JPH08197432A - Electrodeposition grinding wheel and its manufacture - Google Patents

Abstract

PURPOSE: To provide an electrodeposition grinding wheel and its manufacturing method for effectively grinding quartz glass especially which is hard to grind. CONSTITUTION: In making an electrodeposition grinding wheel, a net made of synthetic resin is fixed on the surface of a grinding wheel base material on which a grinding face is formed and abrasive grains are electrodeposited between its lattices to be fixed on the base material, or powder made of synthetic resin is dispersedly fixed on the surface of a grinding wheel base material on which a grinding face is formed and abrasive grains are electrodeposited between the dispersed grains of the powder to be fixed on the base material. Moreover, if necessary, when abrasive grains are fixed on the grinding wheel base material, they are firstly fixed by an electroplating method and then buried by an electroless plating method.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention mainly relates to an electrodeposition grindstone excellent in grinding quartz glass, which is a difficult-to-cut material, and a manufacturing method thereof.

[0002]

2. Description of the Related Art Conventionally, an abrasive grain is suspended in a plating solution,
A method of depositing both the abrasive grains and the plating metal component corresponding to the binder of the abrasive grains on the stone base metal, holding the stone base in a plating solution, and sprinkling the abrasive grains on the necessary part by some method to plate The electrodeposition grindstone was manufactured by a method such as fixing by means of, a method of fixing the abrasive grains to a grindstone base metal with a known adhesive, and then fixing by plating.

[0003]

However, in any of the above-mentioned conventional methods, the abrasive grains tend to be electrodeposited excessively or non-uniformly.
In addition to poor sharpness and easy clogging, quartz glass, which is a difficult-to-grind material, which is one of the more important fields of application, has a drawback that quartz glass, which is an object to be ground, generally has microcracks. There was a problem.

[0004]

[Means for Solving the Problems] From the above viewpoint, as a result of repeated research to develop an electrodeposition grindstone that does not cause defects such as microcracks even when grinding the difficult-to-grind material and has excellent grindability, When fixing the abrasive grains to the whetstone base metal, on the surface of the whetstone base metal forming the grinding surface, the mesh made of synthetic resin is fixed in advance, and after the abrasive grains are arranged between the lattices of the mesh body, The abrasive grains are fixed by plating, or the synthetic resin powder is previously dispersed and adhered to the predetermined surface of the whetstone base, and then the abrasive grains are arranged between the dispersed powders, and the abrasive grains are plated. The adhered electrodeposition grindstone has excellent grindability even in the grinding of the difficult-to-grind material, and it was found that it will be an excellent electrodeposition grindstone without causing microcracks in the object to be ground. is there.

The present invention has been made based on the above-mentioned findings. In an electrodeposition grindstone, a mesh made of synthetic resin is fixed to the surface of a whetstone base metal on which a grinding surface is to be formed. In the lattice of, the abrasive grains are arranged, that each abrasive grain is fixed to the whetstone base metal, or the synthetic resin powder is dispersed and adhered, and the abrasive grains are arranged between the dispersed powders, The characteristic of the electrodeposited whetstone that was fixed to the whetstone base metal was that it was first fixed by the electroplating method and then embedded by the electroless plating method when further fixing the abrasive grains to the whetstone base metal. I have.

In the production of the above-mentioned electrodeposition grindstone, by adjusting the mesh diameter and mesh clearance of the synthetic resin net, the synthetic resin powder particle size,
By adjusting the dispersion density, the density of abrasive grains (concentration degree)
Can be arbitrarily determined, and the performance of the grindstone can be improved.

Further, since the synthetic resin is used in the form of a mesh or powder, the chip pocket is always optimized because the synthetic resin is eroded and worn by chips (glass powder) especially when grinding quartz glass or the like. As a result, chip disposal is facilitated, and there is also a lubricating action, resulting in excellent grinding performance. As the abrasive grains, diamond, super-abrasive grains such as cBN, and abrasive grains such as SiC can be used. Especially, when the object to be ground is quartz glass, the abrasive grains used are diamond abrasive grains. Optimal. Examples of the synthetic resin include Teflon, phenol resin, styrene,
Polyethylene, polypropylene, nylon, acetyl cellulose, urea, melamine, methacryl, styrene,
Polyamide, vinyl chloride resin and the like are used as necessary.

[0008]

EXAMPLES The electrodeposition grindstone of the present invention and the method for producing the same will be described in detail with reference to specific examples.

Example 1 Net wire diameter 40 μm, net wire mesh clearance 80 μ
m Teflon net-like body and diamond abrasive grains with an average abrasive grain size of 60 μm are prepared. First, on the plated surface of the whetstone base metal,
The mesh-like body was fixed with an adhesive, and the surface of the base metal other than the plating target was masked. Then arrange the diamond abrasive grains between the lattices of the mesh, put in this state in the plating tank,
Fixed plating of abrasive grains on a whetstone base was performed by nickel electroplating. The thickness of the plating layer was 15 μm. Further subsequently, embedded plating was performed by an electroless plating method.
The embedded amount was 25 μm. Thus, the electrodeposition grindstone 1 of the present invention was manufactured.

Example 2 Net wire diameter 40 μm, net wire mesh clearance 80 μ
m of a phenol resin mesh is used, and the other examples are used.
The electrodeposition grindstone 2 of the present invention was manufactured under the same structure and conditions as those described above.

Example 3 Spherical Teflon powder having an average particle size of 50 μm and an average abrasive particle size of 60
Diamond abrasive grains of μm were prepared, and first, the Teflon powder was uniformly dispersed and adhered to the surface to be plated of the grindstone base metal using an adhesive. Teflon powder occupied 20% of the plated surface. Then, the surface of the base metal other than the plated surface was masked. Next, the whetstone base metal was immersed in a plating solution, diamond abrasive grains were placed by sprinkling between the Teflon powders, and the abrasive grains were fixed to the base metal by a nickel electroplating method. The thickness of the plating layer was 15 μm. Subsequently, embedded plating was performed by an electroless plating method. Embedded plating layer is 2
It was 5 μm. In this way, the electrodeposition grindstone 3 of the present invention was produced. This method is particularly effective when the plated surface of the base metal has a complicated shape.

Example 4 An electrodeposited grindstone 4 of the present invention was manufactured by using spherical phenol resin powder having an average particle size of 50 μm and using exactly the same configuration and conditions as in Example 3.

Next, a grindstone base metal is prepared, after degreasing, parts other than the surface to be plated are masked, and then pretreatment (chemical treatment) for improving plating adhesion is performed, and the grindstone base metal is placed in a plating tank. After dipping, diamond abrasive grains having an average particle diameter of 60 μm were dispersed on the surface of the base metal to be plated, and at the same time, a DC power source was energized to grow a nickel plating layer to fix the abrasive grains to the base metal. The thickness of the fixed plating layer was 15 μm.

Then, embedded plating was performed by an electroless plating method. The thickness of the embedded plating layer was 25 μm. In this way, a conventional electrodeposition grindstone was manufactured.

The above-mentioned electrodeposition grindstones 1 to 4 of the present invention and the conventional electrodeposition grindstone were subjected to a grinding test for evaluation of grinding performance under the following grinding conditions. Grinding conditions Machine used Horizontal axis surface grinder Wheel DIA # 325 Shape 1A1 φ200 / 6 ^T /50.8 ^H Grindstone peripheral speed 1500 m / min Work piece feed speed 10 m / min Cross feed 4 mm Setting cut 20 μm Work piece Quartz glass Grinding liquid W1 Grinding amount When reaching 500 [CC] Of grinding resistance and surface roughness of workpiece surface, and grinding back force 400
The amount of grinding in each grindstone when [N] was reached was measured. Table 1 shows the results.

[0016]

[Table 1]

[0017]

As is clear from the results shown in Table 1, all of the electroplated grindstones 1 to 4 of the present invention utilize a synthetic resin mesh or powder to disperse the abrasive grains very easily. The abrasive grains are not electrodeposited excessively, the abrasive grain density (concentration) is easy to adjust, and due to the composition containing synthetic resin, the surface of the resin component is deformed or melted during grinding. Lubrication is improved, and it is also possible to form chip pockets that match grinding conditions, especially when grinding difficult-to-cut materials such as quartz glass. Therefore, the grindstone is sharp and does not cause clogging. Even when quartz glass etc. are ground, micro cracks do not occur, and compared to conventional electrodeposition grindstone, stabilization of grinding by improvement of chip discharge,
The remarkable improvement in grinding performance due to the reduction in grinding resistance also extends the service life, which is useful in the industrial world.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Koji Akada 1-297 Kitabukuro-cho, Omiya-shi, Saitama Central Research Laboratory, Mitsubishi Materials Co., Ltd.

Claims (3)

[Claims] 1. In an electrodeposition grindstone, a mesh made of synthetic resin is fixed on the surface of a grindstone base metal on which a grinding surface is to be formed, and abrasive grains are arranged between the lattices of the mesh so that each grinding An electroplated whetstone in which grains are fixed to a whetstone base metal. 2. In an electrodeposition grindstone, a synthetic resin powder is dispersed and adhered to the surface of a grindstone base metal to form a grinding surface,
An electroplated grindstone in which abrasive grains are arranged between the dispersed powders and fixed to a grindstone base metal. 3. The electrodeposition grindstone as set forth in claim 1, wherein the abrasive grains are first fixed to the grindstone base metal by an electroplating method and then embedded by an electroless plating method.
And the method for producing an electrodeposition grindstone according to 2.