラス)で被覆さ
れている。
Among the PDPs manufactured as described above, in the AC type PDP which utilizes wall charges for discharge, the electrodes are covered with a dielectric (usually low melting point glass) with respect to the discharge space 30.

【0007】従来では、AC型PDP1の製造に際し
て、電極がCr/Cu/Crなどの金属薄膜からなる場
合には、電極の端部(すなわち放電空間30の外側に導
出された部分)を含めて電極の全体を被覆するように誘
電体層を設けていた。そして、一対の基板を一体化して
放電空間を密閉した後の段階で、電極と外部との導電接
続を可能とするため、電極の端部を覆う誘電体層を取り
除いていた。
Conventionally, in manufacturing the AC type PDP 1, when the electrode is made of a metal thin film such as Cr / Cu / Cr, the end portion of the electrode (that is, the portion led to the outside of the discharge space 30) is included. The dielectric layer was provided so as to cover the entire electrode. Then, at a stage after the pair of substrates are integrated and the discharge space is sealed, the dielectric layer covering the ends of the electrodes is removed in order to enable conductive connection between the electrodes and the outside.

【0008】このように電極の全体を誘電体層で被覆し
ておくことにより、基板を封止するための熱処理での酸
化を防止することができる。つまり、誘電体層は、60
0℃程度の熱に対する耐熱性を有しており、PDPの製
造段階において、電極(金属薄膜)の熱による変質を防
ぐ電極保護層として用いられる。
By covering the entire electrode with the dielectric layer in this manner, it is possible to prevent oxidation in the heat treatment for sealing the substrate. That is, the dielectric layer is 60
It has heat resistance to heat of about 0 ° C. and is used as an electrode protective layer for preventing deterioration of the electrode (metal thin film) due to heat at the manufacturing stage of PDP.

【0009】なお、電極が露出した状態で熱処理を行う
場合には、不活性雰囲気中で処理を行う必要があり、生
産性が大幅に低下してしまう。
If the heat treatment is carried out with the electrodes exposed, it is necessary to carry out the treatment in an inert atmosphere, resulting in a significant decrease in productivity.

【0010】[0010]

【発明が解決しようとする課題】ところで、PDP1に
おいては、放電空間30に残留する不純物をできるだけ
少なくするのが望ましい。水分や炭酸ガスなどの不純物
が残存すると、放電特性が不安定になり、焼付きが生じ
易くなる。
By the way, in the PDP 1, it is desirable to reduce impurities remaining in the discharge space 30 as much as possible. If impurities such as water and carbon dioxide remain, the discharge characteristics become unstable and seizure easily occurs.

【0011】従来、放電空間30の清浄化の効率を高め
るため、基板11,21を350℃程度に加熱した状態
で排気が行われていた。しかし、350℃程度の熱エネ
ルギーでは不純物を十分に除去することが困難であっ
た。
Conventionally, in order to improve the efficiency of cleaning the discharge space 30, the substrates 11 and 21 have been heated to about 350 ° C. and exhausted. However, it was difficult to remove impurities sufficiently with heat energy of about 350 ° C.

【0012】そこで、不純物を放電(プラズマ)によっ
て物理的及び化学的に除去することが考えられる。この
放電による清浄化は、特に内壁面が活性な状態であるベ
ーキング(真空熱処理)中に行なえばより効果的であ
る。
Therefore, it can be considered to physically and chemically remove the impurities by discharge (plasma). The cleaning by the discharge is more effective if it is performed especially during baking (vacuum heat treatment) in which the inner wall surface is in an active state.

【0013】しかし、従来においては、排気工程段階で
は電極全体が誘電体層(絶縁層)で被覆されているの
で、放電による内部の清浄化を行うことができなかっ
た。本発明は、この問題に鑑みてなされたもので、電極
を変質させることなく、放電による放電空間の清浄化を
行って特性の安定したPDPを製造することを目的とし
ている。
However, in the prior art, since the entire electrode was covered with the dielectric layer (insulating layer) at the exhausting step, the inside could not be cleaned by electric discharge. The present invention has been made in view of this problem, and an object of the present invention is to manufacture a PDP having stable characteristics by cleaning the discharge space by discharge without degrading the electrodes.

【0014】[0014]

【課題を解決するための手段】請求項1の発明の方法
は、図1及び図2に示すように、第1の基板上に複数の
電極を配列し、前記各電極の全体を耐熱性保護層で被覆
した後に、前記第1の基板と第2の基板とを前記各電極
の端部が前記第2の基板の端縁から張り出すように対向
配置し、前記第1及び第2の基板を一体化して放電のた
めの内部空間を形成し、前記第1及び第2の基板を加熱
した状態で前記内部空間の排気を行うPDPの製造方法
であって、前記耐熱性保護層の内の前記各電極の前記端
部を被覆する部分の層として導電性を有した層を形成し
ておき、前記内部空間の排気の途中の段階で前記内部空
間に放電ガスを導入し、前記導電性を有した層を介して
前記各電極に電圧を印加し、前記第1及び第2の基板が
加熱された状態の前記内部空間内で放電を生じさせた後
に、再び前記内部空間の排気を行って放電ガスを導入
し、前記内部空間を完全に密閉する方法である。
According to a first aspect of the present invention, as shown in FIGS. 1 and 2, a plurality of electrodes are arranged on a first substrate, and the entire electrodes are protected against heat. After being covered with a layer, the first substrate and the second substrate are arranged so as to face each other so that the end portions of the respective electrodes project from the end edges of the second substrate. Is formed into an internal space for discharge, and the internal space is evacuated in a state where the first and second substrates are heated. A layer having conductivity is formed as a layer of a portion covering the end portion of each electrode, and a discharge gas is introduced into the internal space at a stage of exhausting the internal space to improve the conductivity. Before applying a voltage to each of the electrodes through the layer having the first and second substrates in a heated state. After causing discharge within the interior space, it is again how the exhaust of the internal space by performing introducing a discharge gas, to completely seal the interior space.

【0015】請求項2の発明の方法は、前記導電性を有
した層を全ての前記電極の端部に跨がるように形成し、
前記導電性を有した層を介して全ての前記電極に一括に
前記電圧を印加して放電を生じさせ、前記内部空間を完
全に密閉した後に前記導電性を有した層を取り除くもの
である。
According to a second aspect of the present invention, the conductive layer is formed so as to extend over the end portions of all the electrodes,
The voltage is applied to all the electrodes at once through the conductive layer to generate a discharge, and the internal space is completely sealed, and then the conductive layer is removed.

【0016】[0016]

【作用】PDPの製造途中において、電極の端部は、導
電性を有した耐熱性保護層によって外気と分断され、加
熱時の化学変化(酸化)による変質が防止される。
In the course of manufacturing the PDP, the end portion of the electrode is separated from the outside air by the heat-resistant protective layer having conductivity, and deterioration due to chemical change (oxidation) during heating is prevented.

【0017】導電性を有した耐熱性保護層を介して電極
と外部の電源とを電気的に接続することができるので、
電極を保護した状態で放電を生じさせることができる。
Since the electrodes can be electrically connected to the external power source through the heat-resistant protective layer having conductivity,
A discharge can be generated with the electrodes protected.

【0018】[0018]

【実施例】図1は本発明に係るPDP1の部分断面図、
図2はPDP1の要部平面図である。また、図3は本発
明に係るPDP1の分解斜視図であり、1つの画素EG
に対応する部分の基本的な構造を示している。なお、こ
れらの図において、図5に対応する構成要素には同一の
符号を付してある。
DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a partial sectional view of a PDP 1 according to the present invention,
FIG. 2 is a plan view of a main part of the PDP 1. 3 is an exploded perspective view of the PDP 1 according to the present invention, showing one pixel EG
The basic structure of the part corresponding to is shown. In these figures, the same reference numerals are given to the constituent elements corresponding to FIG.

【0019】PDP1は、図3のようにマトリクス表示
の単位発光領域EUに一対の表示電極X,Yとアドレス
電極Aとが対応する3電極構造の面放電型PDPであ
り、蛍光体の配置形態による分類の上で反射型と呼称さ
れている。
The PDP 1 is a surface discharge type PDP having a three-electrode structure in which a pair of display electrodes X and Y and an address electrode A correspond to a unit light emitting region EU of a matrix display as shown in FIG. It is called a reflective type after being classified.

【0020】面放電のための表示電極X,Yは、表示面
H側(前面側)のガラス基板11上に設けられ、誘電体
層17によって放電空間30に対して被覆されている。
誘電体層17の表面には、数千Å程度の厚さのMgO膜
18が設けられている。放電空間30は、ガラス基板1
1,21の対向領域の周囲を融着する封止ガラス40
(図1参照)によって密閉されている。
The display electrodes X and Y for surface discharge are provided on the glass substrate 11 on the display surface H side (front side), and are covered with the dielectric layer 17 in the discharge space 30.
On the surface of the dielectric layer 17, a MgO film 18 having a thickness of about several thousand Å is provided. The discharge space 30 is the glass substrate 1
Sealing glass 40 for fusion bonding around the facing regions of 1, 21
(See FIG. 1).

【0021】また、表示電極X,Yは、放電空間30に
対して表示面H側に配置されることから、面放電を広範
囲とし且つ表示光の遮光を最小限とするため、ネサ膜な
どからなる幅の広い透明導電膜41とその導電性を補う
ための幅の狭い3層構造(Cr/Cu/Cr)の金属膜
42とから構成されている。
Further, since the display electrodes X and Y are arranged on the display surface H side with respect to the discharge space 30, the surface discharge is made wide and the shielding of the display light is minimized. The transparent conductive film 41 has a wide width and a metal film 42 having a narrow three-layer structure (Cr / Cu / Cr) for compensating for the conductivity.

【0022】各表示電極X,Yの金属膜42は、図1の
ように駆動系との接続のためにガラス基板11の端縁部
まで導出され、なお且つ先端(図1の斜線を付した部
分)が図2のように接続端子43として幅広に形成され
ている。
The metal film 42 of each of the display electrodes X and Y is led out to the end edge portion of the glass substrate 11 for connection with the driving system as shown in FIG. 1, and the tip (hatched in FIG. 1 is attached). The portion) is formed wide as the connection terminal 43 as shown in FIG.

【0023】一方、単位発光領域EUを選択的に発光さ
せるためのアドレス電極Aは、厚膜電極であって、背面
側のガラス基板21上に表示電極X,Yと直交するよう
に一定ピッチで配列されている。各アドレス電極Aの間
には、120〜150μm程度の高さを有したストライ
プ状の隔壁29が設けられ、これによって放電空間30
がライン方向に単位発光領域EU毎に区画され且つ放電
空間30の間隙寸法が規定されている。
On the other hand, the address electrode A for selectively emitting light in the unit light emitting area EU is a thick film electrode and is arranged on the rear glass substrate 21 at a constant pitch so as to be orthogonal to the display electrodes X and Y. It is arranged. Stripe-shaped barrier ribs 29 having a height of about 120 to 150 μm are provided between the address electrodes A, whereby the discharge space 30 is formed.
Are divided in the line direction for each unit light emitting region EU, and the gap size of the discharge space 30 is defined.

【0024】また、ガラス基板21には、アドレス電極
Aの上面及び隔壁29の側面を含めて背面側の内面を被
覆するように、R(赤),G(緑),B(青)の3原色
の蛍光体28が設けられている。各色の蛍光体28は、
面放電時に放電空間30内の放電ガスが放つ紫外線によ
って励起されて発光する。PDP1では、R,G,Bの
組み合わせによるフルカラー表示が可能である。
Further, the glass substrate 21 is covered with R (red), G (green), and B (blue) so as to cover the inner surface of the rear surface including the upper surface of the address electrode A and the side surface of the partition wall 29. A primary color phosphor 28 is provided. The phosphor 28 of each color is
When the surface discharge occurs, the discharge gas in the discharge space 30 is excited by the ultraviolet rays emitted to emit light. The PDP 1 is capable of full-color display by combining R, G, and B.

【0025】PDP1の製造に際しては、表示電極Y
を、低融点ガラスからなる誘電体層17と導電性耐熱層
50とによって保護する。導電性耐熱層50は、例えば
銀ペースト又は銀と鉛ガラスと主成分とする導電性ペー
ストの焼成によって得られ、封止材40の外側に位置す
る接続端子43を被覆する。本実施例では、図2のよう
に表示電極Yを構成する全ての金属膜42の先端の接続
端子43に跨がるように導電性耐熱層50を形成する。
これにより各表示電極Yに一括に電圧を印加することが
できる。なお、表示電極Xについては、全体を誘電体層
17によって保護する。
In manufacturing the PDP 1, the display electrode Y
Are protected by the dielectric layer 17 made of low melting point glass and the conductive heat-resistant layer 50. The conductive heat-resistant layer 50 is obtained, for example, by firing a silver paste or a conductive paste containing silver and lead glass as a main component, and covers the connection terminals 43 located outside the sealing material 40. In this embodiment, as shown in FIG. 2, the conductive heat-resistant layer 50 is formed so as to extend over the connection terminals 43 at the tips of all the metal films 42 constituting the display electrode Y.
This allows a voltage to be applied to each display electrode Y at once. The display electrode X is wholly protected by the dielectric layer 17.

【0026】表示電極X,Yを被覆した後、誘電体層1
7の表面にMgO膜18を真空蒸着によって形成する。
そして、表示電極X,Yを有するガラス基板11と、別
途にアドレス電極Aなどを設けた背面側のガラス基板2
1とを、接続端子43がガラス基板21の端縁から張り
出すように対向配置して一体化する。これにより、内部
に放電空間30が形成される。ただし、この時点では放
電空間30は大気状態である。
After covering the display electrodes X and Y, the dielectric layer 1 is formed.
A MgO film 18 is formed on the surface of No. 7 by vacuum evaporation.
Then, the glass substrate 11 having the display electrodes X and Y, and the glass substrate 2 on the back side on which the address electrodes A and the like are separately provided.
1 and 1 are arranged so as to face each other so that the connection terminal 43 projects from the edge of the glass substrate 21, and are integrated. As a result, the discharge space 30 is formed inside. However, at this point, the discharge space 30 is in the atmospheric state.

【0027】次に、チップ管60(図5参照)を介して
放電空間30と排気装置とを接続し、真空排気及び35
0℃のベーキング(加熱処理)を行う。このとき、加熱
に先立って導電性耐熱層50に通電用プローブを取り付
けておく。
Next, the discharge space 30 and the exhaust device are connected via a tip tube 60 (see FIG. 5), and vacuum exhaust and 35 are performed.
Baking (heat treatment) is performed at 0 ° C. At this time, a probe for energization is attached to the conductive heat-resistant layer 50 prior to heating.

【0028】ガラス基板11の温度が350℃に達する
と、排気を中断して放電空間30に放電ガスを導入す
る。放電ガスとしては、例えばネオンとキセノンと酸素
との混合ガスを用いる。また、ガス圧力は数十〜数百T
orrの範囲内の適当な値とする。
When the temperature of the glass substrate 11 reaches 350 ° C., the exhausting is stopped and the discharge gas is introduced into the discharge space 30. As the discharge gas, for example, a mixed gas of neon, xenon, and oxygen is used. Also, the gas pressure is several tens to several hundreds T
It is an appropriate value within the range of orr.

【0029】そして、導電性耐熱層50を介して全ての
表示電極Yに対して共通に電圧パルス(200V、10
kHz)を印加し、ガラス基板11を加熱状態に保った
状態で放電空間30を清浄化するための放電を生じさせ
る。本実施例では、放電空間30の前面側及び背面側の
両方の壁面を清浄化するため、図4のように表示電極Y
とアドレス電極Aとを電源80に接続し、ガラス基板1
1,21の対向方向の放電を生じさせる。ここで、アド
レス電極Aについては、導電性耐熱層50と同様の層又
はステンレス板などの冶具を短絡導体55として用いる
ことによって、複数のアドレス電極Aを一括して電源8
0に接続する。
A voltage pulse (200 V, 10 V) is commonly applied to all the display electrodes Y through the conductive heat resistant layer 50.
(kHz) is applied to generate a discharge for cleaning the discharge space 30 while the glass substrate 11 is kept heated. In this embodiment, in order to clean both the front wall surface and the rear wall surface of the discharge space 30, as shown in FIG.
And the address electrode A are connected to the power source 80, and the glass substrate 1
A discharge is generated in the opposite direction of 1, 21. Here, regarding the address electrodes A, by using a layer similar to the conductive heat-resistant layer 50 or a jig such as a stainless plate as the short-circuit conductor 55, the plurality of address electrodes A are collectively supplied to the power source 8.
Connect to 0.

【0030】所定時間にわたって放電を続け、プラズマ
作用によって水分や炭素などの不純物を内壁面から遊離
させた後、再び排気を行って放電ガスとともに不純物を
排出する。その後、新たに放電ガスを導入してチップ管
60を溶断し、放電空間30を完全に密閉する。そし
て、硝酸溶液を用いて導電性耐熱層50を除去し、表示
電極Yを電気的に分離する。これによりPDP1の組立
てが終了する。
The discharge is continued for a predetermined time, impurities such as water and carbon are liberated from the inner wall surface by the plasma action, and then exhaust is performed again to discharge the impurities together with the discharge gas. After that, a discharge gas is newly introduced to melt the tip tube 60 to completely seal the discharge space 30. Then, the conductive heat resistant layer 50 is removed using a nitric acid solution, and the display electrodes Y are electrically separated. This completes the assembly of PDP1.

【0031】上述の実施例においては面放電型のPDP
1を例示したが、本発明は対向放電型のPDPにも適用
可能である。また、放電空間30の排気と並行して放電
ガスを導入することもできる。その場合は、例えば放電
空間30の対角の隅にそれぞれチップ管60を取り付
け、一方を排気装置と接続し、他方を放電ガスの供給源
と接続すればよい。
In the above embodiment, the surface discharge type PDP is used.
However, the present invention is also applicable to a counter discharge type PDP. Further, the discharge gas can be introduced in parallel with the exhaust of the discharge space 30. In that case, for example, the tip tubes 60 may be attached to the diagonal corners of the discharge space 30, and one of them may be connected to an exhaust device and the other may be connected to a discharge gas supply source.

【0032】[0032]

【発明の効果】請求項1及び請求項2の発明によれば、
電極を変質させることなく、放電による放電空間の清浄
化を行って特性の安定したPDPを製造することができ
る。
According to the inventions of claim 1 and claim 2,
It is possible to manufacture a PDP with stable characteristics by cleaning the discharge space by discharge without changing the quality of the electrodes.

【0033】請求項2の発明によれば、製造途中におい
て表示領域の全域で放電を生じさせるための外部電源と
の接続が容易になる。
According to the second aspect of the present invention, connection with an external power source for causing discharge in the entire display area during manufacture becomes easy.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明に係るPDPの部分断面図である。FIG. 1 is a partial cross-sectional view of a PDP according to the present invention.

【図2】PDPの要部平面図である。FIG. 2 is a plan view of an essential part of a PDP.

【図3】本発明に係るPDPの分解斜視図である。FIG. 3 is an exploded perspective view of a PDP according to the present invention.

【図4】電圧の印加方法の一例を示す模式図である。FIG. 4 is a schematic diagram showing an example of a voltage application method.

【図5】PDPの外観図である。FIG. 5 is an external view of a PDP.

【符号の説明】[Explanation of symbols]

1 PDP 11 ガラス基板(第1の基板) 22 ガラス基板(第2の基板) 17 誘電体層(耐熱性保護層) 30 放電空間(内部空間) 43 接続端子(電極の端部) 50 導電性耐熱層(耐熱性保護層、導電性を有した
層) Y 表示電極(電極)
1 PDP 11 Glass Substrate (First Substrate) 22 Glass Substrate (Second Substrate) 17 Dielectric Layer (Heat Resistant Protection Layer) 30 Discharge Space (Internal Space) 43 Connection Terminal (End of Electrode) 50 Conductive Heat Resistance Layer (heat resistant protective layer, conductive layer) Y display electrode (electrode)

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】第1の基板上に複数の電極を配列し、前記
各電極の全体を耐熱性保護層で被覆した後に、前記第1
の基板と第2の基板とを前記各電極の端部が前記第2の
基板の端縁から張り出すように対向配置し、前記第1及
び第2の基板を一体化して放電のための内部空間を形成
し、前記第1及び第2の基板を加熱した状態で前記内部
空間の排気を行うPDPの製造方法であって、 前記耐熱性保護層の内、前記各電極の前記端部を被覆す
る部分の層として導電性を有した層を形成しておき、 前記内部空間の排気の途中の段階で前記内部空間に放電
ガスを導入し、前記導電性を有した層を介して前記各電
極に電圧を印加し、前記第1及び第2の基板が加熱され
た状態の前記内部空間内で放電を生じさせた後に、 再び前記内部空間の排気を行って放電ガスを導入し、前
記内部空間を完全に密閉することを特徴とするPDPの
製造方法。
1. A plurality of electrodes are arranged on a first substrate, and each of the electrodes is covered with a heat-resistant protective layer, and then the first electrode is formed.
The second substrate and the second substrate so as to face each other so that the end portions of the electrodes project from the edge of the second substrate, and the first and second substrates are integrated to form an interior for discharging. A method of manufacturing a PDP which forms a space and evacuates the internal space while heating the first and second substrates, wherein the end portion of each electrode is covered in the heat resistant protective layer. A layer having conductivity is formed as a layer of a portion to be formed, and a discharge gas is introduced into the internal space at a stage in the middle of exhausting the internal space, and each electrode is provided through the layer having conductivity. A voltage is applied to the first and second substrates to generate a discharge in the internal space where the first and second substrates are heated, and then the internal space is evacuated again to introduce a discharge gas. A method for producing a PDP, which comprises completely sealing
【請求項2】前記導電性を有した層を全ての前記電極の
端部に跨がるように形成し、前記導電性を有した層を介
して全ての前記電極に一括に前記電圧を印加して放電を
生じさせ、 前記内部空間を完全に密閉した後に前記導電性を有した
層を取り除く、 請求項1記載のPDPの製造方法。
2. The conductive layer is formed so as to straddle the end portions of all the electrodes, and the voltage is collectively applied to all the electrodes via the conductive layer. The method of manufacturing a PDP according to claim 1, wherein the conductive layer is removed after the discharge is generated to completely seal the internal space.
JP9670695A 1995-04-21 1995-04-21 Manufacturing method of PDP Expired - Fee Related JP3526650B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9670695A JP3526650B2 (en) 1995-04-21 1995-04-21 Manufacturing method of PDP

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9670695A JP3526650B2 (en) 1995-04-21 1995-04-21 Manufacturing method of PDP

Publications (2)

Publication Number Publication Date
JPH08293253A true JPH08293253A (en) 1996-11-05
JP3526650B2 JP3526650B2 (en) 2004-05-17

Family

ID=14172205

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9670695A Expired - Fee Related JP3526650B2 (en) 1995-04-21 1995-04-21 Manufacturing method of PDP

Country Status (1)

Country Link
JP (1) JP3526650B2 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005044590A (en) * 2003-07-25 2005-02-17 Toshiba Corp Discharge lamp
US6936965B1 (en) 1999-11-24 2005-08-30 Lg Electronics Inc. Plasma display panel
KR100647615B1 (en) * 2004-09-21 2006-11-23 삼성에스디아이 주식회사 Plasma display panel
JP2007080608A (en) * 2005-09-13 2007-03-29 Matsushita Electric Ind Co Ltd Method for manufacturing plasma display panel
US7230381B2 (en) * 2002-08-30 2007-06-12 Fujitsu Hitachi Plasma Display Limited Method of manufacturing a plasma display panel
US7250724B2 (en) 2002-09-12 2007-07-31 Lg Electronics Inc. Plasma display panel including dummy electrodes in non-display area
KR100751375B1 (en) * 2006-03-15 2007-08-22 삼성에스디아이 주식회사 Plasma display panel and flat display device therewith
KR100751341B1 (en) * 2005-08-12 2007-08-22 삼성에스디아이 주식회사 Plasma display panel
US7329990B2 (en) 2002-12-27 2008-02-12 Lg Electronics Inc. Plasma display panel having different sized electrodes and/or gaps between electrodes

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6936965B1 (en) 1999-11-24 2005-08-30 Lg Electronics Inc. Plasma display panel
US7235924B2 (en) 1999-11-24 2007-06-26 Lg Electronics Inc. Plasma display panel
US7230381B2 (en) * 2002-08-30 2007-06-12 Fujitsu Hitachi Plasma Display Limited Method of manufacturing a plasma display panel
US7250724B2 (en) 2002-09-12 2007-07-31 Lg Electronics Inc. Plasma display panel including dummy electrodes in non-display area
US7329990B2 (en) 2002-12-27 2008-02-12 Lg Electronics Inc. Plasma display panel having different sized electrodes and/or gaps between electrodes
US7817108B2 (en) 2002-12-27 2010-10-19 Lg Electronics Inc. Plasma display having electrodes provided at the scan lines
JP2005044590A (en) * 2003-07-25 2005-02-17 Toshiba Corp Discharge lamp
KR100647615B1 (en) * 2004-09-21 2006-11-23 삼성에스디아이 주식회사 Plasma display panel
KR100751341B1 (en) * 2005-08-12 2007-08-22 삼성에스디아이 주식회사 Plasma display panel
JP2007080608A (en) * 2005-09-13 2007-03-29 Matsushita Electric Ind Co Ltd Method for manufacturing plasma display panel
KR100751375B1 (en) * 2006-03-15 2007-08-22 삼성에스디아이 주식회사 Plasma display panel and flat display device therewith

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