JPH08201610A - Production of color filter for liquid crystal display device - Google Patents

Abstract

PURPOSE: To eliminate the need for an alignment stage of the photomask images formed with color filter patterns and the apertures of black matrices by transferring and forming the apertures of the black matrix patterns formed on a photomask onto the light shielding films on a glass substrate by using a photolithography means every time the color filters of the same colors are formed. CONSTITUTION: This process has a stage for forming the light shielding films on the glass substrate and a stage for forming the black matrices having the apertures 23 by using the photolithography means in the color filter forming parts every time the color filters of the same colors are formed on the light shielding films. The process has also a stage for forming photosensitive coloring materials of a negative type dispersed with pigments on the glass substrate formed with the apertures 23 in the black matrices. Further, the process has a stage for forming the sensitized parts of the photosensitive coloring materials in the apertures 23 formed in the black matrices by irradiating the glass substrate formed with the light shielding films with light from its rear surface with the black matrices having the apertures as the photomask 21.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a color filter used in a liquid crystal display device or an image pickup device.

[0002]

2. Description of the Related Art Color filters used in liquid crystal display devices or image pickup devices are generally in the form of stripes or mosaics in which red, green, and blue pigments, which are the three primary colors, and colored materials in which dyes are dispersed in resin, are formed on a glass substrate. It has a regular array of shapes.

In particular, in order to improve contrast, in order to prevent color loss between pixels or color mixture between adjacent pixels, a light-shielding portion (hereinafter referred to as a black matrix) provided with a film having a light-shielding property is provided between pixels. The method of forming is used.

Printing means and photolithography means are generally used as means for producing such color filters.

In a method of manufacturing a color filter using a printing means or a photolithography means, a black matrix material coating film made of a metal material such as chromium is formed on a glass substrate and then formed on a photomask by using the photolithography means. The black matrix pattern is transferred as a photoresist image onto the black matrix material coating.

After that, the chromium film in the opening corresponding to the pixel of the liquid crystal display device is etched and removed to form a black matrix on the glass substrate.

In the printing means, a red filter is printed with red ink by using a printing plate in which a color filter pattern is formed in the openings on the black matrix with unevenness of resin or metal.

Similarly, print a green filter with green ink,
Print the blue filter with blue ink.

Further, as a photolithography means, a photosensitive material (hereinafter referred to as a photosensitive coloring material) in which a pigment or a dye is dispersed in a photosensitive resin is formed on a black matrix, and a color filter pattern drawn on a photomask is formed. Is aligned with the opening of the black matrix formed on the glass substrate (hereinafter may be referred to as alignment), and exposed and developed.

In this processing step, a color filter pattern is formed using a photosensitive coloring material that does not dissolve in the developing solution by utilizing the difference in solubility between the exposed area and the unexposed area in the developing solution.

And red in the opening of the black matrix,
When forming green and blue color filters, after forming a black matrix, the same processing steps as described above are repeated three times for each of red, green and blue.

[0012]

However, in the printing means, it is difficult to form a complicated pattern such as a mosaic pattern because the printing alignment accuracy in the manufacturing process is poor. It is difficult to form with high precision.

Further, when a color filter is formed by using photolithography means, an exposure device is used to expose through a photosensitive coloring material or a photomask having a color filter pattern formed on a photosensitive dyeing substrate. By processing, a photosensitive coloring material pattern or a photosensitive dyeing base material pattern is formed.

In this means, the red, green and blue color filter patterns formed on the second layer are
It is necessary to accurately align the color filter pattern image formed on the photomask with the opening of the black matrix formed in the first layer and expose it.

For this reason, when forming a fine pattern, misalignment of the photomask is likely to occur.

When such color filter misalignment occurs, color mixing occurs due to the overlap of the adjacent color filters in the black matrix openings corresponding to the pixels of the liquid crystal display device. Furthermore, if the positions of the black matrix and the color filter are misaligned,
The light of the light source leaks from the opening, which causes the deterioration of the display characteristics of the liquid crystal display device.

An object of the present invention is to solve the above problems and to provide a liquid crystal display which does not require an alignment step between a photomask image having a color filter pattern and a black matrix opening, which is required for each color of the color filter. A method of manufacturing a color filter for a device is provided.

[0018]

In order to achieve the above object, the method for producing a color filter for a liquid crystal display device of the present invention employs the following means.

In the method for producing a color filter of the present invention, a step of forming a light shielding film on a glass substrate, and each time a color filter of the same color is formed on the light shielding film, an opening is formed in a color filter forming portion by using a photolithography means. A black matrix having openings, a step of forming a negative photosensitive colorant in which a pigment is dispersed on a glass substrate having openings formed in the black matrix, and a black matrix having openings. And a step of irradiating light from the back surface of the glass substrate on which the light shielding film is formed as a photomask to form a photosensitive portion of the photosensitive coloring material in the opening formed in the black matrix.

The method for producing the color filter of the present invention comprises:
A step of forming a light-shielding film on a glass substrate, a step of forming a black matrix having openings by using a photolithography means at a color filter forming portion every time a color filter of the same color is formed on the light-shielding film, and a black The process of forming a negative photosensitive dyeable substrate on a glass substrate having an opening formed in the matrix, and the process from the back surface of the glass substrate forming the black matrix using the black matrix having the opening as a photomask. And a step of forming a photosensitive portion of the photosensitive dyeable substrate in the opening formed in the black matrix, and a step of dyeing the photosensitive portion with a dye to form a color filter. To do.

[0021]

According to the method of manufacturing a color filter of the present invention, a photolithography means is provided on the light-shielding film on the glass substrate every time the color filter of the same color is formed in the opening of the black matrix pattern formed on the photomask. It is transferred and formed using motivation.

For example, when forming the color filter of the first color, an opening is formed in the color filter forming portion of the black matrix on the glass substrate, and the photosensitive colorant or the photosensitive dye of the first color is formed on the light shielding film. Forming a flexible base material.

Exposure light is irradiated from the back surface of the glass substrate on which the black matrix is not formed, and the light is transmitted through the opening of the black matrix to be irradiated on the photosensitive coloring material or the photosensitive dyeable substrate.

The photosensitive coloring material or the photosensitive dyeable substrate which has been exposed by the light irradiation is dyed to selectively form a color filter at a predetermined position on the black matrix.

Similarly, when forming the second color filter, an opening is provided in the black matrix,
A second color photosensitive coloring material or a photosensitive dyeable substrate is formed.

Then, exposure light is irradiated from the back surface of the glass substrate on which the black matrix is not formed, and the light-shielding film and the color filter portion of the first color are light of a wavelength in the photosensitive region of the photosensitive coloring material or the photosensitive dyeable substrate. Is blocked, light is transmitted through the openings of the black matrix, and the photosensitive coloring material or the photosensitive dyeable substrate is irradiated with light.

The photosensitive coloring material or the photosensitive dyeable substrate which has been exposed by this light irradiation is dyed to selectively form a second color filter at a predetermined position on the black matrix.

Similarly, when forming the third color filter, an opening is provided in the black matrix to form the third color photosensitive coloring material. Exposure light is irradiated from the back surface of the glass substrate on which the black matrix is not formed. The black matrix and the color filter portions for the first and second colors block the light of the wavelength in the photosensitive region of the photosensitive coloring material or the photosensitive dyeable substrate, and the light is transmitted through the opening of the black matrix to expose the photosensitive material. The colorant or photosensitive dyeable substrate is irradiated with light.

A color filter of the third color is selectively formed at a predetermined position on the black matrix by using a photosensitive coloring material or a photosensitive dyeing base material which is exposed by the light irradiation.

By adopting such a manufacturing method,
Since the color filter is directly formed in the opening of the black matrix formed on the glass substrate as a photomask, the positional deviation between the black matrix and the color filter on the glass substrate can be prevented.

Further, according to the color filter manufacturing method of the present invention, the black matrix formed on the glass substrate is also used as the photomask.

Therefore, the alignment process of the color filter pattern drawn on the photomask for each color of the color filter and the black matrix on the glass substrate, which is performed as the conventional photolithography means, becomes unnecessary, and the manufacturing process is simplified. can do.

[0033]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for manufacturing a color filter in an embodiment of the present invention will be described below with reference to the drawings. First, Figure 1
The structure of the liquid crystal display device capable of color display will be described with reference to FIG.

FIG. 15 shows a liquid crystal that controls the amount of light transmission and a color that enables color display between two glass substrates on which transparent electrodes of indium tin oxide (hereinafter referred to as ITO) are formed. FIG. 3 is a cross-sectional view showing a structure of a liquid crystal display device including a filter and a backlight including a fluorescent tube and a diffusion plate.

On the glass substrate 10, in order to apply a voltage to the liquid crystal 11, the scanning electrode 12 made of ITO is patterned.

Further, the glass substrate 13 is provided with a red color filter 14 which is the three primary colors, a green color filter 15, and a blue color filter 16 in order to enable color display.

Further, in order to improve the display quality of the liquid crystal display device, the color filters are formed on the upper surfaces of these color filters for the purpose of flattening the unevenness of the color filters, and from the damage during the formation of the ITO film formed on the color filters. A protective film 18 having a role of protecting the film is formed.

Further, on the upper surface of the protective film 18, a signal electrode 17 made of ITO is patterned to apply a voltage to the liquid crystal 11.

The signal electrode 17 and the scanning electrode 12 are used for the liquid crystal 1
1 are regularly arrayed in directions orthogonal to each other so as to form pixels which are intersections with each other.

The color filters for the respective colors are arranged at regular intervals corresponding to the pixels of the liquid crystal display device. In addition, the color mixture between adjacent pixels and the backlight 19
The black matrix 20 is formed between the color filters in order to prevent the light emitted from the device from leaking without passing through the color filters and deteriorating the image quality.

Next, a black matrix forming procedure and a color filter forming procedure in the color filter manufacturing method of the present invention will be described by alternately referring to FIGS.

FIG. 1 is a plan view showing the photomask 21, and FIG. 2 is a sectional view showing a section taken along the line AA of FIG.

A black matrix pattern 22 having openings 23 is formed on the photomask 21. Further, the light shielding film is provided with a mark 24 and a mark 25 formed of cross-shaped transparent portions as alignment marks for forming a black matrix at predetermined positions on the glass substrate.

Here, the mutual positional relationship between the mark 24 and the mark 25 is one pixel for the mark 24 in order to form a color filter in a positional relationship corresponding to red, green and blue pixels of the liquid crystal display device. It is formed at a position deviated.

The reason why the marks 24 and the marks 25 are formed in pairs at the left and right positions of the photomask 21 is to improve the alignment accuracy.

In FIG. 3, the black matrix pattern 22 of the photomask 21 shown in FIG. 1 and FIG. 2 is exposed by a photolithography means using a projection exposure apparatus or a contact exposure apparatus, and a black having an opening 28 is formed. FIG. 4 is a plan view showing a glass substrate 26 on which a matrix 27 is pattern-transferred, and FIG. 4 is a sectional view showing a section taken along the line BB in FIG. 3.

The black matrix 27 shown in FIG.
Also serves as a photomask for forming the first color filter.

FIG. 5 shows a glass substrate 30 in which the color filter 25 of the first color is formed in the opening 28 on the glass substrate 26 forming the black matrix 27 shown in FIGS. 3 and 4. FIG. 6 shows the C of FIG.
It is sectional drawing which shows the cross section in a C line. A red color filter is formed as the first color filter.

FIG. 7 shows the photomask 2 shown in FIGS. 1 and 2 on the glass substrate 30 shown in FIGS.
1 shows a glass substrate 32 onto which the black matrix pattern 22 of No. 1 is exposed and transferred. Further, FIG. 8 shows D of FIG.
It is sectional drawing which shows the cross section in a -D line.

Black matrix 3 having openings 34
Reference numeral 3 also serves as a photomask for forming the second color filter.

The black matrix 33 shown in FIG. 7 is moved by moving the photomask shown in FIG. 1 or the glass substrate 30 shown in FIG. 5 by using a projection exposure apparatus or a contact exposure apparatus. Then, the mark 24 on the photomask side is aligned with the mark 31 on the glass substrate 30 to which the mark 25 of the photomask is transferred, and is exposed and transferred.

As a result, an opening 34 is formed at a position on the glass substrate 32 which is shifted by one pixel with respect to the color filter 29 of the glass substrate 30 shown in FIG.

FIG. 9 shows a glass substrate 36 having a second color filter 35 formed on the glass substrate 32 shown in FIGS. 7 and 8, and FIG. It is sectional drawing which shows the cross section in the EE line. A green color filter is formed as the second color filter.

FIG. 11 shows a glass substrate 38 obtained by exposing and transferring the black matrix pattern 22 of the photomask 21 shown in FIG. 1 onto the glass substrate 36 shown in FIG. 9 by photolithography means. 12
FIG. 12 is a sectional view showing a section taken along line FF of FIG. 11.

The black matrix 40 also serves as a photomask for forming the third color filter.

Here, the black matrix 40 shown in FIG. 11 uses a projection exposure apparatus or a contact exposure apparatus similar to the means for forming the openings 34 of the black matrix on the glass substrate 32 shown in FIG. Then, the photomask 21 shown in FIG. 1 or the glass substrate 36 shown in FIG. 9 is moved, and the mark 24 on the photomask side is transferred by shifting the photomask mark 25 by one pixel. The mark 37 is aligned with the mark 37. Then, the black matrix pattern is exposed at a position on the glass substrate 38 which is displaced by one pixel with respect to the color filter 35 shown in FIG. 9, and the pattern is transferred.

FIG. 13 shows a glass substrate 42 in which a third color filter 41 is formed on the glass substrate 38 shown in FIGS. 11 and 12. A blue color filter is formed as the third color filter.

Next, the black matrix forming procedure described above and the color filter manufacturing method in the embodiment of the present invention for forming a color filter using the black matrix as a photomask will be specifically described.

A chromium film having a thickness of 100 nm is formed on a glass substrate by using a sputtering device or a vacuum evaporation device. After that, a positive photoresist OFPR800 manufactured by Tokyo Ohka Co., Ltd. is formed by a roll coating method or a spin coating method so as to have a film thickness of 1.0 μm.

Next, the photomask 2 shown in FIG.
1 is used to perform an exposure process on a portion of the glass substrate on which the first color filter is to be formed, using a projection exposure apparatus or a contact exposure apparatus with an exposure amount of 80 mJ / cm 2.

After that, the exposed glass substrate is immersed in a photoresist developing solution NMD-W manufactured by Tokyo Ohka Co., Ltd. for 1 minute to develop it, and an etching mask is formed by the photoresist pattern.

A glass substrate on which an etching mask having a black matrix pattern is formed is dipped in an etching solution for chromium film, for example, a chromium etching solution manufactured by Inktech Co., Ltd. for 3 minutes to remove the chromium portion exposed from the photoresist by etching. Then, the openings 28 shown in FIGS. 3 and 4 are formed in the black matrix 27 made of a chromium film.

Then, the photoresist stripping solution S-10 manufactured by Tokyo Ohka Co., Ltd. is immersed in the photoresist stripping solution S-10 at a temperature of 50 ° C. for 20 minutes to strip and remove the photoresist, and an opening is made on the glass substrate 26 as shown in FIGS. Black matrix 2 with a part 28
Form 7.

Next, on the surface of the glass substrate 26 shown in FIGS. 3 and 4 on which the black matrix 27 is formed, a negative photosensitive coloring resin in which a red pigment is dispersed in resin, for example, Fuji. A color resist CR-2000 manufactured by Hunt Electronics Technology Co., Ltd. is formed by a roll coating method or a spin coating method so as to have a film thickness of 1.5 μm.

Next, this glass substrate is heat-treated at a temperature of 70 ° C. to 80 ° C. for 5 minutes using a hot plate.

Thereafter, the back surface of the glass substrate 26 on which the photosensitive colored resin is not formed is irradiated with ultraviolet light including g-line, h-line and i-line so that the energy amount is 300 mJ / cm 2 in terms of i-line. To do. Further, the glass substrate 26 is immersed in an alkali developing solution having a temperature of 23 ° C. for 2 minutes to perform a developing process.

After that, heat treatment is performed in a baking furnace at a temperature of 200 ° C. for 30 minutes, and as shown in FIGS.
The red color filter 29 of the first color is formed in the opening of the black matrix 27.

Next, the glass substrate 30 shown in FIG. 5 and FIG.
On the surface where the black matrix 27 is formed, a positive photoresist OFPR800 manufactured by Tokyo Ohka Co., Ltd. is formed by a roll coating method or a spin coating method so as to have a film thickness of 1.0 μm.

Next, using the projection exposure apparatus or the contact exposure apparatus, the photomask 21 shown in FIG.
The glass substrate 30 shown in is moved, and the exposure process is performed by aligning the photomask mark 24 with the mark 31 formed on the glass substrate 30.

After that, the resist is immersed in a photoresist developer NMD-W manufactured by Tokyo Ohka Co., Ltd. at a temperature of 23 ° C. for 1 minute to perform a development process, and an etching mask having a black matrix pattern is formed on the glass substrate 30 by the photoresist.

This glass substrate was immersed in a chromium film etching solution, for example, a chromium etching solution manufactured by Inktech Co., Ltd. for 3 minutes to remove the exposed portion of the chromium film not covered with the photoresist pattern by etching. 8
An opening 34 is formed in the black matrix 33 as shown in FIG.

Further, the photoresist stripping solution S-10 manufactured by Tokyo Ohka Co., Ltd. was immersed in the photoresist stripping solution S-10 at a temperature of 50 ° C. for 20 minutes to strip and remove the photoresist.
A black matrix 33 having an opening 34 is formed on the surface 2.

Then, a negative type photosensitive resin in which a green pigment is dispersed, for example, a color resist CG-5000 manufactured by Fuji Hunt Electronics Technology Co., Ltd. is used.
The black matrix 3 on the glass substrate 32 shown in FIG.
3 On the formation side, a roll coating method or a spin coating method is used to form a film having a thickness of 1.5 μm.

Then, an exposure process, a development process, and a heating process, which are the same processes as the process of forming the color filter of the first color, are performed, and the second process is performed on the glass substrate 36 as shown in FIGS. 9 and 10. The green color filter 35 of the color is formed.

Next, a positive type photoresist OFPR800 manufactured by Tokyo Ohka Co., Ltd. is formed on the surface of the glass substrate 36 shown in FIGS. 9 and 10 on which the black matrix 33 is formed, by a roll coating method or a spin coating method. It is formed to have a thickness of 1.0 μm.

Then, the photomask 21 shown in FIG. 1 or the glass substrate 36 shown in FIG. 9 is moved by using a projection exposure apparatus or a contact exposure apparatus, and the mark 24 of the photomask is formed on the glass substrate 36. Mark 37
The exposure processing is performed by aligning the position with the position matching with.

After that, the resist is immersed in a photoresist developer NMD-W manufactured by Tokyo Ohka Co., Ltd. at a temperature of 23 ° C. for 1 minute to perform a developing treatment, and an etching mask having a black matrix pattern is formed on the glass substrate 31 by the photoresist.

Further, the glass substrate is dipped in an etching solution for a chromium film, for example, a chromium etching solution manufactured by Inktech Co., Ltd. for 3 minutes to remove an exposed portion of chromium not covered with the photoresist pattern by etching.

Further, the photoresist stripping solution S-10 manufactured by Tokyo Ohka Co., Ltd. was immersed in the photoresist stripping solution S-10 at a temperature of 50 ° C. for 20 minutes to strip and remove the photoresist, and an opening was formed on the glass substrate 38 as shown in FIGS. A black matrix 40 having 39 is formed.

Then, a negative type photosensitive resin in which a blue pigment is dispersed, for example, color resist CB-2000 manufactured by Fuji Hunt Electronics Technology Co., Ltd. is roll-coated on the black matrix forming surface side of the glass substrate 38 shown in FIGS. 11 and 12. Method or spin coating method to form a film thickness of 1.5 μm.

Then, an exposure process, a development process, and a heating process, which are the same processes as the color filter forming process for the first color and the second color, are performed, and the glass substrate 42 as shown in FIGS. 13 and 14. A blue color filter 41 of the third color is formed on the top.

Next, a method of manufacturing a color filter for a liquid crystal display device according to the second embodiment of the present invention will be described.

A chromium film having a film thickness of 100 nm was formed on a glass substrate by the same method as in the first embodiment, and then a positive type photoresist OFP manufactured by Tokyo Ohka Co., Ltd.
R800 is formed to a film thickness of 1.0 μm by using a roll coating method or a spin coating method.

Then, using the photomask 21 shown in FIG. 1, only the portion where the color filter for the first color is to be formed is exposed using a projection exposure apparatus or a contact exposure apparatus under an exposure amount of 80 mJ / cm 2. Perform processing.

After that, the glass substrate was immersed in a photoresist developer NMD-W manufactured by Tokyo Ohka Co., Ltd. at a temperature of 23 ° C.
Immerse for a minute, and form an etching mask of a black matrix pattern with photoresist.

Then, this glass substrate is immersed in an etching solution for the chrome film for 3 minutes to remove the exposed portion of the chrome film not covered with the photoresist pattern by etching to form an opening as shown in FIGS. 3 and 4. A black matrix 27 having 28 is formed.

Further, the photoresist is stripped and removed using a photoresist stripping solution, and a black matrix 27 having openings 28 on the glass substrate 26 shown in FIGS. 3 and 4.
To form.

Next, to the surface of the glass substrate 26 on which the black matrix 27 was formed, ammonium dichromate was added to a gelatin aqueous solution made by Fuji Chemical Co. as a negative type photosensitive dyeing base material so that the concentration thereof was 2 w%. This is formed by spin coating to a film thickness of 1.0 μm.

Next, the glass substrate 26 is heat-treated at a temperature of 70 ° C. to 80 ° C. for 5 minutes using a hot plate. Thereafter, the back surface of the glass substrate 26 on which the photosensitive dyeable base material is not formed is irradiated with ultraviolet light including g-line, h-line and i-line so that the exposure amount is 400 mJ / cm 2 in terms of i-line. .

Thereafter, this glass substrate is immersed in an aqueous acetic acid solution having a pH (pH) adjusted to 3 at a temperature of 50 ° C. for 2 minutes to perform a developing treatment.

Next, the red dye PC-RE manufactured by Nippon Kayaku Co., Ltd.
D-R136P is immersed in a red dyeing solution prepared to have a concentration of 1 w% at a temperature of 60 ° C. for 10 minutes to perform a dyeing treatment.

Next, the dyed glass substrate was immersed in a 0.5 w% tannic acid aqueous solution at 60 ° C. for 5 minutes, and then in a 0.5 w% tartarite aqueous solution at 60 ° C. for 5 minutes. During the dyeing process for the second color and the third color, a dye-preventing hard film treatment for preventing dyeing with another dye is performed. As a result, as shown in FIGS. 5 and 6, the first color red color filter 29 can be formed on the glass substrate 30.

Next, by the same method as the method for forming the black matrix 27 on the glass substrate 26 shown in FIG.
And the black matrix 27 of the glass substrate 30 shown in FIG.
A positive photoresist O made by Tokyo Ohka Co., Ltd.
FPR800 is formed in a film thickness of 1.0 μm by using a roll coating method or a spin coating method.

Then, using the projection exposure apparatus or the contact exposure apparatus, the photomask 21 shown in FIG. 1 or the glass substrate 30 shown in FIG.
The exposure process is performed by aligning the mark 24 on the glass substrate 1 with the mark 31 on the glass substrate 30.

After that, it is immersed in a photoresist developer NMD-W manufactured by Tokyo Ohka Co., Ltd. at a temperature of 23 ° C. for 1 minute to form an etching mask having a black matrix pattern on the glass substrate 30 with the photoresist.

This glass substrate is immersed in a chromium film etching solution for 3 minutes to be removed by etching to form a black matrix 33 having openings 34 as shown in FIGS. 7 and 8.

Next, the photoresist is stripped and removed with a photoresist stripping solution, and the black matrix 3 having the openings 34 on the glass substrate 32 as shown in FIGS. 7 and 8.
3 is formed.

Then, a negative photosensitive dyeable substrate is formed on the surface of the glass substrate 32 on which the black matrix is to be formed by the same process as in the first color filter forming step to a film thickness of 1. It is formed to have a thickness of 0 μm.

After that, the glass substrate is heat-treated at a temperature of 70 ° C. to 80 ° C. for 5 minutes using a hot plate.

[0100] After that, the ultraviolet light including the g-line, the h-line and the i-line from the back surface of the glass substrate on which the photosensitive dyeable substrate was not formed was adjusted to an exposure amount of 400 mJ / cm 2 in terms of the i-line. Irradiate.

Furthermore, the glass substrate is adjusted to pH (p
H) is immersed in an acetic acid aqueous solution adjusted to 3 at a temperature of 50 ° C. for 2 minutes to perform development processing.

Next, a green dye PC-GRE manufactured by Nippon Kayaku Co., Ltd.
Dyeing is performed by immersing EN-FOP in a green dyeing solution prepared to have a concentration of 1 w% at a temperature of 60 ° C. for 10 minutes.

Next, the dyed glass substrate was immersed in a 0.5 w% tannic acid aqueous solution at a temperature of 60 ° C. for 5 minutes, and then immersed in a 0.5 w% tartarite aqueous solution at a temperature of 60 ° C. for 5 minutes. A dye-proof hardening treatment for preventing dyeing with another dye is performed during the dyeing treatment for the third color. As a result,
As shown in FIG. 9, the second color green color filter 35 can be formed on the glass substrate 36.

Next, by a method similar to the method of forming the black matrix on the glass substrate 26 shown in FIG. 3, the surface of the glass substrate 36 shown in FIGS. 9 and 10 on which the black matrix 33 is formed is made by Tokyo Ohka. Positive photoresist OF
PR800 is formed to a film thickness of 1.0 μm by using a roll coating method or a spin coating method.

After that, the photomask 21 shown in FIG. 1 or the glass substrate 36 shown in FIG. 9 is moved by using a projection exposure apparatus or a contact exposure apparatus, and the photomask 21 is moved.
The exposure process is performed by aligning the upper mark 24 with the mark 37 on the glass substrate 36.

Further, it is immersed in a photoresist developer NMD-W manufactured by Tokyo Ohka Co., Ltd. at a temperature of 23 ° C. for 1 minute to form an etching mask of a black matrix pattern on the glass substrate 36 with the photoresist.

This glass substrate was dipped in a chromium etching solution.
It is dipped for a minute and etched away to form a black matrix 40 having openings 39 as shown in FIGS. 11 and 12.

Next, the photoresist is stripped and removed using a photoresist stripping solution to form a black matrix 40 having an opening 39 on the glass substrate 38 as shown in FIGS. 11 and 12.

Further, as in the color filter forming method for the first and second colors, a negative photosensitive dyeable base material is applied to the black matrix forming side on the glass substrate 38 by a spin coating method to form a film. It is formed to have a thickness of 1.0 μm.

Then, this glass substrate was heated at a temperature of 70 ° C. to 80 ° C. for 5 minutes using a hot plate, and then g from the back surface of the glass substrate on which the photosensitive dyeable substrate was not formed.
400 m of i-ray converted ultraviolet light including i-ray, h-ray and i-ray
Exposure is performed by irradiating so that the exposure amount is J / cm 2.

Next, the glass substrate was adjusted to pH (p
H) is immersed in an acetic acid aqueous solution adjusted to 3 at a temperature of 50 ° C. for 2 minutes to perform a developing treatment.

Then, a blue dye PC-BL manufactured by Nippon Kayaku Co., Ltd.
UE-B45P was prepared in a concentration of 1 w% in a blue dyeing solution, and the glass substrate after the above development treatment was carried out at a temperature of 60 ° C.
Dip for 0 minutes to perform blue dyeing treatment.

Next, the glass substrate after the dyeing treatment is 0.5
After dipping in a w% tannic acid aqueous solution at a temperature of 60 ° C. for 5 minutes, it is dipped in a 0.5 w% tartaric acid aqueous solution at a temperature of 60 ° C. for 5 minutes to perform a dye-proof hardening treatment. As a result, the third color blue color filter 41 is formed on the glass substrate 42 as shown in FIGS.

[0114]

As is apparent from the above description, in the color filter manufacturing method of the present invention, since the black matrix formed on the glass substrate is used as the photomask, the color filter pattern formed on the photomask is used. The conventional photolithography process for aligning an image at a predetermined position of a black matrix on a glass substrate is not required, which simplifies the manufacturing process.

Further, by adopting the manufacturing method as described above, there is no misalignment between the black matrix and the color filter, which is a cause of color mixture or color loss that impairs display characteristics, and therefore the product yield is improved. However, a low-cost color filter can be obtained.

[Brief description of drawings]

FIG. 1 is a plan view showing the shape of a photomask used in a method for manufacturing a color filter for a liquid crystal display device in an example of the present invention.

FIG. 2 is a cross-sectional view showing the shape of a photomask used in the method for manufacturing a color filter for a liquid crystal display device according to an example of the present invention.

FIG. 3 is a plan view showing a method for manufacturing a color filter for a liquid crystal display device in an example of the present invention.

FIG. 4 is a cross-sectional view showing a method for manufacturing a color filter for a liquid crystal display device in an example of the present invention.

FIG. 5 is a plan view showing a method for manufacturing a color filter for a liquid crystal display device in an example of the present invention.

FIG. 6 is a cross-sectional view showing a method for manufacturing a color filter for a liquid crystal display device in an example of the present invention.

FIG. 7 is a plan view showing a method for manufacturing a color filter for a liquid crystal display device in an example of the present invention.

FIG. 8 is a cross-sectional view showing a method for manufacturing a color filter for a liquid crystal display device in an example of the present invention.

FIG. 9 is a plan view showing a method for manufacturing a color filter for a liquid crystal display device in an example of the present invention.

FIG. 10 is a cross-sectional view showing a method for manufacturing a color filter for a liquid crystal display device in an example of the present invention.

FIG. 11 is a plan view showing a method for manufacturing a color filter for a liquid crystal display device in an example of the present invention.

FIG. 12 is a cross-sectional view showing a method for manufacturing a color filter for a liquid crystal display device in an example of the present invention.

FIG. 13 is a plan view showing a method for manufacturing a color filter for a liquid crystal display device in an example of the present invention.

FIG. 14 is a cross-sectional view showing a method for manufacturing a color filter for a liquid crystal display device in an example of the present invention.

FIG. 15 is a cross-sectional view showing a structure of a liquid crystal display device.

[Explanation of symbols]

 21 Photomask 22 Black Matrix Pattern 24 Mark 26 Glass Substrate 27 Black Matrix 28 Opening 29 Color Filter

Claims (2)

[Claims] 1. A step of forming a light-shielding film on a glass substrate, and each time a color filter of the same color is formed on this light-shielding film, a black matrix having openings is formed in a color filter forming portion by using photolithography means. And a step of forming a negative photosensitive coloring material in which a pigment is dispersed on a glass substrate having openings formed in a black matrix, and a black matrix having openings is used as a photomask to form a light-shielding film. And a step of irradiating light from the back surface of the glass substrate to form a photosensitive portion of a photosensitive coloring material in the opening formed in the black matrix. Method. 2. A step of forming a light-shielding film on a glass substrate, and each time a color filter of the same color is formed on the light-shielding film, a photolithography means is used in the color filter forming portion to form a black matrix having an opening. And a step of forming a negative photosensitive dyeable substrate on a glass substrate having openings formed in a black matrix, and a glass forming a black matrix using the black matrix having openings as a photomask. A step of irradiating light from the back surface of the substrate to form a photosensitive portion of the photosensitive dyeable substrate in the opening formed in the black matrix, and a step of dyeing the photosensitive portion with a dye to form a color filter A method for manufacturing a color filter for a liquid crystal display device, which comprises: