JPH08271873A - Separation of cell assembly - Google Patents

Separation of cell assembly

Info

Publication number
JPH08271873A
JPH08271873A JP7888695A JP7888695A JPH08271873A JP H08271873 A JPH08271873 A JP H08271873A JP 7888695 A JP7888695 A JP 7888695A JP 7888695 A JP7888695 A JP 7888695A JP H08271873 A JPH08271873 A JP H08271873A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
substrate
liquid crystal
cell assembly
cell
active gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7888695A
Other languages
Japanese (ja)
Inventor
Takayuki Yamada
孝行 山田
Original Assignee
Casio Comput Co Ltd
カシオ計算機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Abstract

PURPOSE: To obviate the occurrence of elution of impurity ions into liquid crystals and to prevent the deterioration of the liquid crystals by fusion cutting a pair of large-sized substrates respectively by a laser beam while blowing an active gas to their cutting points.
CONSTITUTION: A cell assembly 10 is placed on the prescribed position on a stage 30 by directing its one substrate 11 upward, aligning the parting lines (a) in the longitudinal direction of this substrate 11 to a Y-axis direction and aligning the parting lines (b) in a transverse direction to an X-axis direction. The cell assembly 10 is fixed by vacuum attraction to the stage 30. Next, the stage 30 is moved in the X-axis and Y-axis directions to oppose one end of first piece of the parting line (a) in the longitudinal direction among the respective parting lines (a), (b) of the upper substrate 11 of the cell assembly 10 to a laser oscillator 31 and an active gas blowing nozzle 32. The blowing of the active gas G from the active gas blowing nozzle 32 is started and the irradiation with the laser beam L from the laser oscillator 31 is started in this state and the substrates are fusion cut by the laser beam L along the parting lines (a) in the longitudinal direction.
COPYRIGHT: (C)1996,JPO

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【産業上の利用分野】この発明は、セル集合体の分離方法に関するものである。 BACKGROUND OF THE INVENTION This invention relates to a method of separating cell aggregates.

【0002】 [0002]

【従来の技術】液晶セルの製法として、複数個の液晶セルを一括して製造する製法がある。 As production method of the prior art liquid crystal cell, there is a method to produce collectively the plurality of liquid crystal cells.

【0003】この製法は、液晶セル複数個分の基板を採取できる大きさの一対の大型基板を各液晶セルの基板となる部分にそれぞれ設けた枠状のシール材を介して接合することにより、複数個の液晶セルが連続的につながったセル集合体を組立て、その後、このセル集合体を個々の液晶セルに分離する方法であり、セル集合体の個々の液晶セルへの分離は、従来、一対の大型基板の外面にそれぞれ所定の分断線に沿って切り溝を入れ、その後、両基板を前記切り溝に沿って折断する方法で行なわれている。 [0003] This process, by joining a pair of large substrates having a size of the substrate of the liquid crystal cell plurality fraction can be collected through the sealant frame-like respectively provided in the substrate to become part of the liquid crystal cell, assembling a plurality cell collection having liquid crystal cells continuously connected to, then, is a method of separating the cell aggregates into individual liquid crystal cells, the separation into individual liquid crystal cells of the cell assembly, conventionally, each placed groove-away along a predetermined cutting line on the outer surface of the pair of large-sized substrate, and then, have been made to both substrates in a manner that Oridan along the kerf.

【0004】図4は従来のセル集合体の分離方法を示すセル集合体10の一方の基板の外面に切り溝を入れている状態の斜視図である。 [0004] FIG. 4 is a perspective view of a state in which putting kerfs on the outer surface of one substrate of the cell assembly 10 illustrating a method of separating a conventional cell assembly.

【0005】まず、セル集合体10について説明すると、図4において、11,12は液晶セル複数個(図では6個)分の基板を採取できる大きさ(面積)の一対の大型ガラス基板であり、これら大型基板11,12の各液晶セルAの基板となる部分の内面にはそれぞれ、図示しないが、ITO膜等からなる透明な電極が設けられるとともに、その上に配向膜が設けられている。 [0005] First, a description will be given of the cell assembly 10, in FIG. 4, 11 and 12 is a pair of large glass substrates of a plurality liquid crystal cell substrate of the component can be collected (six in the figure) the size (area) , each of the inner surfaces of the substrates to become part of the liquid crystal cell a of these large substrates 11 and 12, although not shown, with a transparent electrode made of ITO film or the like is provided, an alignment film is provided on its .

【0006】なお、カラーフィルタを備えた液晶セルを製造する場合は、いずれかの大型基板の各液晶セルAの基板となる部分の内面(電極の上または下)に前記カラーフィルタが設けられる。 [0006] In the case of producing a liquid crystal cell with a color filter, the color filter is provided on the inner surface of the portion to be a substrate of the liquid crystal cell A in any of the large-sized substrate (above or below the electrode).

【0007】このセル集合体10は、上記一対の大型基板11,12の一方に、各液晶セルAの基板となる部分と基板外周部とにそれぞれ対応させて、各液晶セルAの液晶封入領域を囲む枠状のシール材13と外周部シール材15とを印刷し、その後、両基板11,12を重ね合わせて加圧することにより両基板11,12間の間隙を所定のセルギャップになるように調整し、その状態で前記シール材13,15を硬化させる方法で組立てられたものであり、各液晶セルAの液晶封入領域を囲む枠状シール材13には、その一辺を部分的に欠落させて形成(印刷時に形成)された液晶注入口14が設けられている。 [0007] The cell assembly 10, one of the pair of large substrates 11 and 12, respectively in correspondence to the part and the outer peripheral portion of the substrate serving as the substrate of the liquid crystal cell A, liquid crystal sealing area of ​​the liquid crystal cell A print a frame-shaped sealing member 13 and the outer seal member 15 surrounding the then to the gap between the substrates 11 and 12 by pressurizing by superposing the substrates 11 and 12 becomes a predetermined cell gap adjusted to, which was assembled by the method of curing the sealing material 13 and 15 in this state, the frame-shaped sealing member 13 which surrounds the liquid crystal sealing area of ​​the liquid crystal cell a, partially missing one side liquid crystal inlet 14 is provided which is formed (formed at the time of printing) with. なお、上記外周部シール材15は、両基板11,1 Incidentally, the outer peripheral seal member 15, both substrates 11, 1
2を重ね合わせて加圧する際の基板11,12の反りを防ぐために設けられている。 2 superimposed with is provided to prevent the warpage of the substrates 11 and 12 when pressurized.

【0008】このセル集合体10は、従来、図4のように、先端にダイヤモンドチップ等の硬質刃を設けた溝切り工具20を用いてセル集合体10の一方の大型基板1 [0008] The cell assembly 10, conventionally, as shown in FIG. 4, the large substrate 1 of one of the cell assembly 10 with the grooving tool 20 having a hard edge of the diamond chips to the tip
1の外面に図に一点鎖線で示した所定の分断線aに沿って縦および横に切り溝bを入れ、同様にして他方の大型基板12の外面に所定の分断線a,bに沿って縦および横に切り溝を入れた後、両基板11,12を一方向(縦または横)の切り溝に沿って折断してセル集合体10を短冊状に分離し、さらにそれを他方向の切り溝に沿って折断して、個々の液晶セルAに分離されている。 Figure put grooves b cut vertically and laterally along a predetermined cutting line a shown by a one-dot chain line in the first outer surface, the same way the other predetermined cutting line on the outer surface of the large substrate 12 a, along the b after placing the vertical and horizontal to the kerf, the substrates 11 and 12 in one direction along the kerf (vertical or horizontal) separating the cell assembly 10 in a strip shape by Oridan, further it in the other direction and Oridan along the kerf, is separated into individual liquid crystal cells a.

【0009】そして、分離された液晶セルAは、その枠状シール材13に設けられている液晶注入口14から真空注入法によって内部に液晶を充填し、その後前記液晶注入口14を封止して完成されている。 [0009] Then, the liquid crystal cell A was separated, filled with the liquid crystal inside by a vacuum injection method of a liquid crystal injection port 14 provided on the frame-like sealing member 13, sealed then sealing the liquid crystal inlet 14 It has been completed Te.

【0010】 [0010]

【発明が解決しようとする課題】しかしながら、上述した従来のセル集合体の分離方法は、セル集合体10の大型基板11,12の外面に溝切り工具20によって切り溝を入れる際に、基板11,12にクラックが生じることがあり、また両基板11,12を切り溝bに沿って折断する際にも基板11,12が切り溝から外れた方向に割れることがあるため、液晶セルの製造歩留が悪いという問題をもっている。 [SUMMARY OF THE INVENTION However, the method of separating the conventional cell assembly described above, when placing a groove cut by the groove cutting tool 20 to the outer surface of the large-size substrates 11 and 12 of the cell assembly 10, the substrate 11 , there is a crack occurs in 12, also because it can break in a direction deviating from that kerf substrates 11 and 12 even when Oridan along the groove b cut the substrates 11 and 12, manufacturing of the liquid crystal cell yield has a problem of poor.

【0011】しかも、上記分離方法で分離された液晶セルは、その両基板の端面が、切り溝に沿って折断された折断面となっているため、液晶セル内に真空注入法によって液晶を充填する際に、基板に含まれている不純物イオンが液晶中に溶出し、液晶を劣化させてしまうことがあった。 [0011] Moreover, in the liquid crystal cells which are separated the separation process, the filling end face of the both substrates, because that is the Oridan been folded section along the kerf, the liquid crystal by a vacuum injection method in the liquid crystal cell when, impurity ions contained in the substrate is eluted into the liquid crystal, it was sometimes deteriorates the liquid crystal.

【0012】すなわち、液晶セルのガラス基板としては、一般に、石英ガラス、フロートガラス、ソーダガラス等が用いられているが、液晶セルの製造コストの面から見れば、価格が安価なソーダガラスが有利である。 Namely, the glass substrate of the liquid crystal cell, in general, quartz glass, float glass, soda glass, or the like is used, when viewed in terms of manufacturing cost of the liquid crystal cell, the price inexpensive soda glass is advantageous it is.

【0013】しかし、このソーダガラスは、Na + 、C [0013] However, this soda glass, Na +, C
+等のアルカリ性の不純物イオンを含んでいるため、 because it contains alkaline impurity ions a + or the like,
液晶セルの基板がソーダガラスであり、その端面が上記のような折断面となっていると、液晶セル内への液晶の注入に際して、基板に含まれている不純物イオンが基板端面から液晶中に溶出し、液晶セル内に充填された液晶や、液晶注入装置の液晶皿内の液晶が、長期間のうちに劣化してしまう。 A substrate is soda glass of the liquid crystal cell, the end surface thereof is in the folding section as described above, when the liquid crystal injection into the liquid crystal cell, impurity ions contained in the substrate in the liquid crystal from the substrate end face eluted, liquid crystal or filled in the liquid crystal cell, the liquid crystal in the liquid crystal dish liquid crystal injection apparatus, degraded within a long period of time.

【0014】なお、石英ガラスは不純物イオンを含まない高純度のガラスであり、またフロートガラスは不純物イオンの含有量が少ない純度の良いガラスであるため、 [0014] Since the quartz glass has a high purity of the glass that does not contain impurity ions, also float glass is pure good glass containing a small amount of impurity ions,
液晶セルの基板の端面が上記のような折断面であっても、前記基板が石英ガラスである場合は、液晶中への不純物イオンの溶出はなく、またフロートガラスである場合も、基板からの不純物イオンの溶出はあまり問題にならないが、石英ガラスは非常に高価であり、またフロートガラスもソーダガラスに比べるとかなり高価であるため、液晶セルの製造コストが高くなってしまう。 Also the end surface of the substrate of the liquid crystal cell is a fold cross-section as described above, when the substrate is a quartz glass is not eluted impurity ions into the liquid crystal in, also be a float glass, from the substrate Although elution of impurity ions is not a serious problem, quartz glass is very expensive, and because the float glass is also quite expensive compared to soda glass, the manufacturing cost of the liquid crystal cell is increased.

【0015】この発明は、基板にクラック等の欠陥を生じさせることなくセル集合体を個々の液晶セルに分離して、液晶セルの製造歩留を向上させるとともに、前記基板が不純物イオンを含んでいても、液晶中への不純物イオンの溶出が生じないようにして液晶の劣化を防ぐことができる、セル集合体の分離方法を提供することを目的としたものである。 [0015] The present invention separates the cell assembly to each of the liquid crystal cell without causing defects such as cracks in the substrate, it improves the production yield of the liquid crystal cell, wherein the substrate contains impurity ions it can have, it is possible to prevent deterioration of the liquid crystal as the elution of impurity ions into the liquid crystal in does not occur, it is intended to provide a method of separating cell aggregates.

【0016】 [0016]

【課題を解決するための手段】この発明のセル集合体の分離方法は、セル集合体の一対の大型基板をそれぞれ、 Means for Solving the Problems The method for separating cell aggregates of the present invention, each pair of large substrates of the cell aggregates,
その切断箇所に活性ガスを吹き付けながらレーザ光により溶融切断することを特徴とするものである。 It is characterized in that the melt cut by the laser beam while blowing an active gas to the cut portion.

【0017】 [0017]

【作用】この発明によれば、セル集合体の一対の大型基板をそれぞれレーザ光によって溶融切断しているため、 SUMMARY OF] According to the present invention, since the molten cut a pair of large substrates of the cell assembly by a respective laser beam,
前記基板にクラック等の欠陥を生じさせてしまうことはない。 It never would cause defects such as cracks in the substrate. そして、この発明のように、前記基板をその切断箇所に活性ガスを吹き付けながらレーザ光により溶融切断すると、前記基板が溶融切断されると同時にその切断面が活性ガスと反応して酸化され、この切断面に酸化膜が生成して、基板に含まれている不純物イオンの溶出が阻止される。 Then, as in the present invention, when melt cut by the laser beam while blowing an active gas the substrate to the cut part, the cut surface at the same time as the substrate is melted cut is oxidized by reacting with the active gas, the oxide film is generated on the cut surface, the elution of the impurity ions contained in the substrate is prevented.

【0018】 [0018]

【実施例】以下、この発明の一実施例を図1〜図3を参照して説明する。 EXAMPLES Hereinafter, a description will be given of an embodiment of the present invention with reference to FIGS.

【0019】図1はこの実施例のセル集合体の分離方法を示すセル集合体10の一方の基板を切断している状態の斜視図である。 [0019] FIG. 1 is a perspective view of a state where the cutting one of the substrates of the cell assembly 10 illustrating a method of separating cell aggregates of this embodiment. なお、図1に示したセル集合体10 Incidentally, the cell assembly 10 shown in FIG. 1
は、図4に示したものと同じものであるから、重複する説明は図に同符号を付して省略する。 It will be omitted since it is same as that shown in FIG. 4, and duplicate explanations are denoted by the same reference numerals in FIG.

【0020】まず、セル集合体10を分離するための装置について説明すると、このセル集合体分離装置は、図1に示すように、セル集合体10を支持するステージ3 [0020] First, a description will be given of an apparatus for separating cell assembly 10, the cell aggregate separation device, as shown in FIG. 1, stage 3 for supporting the cell assembly 10
0と、このステージ30のセル集合体支持面に対向させて設けられたレーザ発振器31および活性ガス吹付けノズル32とで構成されている。 0, and a laser oscillator 31 and the active gas blast nozzle 32 provided to face the cell collection support surface of the stage 30.

【0021】上記ステージ30は、図示しないステージ移動機構によってY軸方向(前後方向)とX軸方向(左右方向)とに水平移動されるものであり、このステージ30には、その上面に載置されるセル集合体10を固定するための真空吸着手段(図示せず)が設けられている。 [0021] The stage 30, which is horizontally moved with the Y-axis direction by the stage moving mechanism (not shown) (the front-rear direction) and the X-axis direction (lateral direction), in the stage 30 mounted on its upper surface vacuum suction means for fixing the cell assembly 10 (not shown) is provided to be.

【0022】また、レーザ発振器31は、ビーム状のレーザ光Lをステージ30上のセル集合体10に向けて照射するものであり、このレーザ発振器31は、所定の方向にレーザ光Lを照射する状態で設置されている。 Further, the laser oscillator 31 is one for irradiating a laser beam L of the beam shape on the cell assembly 10 on the stage 30, the laser oscillator 31 irradiates the laser beam L in a predetermined direction It has been established in the state.

【0023】さらに、上記活性ガス吹付けノズル32 Furthermore, the active gas spray nozzles 32
は、図示しないガス供給源から供給される、酸素ガスまたは酸素を含むガス等の活性ガスGを、上記セル集合体10に向けて吹付けるものであり、この活性ガス吹付けノズル32は、セル集合体10の上面のうち、上記レーザ発振器31からのレーザ光Lが照射される切断箇所に活性ガスGを吹付けるようにして設けられている。 Is supplied from a gas supply source (not shown), the active gas G of a gas such as an oxygen-containing gas or oxygen, which blows toward the cell assembly 10, the active gas spray nozzle 32, the cell of the upper surface of the assembly 10, it is provided so as blowing inert gas G to cut part of the laser beam L is irradiated from the laser oscillator 31.

【0024】次に、セル集合体10の分離方法を説明すると、このセル集合体10の各液晶セルAへの分離は、 Next, to explain the method of separating the cell assembly 10, separation into the liquid crystal cell A of the cell assembly 10,
上記分離装置により次のようにして行なう。 By the separation device is carried out as follows.

【0025】まず、ステージ30上の所定の位置に、セル集合体10を、その一方の基板11を上に向けた状態で、この基板11の縦方向分断線aをY軸方向に合わせ、横方向の分断線bをX軸方向に合わせて載置し、このセル集合体10をステージ30に真空吸着により固定する。 Firstly, at a predetermined position on the stage 30, the cell assembly 10, the substrate 11 while facing up, aligning the longitudinal component breaking a of the substrate 11 in the Y-axis direction, the horizontal the combined direction of the dividing line b in the X-axis direction is mounted, it is fixed by vacuum suction the cell assembly 10 in the stage 30.

【0026】次に、ステージ30をX軸およびY軸方向に移動させて、セル集合体10の上側の基板11の各分断線a,bのうちの1本目の縦方向分断線aの一端をレーザ発振器31および活性ガス吹付けノズル32に対向させ、その状態で、活性ガス吹付けノズル32からの活性ガスGの吹付けを開始するとともにレーザ発振器31 Next, by moving the stage 30 in the X-axis and Y-axis direction, the section lines a of the upper substrate 11 of the cell assembly 10, one end of the first run of the longitudinal component breakage a of b is opposed to the laser oscillator 31 and the active gas spray nozzle 32, the laser oscillator 31 is in this state, to start the spray of the active gas G from the active gas spray nozzle 32
からのレーザ光Lの照射を開始し、ステージ30をY軸方向に移動させて、前記基板11を、活性ガスGを吹付けながら前記1本目の縦方向分断線aに沿ってレーザ光Lにより溶融切断する。 Start the irradiation of the laser beam L from, by moving the stage 30 in the Y-axis direction, the substrate 11, along a longitudinal partial break a of the first run while blowing inert gas G by the laser beam L melt-cutting.

【0027】なお、前記レーザ光Lの強度は、セル集合体10の下側の基板12には影響を与えずに上側の基板11だけをその全厚(1.5mm以下)にわたって溶融切断するように設定する。 [0027] The intensity of the laser beam L is to melt cut over its entire thickness of only the upper substrate 11 without affecting the lower substrate 12 of the cell assembly 10 (1.5 mm or less) It is set to.

【0028】以下はその繰返しであり、基板11を縦方向分断線aに沿って切断するごとに、ステージ30を縦方向分断線aの間隔だけX軸方向に移動させながら、基板11を各縦方向分断線aに沿って順次切断する。 [0028] The following is its repetition, each is cut along the substrate 11 in the vertical direction component disconnected a, while moving the stage 30 by a distance in the vertical direction partial disconnection a in the X-axis direction, the vertical substrate 11 sequentially cut along the direction component disconnected a.

【0029】また、全ての縦方向分断線aに沿って基板11を切断した後は、前記基板11の1本目の横方向分断線bの一端をレーザ発振器31および活性ガス吹付けノズル32に対向させ、ステージ30をY軸方向に移動させて基板11を前記1本目の横方向分断線bに沿って切断し、以下、基板11を横方向分断線bに沿って切断するごとに、ステージ30を縦方向分断線bの間隔だけY軸方向に移動させながら、基板11を各横方向分断線bに沿って順次切断する。 Further, after cutting the substrate 11 along all of the longitudinal component disconnected a, facing the end of the first run of the lateral component breakage b of the substrate 11 to the laser oscillator 31 and the active gas spray nozzle 32 is, the stage 30 is moved in the Y-axis direction along the substrate 11 in the horizontal direction component breakage b of the first run, the following, each is cut along the substrate 11 in the horizontal direction component breakage b, stage 30 the while moving only in the Y-axis direction interval longitudinal partial disconnection b, sequentially cut along the substrate 11 in the horizontal direction component breakage b.

【0030】そして、セル集合体10の一方の基板11 [0030] Then, one substrate 11 of the cell assembly 10
を全ての分断線a,bに沿って切断した後は、前記液晶セル10を上下を逆にしてステージ30上に載置し直して、他方の基板12を上記と同様に各分断線に沿って溶融切断する。 All segmentation lines a, after cutting along the b, the liquid crystal cell 10 again placed vertically on the stage 30 in the reverse, the other substrate 12 along the cutting line in the same manner as described above Te melt cutting.

【0031】このように、セル集合体10の一方の基板11を全ての分断線a,bに沿って切断し、次いで他方の基板12を全ての分断線に沿って切断すると、セル集合体10が個々の液晶セルAに分離される。 [0031] Thus, when cut along one of the substrate 11 of the cell assembly 10 all the segmentation lines a, a b, then cut along the other substrate 12 to all lines of disruption, the cell assembly 10 There are separated into individual liquid crystal cells a.

【0032】すなわち、上記分離方法は、セル集合体1 [0032] In other words, the above-mentioned methods of separation, cell assembly 1
0の一対の大型基板11,12をそれぞれ、その切断箇所に酸素ガスまたは酸素を含むガス等の活性ガスGを吹き付けながらレーザ光Lにより溶融切断するものであり、この分離方法によれば、前記基板11,12をそれぞれレーザ光Lによって溶融切断しているため、前記基板11,12にクラック等の欠陥を生じさせてしまうことはない。 Each pair of large substrates 11 and 12 0, which melts cut by the laser beam L while blowing an active gas G of a gas such as an oxygen-containing gas or oxygen in the cutting position, according to this separation method, the since the substrate 11 and 12 to melt cut respectively by the laser beam L, and never would cause defects such as cracks in the substrates 11 and 12.

【0033】そして、上記のように、基板11,12をその切断箇所に活性ガスGを吹き付けながらレーザ光L [0033] Then, as described above, the laser beam L while blowing inert gas G to the substrates 11 and 12 to the cut portion
により溶融切断すると、この基板11,12が溶融切断されると同時にその切断面が活性ガスGと反応して酸化される。 When melted cut by, the substrate 11 and 12 the cut surface at the same time is melted cut is oxidized by reacting with active gas G.

【0034】図2および図3は、上記基板11,12の切断箇所の拡大断面図および原子配列図であり、図2および図3において、(a)は切断された瞬間の状態を示し、(b)は切断面が酸化された状態を示している。 FIG. 2 and FIG. 3 is an enlarged cross-sectional view and atomic arrangement view of a cutting portion of the substrates 11 and 12, 2 and 3, (a) is shown a state of the moment it is cut, ( b) shows a state where the cut surface is oxidized. なお、図2および図3に示した基板11,12はソーダガラスからなる基板であり、その表裏面は、ソーダガラス基板に含まれているNa + 、Ca +等の不純物イオンの溶出を防ぐために、Si 0 2膜等の無機膜40で被覆されている。 The substrate 11, 12 shown in FIGS. 2 and 3 is a substrate made of soda glass, front and rear surfaces thereof are, Na + contained in the soda glass substrate, in order to prevent the elution of impurity ions Ca +, etc. , it is covered with the inorganic film 40 such as Si 0 2 film.

【0035】このように、上記基板11,12は、切断した瞬間はその切断面が図2(a)および図3(a)のような状態にあるが、その切断箇所には活性ガスGが吹き付けられているため、前記基板11,12の切断面が、溶融切断により加熱された状態で活性ガスGにさらされ、切断面の原子Si ,Na ,Ca が活性ガスG中の酸素Oと結合して、図2(b)および図3(b)のように、前記切断面に、その全体にわたって酸化膜41が生成する。 [0035] Thus, the substrates 11 and 12, but the moment the cut is the cut surface is in a state shown in FIG. 2 (a) and FIG. 3 (a), is in its cutting position is active gas G because it is blown, bond cleavage plane of the substrate 11 and 12, is exposed to active gases G in a state of being heated by the molten cleavage, atomic Si of the cut surface, Na, Ca with oxygen O in the active gas G and, as shown in FIG. 2 (b) and 3 (b), on the cutting surface, the oxide film 41 to generate over its entire.

【0036】この酸化膜41は、基板11,12の表裏面を被覆しているSi 0 2膜等の無機膜40と同様に、 [0036] The oxide film 41, like the inorganic film 40 of Si 0 2 film or the like covering the front and back surfaces of the substrate 11,
基板11,12に含まれているNa + 、Ca +等の不純物イオンの溶出を阻止する機能をもっている。 Na included in the substrate 11, 12 +, has a function of preventing the elution of impurity ions Ca + or the like.

【0037】したがって、上記分離方法によれば、基板11,12にクラック等の欠陥を生じさせることなくセル集合体10を個々の液晶セルAに分離して、液晶セルの製造歩留を向上させることができるし、また、基板1 [0037] Thus, according to the separation method, the cell assembly 10 without causing defects such as cracks in the substrate 11 is separated into individual liquid crystal cells A, to improve the production yield of the liquid crystal cell it can, also, the substrate 1
1,12が不純物イオンを含んでいても、液晶セルA内に液晶を注入する際の液晶中への不純物イオンの溶出が生じないようにして、液晶の劣化を防ぐことができる。 1,12 even if contains impurity ions, as elution of an impurity ion into the crystal due to injection of the liquid crystal does not occur in the liquid crystal cell A, it is possible to prevent deterioration of the liquid crystal.

【0038】なお、上記分離方法は、大型基板11,1 [0038] In addition, the separation method, a large-sized substrate 11, 1
2にソーダガラスのような不純物イオンの含有量が多いガラスを用いたセル集合体に限らず、フロートガラスのような不純物イオンの含有量が少ないガラス基板を用いたセル集合体の分離にも適用できる。 2 is not limited to the cell collection in which the content of impurity ions with high glass such as soda glass, also applicable to the separation of the cell collection with a glass substrate containing a small amount of impurity ions such as float glass it can.

【0039】また、上記実施例では、活性ガスGを、セル集合体10の上面のレーザ光Lが照射される切断箇所だけに吹付けているが、この活性ガスGは、セル集合体10の上面全体に吹付けてもよい。 Further, in the above embodiment, the active gas G, the laser beam L on the upper surface of the cell assembly 10 is blown only cut part to be irradiated, the active gas G, the cell assembly 10 it may be sprayed on the entire top surface.

【0040】さらに、上記実施例では、レーザ発振器3 [0040] Further, in the above embodiment, the laser oscillator 3
1および活性ガス吹付けノズル32を定位置に設けておき、セル集合体10を支持するステージ30を移動させることによってセル集合体10の基板11,12をその分断線に沿って切断しているが、この基板11,12の切断は、レーザ発振器31と活性ガス吹付けノズル32 1 and active gas blast nozzle 32 may be provided in place, and cut along the substrates 11 and 12 of the cell assembly 10 to the cutting line by moving the stage 30 supporting the cell assembly 10 but cutting of the substrates 11 and 12, the laser oscillator 31 and the active gas blowing nozzle 32
(活性ガスGをセル集合体10の上面全体に吹付ける場合はレーザ発振器31だけ)を基板11,12の分断線に沿って走査移動させて行なってもよい。 The may be performed by scanning movement along the cutting line of the substrate 11 (the laser oscillator 31 only if the active gas G blown across the top of the cell assembly 10).

【0041】 [0041]

【発明の効果】この発明のセル集合体の分離方法は、セル集合体の一対の大型基板をそれぞれ、その切断箇所に活性ガスを吹き付けながらレーザ光により溶融切断するものであるから、基板にクラック等の欠陥を生じさせることなくセル集合体を個々の液晶セルに分離して、液晶セルの製造歩留を向上させるとともに、前記基板が不純物イオンを含んでいても、液晶中への不純物イオンの溶出が生じないようにして液晶の劣化を防ぐことができる。 The method of separation according to the present invention the cell aggregate of the present invention, each pair of large substrates of the cell assembly, since it is intended to melt cut by the laser beam while blowing an active gas to the cut portion, cracks in the substrate be separated into individual liquid crystal cells cell assembly without causing a defect etc., improves the production yield of the liquid crystal cell, wherein the substrate also include impurity ions, the impurity ions into the liquid crystal in it is possible to prevent deterioration of the liquid crystal so as elution does not occur.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】この発明の一実施例によるセル集合体の分離方法を示す、セル集合体の一方の基板を切断している状態の斜視図。 [1] One showing a method of separating cell aggregates according to the embodiment, a perspective view of a state where the cutting one of the substrates of the cell aggregate of the present invention.

【図2】基板の切断箇所を示す、切断された瞬間の状態および切断面が酸化された状態の拡大断面図。 Figure 2 shows a cut portion of the substrate, enlarged cross-sectional view of a state in which the state and the cut surface of the moment it is cut is oxidized.

【図3】基板の切断箇所を示す、切断された瞬間の状態および切断面が酸化された状態の原子配列図。 3 shows a cut portion of the substrate, atomic arrangement view in which the state and the cut surface of the moment it is cut is oxidized.

【図4】従来のセル集合体の分離方法を示す、セル集合体の一方の基板の外面に切り溝を入れている状態の斜視図。 4 shows a method of separating conventional cell assembly, perspective view of a state in which putting kerf in one of the outer surface of the substrate of the cell assembly.

【符号の説明】 DESCRIPTION OF SYMBOLS

10…セル集合体 11,12…大型基板 A…液晶素子集合体 a,b…分断線 13…枠状シール材 14…液晶注入口 15…外周部シール材 30…ステージ 31…レーザ発振器 L…レーザ光 32…活性ガス吹付けノズル G…活性ガス 40…基板の表裏面を被覆している無機膜 41…基板の切断面に生成した酸化膜 10 ... cell assembly 11, 12 ... large-size substrate A ... liquid crystal element assembly a, b ... segmentation lines 13 ... frame-shaped sealing member 14 ... liquid crystal injection port 15 ... outer peripheral seal member 30 ... stage 31 ... laser oscillator L ... laser oxide film formed on the cut surface of the inorganic film 41 ... substrate covering the light 32 ... active gas blast nozzle G ... active gas 40 ... front and back surfaces of the substrate

Claims (1)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】液晶セル複数個分の基板を採取できる大きさの一対の大型基板を各液晶セルの基板となる部分にそれぞれ設けた枠状のシール材を介して接合してなるセル集合体を個々の液晶セルに分離する方法であって、 前記一対の大型基板をそれぞれ、その切断箇所に活性ガスを吹き付けながらレーザ光により溶融切断することを特徴とするセル集合体の分離方法。 1. A cell assembly formed by joining through a liquid crystal cell plurality min sealant substrate a pair of large substrates sized to collect substrate to become part provided with a frame shape for each respective liquid crystal cells of the a method for separating into individual liquid crystal cells, each said pair of large substrates, a method of separating cell aggregates characterized by melt cut by the laser beam while blowing an active gas to the cut portion.
JP7888695A 1995-04-04 1995-04-04 Separation of cell assembly Pending JPH08271873A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7888695A JPH08271873A (en) 1995-04-04 1995-04-04 Separation of cell assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7888695A JPH08271873A (en) 1995-04-04 1995-04-04 Separation of cell assembly

Publications (1)

Publication Number Publication Date
JPH08271873A true true JPH08271873A (en) 1996-10-18

Family

ID=13674301

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7888695A Pending JPH08271873A (en) 1995-04-04 1995-04-04 Separation of cell assembly

Country Status (1)

Country Link
JP (1) JPH08271873A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001073506A1 (en) * 2000-03-24 2001-10-04 Schott Glas Method for producing displays
US6980275B1 (en) 1993-09-20 2005-12-27 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device
KR100870122B1 (en) * 2002-11-28 2008-11-25 엘지디스플레이 주식회사 cutting system and method for cutting LCD panel
US20120198977A1 (en) * 2011-02-07 2012-08-09 Lpkf Laser & Electronics Ag Method for making an opening in a substrate

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6980275B1 (en) 1993-09-20 2005-12-27 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device
US7525629B2 (en) 1993-09-20 2009-04-28 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device comprising drive circuits that include thin film transistors formed on both substrates
WO2001073506A1 (en) * 2000-03-24 2001-10-04 Schott Glas Method for producing displays
KR100870122B1 (en) * 2002-11-28 2008-11-25 엘지디스플레이 주식회사 cutting system and method for cutting LCD panel
US20120198977A1 (en) * 2011-02-07 2012-08-09 Lpkf Laser & Electronics Ag Method for making an opening in a substrate

Similar Documents

Publication Publication Date Title
US6563082B2 (en) Laser cutting method, laser cutting apparatus, and method and apparatus for manufacturing liquid crystal device
US20070125757A1 (en) Laser beam machining method
US7947574B2 (en) Laser processing method and semiconductor chip
US6407360B1 (en) Laser cutting apparatus and method
US5269868A (en) Method for separating bonded substrates, in particular disassembling a liquid crystal display device
US5963289A (en) Asymmetrical scribe and separation method of manufacturing liquid crystal devices on silicon wafers
US8490434B2 (en) Process and apparatus for producing glass member provided with sealing material layer and process for producing electronic device
US6297869B1 (en) Substrate and a liquid crystal display panel capable of being cut by using a laser and a method for manufacturing the same
US6191840B1 (en) Manufacturing method for electro-optical cells or electrochemical photovoltaic cells obtained from this method
US5871134A (en) Method and apparatus for breaking and cutting a glass ribbon
US6512196B1 (en) Laser cutting device and method for cutting glass substrate by using the same
JP2000247671A (en) Method for cutting glass
US20110127244A1 (en) Methods for laser scribing and separating glass substrates
US20020046997A1 (en) Method and apparatus for cutting a non-metal substrate by using a laser beam
JPH06194637A (en) Method for sticking glass substrate for liquid crystal display plate
US6436602B1 (en) Method of repairing a defective portion in an electronic device
JP2001130921A (en) Method and device for processing brittle substrate
JP2008116969A (en) Liquid crystal panel, and device for manufacturing the same
JP2005219960A (en) Cutting and separation method of glass, glass substrate for flat panel display, and flat panel display
US20030184706A1 (en) Improvements in or relating to liquid crystal displays
JP2004224601A (en) Method of cutting liquid crystal display panel
US20020056891A1 (en) Apparatus with double laser beams for cutting two bonded glass substrates and method thereof
US20050258135A1 (en) Method of cutting glass substrate material
US20090040640A1 (en) Glass cutting method, glass for flat panel display thereof and flat panel display device using it
JP2003002677A (en) Support table for laser cutting, apparatus and method for laser cutting, and method for producing liquid crystal panel