JPH08146089A - Test apparatus for electronic circuit board and jig therefor - Google Patents

Abstract

PURPOSE: To produce a test jig for testing a printed circuit board wherein circuits are integrated in a high density at a low cost within a short period. CONSTITUTION: The test jig used in an in-circuit test is constituted so that the position opposed to a printed circuit board is set as the test region and probes 220b, 222b, 108 are arranged in this region. Interface pins 230 are arranged in the region outside the test region and connected to the terminal 11 of a tester 1. Since the signal wires of the probe 220b or the like and the interface pins 230 can be radically arranged centering around a part 31 or the like, the overlap of the signal wires is not generated. Since relay pins are not present within the test region, probes can be erected at arbitrary positions.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tester and a test jig for testing an LSI or a printed circuit board, and more particularly to a test jig suitable for testing a printed circuit board on which an LSI is mounted.

[0002]

2. Description of the Related Art A printed circuit board on which an electronic circuit is mounted is tested for malfunctions such as wiring short-circuits and solder defects. In this test, a method is used in which a probe is brought into contact with an electronic circuit on a printed circuit board, a test electric signal is input from the probe to the circuit, and an output is detected. A system generally called a board tester is used to perform this test at any one of plural positions on the electronic circuit of the printed circuit board at one time.

The board tester is provided with a plurality of terminals, and the above-mentioned probes are respectively connected to the plurality of terminals. A drive circuit for transmitting a test signal and a detection circuit for detecting a test signal are connected to each terminal. Further, a control circuit for controlling the operations of the drive circuit and the detection circuit is provided. Therefore,
A large number of drive circuits and a large number of detection circuits will be mounted on the board tester. Therefore, the board tester is a large and expensive device.

The position of the probe connected to the circuit for the test needs to be changed for each type of circuit on the printed circuit board. On the other hand, the terminals of the board tester are generally fixedly provided. Therefore, usually, a jig for electrically connecting the terminal and the printed circuit board is arranged between the terminal of the board tester and the printed circuit board. The jig vertically supports and supports a large number of probes on a plate-shaped member, and brings the probes into contact with the printed circuit board. The probe is electrically connected to the terminals of the board tester by wiring.

This jig needs to satisfy the conditions that the quality of the test signal is not deteriorated, the jig can be easily assembled and maintained, and the cost is low. Normal,
The jig has a vertical structure in which it is directly installed on the board tester and the printed circuit board is directly mounted on the jig.

Regarding the prior art relating to the test jig, Japanese Patent Application Laid-Open No. 61-162758, "Measuring node relay device for in-circuit tester" and Japanese Patent Application Laid-Open No. 62-115378.
It is described in Japanese Unexamined Patent Publication No. 63-304180, "Printed Circuit Board Test Device".

[0007]

The above prior art has the advantages of reducing the test jig cost, shortening the distance of the signal line connecting the probe pin and the interface, and shortening the signal rise time. However, on the other hand, no consideration has been given to the testing of printed circuit boards that are highly integrated. Therefore, the signal line for the test signal is inevitably overlapped or crossed in the jig, and induced noise is generated. Due to this induced noise, there is a problem that an accurate test cannot be performed when testing a high-integration-density component such as an LSI that operates at high speed.

Further, in the test jig, a relay pin for relaying the wiring must be arranged between the probe that comes into contact with the printed board and the terminal of the board tester. The relay pin is erected and supported by a test jig in the same manner as the probe. When testing a printed circuit board that has been integrated at a high density,
A large number of probes and a large number of relay pins are in a disordered state. Therefore, if you add a probe pin or a relay pin at the time of design change,
Another relay pin may already be arranged. In this case, it has been necessary to change the existing relay pin to another position, set up a probe to be added next, and set up a relay pin for relaying the wiring of this probe.

As described above, when testing a printed circuit board on which high-density circuits are integrated, the workability of adding a probe or a relay pin is poor, which increases the jig manufacturing cost and extends the manufacturing period. There was a problem.

As described above, in the prior art, a printed circuit board in which circuits are integrated at a high density is not considered for workability, and a large amount of cost and time are required to create a test jig.

It is an object of the present invention to provide a test jig for testing a printed circuit board in which circuits are integrated at high density and which can be manufactured at a low cost in a short period of time. I am trying.

[0012]

To achieve the above object, according to the present invention, the terminals of a tester for testing the operation of the printed circuit board by inputting and outputting a test signal from the plurality of terminals to the printed circuit board. And a test jig for electrically connecting the printed circuit board to a support portion for supporting the printed circuit board and a portion for contacting a test signal input / output portion of the printed circuit board. A plurality of probes, an interface pin arranged between the probe and a terminal of the tester to relay connection between the probe and the terminal of the tester, a first support member for supporting the probe, and the interface A first support member for supporting the pin, the first support member having a predetermined test region for supporting the probe, A test jig is provided, wherein the second support member supports the interface pin in a region outside the test region.

[0013]

According to the present invention, conventionally, the test pins, which have been concentrated on the lower part of the printed circuit board or a part thereof, are developed in the peripheral region of the printed circuit board, and the interface pins are connected to the interface pins. Only the probe that contacts the printed circuit board is arranged in the test area facing the printed circuit board. Next, of the signal lines from the probe to the interface pins, preferentially connect the signal lines that connect to the parts that operate at high speed, select the interface pins that are in a short distance so that the signal lines do not overlap, and connect them. Next, the signal lines of other parts that are not required to operate at high speed are connected.

At this time, since the interface pins are developed in the peripheral area of the printed circuit board, the signal lines can be easily connected radially in a short distance.

Further, it is allowed that the signal lines of different parts overlap each other. This is because in the in-circuit test, a test signal is supplied to each component to check the operation, and therefore, even if it overlaps with a signal line other than the signal line related to the component to be tested, there is no adverse effect.

In the present invention, the interface pin is developed in the area outside the printed circuit board, and the interface pin and the probe pin are connected. Therefore, it is difficult to arrange the probe pin in the area facing the printed circuit board. There is no pin that becomes. Therefore, even if the vertical position of the probe pin is changed due to a design change or the like, it can be easily dealt with.

By extending the interface pins in the area outside the printed circuit board, the signal lines can be prevented from overlapping and the signal line length can be shortened, so that the induced noise between the signal lines can be reduced and the signal lines can be reduced. The stray capacitance of can be reduced. This reduces the signal attenuation rate. As a result, the signal sent from the tester and the observed signal can be transmitted and received accurately.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

The structure of the printed circuit board test apparatus of this embodiment will be described.

As shown in FIG. 1, the test apparatus of this embodiment is
A board tester 1 and a test jig 2 mounted on the board tester 1 are provided. The printed circuit board 3 to be tested is mounted on the test jig 2.

The board tester, as shown in FIG.
1 and a test control unit 12 arranged inside the housing 101.
And a test terminal group 11 standing on the upper surface of the housing 101,
And a display 4.

The test control section 12 has a driver circuit for sending a test signal to each terminal of the test terminal group 11,
And a detection circuit for detecting a signal output from the circuit of the printed circuit board. The same number of driver circuits and detection circuits as the respective terminals of the test terminal group 11 are prepared, and the driver circuits and the detection circuits are connected to the respective terminals. The test control 12 and the display 4 are connected by the signal cable 400 and display the detection result of the detection circuit.

Next, the structure of the test jig 2 will be further described.

As shown in FIG. 2, the test jig 2 includes a support plate 2
1, exchange board 22, interface pin board 23,
And a jig frame 25 and a connection frame 22 for supporting them
a. The interface pin board 23 is attached to the jig frame 25. The jig frame 25 is fixed by the fixing portion 45 a so as to surround the test terminal group 11 on the upper surface of the board tester 1. Further, the support plate 21 and the exchange board 22 are set in the connection frame 22a. The connection frame 22a is detachably fixed to the fixed portion 45 of the jig frame 26. As shown in FIG. 3, the printed circuit board 3 to be tested is mounted on the top of the connection frame 22a. When the printed circuit board 3 to be tested is of a different type, the connection frame 22a is removed from the jig frame 25, and the printed circuit board 3, the support plate 21, and the
The exchange board 22 is exchanged as a set.

The structures of the support plate 21, the exchange board 22, and the interface pin board 23 will be described in more detail.

As shown in FIG. 3, the printed circuit board 3 includes a plurality of electronic circuit components 102 and electronic circuit components 3.
1 and 32 are mounted, a case of testing the operation of only the electronic circuit components 31 and 32 as shown in FIG. 4 will be described below. The test jig of this embodiment is the electronic circuit component 3
28 pins 3 arranged with 7 pins on each of 4 sides of 1
A test signal for inputting / outputting a test signal to / from 1a, 31b, 103 and one pin 104 of the electronic circuit component 32 from the back surface of the printed circuit board 3 to test the operation of the electronic circuit component 31, 32. It is a tool.

As shown in FIG. 6, the exchange board 22 is provided with the electronic circuit component 31 immediately below the pins 31a, 31b, 103.
The spring probes 108, 220b, 222b are located at positions directly below the pins 104 of the electronic circuit component 32.
But it is standing. Spring probe 108, 220
b and 222b have spring members built therein.

When the printed circuit board 3 is pressed against the support plate 21 by an urging device (not shown), the tips of the pins 31a, 31b, 103, 104 are spring probes 108, 220b, 222b as shown in FIG. Is pressed against the tip of the and engages with it. As a result, the spring probes 108, 220b, 222b
And the pins 31a, 31b, 103, 104 are electrically connected, and the spring probe 108 and the like supply the test signal from the test control unit 12 to the printed circuit board 3 and output the output to the test control unit 12. Lead.

As shown in FIGS. 2 and 5, through holes are formed in the support plate 21 just below the pins 31a, 31b and 103 of the electronic circuit component 31 and directly below the pin 104 of the electronic circuit component 32. 105 and 105 are formed. As shown in FIG. 3, the tip portions of the spring probes 220b, 222b, 108 are inserted into the through holes 105, 106. As a result, the spring probe 108
b, 220b, 222b, 108 are supported vertically.

As shown in FIGS. 2 and 7, the interface pin board 23 has a plurality of interface pins 230 arranged in a region which does not overlap the printed circuit board 3. The interface pins 230 are arranged in a row at regular intervals so as to surround the region of the interface pin board 23 overlapping the printed circuit board 3 in a quadruple manner. The interface pin 230 connects the test terminal group 1 of the test control unit 12 to the signal line 113.
1 and one-to-one connection. Interface pin 2
30 is a pin having a built-in spring, like the spring probe 220b.

The spring probe 220b and the like include the relay pins 111, 112, 220, 222 and the signal line 220.
It is electrically connected to any one of the interface pins 230 via a, 222a, 420, and 421. In this embodiment, as shown in FIG. 7, the interface pins 230 are arranged around the area overlapping the printed circuit board 3, so that the signal lines 420 and the like can be arranged in a radial pattern. Therefore, the signal lines 420 and the like do not intersect with each other, and induction noise does not occur.

When conducting an in-circuit test, the different parts are usually not tested at the same time. This is because the in-circuit test method performs the test while confirming the operation of each component. Therefore, as shown in FIGS. 6 and 8, the signal line 420 for testing the component 31 overlaps the signal line 421 for testing the component 32, but the induction noise due to this overlap does not occur.

Relay pins 111, 112, 220, 222
Is arranged on the rear surface of the exchange board 22 just above the interface pin 230 to be connected. One end of the signal line 420 or the like is connected to the spring probe 108 or the like, and the other end is connected to the relay pin 111 or the like. Exchange board 22
However, when it is pressed toward the interface pin board 23 by a biasing device (not shown), the tip of the relay pin engages with the tip of the interface pin 230.

As described above, the test jig 2 connects the test terminal group 11 of the board tester 1 and the portion of the printed circuit board 3 where the test signal is to be input / output.

Next, the procedure for performing an operation test of the printed circuit board 3 using the test jig 2 will be described.

First, as a preparation, the test jig 2 is assembled. As shown in FIG. 7, on the interface pin board 23, the interface pins 230 are provided upright at regular intervals around the area overlapping the printed circuit board 3.
The lower end of the interface pin 230 is connected to the test terminal group 11 of the board tester 1 by the signal line 113 on a one-to-one basis. Once the interface pin board 23 is assembled, it is not necessary to change it even if the type of the printed circuit board 3 changes.

The spring probe 108 and the like are erected on the exchange board 22 at a position just below the pins 31a and the like for inputting and outputting the test signal of the printed circuit board 3 (FIG. 6). Further, the interface pin 230 to which the spring probe 108 or the like is connected is determined. This time,
The spring probe connected to the high speed component of the printed circuit board 3 is preferentially connected to the interface pin at the shortest distance. Then, interface pins to be connected to other probes are sequentially selected so that the signal lines do not overlap each other. The relay pin 111 and the like are erected right above the determined interface pin 230.

Then, the spring probe 108 and the like and the relay pin and the like are connected by a signal line 420 and the like, respectively. In this embodiment, since the interface pins 230 are provided in quadruple in four directions such as the spring probe 108, the signal lines 420 can be arranged in a radial pattern.

At a position just above the spring probe 108 of the support plate 21, as shown in FIG.
Empty 106.

Spring probe 10 of exchange board 22
The positions of 8 and the like, relay pin 111 and the like, and the through hole 105 of the support plate 21 and the like are changed each time the type of the printed circuit board 3 and the position for inputting and outputting the test signal are changed.

The support plate 21 and the exchange board 22 are fixed to the connection frame 22a. The connection frame 22a is placed on the jig frame 25 and pressed against the interface pin board 23 by a biasing device (not shown) to connect the relay pins 220 and the like to the interface pins 230. This completes the assembly of the test jig 2.

The printed circuit board 3 to be tested is
The test procedure will be further described.

The printed circuit board 3 to be tested is
It is mounted on the connection frame 22a, and by a biasing device (not shown),
The printed circuit board 3 is pressed against the support plate 21, and the pins 31a of the printed circuit board 3 are attached to the spring probe 2
20b etc. are connected. Then, in order to transmit a signal from the board tester 1, a test signal is injected from the driver circuit of the test control unit 12 of the board tester 1 to the pin 31a of the component 31 of the printed circuit board 3. This signal is transmitted to the test pin group 11 exposed on the surface of the board tester 1. Further, this signal is transmitted to the interface pin board 23.
It is transmitted to the upper interface pin 230, further transmitted to the relay pin 220 on the exchange board 22, transmitted to the spring probe 220b via the signal line 220a, and reaches the target pin 31a.

The signal transmitted to the component 31 activates the component 31. The result is output to the output terminal 31b.
This output is transmitted to the spring probe 222b, transmitted to the relay pin 222b via the signal line 222a, transmitted to the interface pin 230, further transmitted to the test pin group 11, and taken into the detection circuit of the tester control unit 12.
The detection circuit compares the captured output with an expected value, and thereby determines whether or not the output has operated normally. The result is displayed on the display 4 via the signal cable 400.

As described above, according to this embodiment, since the interface pins are arranged in the area around the printed circuit board 3, the area overlapping the printed circuit board 3 is
There is no need to place a relay pin. Therefore, the number of spring probes and the standing position are not limited by the relay pins as in the conventional case, and any number of spring probes can be set at any position in the region overlapping the printed circuit board 3. This makes it possible to easily manufacture a test jig for testing a printed circuit board on which circuits are integrated at high density.

Further, even if a new spring probe is required due to a design change or the like, the spring probe can be added at an arbitrary position without any restriction on the position of the spring probe stand by the relay pin.
Therefore, the work efficiency is good and the cost can be reduced.

Further, since the interface pin area is formed around the area where the spring probe can be erected, the signal line connected to the spring probe for testing one part is centered on the part to be tested. Since it can be pulled out in a radial pattern, the signal lines can be pulled out without overlapping each other. Therefore, the induced noise due to the overlapping of the signal lines can be reduced.

In the above-described embodiment, when a plurality of printed circuit boards 3 of the same type are to be tested, the printed circuit boards 3 can be replaced one after another so that they can be tested by the same test jig 2. , Printed circuit board 3
When the type is changed, or when the printed circuit board 3 of the same type is changed in the place where the test signal is input / output, the support plate 21 and the exchange board 22 need to be remade. In the test jig of this embodiment, a spring probe and a relay pin for another test can be further mounted on the exchange board 22. That is, it is possible to test a plurality of types of printed circuit boards 3 with one exchange board 23. This will be explained further.

As shown in FIG. 8, the spring probe 108 and the like, the relay pin 111 and the like, and the signal line 420 and the like are attached to the exchange board 23 described in the above embodiment.
Here, if another type of printed circuit board 3 needs to be tested, it is costly to prepare a completely new replacement board 23. However, as shown in FIG. 9, the spring probe 3 necessary for testing another type of printed circuit board 3 is mounted on the exchange board 23 shown in FIG.
09 is added and set upright, and this spring probe 3
09 to the signal line 520 and the relay pin 511 in a radial pattern
Can be added. Therefore, a new type of printed circuit board 3 can be tested without recreating the replacement board 23.

In this embodiment, new signal lines 520 can be arranged without crossing each other as shown in FIG. Spring probe 1 originally located
It is not necessary to remove 08, signal line 420, and relay pin 111. If the position of the spring probe 309 for the new test coincides with the position of the spring probe 108 or the like for the original test, that portion is not connected to the wiring 420 of the original spring probe 108 or the like.
For example, the relay pin 111 and the like can be used as they are.

The exchange board 23 wired as shown in FIG.
Since it can also be used for testing the original printed circuit board 3, one replacement board can be shared for testing two types of printed circuit boards.

As shown in FIG. 9, the wiring for testing two kinds of printed circuit boards can be arranged in a radial pattern without intersecting with each other. This is because the 230 are quadruple arranged in a region located outside the printed circuit board 3. In this way, since the interface pins 230 are multiply arranged, the spring probe 10
Even if 8 and the like and the spring probe 309 and the like are densely planted, the wirings 420 and 520 and the like can be drawn out in the same direction. As a result, it is not necessary to intersect the wirings 420, 520, etc., and the induced noise can be reduced. Further, the interface pin 230 is connected to the printed circuit board 3
As described above, it is not necessary to dispose the relay pin in the area inside the printed circuit board 3, as described above. As a result, only the spring probe is erected in the area inside the printed circuit board 3, and there are no restrictions on the position and the number of spring probes to be erected. Therefore, as described above, a large number of spring probes for testing two types of printed circuit boards can be arranged at a necessary place and can be easily added and changed when necessary. Therefore, it is possible to effectively use the exchange board. Also,
Work efficiency is also improved, leading to cost reduction.

In the above embodiment, the interface pin 2
Although the number of the test terminals 30 is the same as that of the test terminal groups 11 of the board tester 1, they are connected in a one-to-one relationship. Alternatively, only the test terminal group 11 can be connected. By increasing the number of interface pins 230, the degree of freedom in arranging the signal line between the spring probe and the relay focus increases.

In this embodiment, a replacement board and an interface pin board are used, a spring probe is erected on the replacement board, and an interface pin board is
The interface pin is set up and the relay pin is used to connect the spring probe and the interface pin. This has the advantage that when the type of printed circuit board changes, only the part above the replacement board need be replaced or modified. However, not limited to this, it is of course possible to mount the spring probe and the interface pin on one board. In this case, there is an advantage that the relay pin is unnecessary.

Further, in this embodiment, the terminal group 11 of the board tester 1 is gathered at one place, and it is spread around the printed circuit board by the interface pin of the test jig to arrange the spring probe. While facilitating and reducing the induced noise, the same effect can be obtained by moving the position of the test terminal group of the board tester to the position of the interface pin of the above-mentioned embodiment. In this case, the interface pin board of the test jig becomes unnecessary.

[0056]

As described above, according to the present invention, a test jig for testing a printed circuit board in which circuits are integrated at high density can be manufactured at low cost in a short period of time. We can provide test jigs.

[Brief description of drawings]

FIG. 1 is a perspective view showing the external appearance of a printed circuit board test device according to a position embodiment of the present invention.

2 is a cross-sectional view of the test apparatus of FIG.

FIG. 3 is a top view of the test apparatus shown in FIG.

FIG. 4 is an explanatory view showing a part of components of a printed circuit board to be tested by the test apparatus of FIG.

5 is a top view of a support plate of a test jig of the test apparatus of FIG.

6 is a top view of the replacement board of the test jig of the test apparatus of FIG.

7 is a top view of the interface pin board of the test jig of the test apparatus of FIG.

8 is an explanatory view in which top views of a replacement board of a test jig and an interface pin board of the test apparatus of FIG. 1 are overlapped.

9 is an explanatory diagram when a signal line is added to FIG.

[Explanation of symbols]

1 ... Tester body, 2 ... Test jig, 3 ... Printed circuit board to be tested, 4 ... Display,
22 ... Exchange board, 23 ... Interface pin board, 220 ... Relay pin, 220a, 420 ...
-Signal line, 220b ... Spring probe.

Claims (10)

[Claims] 1. A test jig for electrically connecting the terminals of a tester for testing the operation of the printed circuit board by inputting / outputting a test signal to / from the printed circuit board from a plurality of terminals and the printed circuit board. And a support portion for supporting the printed circuit board, a plurality of probes for contacting a portion of the printed circuit board for inputting and outputting a test signal, and a probe disposed between the probe and a terminal of the tester. Has been
An interface pin that relays connection between the probe and a terminal of the tester, a first support member that supports the probe, and a first support member that supports the interface pin, the first support member Has a predetermined test area for supporting the probe, and the second support member supports the interface pin in an area outside the test area. 2. The first supporting member and the second supporting member according to claim 1, wherein the first supporting member and the second supporting member are stacked in two stages.
The test jig, wherein the first support member is disposed on the printed circuit board side. 3. The test jig according to claim 1, wherein the areas where the interface pins are arranged are arranged on four sides of the test area. 4. The test jig according to claim 1, wherein the interface pins are arranged in rows, and the rows are at least two rows. 5. The relay pin according to claim 2, further comprising a relay pin for relaying a connection between the probe and the interface pin, wherein the relay pin is supported by the interface pin on a first support member. A test jig, which is arranged in a region facing the region. 6. The first support member according to claim 5, wherein the first support member is detachably provided from the second support member, and the relay pin has the first support member attached to the second support member. The test jig is arranged so as to electrically connect the probe and the interface pin by contacting the interface pin when the test jig is turned on. 7. The test jig according to claim 6, wherein one of the interface pin and the relay pin is a spring probe having a spring inside. 8. The test jig according to claim 1, wherein the probe is a spring probe having a spring inside. 9. The test jig according to claim 8, wherein a member for supporting a tip end portion of the probe is arranged between the plate-shaped member and the printed circuit board. 10. A driver circuit for oscillating a test signal input to a printed circuit board, a detection circuit for detecting a test signal output by the printed circuit board, and the driver circuit and the detection circuit are connected. A plurality of terminals, a support portion that supports the printed circuit board, a plurality of probes for contacting a portion of the printed circuit board that inputs and outputs a test signal, and a signal line that connects the probe and the terminal A first support member for supporting the probe, and a second support member for supporting the terminal, wherein the first support member has a predetermined test area for supporting the probe. The test device, wherein the second support member supports the interface pin in a region outside the test region.