JPH08233855A - Electrostatic capacity type acceleration sensor - Google Patents

Electrostatic capacity type acceleration sensor

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Publication number
JPH08233855A
JPH08233855A JP4038995A JP4038995A JPH08233855A JP H08233855 A JPH08233855 A JP H08233855A JP 4038995 A JP4038995 A JP 4038995A JP 4038995 A JP4038995 A JP 4038995A JP H08233855 A JPH08233855 A JP H08233855A
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Prior art keywords
weight
movable
board
movable substrate
substrate
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JP4038995A
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Japanese (ja)
Inventor
Kazuo Eshita
和雄 江下
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Kansai Gas Meter Co Ltd
関西ガスメータ株式会社
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Priority to JP4038995A priority Critical patent/JPH08233855A/en
Publication of JPH08233855A publication Critical patent/JPH08233855A/en
Application status is Granted legal-status Critical

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Abstract

PURPOSE: To provide an electrostatic capacity type acceleration sensor in which the asymmetry of sensitivities in the approaching and separating directions of both a fixed board and a movable board is improved by approaching the increased amount and the decreased amount of an electrostatic capacity when the accelerations of the same magnitude are applied in the approaching and separating directions of both the fixed and the movable boards.
CONSTITUTION: A fixed board 1 and a movable board 2 disposed oppositely at an interval to the board 1 under the board 1 are provided. Capacitors 10, 11a, 11b, 12a, 12b are formed by the electrodes 6, 7a, 7b, 8a, 8b, 9 of the surfaces of both the boards, and a weight 20 is provided on the movable board. An electrostatic capacity type sensor detects the acceleration by detecting the capacity change of the capacitor based on the deformation of the movable board when an acceleration is applied to the weight. The weight is so provided as to sandwich the movable board between an inner member 21 disposed at the fixed board side and a weight body 22 disposed at the opposite side. It is so set that the contact area of the body with the movable board is larger than that of the inner member with the movable board.
COPYRIGHT: (C)1996,JPO

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【産業上の利用分野】この発明は、加速度を検出する静電容量式加速度センサに関する。 BACKGROUND OF THE INVENTION This invention relates to an electrostatic capacitance type acceleration sensor for detecting acceleration.

【0002】 [0002]

【従来の技術】加速度を検出するセンサとして、従来より圧電型のものが用いられていたが、最近では静電容量の変化を利用した静電容量式センサが、高感度、低消費電力等の利点を有することから注目されている(例えば特開平4−19568号)。 2. Description of the Related Art As a sensor for detecting acceleration, had those of the piezoelectric type conventionally used, recently the capacitance type sensor which utilizes a change in capacitance, high sensitivity, and low power consumption it has attracted attention because of its advantages (for example, Japanese Unexamined Patent Publication No. 4-19568).

【0003】この静電容量式センサの従来例を図4に示す。 [0003] showing a conventional example of the electrostatic capacitance type sensor in FIG. 同図において、(1)は水平状態に配置された円形の固定基板、(2)は該固定基板(1)の下方に水平状態に配置された円形の可動基板である。 In the figure, (1) is circular fixed substrate disposed in a horizontal state, a circular movable substrate disposed horizontally below the (2) is the stationary substrate (1). これら固定基板(1)と可動基板(2)とは、中間にスペーサ(3)を介在させた状態で、周端部を上側押さえ部材(4)と下側押さえ部材(5)とにより押さえ付けて固定されることによって、スペーサ(3)の厚さ分の距離を保持して平行状態に対向配置されている。 These fixed substrate (1) and a movable board (2) is in a state of intermediate is interposed a spacer (3), pressed by the peripheral edge and the upper pressing member (4) and the lower pressing member (5) by being fixed Te are opposed parallel holding a distance corresponding to the thickness of the spacer (3).

【0004】前記固定基板(1)はプリント配線基板によって構成され、その下面中央部には円形電極(6)が設けられるとともに、該円形電極(6)の外側においてX軸方向(図4(b)の左右方向)及びY軸方向(図4 [0004] The fixed substrate (1) is constituted by a printed circuit board, together with the circular electrode (6) is provided on its lower surface central portion, X-axis direction in the outer circular electrode (6) (Fig. 4 (b horizontal direction) and the Y-axis direction) (FIG. 4
(b)の上下方向)のそれぞれ対称位置に4個の扇形の分割電極(7a)(7b)(8a)(8b)が設けられている。 Vertical direction) of the four fan-shaped symmetrical positions each of the divided electrodes (7a) (7b) (8a) (8b) is provided in (b).

【0005】一方、前記可動基板(2)は薄肉のリン青銅やSUS等の可撓性材料からなるもので、基板そのものが1枚の共通電極(9)となされている。 On the other hand, the movable substrate (2) is made of a flexible material such as a thin phosphor bronze or SUS, the substrate itself is made as a common electrode of one (9). そして、この共通電極(9)と、前記固定基板(1)の円形電極(6)との間で、基板中央部に円形コンデンサ(10)が形成されるとともに、共通電極(9)と各分割電極(7 Then, a common electrode (9), between the circular electrode (6) of the fixed substrate (1), with circular capacitor (10) is formed in the central portion of the substrate, each of the divided common electrode (9) electrode (7
a)(7b)(8a)(8b)との間でX軸方向及びY軸方向に分割された4個のコンデンサ(11a )(11b )(12a a) (7b) (8a) (4 pieces of capacitors divided in the X-axis direction and the Y-axis direction between the 8b) (11a) (11b) (12a
)(12b )が形成されている。 ) (12b) are formed.

【0006】さらに、可動基板(2)の下面中央部には、円柱形の重り(100 )が垂下状態に固定されている。 Furthermore, the central portion of the lower surface of the movable substrate (2), cylindrical weight (100) is fixed to the suspended state. このおもりの上面中央部には径小の首部(101 )が形成され、この首部(101 )の上面が接着等の方法により可動基板(2)に固定されている。 This is the upper central portion of the weight is formed neck of small diameter (101) is, the upper surface of the neck portion (101) is fixed to the movable substrate (2) by a method such as adhesion.

【0007】図4に示すセンサでは、例えばZ軸正方向(固定基板と可動基板の接近方向)に加速度が作用すると、おもり(100 )にはZ軸負方向(固定基板と可動基板の離間方向)に慣性力が作用し、可動基板(2)は下方に引っ張られて固定基板(1)と可動基板(2)の対向距離が拡大する。 [0007] In the sensor shown in FIG. 4, for example Z-axis when an acceleration in the (approaching direction of the stationary substrate and the movable substrate) positive direction acts, the weight (100) separating direction of the Z-axis negative direction (fixed substrate and the movable substrate ) inertial force acts on the movable substrate (2) opposing the distance of the fixed substrate is pulled downward (1) and the movable substrate (2) is enlarged. そのため、コンデンサ(10)の静電容量が小さくなる。 Therefore, the capacitance of the capacitor (10) is reduced. 逆に、Z軸負方向に加速度が作用すると固定基板(1)と可動基板(2)の対向距離が縮小し、コンデンサ(10)の静電容量が大きくなる。 Conversely, Z-axis to face distance reduction in negative direction and acceleration is applied fixed substrate (1) and the movable substrate (2), the capacitance of the capacitor (10) increases. そして、このようなコンデンサ(10)の容量変化を検出してZ軸方向の外力を検出するものとなされている。 Then, it has been made as to detect the external force in the Z-axis direction by detecting a change in capacitance of such capacitors (10). また、 Also,
X軸方向に加速度が加わった場合には、コンデンサ(11 When the acceleration is applied in the X axis direction, the capacitor (11
a )(11b )の容量が増減することから、この容量変化を検出してX軸方向の加速度を検出するものとなされている。 Since the capacity of a) (11b) increases or decreases, it has been made as to detect the acceleration in the X-axis direction by detecting this capacitance change. 同様に、Y軸方向のコンデンサ(12a )(12b ) Similarly, Y-axis direction of the capacitor (12a) (12b)
の容量変化に基いてY軸方向の加速度を検出することができる。 It is possible to detect the acceleration in the Y-axis direction based on the change in capacitance.

【0008】 [0008]

【発明が解決しようとする課題】ところで、上記各コンデンサ(10)(11a )(11b )(12a )(12b )のような平行平板コンデンサの静電容量値Cは、一般に、C= [SUMMARY OF THE INVENTION Incidentally, the capacitance value C of the parallel plate capacitor as each capacitor (10) (11a) (11b) (12a) (12b) are generally, C =
ε(S/d)(ε:誘電率、S:電極面積、d:電極間距離)で表される。 ε (S / d) (ε: dielectric constant, S: electrode area, d: inter-electrodes distance) is represented by. この式からわかるように、電極の面積が一定の場合容量値Cは電極間距離dに反比例する。 As can be seen from this equation, the capacitance value C area of ​​certain electrodes is inversely proportional to the inter-electrode distance d.

【0009】而して、センサに上方及び下方に同一の大きさの加速度が加わった場合、可動基板(2)は上下に同一量だけ変位する。 [0009] In Thus, if the acceleration is applied in the same size in the upper and lower sensor, the movable substrate (2) is displaced by the same amount up and down. しかるに、上述のとおり、容量値Cは電極間距離dに反比例するから、可動基板(2)が上下に同一量だけ変位しても上方固定基板(1)側に変位した方がコンデンサの静電容量の増加量が大きく、下方変位の場合は減少量が小さいことになる。 However, as described above, since the capacitance value C is inversely proportional to the distance between electrodes d, it is an electrostatic capacitor movable substrate (2) is displaced in the same amount by a displacement upward fixed substrate be (1) side in the vertical large increase in capacity, in the case of downward displacement would decrease is small. このため、 For this reason,
センサにおける上下方向の感度が非対象となり、加速度の大きさを高精度に検出することができないとか、高精度に検出するためには処理回路が複雑になる等の欠点があった。 The sensitivity of the vertical direction of the sensor becomes non-target, or that you can not be detected magnitude of the acceleration with high accuracy, in order to detect with high accuracy a drawback such that the processing circuit becomes complicated.

【0010】この発明は、このような技術的背景に鑑みてなされたものであって、固定基板と可動基板の接近方向及び離間方向に同一の大きさの加速度が加わったときの静電容量の増加量及び減少量を接近させて、両基板の接近方向及び離間方向における感度の非対称性を改善した静電容量式加速度センサの提供を目的とする。 [0010] The present invention, the capacitance of such was made in view of the technical background, when applied the same magnitude of the acceleration in the approaching direction and separating direction of the fixed substrate and the movable substrate It is brought closer the increase and decrease, and an object thereof is to provide a capacitance type acceleration sensor having improved asymmetry of sensitivity in approaching direction and separation direction of the two substrates.

【0011】 [0011]

【課題を解決するための手段】上記目的を達成するために、この発明は、可動基板に固定されたおもりの固定面積が変わると、同一外力に対する可動基板のたわみ量が変化することに着目してなされたものである。 To achieve the above object of the Invention The, present invention is the fixed area of ​​the fixed weight on the movable substrate is changed, focusing on the deflection of the movable substrate changes with respect to the same external forces It has been made Te.

【0012】即ち、この発明は、図面の符号を参照して示すと、固定基板(1)と該固定基板に間隔をおいて対向配置された可動基板(2)とを備え、固定基板表面の電極(6)(7a)(7b)(8a)8b)と可動基板表面の電極(9)とによってコンデンサ(10)(11a )(11b ) Namely, the present invention, indicating with reference to the numerals of the drawing, and a oppositely disposed movable substrate (2) at a distance to the fixed substrate (1) and the fixed substrate, the fixed substrate surface electrodes (6) (7a) (7b) capacitor (10) by (8a) 8b) and the electrode of the movable substrate surface (9) (11a) (11b)
(12a )(12b )が形成されるとともに、可動基板(2)におもり(20)が設けられ、該おもり(20)に外力が付与されたときの可動基板(2)の変形に基く前記コンデンサの容量変化を検出することにより加速度を検出するものとなされた静電容量式加速度センサにおいて、前記おもり(20)が、固定基板(1)側に位置する内側部材(21)と反対側に位置するおもり本体(22)とによって可動基板(2)を挟着した状態に設けられるとともに、おもり本体(22)と可動基板(2)との接触面積が内側部材(21)と可動基板(2)との接触面積よりも大に設定されていることを特徴とする静電容量式加速度センサを要旨とする。 With (12a) (12b) are formed, the weight (20) is provided on the movable substrate (2), the capacitor based on the deformation of the movable substrate (2) when an external force is applied to the weight (20) in the electrostatic capacitance type acceleration sensor was made as to detect the acceleration by detecting a change in capacitance, the the weight (20), positioned on the opposite side of the inner member (21) located in the fixed substrate (1) side together provided a movable substrate (2) to the state of being sandwiched by the weight body (22) to a movable substrate weight body (22) (2) the contact area between the inner member (21) and the movable substrate (2) and gist electrostatic capacitance type acceleration sensor, characterized in that it is set to larger than the contact area between.

【0013】 [0013]

【作用】内側部材(21)と可動基板(2)との接触面積は小さく、おもり本体(22)と可動基板(2)との接触面積は大きいから、同一の大きさの加速度が両基板の接近方向と離間方向においておもりに加わった場合、接近方向へのたわみ量△d2は小さく離間方向へのたわみ量△d1 は大きい。 [Action] is the contact area between the inner member (21) and the movable substrate (2) small, because the contact area between the weight body (22) and the movable substrate (2) is large, the acceleration of the same magnitude in both substrate If applied to the weight in the approach direction and the detaching direction, deflection of △ d1 to deflection amount △ d2 is small detaching direction of the approaching direction is large. 一方、可動基板(2)が接近方向にたわんだ時のコンデンサ(10)の静電容量の増加量は大きく、可動基板(2)が離間方向にたわんだ時の静電容量の減少量は小さいから、離間方向へのたわみ量△d1 が接近方向へのたわみ量△d2 よりも大きくなることによって、静電容量の増加量と減少量の差が相殺され、増加量と減少量は接近して静電容量の非対称性が改善される。 On the other hand, the increase in the capacitance of the capacitor when the movable board (2) is deflected in the direction of approach (10) is large, the decrease in capacitance when the movable board (2) is deflected in the detaching direction is small from the fact that the deflection amount △ d1 in the separating direction becomes larger than the amount of deflection △ d2 in the approaching direction, the difference increase and decrease of the capacitance is canceled, reduction is close to the increment asymmetry of the capacitance is improved.

【0014】 [0014]

【実施例】次に、この発明の実施例を図1〜3に基いて説明する。 BRIEF DESCRIPTION OF on the basis of the embodiments of the present invention in FIGS.

【0015】図1及び図2において、(1)は固定基板、(2)は可動基板、(3)はスペーサ、(4)は上側押え部材、(5)は下側押え部材、(7a)(7b)(8 [0015] In FIGS. 1 and 2, (1) a fixed substrate, the (2) movable substrate, the (3) spacer, (4) the upper holding member, is (5) the lower holding member (7a) (7b) (8
a)(8b)は分割電極、(9)は可動基板からなる共通電極、(11a )(11b )(12a )(12b )はX軸方向及びY軸方向に分割された4個のコンデンサであり、これらは図4に示した構成と同一であり、その説明を省略する。 a) (8b) is divided electrodes, (9) a common electrode comprising a movable substrate, (11a) (11b) (12a) (12b) is of four capacitors which are divided into X-axis and Y-axis directions , they are the same as that shown in FIG. 4, the description thereof is omitted. また、この実施例では、上下方向の加速度を検出するコンデンサを形成するための電極(6)は、固定基板中心部に後述する孔(1a)が開けられるため、環状に形成されている。 Further, in this embodiment, the electrodes for forming the capacitor for detecting acceleration in the vertical direction (6), since the holes (1a) is opened, which will be described later on the fixed center portion of the substrate, it is formed annularly. これに伴い、環状電極(6)と共通電極(9)とによって形成されるコンデンサ(10)も環状に形成されている。 Accordingly, the capacitor (10) formed by the annular electrode (6) and the common electrode (9) is also formed in an annular shape.

【0016】前記可動基板(2)にはおもり(20)が固定されている。 [0016] The the movable substrate (2) being fixed weight (20). このおもり(20)は、可動基板(2)の上側(固定基板側)に位置する内側部材(21)と下側(固定基板と反対側)に位置するおもり本体(22)とによって構成されている。 The weight (20) is constituted by an inner member positioned on the upper side (fixed substrate side) of the movable substrate (2) (21) lower a weight body located (fixed substrate opposite) (22) there. おもり本体(22)は、断面円形の胴部(22a )と該胴部の上面中央部に一体形成された断面円形かつ胴部よりも径小の首部(22b )とからなる。 Weight body (22) is composed of barrel of circular cross section and (22a) neck of smaller diameter than the circular cross-section and the body portion which is integrally formed on the upper central portion of the body portion and (22b). 一方、内側部材は断面円形のボルトの頭部からなる。 On the other hand, the inner member consists of a head of circular cross-section of the bolt. この内側部材の外径b´は前記おもり本体(22)の首部(22b )の外径bよりも小に設定されている。 Is set to be smaller than the outer diameter b of the outer diameter b'is the neck portion of the weight body (22) of the inner member (22b). そして、可動基板(2)を貫通してボルトの軸部(21a )をおもり本体(22)の首部(22b )にねじ込むことにより、内側部材(21)とおもり本体(22)の首部(22b ) Then, by screwing the shaft portion of the bolt through the movable substrate (2) neck of (21a) the weight body (22) (22b), the neck portion of the weight body (22) and the inner member (21) (22b)
とによって可動基板(2)を挟着した状態で、おもり(20)が可動基板(2)に固定されている。 While sandwiched a movable substrate (2), the weight (20) is fixed to the movable substrate (2) by the. 前記内側部材(21)は前記おもり本体(22)の首部(22b )よりも径小であるから、内側部材(21)の断面積は首部(22b Since the inner member (21) is a smaller diameter than the neck portion (22b) of said weight body (22), the cross-sectional area of ​​the inner member (21) neck (22b
)の断面積よりも小さく、従って可動基板(2)の挟着状態では、内側部材(21)と可動基板(2)との接触面積よりもおもり本体(22)の首部(22b )と可動基板(2)との接触面積の方が大きいものとなされている。 Smaller than the cross-sectional area of), thus the clamping state of the movable substrate (2), the neck portion of the weight body (22) than the contact area between the inner member (21) and the movable substrate (2) (22b) and the movable substrate (2) it has been made as the larger contact area with.

【0017】このように、内側部材(21)と可動基板(2)との接触面積と、おもり本体(22)の首部(22b [0017] Thus, the contact area between the inner member (21) and the movable substrate (2), the neck portion of the weight body (22) (22b
)と可動基板(2)との接触面積を異なるものに設定したのは、上下方向(固定基板(1)と可動基板(2) ) And the movable substrate (2) was set to the contact area different from the upper and lower directions (fixed substrate (1) and the movable substrate (2)
との接近方向及び離間方向)に同一の大きさの加速度が作用したときに、可動基板(2)の上方へのたわみ量を小さく、下方へのたわみ量を大きくするためである。 When the acceleration in the approaching direction and separating direction) in the same magnitude is applied to the small deflection amount of upward moving substrate (2), in order to increase the bending amount of downward. 即ち、一般に、周囲固定円形平板の中心部分に荷重が加わった場合、同一の大きさの荷重であっても、それが集中荷重として加わった場合と分散荷重として加わった場合とでは平板のたわみ量は異なるものとなり、集中荷重として加わった方がたわみ量が大きく、荷重面積が拡大するほどたわみ量は小さくなる。 That is, in general, when a load is applied to the central portion of the peripheral fixed circular flat plate, even load of the same magnitude, the amount of deflection of the plate in the case where it is applied as if a dispersion load applied as concentrated load becomes different, the deflection amount is large who applied as concentrated load, the amount of deflection as the load area is enlarged is reduced. 而して、図1、2のセンサのおもり(20)に下向き加速度(上向きの慣性力)が加わった場合、可動基板(2)にはおもり本体(22)の首部(22b )との接触面を介して荷重が加わり、上向き加速度(下向きの慣性力)が加わった場合、可動基板(2)には内側部材(21)との接触面を介して荷重が加わる。 And Thus, the contact surface between the case where the applied downward acceleration (upward inertial force), the neck portion of the weight body in the movable substrate (2) (22) (22b) to the weight (20) of the sensor of FIGS applied load via, if applied upward acceleration (downward inertial force), the load applied through the contact surface between the inner member (21) in the movable substrate (2). しかるに、内側部材(21)と可動基板(2)との接触面積(図2(b)の実線ハッチングの部分)は小さく、おもり本体(22)の首部(22b )と可動基板(2) However, the inner member (21) and the contact area between the movable substrate (2) (solid line hatching portion in FIG. 2 (b)) is small, the neck portion of the weight body (22) (22b) and the movable substrate (2)
との接触面積(図2(b)の点線ハッチングの部分)は大きいから、図2(a)に示すように、上方へのたわみ量△d2 は小さく下方へのたわみ量△d1 は大きいものとなる。 Since the contact area (dotted hatched portion in FIG. 2 (b)) is large with, as shown in FIG. 2 (a), the deflection amount of upward △ d2 is the amount of deflection of the smaller lower △ d1 as the large Become.

【0018】なお、おもり(20)が上方変位した際の内側部材(21)との接触を避けるため、固定基板(1)の中心部には内側部材(21)を通過させる孔(1a)が形成されている。 [0018] In order to avoid contact between the weight (20) inside member when is displaced upward (21), in the center of the fixed substrate (1) hole (1a) is passing the inner member (21) It is formed.

【0019】図1及び図2に示すセンサでは、上向きに加速度が作用した場合、おもり(20)には下向きの慣性力が作用し、可動基板(2)は内側部材(21)との接触面を介して下向き荷重が加わり、可動基板(2)は図3 [0019] In the sensor shown in FIGS. 1 and 2, upward when the acceleration is applied, the weight (20) acts downward inertial force, the contact surface between the movable substrate (2) the inner member (21) joined by downward load through the movable board (2) is 3
(a)のように下向きにたわむ。 Downwardly bent as shown in (a). 一方、下向きに同一の大きさの加速度が作用すると、おもり(20)には上向きに同一の大きさの慣性力が作用し、可動基板(2)はおもり本体(22)の首部(22b )との接触面を介して上向き荷重が加わり、可動基板(2)は図3(b)のように上向きにたわむ。 On the other hand, to act acceleration of the same magnitude downwards, the weight (20) upward acts the same magnitude inertial force, the movable substrate (2) is the neck of the weight body (22) and (22b) joined by an upward load through the contact surfaces, the movable substrate (2) is upwardly bent as shown in FIG. 3 (b). 前述のとおり、内側部材(21)と可動基板(2)との接触面積は小さく、おもり本体(22)の首部(22b )と可動基板(2)との接触面積は大きいから、上方へのたわみ量△d2 は小さく下方へのたわみ量△d1 は大きい。 As described above, since the inner member (21) contact area is small between the movable substrate (2), the contact area of ​​the neck of the weight body (22) and (22b) and the movable substrate (2) is large, deflection of the upward the amount △ d2 is the amount of deflection of the small downward △ d1 is large. 一方、可動基板(2)が上向きにたわんだ時のコンデンサ(10)の静電容量の増加量は大きく、可動基板(2)が下向きにたわんだ時の静電容量の減少量は小さいから、下方へのたわみ量△d1 が上方へのたわみ量△d2 よりも大きくなることによって、静電容量の増加量と減少量の差が相殺され、増加量と減少量は接近して静電容量の非対称性が改善される。 On the other hand, the increase in the capacitance of the capacitor (10) when the movable board (2) took upwardly deflected is large, since the movable board (2) decrease the amount of capacitance when deflected downwardly is small, by bending amount of downward △ d1 is larger than the deflection amount △ d2 upward, offset the difference increase and decrease in capacitance, the decrease and increase in the capacitance close asymmetry is improved.

【0020】ちなみに、C+△C=ε・S/(d+△d [0020] By the way, C + △ C = ε · S / (d + △ d
1 )、C−△C=ε・S/(d−△d2 )とすれば、△ 1), C- △ C = ε · S / (d- △ d2) and if, △
d2 =△d1 /(1+△d1 /d)となる。 d2 = △ d1 / become (1 + △ d1 / d). d=0.1 d = 0.1
mm、△d1 =0.01mmとすると△d2 =0.00 mm, and the △ d1 = 0.01mm △ d2 = 0.00
917mmとなり、これに見合うように内側部材の外径b´を決定すれば良い。 917mm, and it suffices to determine the outer diameter b'of the inner member so as to meet this.

【0021】 [0021]

【発明の効果】以上説明したようにこの発明は、おもりが、固定基板側に位置する内側部材と反対側に位置するおもり本体とによって可動基板を挟着した状態に設けられるとともに、おもり本体と可動基板との接触面積が内側部材と可動基板との接触面積よりも大に設定されていることを特徴とするものであるから、両基板の接近方向及び離間方向へ同一の大きさの加速度が加わったときのコンデンサの静電容量変化量の差を小さくできる。 The invention described above, according to the present invention, together with the weight is provided in a state where the movable substrate was sandwiched by a weight body located on the opposite side of the inner member located on the fixed substrate side, and the weight body because characterized in that the contact area between the movable substrate is set larger than the contact area between the inner member and the movable substrate, the acceleration of the same magnitude to the approaching direction and separation direction of the two substrates the difference between the variation amount of capacitance of the capacitor when applied can be reduced. その結果、センサにおける両基板の接近方向及び離間方向の感度の非対称性を改善でき、加速度の大きさを高精度に検出することができるとか、処理回路を簡素化できる等の効果を奏する。 As a result, achieved can improve asymmetry approaching direction and separating direction sensitivity of the substrates in the sensor, Toka can detect the magnitude of acceleration with high accuracy, the effect of such can be simplified processing circuit.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】この発明の一実施例を示すもので、(a)は断面図、(b)は(a)のIb−Ib線断面図である。 [1] shows one embodiment of the present invention, (a) shows the cross sectional view, (b) is a line Ib-Ib cross sectional view of (a).

【図2】(a)はおもりの取り付け状態を示す拡大断面図、(b)は(a)のIIb −IIb 線断面図である。 2 (a) is an enlarged sectional view showing a mounting state of the weight, a IIb-IIb sectional view taken along line (b) is (a).

【図3】(a)は図1に示した静電容量式加速度センサのおもりに下向きの慣性力が加わっている状態の断面図、(b)は同じく上向きの慣性力が加わっている状態の断面図ある。 3 (a) is an electrostatic capacitance type acceleration section of the state in which the downward inertia force to the weight is applied view of the sensor shown in FIG. 1, (b) it is also a condition that participates upward inertia force It is a cross-sectional view.

【図4】従来の静電容量式加速度センサを示すもので、 [4] shows the conventional electrostatic capacitance type acceleration sensor,
(a)は断面図、(b)は(a)のIVb −VIb 線断面図である。 (A) is a cross-sectional view, a IVb -VIb line cross-sectional view of (b) is (a).

【符号の説明】 DESCRIPTION OF SYMBOLS

1…固定基板 2…可動基板 6、7a、7b、8a、8b、9…電極 10、11a 、11b 、12a 、12b …コンデンサ 20…おもり 21…内側部材 22…おもり本体 1 ... fixed substrate 2 ... movable substrate 6,7a, 7b, 8a, 8b, 9 ... electrodes 10,11a, 11b, 12a, 12b ... condenser 20 ... weight 21 ... inner member 22 ... weight body

Claims (1)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 固定基板(1)と該固定基板に間隔をおいて対向配置された可動基板(2)とを備え、固定基板表面の電極(6)(7a)(7b)(8a)8b)と可動基板表面の電極(9)とによってコンデンサ(10)(11a ) 1. A fixed board (1) at a distance to the fixed substrate and a oppositely disposed movable substrate (2), the electrode of the fixed substrate surface (6) (7a) (7b) (8a) 8b ) and capacitor by the electrode (9) of the movable substrate surface (10) (11a)
    (11b )(12a)(12b )が形成されるとともに、可動基板(2)におもり(20)が設けられ、該おもり(20) (11b) (12a) with (12b) is formed, the weight (20) is provided on the movable substrate (2), said weight (20)
    に加速度が作用したときの可動基板(2)の変形に基く前記コンデンサの容量変化を検出することにより加速度を検出するものとなされた静電容量式加速度センサにおいて、 前記おもり(20)が、固定基板(1)側に位置する内側部材(21)と反対側に位置するおもり本体(22)とによって可動基板(2)を挟着した状態に設けられるとともに、おもり本体(22)と可動基板(2)との接触面積が内側部材(21)と可動基板(2)との接触面積よりも大に設定されていることを特徴とする静電容量式加速度センサ。 In the electrostatic capacitance type acceleration sensor was made as to detect the acceleration by the acceleration detecting a change in capacitance of the capacitor based on the deformation of the movable substrate (2) when applied, it said weight (20) is fixed together provided while sandwiched a movable substrate (2) by a substrate (1) an inner member positioned side (21) a weight body on the opposite side (22), the weight and the movable substrate body (22) ( electrostatic capacitance type acceleration sensor, characterized in that it is set to larger than the contact area of ​​the contact area with the inner member (21) and the movable substrate (2) with 2).
JP4038995A 1995-02-28 1995-02-28 Electrostatic capacity type acceleration sensor Granted JPH08233855A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4038995A JPH08233855A (en) 1995-02-28 1995-02-28 Electrostatic capacity type acceleration sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4038995A JPH08233855A (en) 1995-02-28 1995-02-28 Electrostatic capacity type acceleration sensor

Publications (1)

Publication Number Publication Date
JPH08233855A true JPH08233855A (en) 1996-09-13

Family

ID=12579310

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4038995A Granted JPH08233855A (en) 1995-02-28 1995-02-28 Electrostatic capacity type acceleration sensor

Country Status (1)

Country Link
JP (1) JPH08233855A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6468816B2 (en) * 1998-03-06 2002-10-22 Applied Materials, Inc. Method for sensing conditions within a substrate processing system
US7283255B2 (en) 2002-02-06 2007-10-16 Cyberoptics Semiconductor, Inc. Wireless substrate-like sensor
WO2011142754A1 (en) * 2010-05-12 2011-11-17 Hewlett-Packard Development Company, L.P. Accelerometer

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6468816B2 (en) * 1998-03-06 2002-10-22 Applied Materials, Inc. Method for sensing conditions within a substrate processing system
US6642853B2 (en) 1998-03-06 2003-11-04 Applied Materials, Inc. Movable wireless sensor device for performing diagnostics with a substrate processing system
US6895831B2 (en) 1998-03-06 2005-05-24 Applied Materials, Inc. Sensor device for non-intrusive diagnosis of a semiconductor processing system
US7331250B2 (en) 1998-03-06 2008-02-19 Applied Materials, Inc. Sensor device for non-intrusive diagnosis of a semiconductor processing system
US7434485B2 (en) 1998-03-06 2008-10-14 Applied Materials, Inc. Sensor device for non-intrusive diagnosis of a semiconductor processing system
US7283255B2 (en) 2002-02-06 2007-10-16 Cyberoptics Semiconductor, Inc. Wireless substrate-like sensor
US7289230B2 (en) 2002-02-06 2007-10-30 Cyberoptics Semiconductors, Inc. Wireless substrate-like sensor
WO2011142754A1 (en) * 2010-05-12 2011-11-17 Hewlett-Packard Development Company, L.P. Accelerometer

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