JPH08204387A - Electronic parts mounting apparatus - Google Patents

Abstract

PURPOSE: To optimize the distance between the substrate waiting position and the mounting position according to the size of the substrate, minimize the substrate entrance-discharge time to improve the facilities productivity by providing a function to change the substrate waiting position according to the size of the substrate being carried, thereby putting this position near the mounting position. CONSTITUTION: A substrate carried from upstream is carried toward a substrate waiting position 22 by actuating a loader belt motor 13 to rotate a loader belt supported with loader pulleys 7-11 through a loader motor timing belt 12. According to the size of the substrate the positions of table pulleys 16 and 17, loader pulleys 7, 9 and 10, and loader side substrate detecting sensor 24 are changeable while the pulleys 15, 18, and 19, table motor 21, pulleys 8, 11 and motor 13 are normally fixed to the same positions.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus. More specifically, the present invention relates to a new electronic component mounting apparatus that enables the electronic circuit board to be efficiently produced by minimizing the time required to transfer the substrate when mounting the electronic component on the substrate. is there.

[0002]

2. Description of the Related Art Conventionally, in mounting various electronic components, various measures have been taken to accurately mount a plurality of types of electronic components in a shorter time. Normally, the mounting apparatus shown in FIGS. 3A and 3B is used when mounting electronic components on a substrate. FIG. 3A shows a case where electronic components are mounted on a small-sized board, and FIG.
Shows the case where electronic components are mounted on a large-sized board.

As shown in FIGS. 3 (a) and 3 (b), the substrate transferred from the upstream equipment is transferred to the mounting position (5) by the loader belt (1) and the table belt (2), and the electronic parts are transferred. It is mounted on the board. Then, while the electronic component is being mounted on the substrate, the substrate to be mounted next is conveyed to the substrate standby position (4) by the loader belt (1).

When the mounting of the electronic components on the substrate is completed, the substrate is carried out to the downstream equipment by the table belt (2) and the unloader belt (3). When the mounted substrate is transferred from the table belt (2) to the unloader belt (3), the substrate at the substrate standby position (4) is conveyed to the mounting position (5).

[0005]

However, in such a conventional electronic component mounting apparatus, since the board standby position of the board to be mounted next is fixed, when a relatively small board is transported, the board is not transferred. There is a problem that the distance between the standby position and the mounting position is too wide, and it takes time to carry the substrate.

[0006] Such a problem at the time of carrying the substrate has been a factor limiting the improvement in productivity. The present invention has been made in view of the above circumstances, eliminates the drawbacks of the conventional device, brings the board standby position and the mounting position close to each other, and optimizes the distance between the two according to the size of the board. It is an object of the present invention to provide a new electronic component mounting apparatus capable of minimizing the time required for loading and unloading a board and improving the equipment productivity.

[0007]

In order to solve the above-mentioned problems, the present invention solves the above-mentioned problems by carrying in a board from a facility upstream to a predetermined position, a mounting step of mounting electronic parts, and a board after mounting. And an unloading step for transporting the electronic components downstream of the equipment, the electronic component mounting apparatus including standby position setting means for transporting a substrate for mounting electronic components to a substrate standby position and waiting for the standby position setting means. Provides an electronic component mounting apparatus (Claim 1) having a function of changing the substrate standby position according to the size of a substrate to be transported.

Further, according to the present invention, in the above electronic component mounting apparatus, the standby position setting means changes the length of the rail for transporting the substrate or the length of the belt for transporting itself ( Claim 2) or the standby position setting means includes means for inputting numerical values in advance, and the substrate standby position can be changed based on the numerical data input in advance (claim 3). A plurality of standby position data is provided (Claim 4), and further, a plurality of standby position data is provided according to the type of the board to be loaded and unloaded, and a plurality of electronic components are provided according to the type of the board. The mode is automatically changed to the corresponding data at the same time as selecting the program to be mounted above (claim 5).

[0009]

With the above-described structure, in the electronic component mounting apparatus of the present invention, the optimum board waiting position is determined according to the size of the board to be transported, and the board loading / unloading time is changed by changing this position. Minimize and greatly improve the productivity of equipment. Examples will be shown below to describe the apparatus of the present invention in detail.

[0010]

1 (a) and 1 (b) are a plan view and a sectional view showing an embodiment of an electronic component mounting apparatus of the present invention. For example, as illustrated in FIGS. 1A and 1B, in the apparatus of the present invention, the substrate loaded from the upstream side operates the loader belt motor (13) to load the loader motor timing belt (12). The loader belt (6) supported by the loader pulleys (7), (8), (9), (10) and (11) is rotationally driven via the substrate waiting position (2).
Transport it to 2).

The loader side substrate detection sensor (24)
When it is detected that the board has arrived at the board waiting position (22), the loader motor (13) is stopped,
The substrate is positioned at the substrate standby position (22). Next, the table-side board detection sensor (25) detects that the electronic parts have been mounted on the board already at the mounting position (23) and the board has been carried out to the downstream equipment, and the table belt ( 14) When the upper board is transferred to the downstream equipment, the loader motor (13) and the table motor (21) are rotated to transfer the board at the board standby position (22) to the mounting position (23).

When the positioning of the board sent to the mounting position (23) is completed, with respect to the board on the mounting position (23),
The mounting operation of the electronic component is started. In the electronic component mounting apparatus of the present invention having such a carrying step, the table pulleys (16) (17) and the loader pulley (7) are provided in accordance with the size of the substrate, as illustrated in, for example, FIGS. ) (9) and (10) and the loader side substrate detection sensor (24) are arranged so that their positions can be changed.

At this time, the table pulley (15) (1
8) (19), the table motor (21), the loader pulleys (8) (11), and the loader motor (13) are always fixed in the same position. By adopting such standby position setting means capable of changing the distance between the mounting position and the substrate standby position, the position of the standby substrate can be made as close as possible to the position of the mounting substrate even if the size of the substrate is changed. As a result, the transport time can always be minimized.

In the above example, the table pulleys (16) (17) and the loader pulleys (7) (9) (1).
0) and the loader side substrate detection sensor (24) can be fixed to the same bracket, and positioning can be driven by a dedicated pulse motor. Further, the electronic component mounting apparatus of the present invention may be provided with means for inputting numerical values for the sizes of boards of all sizes in advance, and when the size of the board is switched, the electronic parts corresponding to the size of the board are mounted on the board. Select a program to be mounted on the board, and automatically change the corresponding board size data, and automatically drive the pulse motor based on the data to realize automatic board standby position change. You can also

[0015]

As described in detail above, according to the present invention, the optimum distance between the substrate standby position and the mounting position is determined according to the size of the substrate to be transported, so that the loading / unloading time of the substrate is minimized. It is possible to improve the productivity of the equipment.

[Brief description of drawings]

FIG. 1A is a plan view showing an embodiment of the present invention, and FIG. 1B is a sectional view thereof.

2A is a plan view showing a change of a substrate standby position in the embodiment of FIG. 1, and FIG. 2B is a sectional view thereof.

3A and 3B are plan views showing a conventional electronic component mounting apparatus.

[Explanation of symbols]

 1 Loader Belt 2 Table Belt 3 Unloader Belt 4 Substrate Standby Position 5 Mounting Position 6 Loader Belt 7 Loader Pulley 8 Loader Pulley 9 Loader Pulley 10 Loader Pulley 11 Loader Pulley 12 Loader Motor Timing Belt 13 Loader Belt Motor 14 Table Belt 15 Table Pulley 16 Table pulley 17 Table pulley 18 Table pulley 19 Table pulley 20 Table motor timing belt 21 Table motor 22 Board standby position 23 Mounting position 24 Loader side board detection sensor 25 Table side board detection sensor

Claims (5)

[Claims] 1. A method for mounting an electronic component, comprising: a carry-in step of transporting a board from a facility upstream to a predetermined position; a mounting step of mounting an electronic component; and a carry-out step of transporting a mounted board downstream of the facility. An electronic component mounting apparatus including a standby position setting unit that transfers a substrate to a substrate standby position and waits for the substrate, the standby position setting unit having a function of changing the substrate standby position according to the size of the substrate to be transferred. An electronic component mounting device characterized by being provided. 2. The standby position setting means is for changing the length of the rail itself for carrying the substrate or the length of the belt itself for carrying the substrate.
Electronic component mounting equipment. 3. The electronic component mounting apparatus according to claim 1, wherein the standby position setting means includes means for inputting a numerical value in advance, and changes the substrate standby position based on the numerical data input in advance. 4. The electronic component mounting apparatus according to claim 3, wherein the standby position setting means includes means for inputting a numerical value in advance, and has a plurality of board standby position data according to the type of board to be carried in. . 5. A standby position setting means selects a program for mounting a plurality of standby position data corresponding to the type of a board to be carried in and out, and a plurality of electronic parts mounted on the substrate according to the type of the board. At the same time, the electronic component mounting apparatus according to claim 4, wherein the corresponding data is automatically changed.