JPH08264364A - Manufacture of inductance component - Google Patents

Abstract

PURPOSE: To provide a compact and thin inductance component having low conductor resistance and good pattern sizing with respect to a method for fabricating the inductance component used in various electronic devices. CONSTITUTION: A recess 11 having a coil pattern shape and a thickness of a conductor is formed on an insulator layer 3 as a ceramic layer formed on a support film 9, a conductor 4 having a coil pattern shape is formed further in the recess 11 of the insulator layer 3, and a desired number of the insulator layers 3 are laminated and heat-contact-bonded to form an inductance component, wherein since the conductor 4 can be thick, a compact and thin inductance component having a low conductor resistance can be obtained.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an inductance component used in various electronic devices.

[0002]

2. Description of the Related Art In recent years, in order to cope with downsizing and thinning of portable electronic equipment, there has been a demand for small and thin electronic components which can also be used for high density mounting. Among the electronic parts, thick parts technology is applied to miniaturize passive parts such as resistors, capacitors, and inductance parts.
Thick film components, which have been made thinner, have come to be used for high-density mounting. As a method for manufacturing a small-sized inductance component, for example, as disclosed in JP-A-56-138909, a ceramic layer is formed on a supporting film by a green sheet method, and a conductor is further printed thereon by a printing method. One is formed by forming a predetermined number of these, then stacking and thermocompressing them.

[0003]

However, in the inductance component manufactured by the above-mentioned conventional method, the thickness of the conductor of the coil causes a step, which hinders the stacking. When the lamination pressure is constant, the thickness difference of the conductor that can be absorbed by the thickness of the ceramic layer is limited, so that the ratio of the thickness of the ceramic layer to the thickness of the conductor is determined. As a result, the thickness of the conductor cannot be increased further. Further, in order to increase the thickness of the conductor, it is necessary to increase the pressure during thermocompression bonding in order to absorb the conductor step difference in the stacking process. As a result, the conductor is expanded and deformed. In the former case, the conductor resistance is high, and in the latter case, there is a problem that a pattern and conductor shape having a predetermined size cannot be obtained.

The present invention solves the above-mentioned conventional problems, and an object thereof is to provide a method for obtaining an inductance component having a low conductor resistance and an excellent pattern size.

[0005]

In order to achieve the above object, the present invention provides a ceramic layer with a concave portion for absorbing a step difference of a desired thickness, and forming a conductor in the concave portion. A desired number of ceramic layers provided with are laminated.

[0006]

According to the present invention, it is possible to absorb the step difference corresponding to the conductor thickness in order to form the concave portion for absorbing the step difference corresponding to the desired thickness in the ceramic layer. As a result, the conductor can be made thicker and the pressure at the time of thermocompression bonding can be lowered, so that the conductor can be prevented from being deformed due to the spread. Therefore, it is possible to obtain an inductance component having a low conductor resistance and a good pattern size and conductor shape.

[0007]

EXAMPLE A method of manufacturing an inductance component according to an example of the present invention will be described below.

The method of manufacturing the inductance component of the present embodiment is a method in which a desired number of ceramic layers containing a coil pattern-shaped conductor are laminated. The inductance component may be configured by adding a ferrite magnetic material layer, a conductor forming the coil, and if necessary, a nonmagnetic material layer.

FIG. 1 (a) is a perspective view of an inductance component obtained by a typical example of the method for manufacturing an inductance component of the present invention, and FIG. 1 (b) is a sectional view taken along line AA 'of FIG. 1 (a). The schematic diagram of the cross section at the time of doing is shown. 1A and 1B, a plate-like ferrite magnetic body 1, a coil 2 in which an insulator layer 3 as a ceramic layer and a conductor 4 are alternately laminated, a central columnar ferrite magnetic body 5, and end columnar ferrites. The inductance component is composed of a magnetic body 6, a plate-shaped ferrite magnetic body 7, and an external electrode 8.

Ni-Zn, which is generally known as a ferrite material used for the ferrite magnetic bodies 1, 5, 6, 7
System, Ni-Zn-Cu system or Mn-Zn system ferrite materials. A material having excellent conductivity and a low conductor resistance is suitable for the conductor 4, and a material used for forming the nonmagnetic layer as the insulator layer 3 is fired at the same time as the conductor 4. Materials having excellent insulating properties, such as glass having electrical insulating properties, oxides, glasses for various ceramic substrates, and the like, and ferrite materials having magnetic properties as low as that of glass materials are also suitable.

As a method of forming the plate-shaped ferrite magnetic bodies 1 and 7, there are methods such as a printing method and a green sheet method. Further, as a method of forming the columnar ferrite magnetic bodies 5 and 6,
There are printing method, dip method, etc.

As an example of a method of forming an inductance component, first, an insulating layer 3 including one lead conductor 4 of a pair of lead conductors 4 is arranged, and an insulating layer 3 including a conductor 4 having a through-hole conductor at its end is arranged thereon. The required number of body layers 3 are sequentially laminated, and finally the insulator layer 3 including the other lead conductor 4 is laminated to form the coil 2, and the through holes for forming the columnar ferrite magnetic bodies 5 and 6 are collectively formed. To form.
After that, there is a method in which the ferrite magnetic bodies 1, 5, 6, 7 are formed, these are collectively fired, and finally the external electrode 8 is provided so as to be in contact with the plate-shaped ferrite magnetic body 7 and the lead conductor 4 of the coil 2.

The present invention relates to a method of forming an insulator layer 3 including one conductor 4 which forms the coil 2 of the inductance component as described above. Therefore, the above-described application example is only an example, and is applicable to all the inductance components having the coil 2 in which the insulating layers 3 and the conductors 4 are alternately laminated, other than the inductance component shown in FIG. In particular, this is an effective method for an inductance component used in a power supply line in which a large current flows.

The following example is for an insulator layer 3 including a conductor 4.
The manufacturing method of the present invention for forming

(Embodiment 1) A first embodiment of the present invention will be described below with reference to the drawings. FIG. 2 is a cross-sectional view of the insulator layer 3 having the one-layer conductor 4 used for forming the coil 2 according to the first embodiment of the present invention.
As shown in FIG. 2A, with respect to the insulator layer 3 formed on the support film 9, as shown in FIG.
At 0, the desired thickness is compressed to form the recess 11 with less than one turn. At this time, a through hole is formed at one end of the recess. Further, as shown in FIG. 2C, a conductor paste is printed on the concave portion 11 of the insulator layer 3 to form the conductor 4.
This conductor 4 is also formed in a through hole at one end of the recess to become a through hole conductor. Insulator layer 3 having these conductors 4 formed
Are prepared for the number of layers required to obtain a coil having a desired number of turns. The untreated insulator layer 3 is sequentially laminated and thermocompression bonded repeatedly, and finally the untreated insulator layer 3 is laminated and thermocompressed to form the coil 2. Through holes for forming the columnar ferrite magnetic bodies 5 and 6 are collectively formed in the coil 2. After that, the ferrite magnetic bodies 1, 5, 6, 7 are formed and collectively fired,
Finally, an external electrode 8 is provided in contact with the plate-shaped ferrite magnetic body 7 and the lead conductor 4 of the coil 2 to obtain an inductance component.

In the inductance component constructed as described above, a recess 11 having a coil pattern shape and a desired thickness is formed on the insulating layer 3 formed on the support film 9, and the recess 11 of the insulating layer 3 is further formed. This is a method in which a conductor 4 having a coil pattern shape is formed, a desired number of the insulating layers 3 are laminated, and thermocompression bonding is performed. Since the thickness of the conductor 4 can be increased, the conductor resistance is small and thin. It becomes an inductance component of. At this time, even if the ratio of the conductor thickness to the insulator layer thickness was increased from 1: 5 to 1: 3, the pattern dimensions and shape were not changed due to the deformation of the conductor 4.
Further, the insulator layer between the conductor layers is also pressed by the mold, so that the insulation resistance between the layers is improved.

(Second Embodiment) A second embodiment of the present invention will be described below with reference to the drawings. FIG. 3 shows a sectional view of one layer used for forming the coil 2 in the second embodiment of the present invention. As shown in FIG. 3 (a), on the insulator layer 3 formed on the support film 9, an insulator paste similar to that used in the production of the insulator layer 3 as shown in FIG. 3 (b) is used. The insulating layer 3a is formed in a pattern shape opposite to that of the coil pattern to be used to form the recess 11. Further, as shown in FIG. 3C, a conductor paste is printed on the recess 11 formed by the insulator layer 3a to form the conductor 4. In addition, a through hole is formed in the insulating layer 3 corresponding to one end of the recess 11 so that the through hole conductor is simultaneously formed when the conductor 4 is printed. The insulator layers 3 on which the conductors 4 are formed are prepared by the number of layers required to obtain a coil having a desired number of turns. The untreated insulator layer 3 is sequentially laminated and thermocompression bonded repeatedly, and finally the untreated insulator layer 3 is laminated and thermocompressed to form the coil 2. Through holes for forming the columnar ferrite magnetic bodies 5 and 6 are collectively formed in the coil 2. After that, the ferrite magnetic bodies 1, 5, 6, 7 are formed, and after they are collectively fired, the external electrodes 8 are provided so as to be in contact with the plate-shaped ferrite magnetic body 7 and the lead conductor 4 of the coil 2 to obtain an inductance component.

In the inductance component constructed as described above, the insulating layer 3 formed on the support film 9 is formed with an insulating layer 3a having a pattern shape opposite to the coil pattern and having a desired thickness, and further the insulating layer 3a is formed. Recess 1 by body layer 3a
1 is a method in which a coil-pattern-shaped conductor 4 is formed, and a desired number of the insulating layers 3 are stacked and thermocompression-bonded. Since the flatness of the surface to be crimped is improved, the bondability is improved. Since it is possible to increase the thickness of the conductor 4, it becomes a small and thin inductance component having a low conductor resistance. At this time, the ratio of the conductor thickness and the insulator layer thickness is
Even if the ratio was increased from 1: 5 to 1: 3, the size and shape of the pattern did not change due to deformation of the conductor 4.

(Third Embodiment) A third embodiment of the present invention will be described below with reference to the drawings. FIG. 4 shows a sectional view of one layer used for forming the coil 2 in the third embodiment of the present invention. As shown in FIG. 4A, a conductor paste is printed on the insulator layer 3 formed on the support film 9 as shown in FIG. 4B to form the conductor 4 and the unformed portion 12 is provided. . Further, as shown in FIG. 4C, the insulating layer 3a is formed in the unformed portion 12 by using an insulating paste similar to that used for manufacturing the insulating layer 3 in a pattern shape opposite to the coil pattern. . A through hole is provided at a position corresponding to the end of the conductor 4 of the insulator layer 3 so that the through hole conductor is formed when the conductor 4 is printed. The insulator layers 3 on which the conductors 4 are formed are prepared by the number of layers required to obtain a coil having a desired number of turns. The insulator layer 3 is sequentially laminated and thermocompression bonding is repeated to form the coil 2. Through holes for forming the columnar ferrite magnetic bodies 5 and 6 are collectively formed in the coil 2. After that, the ferrite magnetic bodies 1, 5, 6, 7 are formed, these are collectively fired, and the external electrode 8 is provided so as to be in contact with the plate-shaped ferrite magnetic body 7 and the lead conductor 4 of the coil 2 to obtain an inductance component.

In the inductance component constructed as described above, the coil pattern-shaped conductor 4 is formed on the insulator layer 3 formed on the support film 9, and the unformed portion 12 is formed.
In this method, an insulating layer 3a having a pattern shape opposite to the coil pattern and having a conductor thickness is formed, and a desired number of the insulating layers 3 are laminated and thermocompression bonded. Since it is improved, the bondability can be improved,
Since the thickness of the conductor 4 can be increased, a small and thin inductance component with low conductor resistance is obtained. At this time, the ratio of the conductor thickness and the insulator layer thickness is changed from 1: 5 to 1: 3.
Even if the height was increased to 0, no dimensional change of the pattern due to deformation of the conductor 4 was observed.

(Fourth Embodiment) A fourth embodiment of the present invention will be described below with reference to the drawings. FIG. 5 shows a sectional view of one layer used for the coil 2 in the fourth embodiment of the present invention. As shown in FIG. 5A, the conductor 4 having a coil pattern shape is formed on the support film 9 by using a conductor paste. At this time, a through-hole conductor is placed on the end of the conductor 4 and formed by printing. Further FIG.
As shown in (b), the insulating layer 3a having a pattern shape opposite to the coil pattern is formed on the unformed portion 12 of the conductor 4 by using an insulating paste. Further, as shown in FIG. 5C, the insulator layer 3 is formed on the entire surface of the insulator layer by using the same insulator slurry as that used for forming the insulator layer 3a.
At this time, the through-hole conductor at the end of the conductor 4 penetrates the insulator layer 3. Insulator layers 3 including these conductors 4 are prepared by the number of layers required to obtain a coil having a desired number of turns. Then, the insulating layer 3 is sequentially laminated and thermocompression bonding is repeated to form the coil 2. Through holes for forming the columnar ferrite magnetic bodies 5 and 6 are collectively formed in the coil 2. After that, the ferrite magnetic bodies 1, 5, 6, 7 are formed, these are collectively fired, and the external electrode 8 is provided so as to be in contact with the plate-shaped ferrite magnetic body 7 and the lead conductor 4 of the coil 2 to obtain an inductance component.

The inductance component constructed as described above has the coil-shaped conductor 4 on the support film 9.
Then, an insulating layer 3a having a pattern shape opposite to the coil pattern and having a conductor thickness is formed on the unformed portion 12 of the conductor 4, and the insulating layer 3 is further formed on the entire surface. This is a method in which a desired number of the insulating layers 3 including the conductor 4 are laminated and formed by thermocompression bonding. Since the flatness of the surface to be crimped is improved, the bondability can be improved, and the thickness of the conductor 4 can be improved. Since it can be thickened, it becomes a small and thin inductance component with low conductor resistance. At this time, even if the ratio of the conductor thickness and the insulator layer thickness is increased from 1: 5 to 1: 3, the conductor 4
No dimensional change of the pattern due to deformation of the pattern was observed.
Further, in terms of pattern, since the insulator layer 3 is further formed after the coil pattern and the reverse pattern are formed, there is a margin in the accuracy of the reverse pattern.

(Embodiment 5) A fifth embodiment of the present invention will be described below with reference to the drawings. FIG. 6 shows a sectional view of one layer used for the coil 2 in the fifth embodiment of the present invention. As shown in FIG. 6A, an insulating paste is used on the supporting film 9 to form an insulating layer 3a having a pattern shape opposite to the coil pattern, and a recess 11 is provided. Further, as shown in FIG. 6B, a conductor 4 having a coil pattern shape is formed in the recess 11 by using a conductor paste.
At this time, a through-hole conductor is formed at the end of the conductor 4. Further, as shown in FIG. 6C, an insulator layer 3 is formed on the entire surface of the insulator layer by using an insulator slurry similar to that used for forming the insulator layer 3a. At this time, the through-hole conductor is assumed to penetrate this insulator layer 3. Insulator layers 3 including these conductors 4 are prepared by the number of layers required to obtain a coil having a desired number of turns. The coil 2 is formed by sequentially stacking the solid insulating layer 3 on the entire surface and repeating thermocompression bonding. The columnar ferrite magnetic bodies 5,
6. Form a through hole for formation. After that, the ferrite magnetic bodies 1, 5, 6, 7 are formed and collectively fired, and then the external electrode 8 is provided so as to be in contact with the plate-shaped ferrite magnetic body 7 and the lead conductor 4 of the coil 2 to obtain an inductance component.

In the inductance component constructed as described above, the insulating layer 3a having a pattern shape opposite to the coil pattern and having a desired thickness is formed on the support film 9, and the conductor 4 having the coil pattern shape is formed. Further, an insulator layer 3 is formed on this. This is a method in which a desired number of the insulating layers 3 including the conductor 4 are laminated and formed by thermocompression bonding. Since the flatness of the surface to be crimped is improved, the bondability can be improved, and the thickness of the conductor 4 can be improved. Since it can be thickened, it becomes a small and thin inductance component with low conductor resistance. At this time, even if the ratio of the conductor thickness to the insulator layer thickness was increased from 1: 5 to 1: 3, the dimensional change of the pattern due to the deformation of the conductor 4 was not observed. Further, in terms of pattern, since the insulating layer is further formed after forming the coil pattern and the reverse pattern, there is a margin in the accuracy of the reverse pattern.

(Embodiment 6) A sixth embodiment of the present invention will be described below with reference to the drawings. FIG. 7 is a sectional view of one layer used for the coil 2 in the sixth embodiment of the present invention. As shown in FIG. 7 (a), a coil pattern-shaped nonmagnetic insulator layer 13 having a through hole at the end is formed on the support film 9, and further on the support film 9 as shown in FIG. 7 (b). The magnetic layer 14 having an insulating property having a pattern shape opposite to the coil pattern is formed. Next, as shown in FIG. 7C, a nonmagnetic insulator layer 1
A coil pattern-shaped conductor 4 is formed on the surface 3. The layers of these combinations are prepared by the number of layers required to obtain the coil 2 having the desired number of turns. The layers of this combination are sequentially laminated, and thermocompression bonding is repeated to form the coil 2. Through holes for forming the columnar ferrite magnetic bodies 5 and 6 are collectively formed in the coil 2. After that, the ferrite magnetic body 1,
After forming 5, 6 and 7 and performing co-firing, an external component 8 is provided so as to contact the plate-shaped ferrite magnetic body 7 and the lead conductor 4 of the coil 2 to obtain an inductance component.

In the inductance component constructed as described above, a coil pattern-shaped non-magnetic insulator layer 13 is formed on a support film 9, and a pattern shape opposite to the coil pattern is further formed on the support film 9. A magnetic layer 14 having an insulating property is formed, and a desired number of layers of these combinations, in which the conductor 4 having a coil pattern shape is formed on the non-magnetic insulating layer 13, are laminated and thermocompression bonded. Since the conductor 4 can be thickened, a small and thin inductance component with low conductor resistance is obtained. At this time, the ratio of the conductor thickness and the insulator layer thickness is changed from 1: 5 to 1:
Even if the height was increased to 3, no dimensional change of the pattern due to deformation of the conductor 4 was observed. Also, with this configuration, the coil 2
It is possible to make a single inductance component by itself.

(Embodiment 7) A seventh embodiment of the present invention will be described below with reference to the drawings. FIG. 8 is a sectional view showing one layer used for the coil 2 in the seventh embodiment of the present invention. As shown in FIG. 8 (a), a coil pattern-shaped non-magnetic insulator layer 13 having a through hole at the end is formed on the support film 9, and as shown in FIG. 8 (b), the coil pattern shape is formed thereon. The conductor 4 is formed.
At this time, a through-hole conductor is formed in the through-hole of the nonmagnetic insulator layer 13. Further, as shown in FIG. 8C, a magnetic material layer 14 having an insulating property having a pattern shape opposite to the coil pattern is formed on the support film 8. The layers of these combinations are prepared by the number of layers required to obtain the coil 2 having the desired number of turns. The layers of this combination are sequentially laminated and thermocompression bonding is repeated to form the coil 2. Through holes for forming the columnar ferrite magnetic bodies 5 and 6 are collectively formed in the coil 2. After that, ferrite magnetic materials 1, 5,
After forming 6, 7 and collectively firing, an external electrode 8 is provided so as to contact the plate-shaped ferrite magnetic body 7 and the lead conductor 4 of the coil 2 to obtain an inductance component.

In the inductance component constructed as described above, the coil pattern-shaped non-magnetic insulator layer 13 is formed on the support film 9, and the coil pattern-shaped conductor 4 is formed thereon, and further supported. This is a method of forming a magnetic material layer 14 having an insulating property of a pattern shape opposite to the coil pattern on the film 9, laminating a desired number of layers of these combinations, and thermocompression-bonding the layers. Since it can be thickened, it becomes a small and thin inductance component with low conductor resistance. At this time, even if the ratio of the conductor thickness to the insulator layer thickness was increased from 1: 5 to 1: 3, the dimensional change of the pattern due to the deformation of the conductor 4 was not observed. Further, with this configuration, the coil 2 alone can be used as a single inductance component.

In each of the above embodiments, the plate-like ferrite magnetic bodies 1 and 7 are printed simultaneously with the columnar ferrite magnetic bodies 5 and 6 to form a green sheet. Alternatively, the fired plate-shaped ferrite magnetic bodies 1 and 7 may be incorporated after the coil portion is fired.

[0030]

As described above, according to the method of manufacturing an inductance component of the present invention, the concave portion is formed by forming the concave portion having the coil pattern shape and the conductor thickness on the ceramic layer formed in advance and forming the step portion having the desired thickness. In order to adopt a method of forming the coil pattern-shaped conductor in the concave portion on the ceramic layer, laminating a desired number of the ceramic layers, and thermocompression bonding, It is possible to obtain a small and thin inductance component having a low conductor resistance, since the ratio can be increased.

[Brief description of drawings]

FIG. 1A is a perspective view of an inductance component manufactured by an embodiment of a method of manufacturing an inductance component of the present invention. FIG. 1B is a sectional view taken along line AA ′ of FIG. 1A.

2A to 2C are cross-sectional views showing a manufacturing process of one layer used for the coil in the first embodiment of the present invention.

3A to 3C are cross-sectional views showing a manufacturing process of one layer used for the coil in the second embodiment of the present invention.

4A to 4C are cross-sectional views showing a manufacturing process of one layer used for the coil in the third embodiment of the present invention.

5A to 5C are cross-sectional views showing a manufacturing process of one layer used for the coil in the fourth embodiment of the present invention.

6 (a) to 6 (c) are sectional views showing a manufacturing process of one layer used for a coil in a fifth embodiment of the present invention.

7 (a) to 7 (c) are sectional views showing a manufacturing process of one layer used for a coil in a sixth embodiment of the present invention.

8A to 8C are cross-sectional views showing a manufacturing process of one layer used for a coil in a seventh embodiment of the present invention.

[Explanation of symbols]

 1 plate-like ferrite magnetic body 2 coil 3 insulator layer 4 conductor 5 columnar ferrite magnetic body at the center 6 columnar ferrite magnetic body at the end 7 plate-like ferrite magnetic body 8 external electrode 9 support film 10 convex mold 11 concave 12 not Forming part 13 Non-magnetic insulator layer 14 Insulating magnetic layer

Claims (7)

[Claims] 1. A ceramic die having a coil pattern shape and a recess having a desired thickness is formed on a preformed ceramic layer by using a convex mold, and a conductor having a coil pattern shape is further formed in the recess portion of the ceramic layer. A method for manufacturing an inductance component, which comprises forming a desired number of layers and firing them. 2. A conductor layer having a coil pattern shape is formed by forming a ceramic layer having a pattern shape opposite to the coil pattern shape and having a desired thickness on a previously formed ceramic layer to form a concave portion, and further forming a concave portion in the ceramic layer. And a desired number of layers of the ceramic layers are laminated and fired to form an inductance component. 3. A conductor having a coil pattern shape is formed on a ceramic layer formed in advance, and a ceramic layer having a pattern shape opposite to the coil pattern shape and having a thickness of the conductor is formed in a recess between the conductors. A method for manufacturing an inductance component, which is formed by laminating a desired number of the ceramic layers and firing them. 4. A conductor having a coil pattern shape is formed on a support, and a ceramic layer having a pattern shape opposite to the coil pattern shape and having a thickness of the conductor is formed in a recess between the conductors, and further formed on the conductor layer. A method of manufacturing an inductance component, comprising forming a ceramic layer, laminating a desired number of the ceramic layers, and firing the laminated layers. 5. A ceramic layer having a pattern shape opposite to the coil pattern shape and having a desired thickness is formed on a support to form a concave portion, a coil pattern shaped conductor is formed in the concave portion, and a ceramic is further formed thereon. A method of manufacturing an inductance component, comprising forming layers, laminating a desired number of the ceramic layers, and firing the layers. 6. A ceramic layer having a coil pattern shape is formed on a support to form a concave portion, and a ceramic layer having a pattern shape opposite to the coil pattern shape and having a desired thickness is formed in the concave portion, and further formed. A method of manufacturing an inductance component, comprising forming a coil pattern-shaped conductor in a concave portion of the ceramic layer, laminating a desired number of the ceramic layers, and firing the laminated layers. 7. A coil pattern-shaped ceramic layer is formed on a support, a coil pattern-shaped conductor is formed on the ceramic layer, and a pattern opposite to the coil pattern shape is formed in a recess formed by the conductor. A method of manufacturing an inductance component, comprising forming a ceramic layer having a shape, laminating a desired number of the ceramic layers, and firing the layers.