JPH08138813A - Socket for inspection of electronic parts - Google Patents

Abstract

(57) [Abstract] [Purpose] When the electrical characteristics of the IC 11 are inspected, the output signal from each lead terminal 13 can be measured accurately and efficiently. [Structure] The IC is provided on the upper surface side of a socket body 15 of an inspection socket 14 used when an electric characteristic of the IC 11 is inspected.
A plurality of metal lead terminals 13 protruding from the side surface of the package 12 of 11 are contacted with each other, and contact terminals 16 made of a metal having a spring property are embedded in the socket body 15. A male pin 17 electrically connected to the connector 16 is projected, and a check pin 18 for inspection is further projected on the side surface of the socket body 15, and the projecting position of the check pin 18 is an odd number of the check pins 18. And the even-numbered parts are set at positions apart from each other in the upper and lower parts of the side surface of the socket body 15.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component such as an integrated circuit in which a semiconductor element portion is packaged in a synthetic resin mold portion so that external lead terminals for the semiconductor element protrude from the mold portion. The present invention relates to an inspection socket used during inspection.

[0002]

2. Description of the Related Art Generally, in manufacturing electronic components such as integrated circuits, in order to confirm the design reliability before mass production,
In order to confirm the reliability in the production of mass-produced products, the electrical characteristics of electronic components are inspected. For example, a dual in-line package type IC as an example of an electronic component
Conventionally, as shown in FIG. 9, an inspection socket used when inspecting the electrical characteristics of an (integrated circuit) has an IC on the upper surface side of an electrically insulating socket body 35 made of synthetic resin or the like.
A plurality of metal lead terminals 13 projecting from the side surface of the package 12 of 11 are contacted with each other, and contact terminals 36 made of a metal having a spring property are embedded in the socket body 35. A male pin 37 that is electrically connected to the connector 36 is projected.

By mounting the IC 11 on the upper surface side of the socket main body 35 of the inspection socket 34 having such a structure, each lead terminal 13 protruding from the package 12 of the IC 11 corresponds to the corresponding socket main body 35. Each contacts the contact terminal 36 at a predetermined position. Furthermore,
By connecting the male pin 37 projecting from the lower surface of the socket body 35 to the connector 3 and electrically connecting the connector 3 to the inspection circuit 1 for signal input through the plurality of parallel cords 2, the IC 11 An electric signal from the inspection circuit 1 is applied to each of the lead terminals 13. Then, the predetermined lead terminal 13 in the IC 11
In addition, if the signal output of each lead terminal 13 when the electric signal from the inspection circuit 1 is applied is measured with an oscilloscope and the output lead terminal number and the lead terminal number on the wiring table of the IC 11 are collated, disconnection, short circuit, It is possible to inspect for insufficient wiring, surplus wiring, and whether or not electric characteristic values are normal.

Conventionally, when the signal output is measured with an oscilloscope, the output lead terminal 13 to be measured is used.
The probe of the oscilloscope is brought into direct contact with the male pin 37 corresponding to, or the check pin for inspection is attached to the male pin 37 by soldering as necessary, or the check pin of the IC of the flat package or the like. In the case of a shape that is difficult to mount, a check pin is mounted on the circuit board of the inspection circuit 1 and a probe is brought into contact with the check pin to confirm the display on the oscilloscope.

[0005]

However, since the male pins and the check pins are arranged at small intervals, it is difficult to use a probe having a certain size such as a clip-type probe, and a normal probe is used. However, when the probe is brought into contact with the male pin or the check pin, the probe may come into contact with another adjacent male pin or the check pin, which hinders correct electrical characteristic inspection. . In addition, there is also a problem that the work efficiency of the inspection is lowered because a laborious work such as soldering is required when attaching the check pin.

The present invention provides an inspection socket for an electronic component, which is capable of solving these problems, and enables the electrical characteristic inspection of the electronic component to be performed accurately and efficiently. This is a technical issue.

[0007]

In order to achieve this technical object, an inspection socket for electronic parts according to the present invention has an electronic part such as an integrated circuit on the upper surface side of an electrically insulating socket body made of synthetic resin or the like. For inspecting electronic parts in which contact terminals are buried so that a plurality of metal lead terminals protruding from each contact with each other, and male pins electrically connected to the contact terminals are protruded on the lower surface side of the socket body. In the socket, on the side surface of the socket body, a check pin for inspection electrically connected to each of the contact terminals is projected, and the projecting position of the check pin is an odd number and an even number, The configuration is such that the upper and lower parts of the side surface of the socket body are alternately set apart from each other.

[0008]

By using the electronic component inspection socket having the above-described structure, when measuring the signal output with a measuring device such as an oscilloscope, the check pin can be attached by a troublesome work such as soldering. Even if the check pin is not provided, the check pin is provided in advance on the side surface of the socket body, so that the efficiency of the inspection work can be improved. In addition, by setting the protruding position of the check pin to be an odd number position and an even number position, which are spaced apart from each other in the upper and lower parts of the side surface of the socket body, the check pin arrangement interval can be set in the vertical and horizontal directions. Therefore, when the probe of the measuring apparatus is brought into contact with the check pin, it is possible to prevent or significantly reduce the contact of the probe with other adjacent check pins.

Further, as in the inspection socket for an electronic component according to claim 2, each check pin is color-coded in a predetermined order, and the color code of the check pin is shown in the wiring table of the electronic component. If described, the possibility that the check pin to be inspected is wrong during the inspection work is reduced, so that the efficiency of the inspection work can be further improved in addition to the effect of the invention according to claim 1. .

[0010]

Embodiments of the present invention will be described below with reference to the drawings. 1 to 4 show a first embodiment. In this figure, reference numeral 11 is a dual in-line package type I.
Reference numeral 14 denotes C, and a reference numeral 14 is an inspection socket used when an electric characteristic of the IC 11 is inspected.

This inspection socket 14 is a spring for contacting a plurality of metal lead terminals 13 protruding from the side surface of the package 12 of the IC 11 with the upper surface of an electrically insulating socket body 15 made of synthetic resin or the like. A contact terminal 16 made of a metal having a conductivity is embedded, and a male pin 1 electrically connected to the contact terminals 16 is formed on the lower surface of the socket body 15.
7 is protruding. Further, on the side surface of the socket body 15, a check pin 18 for inspection electrically connected to the contact terminal 16 inside the socket body 15 is projected, and the protruding position of the check pin 18 is shown in FIG. As shown in FIG. 3, the odd-numbered and the even-numbered from the left are the upper row and the lower row, respectively.
The upper and lower portions of the side surface of the socket body 15 are alternately set apart from each other. Further, the check pin 18 is given the same number as the terminal number of the lead terminal 13, and according to the order of the numbers, for example, 1 is brown, 2 is red, 3 is orange, and 4 is yellow. Color them separately. In the wiring table of the IC 11 to be inspected, the same color code as that of the check pin 18 is described in the order of the terminal numbers of the lead terminals.

Then, the IC 11 is mounted on the upper surface side of the socket body 15 of the inspection socket 14 having the above structure, and the lead terminals 13 protruding from the package 12 of the IC 11 are brought into contact with each other at predetermined positions in the corresponding socket body 15. The male pin 17 protruding from the lower surface of the socket body 15 is connected to the connector 16 so as to be in contact with the terminal 16, and the connector 3 is connected to the connector 3 via a plurality of parallel cords 2. The electrical signal from the inspection circuit 1 can be applied to each of the lead terminals 13 in the IC 11 by electrically connecting to the lead terminal 13. And I
A signal output from each lead terminal 13 when an electric signal from the inspection circuit 1 is applied to a predetermined lead terminal 13 among the plurality of lead terminals 13 in C11 is sent to a check pin 18 corresponding to each lead terminal 13. A probe 4 of an oscilloscope (not shown) as an example of each measuring device
By contacting with the oscilloscope to check the display by the oscilloscope while checking the output lead terminal number and the lead terminal number of the wiring table of the IC 11 by checking the disconnection, short circuit, unwiring, surplus wiring, and It is possible to inspect whether the electrical characteristic value is normal.

In this case, unlike the conventional inspection socket, since the check pin 18 is arranged in advance in the socket body 15, the troublesome work such as soldering required when the check pin 18 is attached can be eliminated. Therefore, the efficiency of the inspection work can be improved. Further, by setting the protruding position of the check pin 18 at the odd-numbered position and the even-numbered position, which are alternately separated from the upper and lower portions of the side surface of the socket body 15, the check pin 18 to be inspected and the adjacent check pin 18 are arranged. The arrangement intervals of the check pins are L1 and L2 in FIG. 1, which can be significantly wider than the arrangement intervals of the conventional check pins. Therefore, when the probe 4 of the oscilloscope is brought into contact with the check pin to be inspected, it is incorrect. It is possible to prevent or significantly reduce the contact of the probe 4 with the check pin other than the inspection target. Furthermore, since the arrangement interval of each check pin 18 is widened, it becomes possible to use a clip-shaped probe 4 of the oscilloscope (in the conventional inspection socket, the arrangement interval of the male pin and the check pin). Is too narrow, and it was difficult to use a probe with a certain size such as a clip type probe.), Check pin 18
Moreover, it becomes possible to measure the signal output for each lead terminal 13 while fixing the clip type probe 4 so as to be sandwiched by the sandwiching mechanism, and the work efficiency is further improved.

Further, as described above, the check pin 18
Are color-coded according to the order of the numbers, and if the same color code as the check pin 18 is described in the order of the numbers of the lead terminals in the wiring table of the IC 11 to be inspected, the inspection is performed during the inspection work. Since the possibility that the check pin 18 is mistaken is reduced, the efficiency of inspection work can be further improved.

5 to 7 show a second embodiment. In this figure, reference numeral 21 denotes a flat package type IC in which lead terminals are taken out from the four side surfaces, and reference numeral 24 is an inspection socket used when the electrical characteristics of the IC 21 are inspected. This inspection socket 24
Is embedded with a contact terminal 26 made of metal for contacting a plurality of metal lead terminals 23 protruding from four side surfaces of the package 22 of the IC 21 on the upper surface side of the electrically insulating socket body 25 made of synthetic resin or the like. Between the contact terminals 26, a convex portion 29 for engaging the lead terminal 23 and for stopping the IC 21 is formed, and the lower surface of the socket body 25 is electrically connected to the contact terminals 26. The male pin 27 projects. Further, on the four side surfaces of the socket body 25, a check pin 28 for inspection electrically connected to the contact terminal 26 inside the socket body 25 is projected, and the projecting position of the check pin 28 is shown in FIG. As shown in FIG. 7, the odd-numbered line from the left is the upper stage and the even-numbered line is the lower stage.
The upper and lower parts of the side surface of the socket body 25 are alternately set apart from each other. Further, the same number as the terminal number of the lead terminal 23 is given to the check pin 28 and the colors are classified according to the order of the number. Then, in the wiring table of the IC 21 to be inspected, the same color code as that of the check pin 28 is described in the order of the terminal numbers of the lead terminals.

By using the test socket 24 having such a structure, the electrical characteristic test of the flat package type IC 21 is performed in the same manner as the electrical property test of the dual in-line package type IC 11 described in the first embodiment. Can be done. Further, as shown in FIG. 8, the check pin 18a arranged on the upper side of the side surface of the socket body 15 'of the inspection socket 14' and the check pin 18b arranged on the lower side are formed in a key shape and arranged on the upper side. The check pin 18a is arranged so that its tip end faces upward, and the check pin 18b arranged at the lower stage protrudes so that its tip end faces downward. 18a,
When the probe 4 is brought into contact with the check pin 18b, the possibility that the probe 4 is accidentally brought into contact with the check pin to be inspected and the adjacent check pin is further reduced, and the working efficiency is further improved. In this case, it is not always necessary to form both the check pin 18a arranged in the upper stage and the check pin 18b arranged in the lower stage in a key shape, and only one of them may be formed. Here, FIG. 8 shows the test socket of the IC 11 of the dual in-line package type, but of course, the flat package type IC in which the lead terminals used in Example 2 are taken out from the four side surfaces.
This is also applicable to the inspection socket, etc.

The electronic component inspection socket of the present invention has an integrated circuit in which lead terminals are projected in a grid pattern in the vertical direction from the lower surface of the package, or a lead terminal taken out from the side surface of the package. It is needless to say that the present invention can be applied to various electronic components such as integrated circuits that project so as to wrap around the lower surface side.

[Brief description of drawings]

FIG. 1 is a perspective explanatory view of an inspection socket according to a first embodiment.

FIG. 2 is a plan view of the inspection socket of the first embodiment.

FIG. 3 is a sectional view taken along line III-III in FIG.

4 is a sectional view taken along line IV-IV of FIG.

FIG. 5 is a perspective explanatory view of the inspection socket of the second embodiment.

FIG. 6 is a plan view of the inspection socket of the second embodiment.

FIG. 7 is a front view of the inspection socket of the second embodiment.

FIG. 8 is an explanatory perspective view showing a case where a check pin protruding from a side surface of the inspection socket is formed in a key shape.

FIG. 9 is a perspective explanatory view of a conventional inspection socket for an electronic component.

[Explanation of symbols]

 1 Inspection Circuit 2 Parallel Cord 3 Connector 4 Probe 11 IC 12 Package 13 Lead Terminal 14 Inspection Socket 15 Socket Body 16 Contact Terminal 17 Male Pin 18 Check Pin

Claims (2)

[Claims] 1. A socket body in which a plurality of metal lead terminals projecting from an electronic component such as an integrated circuit are respectively in contact with the upper surface of an electrically insulating socket body made of synthetic resin or the like, and the socket body is embedded. An inspection socket for an electronic component in which a male pin electrically connected to each of the contact terminals is projected on a lower surface side of the socket, and an inspection socket electrically connected to each of the contact terminals is provided on a side surface of the socket body. Of the electronic component, characterized in that the check pin of the socket is projected, and the projecting position of the check pin is set to be an odd number position and an even number position, which are alternately separated from each other in the upper and lower parts of the side surface of the socket body. For socket. 2. The electronic component inspection socket according to claim 1, wherein each of the check pins is color-coded in a predetermined order.