JPH08242074A - Printed board soldering device - Google Patents

Abstract

PURPOSE: To make the pressure distribution of a supply opening uniform by receiving molten solder supplied from a first supply opening with an upper injection port of a tubular injection part, providing a tubular supply part with a second supply opening in a position lower than the tubular injection part and carrying a printed board with a soldered surface thereof down so that it passes through a position lower than the tubular supply part. CONSTITUTION: A primary jet part 14 is immersed in molten solder 12 of a solder bath 11 while directing a first jet port 21 up and projecting it from a liquid surface and the molten solder 12 is sucked up by a solder suction part 13 and received by an injection port 25 of a tubular injection part 22. A second jet part 23 which communicates with the tubular injection part 22 and is provided with a second jet part 26 at a position lower than a height up to the injection port 25 is provided. A printed board 31 is carried by a printed board carrier mechanism 32 while directing a soldered surface thereof down so that it passes through a position lower than a height up to an opening part of the tubular injection part 22 above the second jet part 23. Thereby, it is possible to make the pressure distribution of a supply opening uniform and to eliminate irregularities of supply height and flow rate of the molten solder 12.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board soldering apparatus for uniformly soldering one surface of a printed circuit board.

[0002]

2. Description of the Related Art Conventionally, in a printed circuit board soldering apparatus of this type, the upper side of a blow-out port 2 of a solder suction portion 1 as shown in FIG. 12 which is submerged in molten solder stored in a liquid tank is printed. By passing through a board (not shown), the molten solder spouted from the air outlet 2 is attached to one surface of the printed board.

Specifically, the above-mentioned solder suction part 1 is provided with a flat box-shaped solder suction part 3 horizontally laid below the liquid tank, and a flat box-shaped solder blowing part 4 provided upright. . The solder blowing portion 4 communicates with the solder suction portion 3 at the lower portion of the side surface.

A suction port 5 for sucking the molten solder accumulated in the liquid tank is provided on the upper surface of the solder suction portion 3, and the tip of the drive shaft 6a of the motor 6 is vertically inserted into the suction port 5. are doing. A fan 7 is connected to the tip of the drive shaft 6a.

In such a printed circuit board soldering apparatus, when the motor 6 is driven, the rotation of the fan 7 causes a pressure difference between the inside and outside of the solder suction portion 3. As a result, the molten solder stored in the liquid tank is sucked through the suction port 5. This molten solder further passes through the solder suction portion 3,
It is pushed up along the solder blowing portion 4. Then, the molten solder is ejected from the outlet 2 of the solder suction portion 3. Further, in order to change the rotation speed of the fan 7 and adjust the solder blowing height from the outlet 2, the rotation speed adjuster 8 for controlling the rotation speed of the motor 6 is provided.

[0006]

However, in such a printed circuit board soldering apparatus, since the molten solder is blown out from the blowout port 2 by utilizing the rotation of the fan 7, the melting from the blowout port 2 is prevented. The blowing pressure of the solder depends on the rotation of the fan 7.

Therefore, the motor 6 is controlled by the rotation speed regulator 8.
Even if the solder blowing height is adjusted by controlling the number of revolutions of No. 3, the distribution of the blowing pressure of the solder blown from the blower outlet 2 is disturbed due to the disturbance of the flow velocity of the molten solder due to the rotation of the fan 7, There is a problem in that the height of the molten solder blown out varies, and the solder cannot be evenly attached onto the printed circuit board. This has also been a cause of defective soldering of the surface-mounted components of the printed circuit board.

Therefore, by making the pressure distribution at the outlets uniform and eliminating the variations in the blowing height and the flow velocity of the molten solder, the solder can be evenly attached on the printed circuit board, resulting in defective soldering. It is an object of the present invention to provide a printed circuit board soldering device capable of preventing the above.

[0009]

According to the first aspect of the present invention,
The molten solder is sucked from the liquid tank for accumulating the molten solder and the suction portion submerged in the molten solder in the liquid tank, and the molten solder is lifted up to the first outlet formed by protruding from the liquid surface and blown. The solder suction portion to be discharged, the cylindrical injection portion that receives the molten solder blown out from the first outlet at the upper injection opening, and the cylindrical injection portion that are in communication with each other The printed circuit board so as to pass through a tubular outlet having the second outlet at a lower position and a position lower than the height to the opening of the tubular inlet above the tubular outlet. And a transporting means for transporting with the soldering surface facing downward.

According to a second aspect of the present invention, there is provided a height adjusting means for adjusting the height of the cylindrical injection portion up to the injection port.
It is the printed circuit board soldering device described. The invention according to claim 3 is the printed circuit board soldering apparatus according to claim 1, further comprising area adjusting means for adjusting the area of the second outlet of the tubular outlet.

According to a fourth aspect of the present invention, a communication passage is provided between the cylindrical injection portion and the cylindrical ejection portion so as to communicate the inside thereof.
The printed circuit board soldering device according to claim 1, wherein a strainer is provided in the communication passage.

According to a fifth aspect of the present invention, there is provided a first solder suction upper portion.
2. The printed circuit board soldering device according to claim 1, further comprising a cap-shaped blocking member for blocking the air outlet and the inlet of the cylindrical inlet from the atmosphere.

According to a sixth aspect of the present invention, a common movable side surface that is slidable in the width direction is provided in the cylindrical injection portion, the cylindrical ejection portion, and the communication passage, and the conveying means responds to the movable side surface. The printed circuit board soldering device according to claim 1, further comprising a printed circuit board holding means for changing a holding width of the printed circuit board.

According to a seventh aspect of the present invention, there is provided a straightening plate for vertically dividing the injection port of the cylindrical injection portion into a direction separating from the solder blowing portion side, and molten solder to the opening portion of each divided portion. 2. The printed circuit board soldering device according to claim 1, further comprising an adjusting valve for adjusting the injection amount of the.

[0015]

According to the first aspect of the invention, the molten solder sucked up by the solder suction portion is injected into the cylindrical injection portion. Then, when the height of the injected molten solder exceeds the height of the tubular outlet to the second outlet, the molten solder is blown out from the second outlet. As described above, the kinetic energy of the molten solder sucked up by the solder suction portion is different in height between the height of the cylindrical pouring part receiving the kinetic energy and the height of the cylindrical blowing part to the second blowing port. Is converted into potential energy. Thereby, the blowout pressure distribution of the molten solder from the second blowout port of the tubular blowout portion becomes uniform, and the blowout height also becomes constant. At this time, when the printed circuit board is conveyed above the second air outlet, the molten solder blown out from the second air outlet adheres to the lower surface of the printed circuit board.

Further, by adjusting the height adjusting means to change the height of the cylindrical injection part up to the injection port, the blowing height of the molten solder from the second blow-out port of the cylindrical blow-out part is changed. Further, the height of the molten solder from the second outlet is changed by adjusting the area adjusting means and changing the area of the second outlet of the tubular outlet.

Further, since the molten solder injected from the cylindrical injection portion moves to the cylindrical ejection portion through the strainer in the communication passage, the oxide and dross contained in the molten solder are recovered by the strainer.

Further, since the cap-shaped blocking member blocks the first blow-out port of the solder suction part and the injection port of the cylindrical injection part from the atmosphere, oxidation of the molten solder is prevented. Also,
By driving the cylindrical injecting section, the cylindrical blowing section, and a common movable side surface that is slidable in the width direction in these communication paths, the holding width of the printed circuit board is also set to the second blowing port of the cylindrical blowing section. It changes together. Further, by adjusting the adjusting valve, the injection amount of the molten solder injected into each of the injection ports of the cylindrical injection portion divided by the flow regulating plate is adjusted.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a first embodiment of the present invention will be described with reference to FIGS.
Will be described with reference to. In FIG. 1, molten solder 12 is stored in a solder bath 11 as a liquid bath. In the molten solder 12, a solder suction portion 13 that sucks the molten solder 12 from below and a solder blowing portion 14 that is connected to the solder suction portion 13 are submerged. As shown in FIG. 2, the solder suction part 13 has a flat box-shaped solder suction part 15 horizontally sunk below the solder bath 11, and a flat box-shaped primary blowing part provided upright. 16 is provided. The primary blowout portion 16 communicates with the solder suction portion 15 at the lower portion of the side surface.

On the upper surface of the solder suction portion 15, the solder bath 1
1 is provided with a suction port 17 for sucking the molten solder 12 accumulated therein. The suction port 17 has a drive shaft 18a for a motor 18a.
The tip of is inserted vertically. A fan 19 is connected to the tip of the drive shaft 18a.

Further, the primary outlet 16 is formed with a primary outlet 21 which opens upward, and the primary outlet 2
The reference numeral 1 projects from the liquid surface of the molten solder 12. A notch 21a is provided on the side surface of the primary outlet 21 on the solder outlet 14 side, and the molten solder 12 is injected into the solder outlet 14 through the notch 21a.

The solder blow-out part 14 is a flat box-shaped cylindrical injection part 22 provided adjacent to the solder suction part 13 in an upright state.
A flat box-shaped secondary outlet 23 for ejecting the molten solder 12 injected into the tubular inlet 22 upward, and a horizontal communication passage communicating the tubular inlet 22 and the secondary outlet 23. And the joint pipe 24 constituting the.

The cylindrical injection part 22 is formed with an injection port 25 opening upward, and the outer wall height y to the injection port 25 is the outer wall height up to the notch 21a of the primary blowout part 16. It is equal to or lower than x. As a result, the molten solder 12 that has flowed out of the notch 21 a is injected from the injection port 25 of the solder blowing portion 14.

The secondary outlet 23 is also formed with a secondary outlet 26 opening upward.
The outer wall height z up to 6 is lower than the outer wall height y of the tubular injection portion 22. Furthermore, 2 of the secondary outlet 23
The opening area of the next outlet 26 is equal to the inlet 2 of the tubular inlet 22.
5 is smaller than the opening area.

As shown in FIG. 1, a printed circuit board transport mechanism 32 for passing the printed circuit board 31 over the secondary outlet 26 is provided above the solder bath 11. The printed circuit board transport mechanism 32 is configured such that the pillar 33 has one end thereof directed toward the solder suction portion 13 and the other end thereof directed toward the solder blowing portion 14 and is suspended above the solder tank 13. It is fixed at 11.

The pillars 33 are arranged so that the printed circuit board 31 to be conveyed passes above the secondary outlets 26 and below the outer wall height y of the cylindrical injection portion 22 at the solder blowing portion. 14 side is inclined so as to be lower than the solder suction upper side 13 side.

Below the support column 33, the printed circuit board 3 is provided.
A plurality of holding claws 34 for holding both end portions of 1 are provided so as to be movable along the support column 33 in a state in which a fixed interval is provided. Specifically, the printed circuit board 31 is held in a state in which the surface to be soldered is directed downward, and both ends thereof are held by some of the holding claws 34, and together with the holding claws 34, as shown in FIG. Move in the direction indicated by the solid line arrow.

In this embodiment having such a structure, when the motor 18 is driven, a pressure difference is generated between the inside and outside of the solder suction portion 15 due to the rotation of the fan 19. As a result, the solder bath 1
The molten solder 12 stored in 1 is sucked through a suction port 17, further passes through a solder suction portion 15, and a primary blowing portion 16
Pushed up along. Then, the molten solder 12 is ejected from the primary outlet 21 of the primary outlet 16.

The molten solder 12 flows out from the notch 21a of the primary outlet 21 to the cylindrical injection portion 22, and the cylindrical injection portion 22, the joint pipe 24, and the secondary ejection portion 23 are the molten solder 1
2 will be filled gradually. When the height of the liquid surface of the molten solder 12 exceeds the outer wall height z of the secondary outlet 23, 2
The molten solder 12 blows from the next outlet 26.

That is, the kinetic energy of the molten solder 12 having the flow velocity varied by the fan 19 is the injection port 25.
Up to the outer wall height y up to the secondary outlet 23 and the outer wall height z is converted into potential energy by the height difference, and the molten solder 12 having a uniform pressure distribution is ejected from the secondary outlet 26. is there.

Thus, the outer wall height y up to the inlet 25
And a height difference between the outer wall height z up to the secondary outlet 23, the molten solder 12 whose pressure distribution is disturbed by the rotation of the fan 19 has a constant flow velocity near the outlet of the secondary outlet 26. In addition, a uniform pressure distribution without variation can be obtained. Therefore, the molten solder 12 is discharged from the secondary outlet 26.
Is ejected at a constant height.

Therefore, in this state, the printed circuit board 31 is
When the molten solder 12 is conveyed and passes above the secondary outlet 26, the molten solder 12 blown out from the secondary outlet 26 is transferred to the printed circuit board 3.
1 is attached to the lower surface. At this time, the blowing pressure of the molten solder 12 has a uniform distribution without variation, and the blowing height is also kept constant.
Can be evenly attached to the lower surface of the. As a result, it is possible to prevent defective soldering of the surface-mounted components of the printed circuit board.

Next, a second embodiment of the present invention will be described with reference to FIG. In this embodiment, the same parts as those in the above embodiment are designated by the same reference numerals and detailed description thereof will be omitted. FIG. 3 is a perspective view showing an external configuration of the solder suction portion 13 and the solder blowing portion 14 of the printed circuit board soldering apparatus according to the present embodiment. What is different from FIG. Instead of opening the upper part, the cylindrical injection part 2
The point of forming a horizontal flow passage in the upper part toward the 2 side and providing a side surface opening portion 41 having an opening at the end portion thereof.
The point is that a height adjusting plate 43 that adjusts the height of the outer wall 42 is provided on the upper portion of the outer wall 42 on the side of the next outlet portion 23.

Specifically, the height adjusting plate 43 is formed with a plurality of elongated holes 44, and the elongated holes 44 are fixed to the upper end portion of the outer wall 42 with a screw 45. In the present embodiment having such a configuration, the molten solder 12 that has risen along the primary blowing portion 16 due to the rotation of the fan 19 has the side opening 4
It is injected into the injection port 25 of the cylindrical injection part 22 along the horizontal passage 1.

As described above, by providing the side opening 41 as the primary outlet in the solder suction part 13 of the first embodiment, the same effect as that of the first embodiment is obtained, and the solder suction part 13 is added. It is possible to obtain the effect of being able to more reliably inject the molten solder from the above into the injection port 25 of the cylindrical injection portion 22.

Further, by loosening the screw 45 and adjusting the height adjusting plate 43 up and down, the injection port 2 of the cylindrical injection portion 22 is
Height y up to 5 can be adjusted. As a result, the height difference between the height y to the inlet 25 and the height z to the secondary outlet 26 can be varied, so that the height of the molten solder 12 blown out from the secondary outlet 26 can be adjusted.

Next, a third embodiment of the present invention will be described with reference to FIG. In this embodiment, the same parts as those in the above embodiment are designated by the same reference numerals and detailed description thereof will be omitted. FIG. 4 is a perspective view showing an external configuration of the secondary outlet 23 of the solder outlet 14 of the printed circuit board soldering apparatus according to the present embodiment. The difference from FIG. The point is that the area adjustment unit 51 that can change

Specifically, the area adjusting portion 51 includes a pair of rails 52 having both ends fixed to the solder bath 11 along the width direction of the secondary outlet 26, and a groove provided in the rail 52. The area adjusting plate 53 is slidably supported at each side end thereof. The area adjusting plate 53 closes a part of the secondary outlet 26.

In this embodiment having such a structure, the opening area of the secondary outlet 26 can be adjusted by sliding the area adjusting plate 53 along the rail 52 in the horizontal direction.
As a result, in addition to the effects of the above embodiment, the secondary outlet 2
The blowing height of the molten solder 12 from 6 can be adjusted. Further, the opening area of the secondary outlet 26 can be matched with the width of the printed board 31 carried by the printed board carrying mechanism 32. Therefore, the atmosphere and the molten solder 12
The area of contact with the molten solder 12 can be reduced and oxidation of the molten solder 12 can be prevented as much as possible.

Next, a fourth embodiment of the present invention will be described with reference to FIGS. In this embodiment, the same parts as those in the above embodiment are designated by the same reference numerals and detailed description thereof will be omitted.

FIG. 5 is a sectional view of the solder blowing portion 14 of the printed circuit board soldering apparatus according to this embodiment. The difference from FIG. 1 is that the solder oxide and dross of the molten solder 12 are present in the middle of the joint pipe 24. The point is that the cylindrical strainer 61 for removal is provided in a state in which its axis is horizontal in the width direction of the solder blowing portion 14.

As shown in FIG. 6, the strainer 61 is formed by rolling a web-shaped strip into a cylindrical shape. A plurality of feed holes 62 are formed along the circumference at both ends of the strainer 61 at a predetermined pitch P1.

On the other hand, in the middle of the joint pipe 24, as shown in FIG. 7, the upper plate 24a has two upper slits 63a,
63b are spaced apart from each other and formed in the width direction. Two lower slits 64a and 64b are formed in the lower plate 24b in the width direction so as to face the upper slits 63a and 63b, respectively. The strainer 61 is provided so as to penetrate the slits 63a, 63b and 64a, 64b.

Of these slits, the slits 63a and 64a on the cylindrical injection portion 22 side are provided with brush bodies 65a and 65b on both side edges thereof for removing solder oxide and dross adhering to the strainer 61, respectively. It is attached to the upper side of the lower plate 24a and the lower plate 24b. In addition, the secondary outlet 2
Brush bodies 66a and 66b similar to the above are provided in the slits 63b and 64b on the third side, respectively, on the upper plate 24a and the lower plate 24b.
It is mounted on the underside of.

Slits 63a on the side of the cylindrical injection part 22,
Two shafts 67 and 68 for rotationally driving the strainer 61 are provided in parallel to the axial direction of the strainer 61 at a substantially middle portion between the slit 64b and the slits 63b and 64b on the side of the secondary outlet 23. Further, these shafts 67 and 68 are joint pipes 2
The upper plate 24 is attached to the upper and lower edges of the four side plates 24a and 24b, respectively.
The bearing columns 71 and 72 are rotatably supported by the bearing columns 71 and 72 apart from the lower plate 24b.

The shafts 67 and 68 are provided with bearing struts 71,
Gears 73 and 74, which mesh with the feed hole 62 of the strainer 61 from the inside, are fixed inside the 72, respectively. Also,
Outside the bearing columns 71, 72, the worm gear 75,
76 is fixed.

The worm gears 75 and 76 mesh with worms 81 and 82 provided midway on the drive shafts 77 and 78 provided in the vertical direction. This drive shaft 77, 78
Is rotatably supported by the solder bath 11 apart from the side plates 24a and 24b of the joint pipe 24. The drive shafts 77 and 78 are connected to a motor 79.

In the present embodiment having such a configuration, when the motor 79 is driven, this rotational force is generated by the worms 81, 8
2 and the worm gears 75, 76, and the shafts 67, 6
8 rotates. As a result, the gears 73 and 74 rotate, and the strainer 61 rotates in the direction of the dotted arrow shown in FIG.

In this state, the molten solder 12 is filled with the cylindrical injection portion 2
When the molten solder 12 is injected from the injection port 25 of No. 2, the molten solder 12 flows into the secondary outlet 23 through the inside of the joint pipe 24. At this time, the solder oxide and dross contained in the molten solder 12 injected from the injection port 25 are removed by the strainer 61.

Thus, in addition to the structure of the above embodiment, by providing the strainer 61 in the middle of the joint pipe 24,
In addition to the effects of the above-described embodiment, it is possible to prevent the solder oxide and the dross contained in the molten solder 12 injected from the injection port 25 from being ejected together with the molten solder 12 from the secondary outlet 26 of the secondary outlet 23. It is possible to exert an effect.
As a result, soldering with the high-purity molten solder 12 can be performed.

Further, the strainer 61 is formed into a cylindrical shape,
Since the strainer 61 is rotatably provided and penetrates the joint pipe 24 from the slits 63a and 64b through the brush bodies 65a and 65b, the solder attached to the surface of the brush bodies 65a and 65b by rotating the strainer 61. Oxides and dross can be continuously removed, and solder oxides and dross can be more reliably prevented from moving to the secondary outlet portion 23. It is possible to prevent impurities from adhering to the printed circuit board 31 and improve reliability of soldering without cleaning. In addition, the amount of solder consumed can be reduced.

Next, a fifth embodiment of the present invention will be described with reference to FIG.
Will be described with reference to. In this embodiment, the same parts as those in the above embodiment are designated by the same reference numerals and detailed description thereof will be omitted.

FIG. 8 is a partial sectional view of the solder suction portion 13 and the solder blowing portion 14 of the printed circuit board soldering apparatus according to this embodiment. The difference from FIG. 3 is that the upper portion of the solder suction portion 13 and the cylindrical shape are cylindrical. A cap-shaped blocking member 85 that covers the upper part of the injection part 22 and blocks the atmosphere is fixed to the upper plate 41a of the side opening 41 by a column (not shown).

The opening 85 of the blocking member 85 faces downward, and the edge of the opening 86 is soaked in the molten solder 12 in the solder bath 11. As a result, the inside of the blocking body 85 is blocked from the outside atmosphere. Also,
A pressure valve 89 for maintaining a constant pressure difference between the inside and outside of the blocking body 85 due to heating of the solder bath 11 is provided on the upper plate 85a of the blocking body 85.

With this structure, in addition to the effects of the above-described embodiment, it is possible to prevent oxidation of the molten solder 12 injected from the primary blowout part 16 into the cylindrical injection part 22. This prevents impurities from adhering to the printed circuit board and improves the reliability of soldering without cleaning. In addition, the amount of solder consumed can be reduced.

Further, since the pressure valve 89 is provided in the blocking body 85, the pressure difference between the inside and outside of the blocking body 85 during the injection of the molten solder 12 into the cylindrical injection portion 22 and the cooling and heating of the solder bath 11 is rapid. Change can be prevented.

Next, a sixth embodiment of the present invention will be described with reference to FIG.
Also, description will be made with reference to FIG. In this embodiment, the same parts as those in the above embodiment are designated by the same reference numerals and detailed description thereof will be omitted.

FIG. 9 is a perspective view showing the structure of the solder blowing portion 14 of the printed circuit board soldering apparatus according to this embodiment. The difference from FIG. 2 is that one side plate of the solder blowing portion 14 is slid in the width direction. It is configured to be movable, and one of the columns 33b of the printed circuit board transport mechanism 32 is configured to be slidable in the width direction.
The point that the width between the columns is changed by interlocking the columns 33a with the movable side plate 91.

Specifically, one side surface of the solder blowing portion 14 is opened, and the movable side plate 91 is inserted into this opening portion.
And the secondary outlet 23 and the upper and lower plates of the joint pipe 24 are slidably provided.

On the outer side surface of the movable side plate 91, one end portions of a plurality of support rods 92 are fixed in the horizontal direction, and the other end portions of these support rods 92 are side plates of a fixing member 93 having an inverted L-shaped cross section. It is fixed to 94.

At the end where the upper plate 95 of the fixing member 93 projects, one of the columns 33b of the printed circuit board transport mechanism 32 is provided.
Has been fixed. As shown in FIG. 10, the printed circuit board transporting mechanism 32 in the present embodiment is provided with a plurality of support rods 96 fixed to the solder bath 11 over the width of the solder blowing portion 14. These support rods 96 include
While one of the columns 33b is slidably attached,
The other pillar 33a is fixed.

A plurality of holding claws 34a, 34b for holding both ends of the printed circuit board 31 are provided at positions facing the columns 33a, 33b. The holding claw 34b of the column 33b is positioned above the movable side plate 91.

In this embodiment having such a structure, when the movable side plate 91 is slid in the direction of the solid line arrow in FIG. 9, in response to this, the support rod 92 and the fixing member 93 as well as one of the columns 33b are moved. Slide in the width direction. As a result, the distance between the holding claws 34a and 34b holding the printed circuit board 31 changes, and the opening areas of the water injection port 25 and the secondary outlet 26 of the solder blowing portion 14 also change.

In this way, the movable side plate 9 of the solder blowing portion 14 is
1 and one of the support columns 33b of the printed circuit board transport mechanism 32 are configured to be slidable in the width direction in cooperation with each other, so that the holding claws 34a and 34b of the printed circuit board transport mechanism 32 are formed.
And the width of the secondary outlet 26 can be easily adjusted to the width of the printed board 31.

As a result, the contact area between the atmosphere and the molten solder 12 can be minimized, so that the generation of solder oxide and dross can be reduced and the amount of impurities adhering to the printed circuit board can be reduced. Therefore, the reliability of the non-cleaning soldering can be improved. In addition, the amount of solder consumed can be reduced.

Next, a seventh embodiment of the present invention will be described with reference to FIG.
1 will be described. In this embodiment, the same parts as those in the above embodiment are designated by the same reference numerals and detailed description thereof will be omitted.

FIG. 11 is a perspective view showing the structure of the solder blowing portion 14 of the printed circuit board soldering apparatus according to this embodiment.
The difference from the above-mentioned embodiment is that the injection port 25 of the cylindrical injection part 22 is provided.
Is provided with a rectifying plate 101 that divides the injection port 25 into a plurality of upper and lower parts in a direction away from the wall 22a on the solder injection side, and an adjusting valve 102 for adjusting the injection amount of the molten solder into the opening of each divided portion. That is the point.

The adjusting valve 102 is, specifically, a shaft 103 rotatably installed in the opening of the flow straightening plate 101 so as to be rotatable in the width direction, and a plate blade 104 fixed to the shaft 103.
Consists of The plate blade 104 is configured to rotate about the shaft 103, and the flow rate of the molten solder 12 injected from the injection port 25 changes according to the rotation angle of the plate blade 104.

In addition to the effects of the above-described embodiment, the present embodiment has an effect that the inflow speed of the molten solder 12 into each opening can be adjusted by changing the angle of the plate blade 104.

Therefore, the flow velocity in the middle portion of the injection port 25 is set to the wall 2
It can also be lower than the flow velocity near 2a. Thereby, the disturbance of the pressure distribution of the molten solder 12 to the injection port 25 due to the phenomenon that the flow velocity increases with the distance from the wall surface of the tube, which is a characteristic of the Newtonian fluid such as the molten solder 12, can be alleviated. That is, the molten solder 1 at the time of injection
The pressure distribution of 2 can be made uniform.

In this embodiment, the rectifying plate 101 and the adjusting plate 102 are provided at the injection port 25 of the cylindrical injection portion 22, but the present invention is not limited to this, and the secondary blowout portion 23 is not limited thereto. The secondary outlet 26 may be provided.
Thereby, the molten solder 1 blown out from the secondary outlet 26
The pressure distribution of 2 can also be made more uniform.

[0072]

As described in detail above, according to the present invention,
Utilizing the difference in height between the kinetic energy of the molten solder sucked up by the solder suction part and the height of the cylindrical pouring part receiving the kinetic energy to the pouring port and the second blowing port of the cylindrical blowing part. By converting into the potential energy, the blowout pressure and flow velocity distribution of the molten solder blown out from the second blowout port can be made uniform, and the blowout height can be made constant. As a result, the solder can be evenly adhered to the printed circuit board, so that defective soldering can be prevented.

Further, the height of the molten solder blown out from the second outlet of the tubular outlet is adjusted by adjusting the height to the inlet of the tubular inlet by the height adjusting means. Can be adjusted. As a result, the molten solder can be attached in an appropriate amount to the printed circuit boards having different printed circuit board dimensions and thicknesses.

Further, by adjusting the area of the second outlet of the cylindrical outlet by the area adjusting means, it is possible to adjust the blowing height and the flow velocity of the molten solder blown from the second outlet. As a result, the molten solder can be attached in an appropriate amount to the printed circuit boards having different printed circuit board dimensions and thicknesses.

Further, since the strainer is provided in the communication passage between the tubular injection portion and the tubular blowing portion, the solder oxide and the dross can be collected when the molten solder is moved to the tubular blowing portion. Can be prevented from flowing into the air outlet. As a result, it is possible to prevent impurities from adhering to the printed circuit board and improve the reliability of non-cleaning soldering. In addition, the amount of solder consumed can be reduced.

Further, by providing a cap-shaped blocking member for blocking the first outlet of the solder suction portion and the inlet of the cylindrical inlet from the atmosphere, oxides generated during solder supply,
It is possible to prevent the generation of dross and prevent the inflow into the tubular outlet. This prevents impurities from adhering to the printed circuit board and improves the reliability of soldering without cleaning. In addition, the amount of solder consumed can be reduced.

The holding width of the printed circuit board can also be increased by driving the cylindrical injecting section, the cylindrical blowing section, and a common movable side surface which is slidable in the width direction in the communicating path. Since it changes according to the two outlets, the second outlet can be adjusted according to the width of the printed circuit board. Therefore, the contact area between the atmosphere and the molten solder can be minimized. This can reduce the generation of solder oxides and dross, reduce the amount of impurities adhering to the printed circuit board, and improve the reliability of non-cleaning soldering. In addition, the amount of solder consumed can be reduced.

Further, by adjusting the adjusting valve, it is possible to adjust the injection amount of the molten solder into each injection port of the cylindrical injection portion divided by the flow regulating plate. As a result, the flow velocity in the tubular injection part can be made constant, so that the blowout pressure and flow velocity from the second outlet of the tubular blowout part can be made uniform, and the soldered state of the printed circuit board is further stabilized. .

[Brief description of drawings]

FIG. 1 is a sectional view showing a configuration of a first embodiment of the present invention.

FIG. 2 is a perspective view showing an external configuration of a solder suction part and a solder blowing part shown in FIG.

FIG. 3 is a perspective view showing an external configuration of a second embodiment of the present invention.

FIG. 4 is a perspective view showing an external configuration of a third embodiment of the present invention.

FIG. 5 is a sectional view showing the configuration of a fourth embodiment of the present invention.

6 is a front view showing the configuration of the strainer shown in FIG.

FIG. 7 is a perspective view showing an external configuration when a strainer is removed in the present embodiment.

FIG. 8 is a sectional view showing the structure of a fifth embodiment of the present invention.

FIG. 9 is a perspective view showing an external configuration of a sixth embodiment of the present invention.

10 is a cross-sectional view taken along the line AA shown in FIG.

FIG. 11 is a sectional view showing the structure of a seventh embodiment of the present invention.

FIG. 12 is a diagram illustrating a conventional printed circuit board soldering device.

[Explanation of symbols]

 11 ... Solder tank (liquid tank) 13 ... Solder suction part 21 ... Primary outlet (first outlet) 22 ... Cylindrical injection part 23 ... Secondary ejection part (cylindrical ejection part) 25 ... Injection port 26 ... Secondary outlet (second outlet) 31 ... Printed circuit board 32 ... Printed circuit board transport mechanism (transfer means) 33 ... Support 43 ... Height adjusting plate (height adjusting means) 51 ... Area adjusting unit (area adjusting means) 61 ... Strainer 85 ... Breaker (blocking member) 91 ... Movable side plate (movable side) 101 ... Rectifier plate 102 ... Regulator valve

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Naoki Takeda No. 1 Toshiba-cho, Fuchu-shi, Tokyo Toshiba Corporation Fuchu factory inside

Claims (7)

[Claims] 1. A liquid tank for storing the molten solder, and a first blow-out port formed by sucking the molten solder from a suction portion of the liquid tank which is submerged in the molten solder and projecting the molten solder from the liquid surface. Of the solder, which is blown up and blows up to, a tubular injecting portion that receives the molten solder ejected from the first outlet through an upper inlet, and a cylindrical injecting portion that communicates with the tubular injecting portion. It passes through a tubular outlet having a second outlet at a position lower than the height to the inlet and a position lower than the height to the opening of the tubular inlet above the tubular outlet. As described above, the printed circuit board soldering device is provided with a conveying means for conveying the printed circuit board with its soldering surface facing downward. 2. The height adjusting means for adjusting the height of the tubular injection part up to the injection port is provided.
The printed circuit board soldering device described. 3. The printed circuit board soldering apparatus according to claim 1, further comprising area adjusting means for adjusting an area of the second outlet of the tubular outlet. 4. The print according to claim 1, wherein a communication passage is provided between the tubular injection portion and the tubular ejection portion to communicate the inside thereof, and a strainer is provided in the communication passage. Board soldering equipment. 5. The printed circuit board according to claim 1, further comprising a cap-shaped blocking member that blocks the first outlet of the solder suction portion and the inlet of the cylindrical inlet from the atmosphere. Soldering device. 6. A common movable side surface slidable in the width direction of the tubular injection portion, the tubular outlet portion, and the communication passage is provided, and the conveying means is responsive to the movable side surface. 2. The printed circuit board soldering device according to claim 1, further comprising a printed circuit board holding means for changing a holding width of the printed circuit board. 7. A rectifying plate that vertically divides the injection port of the tubular injection part into a plurality of parts in the direction away from the solder blowing part side is provided, and the amount of molten solder injected into the opening part of each division part is set. The printed circuit board soldering apparatus according to claim 1, further comprising an adjusting valve for adjusting.