JPH0821642B2 - Package for high frequency devices - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a high-frequency element package that accommodates high-frequency elements such as semiconductor elements that operate at ultrahigh frequencies or high frequencies of 3 GHz to 50 GHz.

[Prior Art] In recent years, as the performance and speed of information processing devices have increased, the frequency of elements such as semiconductor elements has increased further, and the demand for packages with excellent high frequency characteristics that accommodate these elements has increased. It's starting.

As a package for accommodating this high frequency element, for example, there is a package described in Japanese Utility Model Laid-Open No. 61-86944.
In this package, a notch is provided on a metal substrate, and a ceramic input / output terminal attachment member having a signal line made of a metallized layer is fitted inside the notch. In this package, the metal base that conducts to the ground layer around the notch in which the input / output terminal attachment member is fitted has a coaxial structure surrounding the signal line provided in the ceramic input / output terminal attachment member. The metal wall made of a metal substrate prevents a signal flowing through the signal line in the input / output terminal attachment member from leaking to the outside of the signal line.

[Problems to be Solved by the Invention] However, in the above-described package, it is extremely difficult to form a notch for fitting the input / output terminal attachment member on the metal base during the manufacture thereof, With the package, it has become impossible to cope with the recent high-density mounting of semiconductor elements and the increase in the number of input / output terminals. Further, in the above-described package, the input / output terminal attaching member peripheral wall and the inner surface of the cutout portion must be brazed or the like via a metallized layer formed in advance on the input / output terminal attaching member peripheral wall, and the production thereof is required. It took a lot of trouble and time.

The present invention is to solve such a problem, and an object thereof is to be compatible with high-density mounting of elements such as semiconductor elements for high frequency and multi-terminals of input / output terminals, and easy to manufacture, An object is to provide a package for a high frequency element that accommodates elements such as ultra high frequency and high frequency semiconductor elements.

[Means for Solving the Problems] In order to achieve the above object, in the high-frequency device package of the present invention, a frame body made of an insulator surrounding the high-frequency device is laminated on a substrate made of an insulator to which the high-frequency device is attached. In the package for a high-frequency device, in which a plurality of signal lines are provided side by side on the substrate, the substrate is provided with a ground layer that continuously covers the lower side of the plurality of signal lines, and the frame body is provided with the ground layer. A plurality of conductors are provided in an insulator portion that includes a ground layer that continuously covers the upper portions of the plurality of signal lines, and that sandwiches the upper and lower ground layers and that forms the substrate and the frame on the left and right sides of the signal line. It is characterized in that the layers are arranged in a plurality of layers vertically in parallel or substantially parallel to the signal line, and a conductor line for conducting the conductor layer to the ground layer is provided in the insulator portion.

[Operation] In the high-frequency device package of the present invention, the upper side and the lower side of each signal line are covered with a ground layer having a shield effect without a gap.

Further, a plurality of conductor layers each having a left side portion and a right side portion of each signal line sandwiched between the upper and lower ground layers arranged side by side in a plurality of stages, the shield being electrically connected to the ground layer via the conductor lines. It is densely surrounded by multiple conductor layers that have an effect.

Further, the left side portion and the right side portion of each signal line sandwiched between the upper and lower ground layers are surrounded by a conductor line having a shield effect that conducts to the ground layer.

In other words, the upper and lower sides and the left and right sides of each signal line are densely surrounded by a shield wall composed of a ground layer, a conductor layer, and a conductor line with a small gap, and each signal line is formed into a pseudo coaxial line extremely close to the coaxial line. ing.

Therefore, it is possible to reliably prevent the high-frequency signal transmitted to each signal line from mixing into another signal line by the shield wall having a small shield effect and a high shield effect. And the insulation degree between each signal line can be improved significantly.

Also, the distance between the signal line and the ground layer, the conductor layer, or the conductor line that constitutes the shield wall around the signal line, the pitch of the conductor layers arranged in a plurality of upper and lower layers, or the width of the signal line, the conductor layer, or the conductor line. By adjusting the thickness and its thickness,
The characteristic impedance of the signal line can be easily and accurately matched to a constant value.

In addition, the number of a plurality of conductor layers arranged in a plurality of upper and lower layers in an insulator portion which constitutes the substrate and the frame body sandwiched between the upper and lower ground layers may be increased, or a plurality of conductors arranged in a plurality of upper and lower layers may be arranged. By sandwiching the pitch of the layers, it is possible to bring almost the entire insulator portion sandwiching the upper and lower ground layers, which constitutes the substrate and the frame, to the ground potential. Then, the resonance width of the ring resonance generated in the ring-shaped frame portion or the substrate portion around the signal line by the high frequency signal transmitted to the signal line can be significantly reduced. Then, it is possible to reliably prevent the high frequency characteristics of the signal line from being deteriorated due to the influence of the ring resonance generated in the frame portion or the substrate portion around the signal line.

[Embodiment] Next, an embodiment of the present invention will be described with reference to the drawings.
1 and 2 show a preferred embodiment of the high-frequency device package of the present invention. FIG. 1 is a perspective view of the package, and FIG. 2 is a cross-sectional view of a signal line portion of the package. . In the figure, reference numeral 8 is a substrate on which an element such as a semiconductor element, which is a laminate of two rectangular ceramic plates 8a and 8b as the insulator 3, is mounted. At the center of the surface of the upper plate 8a of the substrate 8, a buried hole 15 for burying a device such as a semiconductor device is buried.
Through. Then, on the upper surface of the upper plate 8a around the buried hole 15, a conductor layer 7 having a strip-shaped metallized layer whose outer end reaches the peripheral edge of the plate 8a and a strip-shaped metallized layer having its outer end reaching the peripheral edge of the plate 8a are formed. A plurality of signal lines 1 are provided in a radial pattern so that the conductor layers 7 adjacent to each other and the signal lines 1 are alternately arranged at predetermined intervals and are parallel or substantially parallel to each other. A bonding layer 9 for mounting an element such as a semiconductor is provided at the center of the upper surface of the lower plate 8b exposed inside the buried hole 15 of the substrate 8. Further, a conductor layer 7 composed of a band-shaped metallized layer that passes through the lower surface of the upper plate 8a and reaches the peripheral edge of the plate 8b around the upper surface of the lower plate 8b is provided on the upper surface of the upper plate 8a. A plurality of them are provided in parallel or substantially in parallel with each signal line 1 and immediately below each conductor layer 7 provided on the upper surface of the upper plate 8a, and are spaced at predetermined intervals. In addition, the ground layer 5 whose peripheral edge reaches the peripheral edge of the substrate 8 is provided on the entire lower surface of the substrate 8. Further, two ceramic frame plates 12 that are substantially rectangular frame-shaped insulators 3
A frame body 12 surrounding an element such as a semiconductor element formed by laminating a and 12b is provided, the frame body 12 is laminated on the upper surface of the substrate 8, and each signal line radially provided around the upper surface of the substrate 8 is provided. A frame 12 covers the intermediate portions of 1 and each conductor layer 7. Then, a cavity 10 for accommodating an element such as a semiconductor element is formed inside the frame body 12. In addition, a conductor layer 7 composed of a strip-shaped metallized layer that passes through the lower surface of the upper frame plate 12a and reaches the inner and outer peripheral edges of the frame plate 12b around the upper surface of the lower frame plate 12b of the frame body 12 described above.
Are arranged in parallel or substantially parallel to the respective signal lines 1 provided on the upper surface of the substrate 8 and directly above the respective conductor layers 7 provided on the upper surface of the substrate 8, and a plurality of them are radially arranged at predetermined intervals. Prepare Further, on the upper surface of the frame body 12, there is provided a metallization layer 13 which also serves as a ground layer 5 whose peripheral edge to which a sealing cap (not shown) is attached reaches inner and outer peripheral edges of the frame body 12. further,
On the peripheral side surface of the substrate 8, the outer ends of the conductor layers 7 provided on the upper surface of the upper plate 8a and the outer ends of the conductor layers 7 provided on the upper surface of the lower plate 8b immediately below and the periphery of the ground layer 5 on the lower surface of the substrate 8 A plurality of strip-shaped metallization layers 13 are provided at predetermined intervals so as to be electrically connected to each other. In addition, on the inner and outer peripheral side surfaces of the frame body 12, the frame body 12
The outer edges of the inner and outer conductor layers 7 provided on the upper and lower edges of the ground layer 5 and the upper surface of the lower frame plate 12b, and the surfaces of the conductor layers 7 provided on the upper surface of the upper plate 8a of the substrate 8 immediately thereunder. A plurality of strip-shaped metallized layers 13 are provided at predetermined intervals so as to be electrically connected to each other. Further, on each side surface 14 at four corners around the outside of the package 2 formed by stacking the substrate 8 and the frame body 12, each conductor layer provided inside or on the surface of the substrate 8 or the frame body 12 exposed on each side surface 14. A wide strip-shaped metallization layer 13 is provided to electrically connect the outer edge of the ground layer 7 and the periphery of the ground layer 5. Further, the input / output terminals 16 are brazed to the end portions of each signal line 1 exposed on the upper surface of the substrate 8 around the outer side of the rectangular frame-shaped frame 12. The package 2 shown in FIGS. 1 and 2 has the above-described structure. For manufacturing the package 2, for example, the plates 8a, 8b coated with the conductor paste for forming the signal line 1, the conductor layer 7, the ground layer 5 and the like on the surface thereof. A package member formed by stacking the ceramic green sheets for the frames 12a and 12b is integrally fired to manufacture. In addition, the conductor layer 7
The metallization layer 13 that electrically connects the grounding layer 5 to the ground layer 5 is a plate.
After the conductor paste for the metallization layer 13 is applied by screen printing or the like to the inner and outer peripheral side surfaces of the package member formed by laminating the ceramic green sheets for 8a, 8b and the frame plates 12a, 12b, the package member is integrated. To prepare for the inner and outer peripheral side surfaces of the package 2 by firing to
The ceramic green sheets for 8a, 8b and the frame plates 12a, 12b have through holes coated with the conductor paste on the inner peripheral surface, and the ceramic green sheets are cut for the plates 8a, 8b and the frame plates 12a, 12b. The ceramic green sheets are cut across the above-mentioned through holes, and the plates 8a, 8b are cut.
And on the inner and outer peripheral side surfaces of each of the ceramic green sheets for the frame plates 12a and 12b, a notch 13a having a semicircular cross section in which a conductor paste is applied to the inner peripheral surface thereof, and a plate 8a having the notch 13a, The package member formed by laminating the ceramic green sheets for 8b and the frame plates 12a, 12b is integrally fired to provide the strip-shaped metallization layer 13 on the inner and outer peripheral side surfaces of the package 2.

Next, an example of its use will be described. A bonding layer 9 in the substrate 8 in which a device (not shown) such as a semiconductor device is housed inside the cavity 10 and exposed inside the buried hole 15 at the bottom thereof.
Attach the back side of the element to the front side. Then, each connection pattern in the element and each signal line 1 on the upper surface of the substrate 8 exposed around the inside of the cavity 10 inside the frame 12 are connected by wires.
Next, a sealing cap (not shown) is covered over the upper surface of the frame body 12 and the upper surface of the cavity 10, and the metallized layer 13 on the upper surface of the frame body 12 is covered with a gold-tin material or the like around the cap. Put on. Then, when a signal is sent to each input / output terminal 16 brazed to the end of each signal line 1 exposed on the upper surface of the substrate 8 outside the frame 12, each signal on the upper surface of the substrate 8 to which each terminal 16 is connected is connected. A signal flows through the line 1 and is transmitted to an element such as a semiconductor element enclosed in the cavity 10 connected to each signal line 1 by a wire. Then, at that time, the signal lines 1 are provided inside or on the surface of the substrate 8 or the frame body 12 of the ceramic insulator 3 which is the dielectric material around the signal lines 1 of the package 2 in parallel or substantially parallel to each signal line 1. Each conductor layer 7 that conducts to the ground layer 5 that constitutes the pseudo metal wall 6 is provided such that the signal flowing through each signal line 1 passes through the ceramic insulator 3 that constitutes the substrate 8 or the frame 12, or through the air. It is properly prevented from leaking to the outside and mixing into the other adjacent signal lines 1.

Further, the ground line 5 widely and continuously covers the upper part and the lower part of the signal line 1. Further, a plurality of conductor layers 7 electrically connected to the ground layer 5 are arranged in a plurality of layers vertically on the left side portion and the right side portion of the signal line 1 sandwiched between the upper and lower ground layers 5. Further, a conductor line composed of a metallized layer 13 electrically connected to the ground layer 5 is provided on the left side portion and the right side portion of the signal line 1 sandwiched between the upper and lower ground layers 5. The signal line 1 has a pseudo coaxial line structure that is extremely close to the coaxial line. Therefore, the distance between the signal line 1 and the ground layer 5, the conductor layer 7, or the conductor line, the pitch of the plurality of conductor layers 7 arranged vertically in a plurality of stages, or the signal line 1, the ground layer 5, or the conductor layer 7. By adjusting the width and the thickness of the conductor line, the characteristic impedance of the signal line 1 can be accurately matched to a constant value. Then, it is possible to suppress the transmission loss of the high frequency signal transmitted to the signal line 1.

Further, a plurality of conductor layers 7 provided with the left side portion and the right side portion of the signal line 1 sandwiched between the upper and lower ground layers 5 densely arranged in a plurality of upper and lower stages, and the conductor layers 7 are electrically connected to the ground layer 5. Since it is closely surrounded by a shield wall having a high shield effect including a conductor line with a small gap, a part of the high frequency signal transmitted to the signal line 1 passes through the gap of the shield wall and is mixed with another signal line 1. Can be reliably prevented.

Further, since a plurality of conductor layers 7 are densely arranged vertically in a plurality of stages in an insulator portion which constitutes the substrate 8 and the frame body 12 sandwiched between the upper and lower ground layers 5, the upper and lower ground layers 5 are provided. It is possible to bring almost the entire insulator portion that constitutes the substrate 8 and the frame body 12 sandwiched between the two close to the ground potential. Then, the amplitude width of the ring resonance generated in the ring-shaped frame 12 portion and the substrate 8 portion around the signal line 1 by the high frequency signal transmitted to the signal line 1 can be significantly reduced. And the signal line 1
It is possible to prevent the transmission characteristics of the high-frequency signal transmitted to the signal line 1 from being deteriorated due to the adverse effect of ring resonance generated in the surrounding frame 12 portion and the substrate 8 portion.

In addition, in the package 2 of the above-described embodiment, according to the high and low of the frequency of the signal sent to each signal line 1, the pseudo inside of the substrate of the insulator 3 around each signal line 1 and the frame 12 and the surface thereof are provided. The distance between each conductor layer 7 forming the metal wall 6 and each signal line 1 is adjusted by changing the thickness of the plates 8a, 8b and the frame plates 12a, 12b which are the insulators 3 forming the package 2. It is necessary to adjust so that the signal flowing through each signal line 1 does not leak over the conductor layers 7 of the pseudo metal wall to the outside thereof.

Further, in the case where the conductor layers 7 which are electrically connected to the ground layer 5 formed by the pseudo metal wall 6 provided inside or on the surface of the substrate 8 or the frame 12 which is the ceramic insulator 3 around each signal line 1 are long, As shown in FIG. 3, the metallized conductor was filled in the substrate 8 or the frame 12 which is the insulator 3 between the midway portion of each conductor layer 7 and the ground layer 5 or between each conductor layer 7. The via holes 17 are provided, and the ground layer 5 and the middle portions of the conductor layers 7 are electrically connected through the via holes 17, and all the conductor layers 7 maintain the same potential as the ground layer 5. It is good to do so. Further, in such a case, a plurality of conductor layers 7 provided with the left side portion and the right side portion of the signal line 1 sandwiched between the upper and lower ground layers 5 arranged vertically in a plurality of stages and the conductor layers 7 are ground layers 5.
In addition to the metallization layer 13 that conducts to the ground, the via hole filled with the metallization conductor that conducts the conductor layer 7 to the ground layer 5
At 17, it can be tightly enclosed. And the upper and lower ground layers 5
The left side portion and the right side portion of the signal line 1 sandwiched between are densely surrounded by a shield wall having a high shielding effect, which is composed of the conductor layer 7, the ground layer 5, the metallized layer 13 and the via hole 17 and has a high shield effect. Part of the high-frequency signal transmitted on line 1
This is convenient because it can be surely prevented from entering the other signal line 1 through the gap of the shield wall, and that the characteristic impedance of the signal line 1 can be accurately matched. Furthermore, in order to maintain the same potential of each conductor layer 7 and the ground layer 5 accurately, each conductor layer provided inside or on the surface of the substrate 8 or the frame 12 which is the insulator 3 around each signal line 1 is provided. The width and the thickness of 7 need to be formed in a predetermined width and thickness in consideration of the impedance of each signal line 1.

Furthermore, in the package 2 of the above-described embodiment, the substrate 8 and the frame body 12 each have two layers, but it is preferable to increase the number of the conductor layers 7 in the package 2 by using three layers or more. Needless to say.

Further, as an embodiment similar to the above-mentioned embodiment, as shown in FIG. 4, multistages such as upper and lower two stages are provided inside or on the surface of the substrate 8 which is the insulator 3 constituting each package of each signal line 1. A plurality of conductor layers 7 that are electrically connected to the ground layer 5 are provided inside or on the surface of the substrate 8 or the frame body 12 that is the insulator 3 around each signal line 1 at each stage. A package 2 with or in parallel with 1 is conceivable.

Further, a resin such as a polyimide resin is used for the insulator 3 that forms the substrate 8 and the frame 12 of the package 2, and the signal line 1 and the conductor layer 7 are formed inside or on the surface of the resin by vapor deposition or laminating. The high frequency element package 2 of the present invention may be formed by providing the conductor pattern constituting the above.

The following Table 1 shows the relationship between the adjacent signal lines 1 in the ceramic package A formed by the conventional ordinary lamination method, the package B described in Japanese Utility Model Laid-Open No. 61-86944, and the package C of the present invention. A comparison of insulation is shown.

According to Table 1, compared with the conventional package A, the package C of the present invention has an extremely high degree of insulation at ultra-high frequencies, etc., similarly to the package B described in Japanese Utility Model Application Laid-Open No. 61-86944. It can be seen that the package has excellent characteristics.

[Effects of the Invention] As described above, according to the high-frequency device package of the present invention, the left and right portions of the signal line sandwiched between the upper and lower ground layers are densely arranged vertically in a plurality of stages. Further, it is possible to form a shield wall having a high shield effect with a small gap formed of a plurality of conductor layers and a conductor line that conducts the conductor layers to the ground layer. Then, it is possible to reliably prevent a part of the high frequency signal transmitted to the signal line from passing through the gap of the shield wall and being mixed into another signal line.

In addition, a ground layer having a high shielding effect can be provided above and below the signal line so as to continuously cover the upper and lower parts of the signal line with no gap, and the signal sandwiched between the upper and lower ground layers can be provided. It is possible to equip the left side portion and the right side portion of the line with the shield wall having a small shield and a high shield effect. Then, the signal line can be formed into a pseudo coaxial line extremely close to the coaxial line. Then, the distance between the signal line and the ground layer, the conductor layer, or the conductor line, the pitch of the plurality of conductor layers arranged in a plurality of layers vertically, or the width of the signal line, the ground layer, the conductor layer, or the conductor line, or the width thereof. By adjusting the thickness to a large or small value, the characteristic impedance of the signal line can be accurately matched to a constant value. Then, it is possible to reduce the transmission loss of the high frequency signal transmitted through the signal line based on the mismatch of the characteristic impedance of the signal line.

Further, a plurality of conductor layers are densely arranged vertically with a plurality of small pitches in an insulator portion forming a substrate and a frame body sandwiched between the upper and lower ground layers, and sandwiched between the upper and lower ground layers. It is possible to bring almost the entire insulator portion forming the substrate and the frame close to the ground potential. Then, the amplitude width of the ring resonance generated in the ring-shaped frame portion or the substrate portion around the signal line by the high frequency signal transmitted to the signal line can be significantly reduced. Then, it is possible to reliably prevent the high frequency characteristics of the signal line from being deteriorated due to the adverse effect of the ring resonance generated in the frame portion and the substrate portion around the signal line.

In addition, when manufacturing the package of the present invention, the package of the present invention can be manufactured very easily by using the conventional method of manufacturing a ceramic package in which a plurality of ceramic green sheets are laminated and integrally fired. Further, it is possible to eliminate the need for the laborious work of cutting the notch for fitting the input / output terminal attachment member made of ceramic or the like on the metal base body forming the package body.

Further, in manufacturing the package of the present invention, a metallized line for forming a signal line, a metallized layer for forming a conductor layer, and a metallized layer for forming a conductor line for conducting the conductor layer to a ground layer and a via filled with a metallized conductor are used. By providing a large number of holes on the substrate or the ceramic green sheet for forming the frame, the package of the present invention can be easily provided with multiple terminals.

[Brief description of drawings]

1 is a perspective view of a package of the present invention, FIG. 2 is an enlarged cross-sectional view of a signal line portion of the package of FIG. 1, FIG. 3 is a cross-sectional view of a signal line portion of another package of the present invention, FIG. 4 is a cross-sectional view of a signal line portion of another package of the present invention. 1 ... Signal line, 2 ... Package, 3 ... Insulator, 7 ... Conductor layer, 8 ... Substrate, 12 ... Frame body.

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Hiroyuki Sakai, Hiroyuki Sakai, 711, Rita, Kurita, Nagano City, Nagano Shinko Electric Industry Co., Ltd. (72) Inventor Nobuo Sato 3-9-11 Midoricho, Musashino City, Tokyo Japan Telegraph and Telephone Corporation, Research Institute for Electronic Devices (56) References: 59-74758 (JP) , U)

Claims (1)

[Claims] 1. A package for a high-frequency element, comprising a substrate made of an insulator for mounting a high-frequency element, a frame made of an insulator surrounding the high-frequency element laminated on the substrate, and a plurality of signal lines arranged side by side on the substrate. In the above, the substrate is provided with a ground layer continuously covering the lower portions of the plurality of signal lines, and the frame body is provided with a ground layer continuously covering the upper portions of the plurality of signal lines. The plurality of conductor layers are arranged in parallel in the signal lines on the left and right sides of the respective signal lines sandwiched between the substrate and the frame, and are arranged substantially vertically in parallel with each other. A package for a high-frequency element, comprising a conductor line for conducting the conductor layer to the ground layer in a body portion.