JPH08130329A - Led illuminator - Google Patents

Led illuminator

Info

Publication number
JPH08130329A
JPH08130329A JP6266467A JP26646794A JPH08130329A JP H08130329 A JPH08130329 A JP H08130329A JP 6266467 A JP6266467 A JP 6266467A JP 26646794 A JP26646794 A JP 26646794A JP H08130329 A JPH08130329 A JP H08130329A
Authority
JP
Japan
Prior art keywords
substrate
adhesive
led
formed
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6266467A
Other languages
Japanese (ja)
Inventor
Eiji Nakanishi
Yoshinori Shimizu
栄二 中西
義則 清水
Original Assignee
Nichia Chem Ind Ltd
日亜化学工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Chem Ind Ltd, 日亜化学工業株式会社 filed Critical Nichia Chem Ind Ltd
Priority to JP6266467A priority Critical patent/JPH08130329A/en
Publication of JPH08130329A publication Critical patent/JPH08130329A/en
Application status is Pending legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

PURPOSE: To realize an LED illuminator in which an adhesive does not protrude to parts other than a bonding face when a board with an LED mounted is bonded to the edge of a light conducting plate and in which the plane of the light conducting plate is not contaminated. CONSTITUTION: In an LED illuminator, a light source formed by attaching and bonding an LED element 3 to a hole 2 formed in a board 1 is connected to the edge of a light-conducting plate 4 via an adhesive. In the LED illuminator, a groove 5 connected to the hole 2 is formed on the surface of the board 1. Thereby, a part in which the adhesive escapes in a bonding operation is formed, and the adhesive does not protrude to the interface between the light conducting plate and the board.

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【産業上の利用分野】本発明はLED(発光ダイオード)を光源とする照明に係り、特に主として液晶、文字盤等のバックライトに使用されるLED照明に関する。 The present invention relates generally relates to LED (light emitting diode) to illuminate the light source, more particularly mainly LCD, LED lighting used for the backlight of the dial or the like.

【0002】 [0002]

【従来の技術】液晶、文字盤等のバックライト用の光源にはEL、冷陰極線管、LED等が知られているが、L 2. Description of the Related Art Liquid crystal, EL as a light source for the backlight of the dial such as a cold cathode ray tube, but an LED or the like is known, L
EDは白色光源となる青色光が実現されていなかったので、従来では専らEL、冷陰極線管が用いられてきた。 Since ED blue light comprising a white light source has not been realized, in the conventional been exclusively EL, cold cathode is used.
しかしながら、最近、青色LEDが実用化されたことにより、LEDに三原色揃い、白色光源としてのLED照明が注目されてきた。 However, recently, by the blue LED has been put to practical use, the three primary colors aligned, LED lighting as a white light source has been noted the LED.

【0003】バックライトのような面光源のLED照明は、通常はLED素子が基板に装着されてなる光源を、 [0003] LED lighting surface light source as backlight, a normally light source LED element is mounted on the substrate,
導光板の端面に密着させた構造を有する。 It has a structure in which in close contact with the end face of the light guide plate. 図4は従来のLED照明の一構造を示す模式的な断面図であり、図5 Figure 4 is a schematic sectional view showing one structure of a conventional LED lighting, 5
はそのLED照明の平面図である。 Is a plan view of the LED lighting. 図4に示すように従来のLED照明は、基板11に予め形成された孔22にLED素子33が挿入されてなる光源を、導光板44の端面に接着剤77を介して密着させた構造を有している。 The the conventional LED lighting as shown in FIG. 4, the light sources LED element 33 into the hole 22 previously formed in the substrate 11 is inserted, was adhered through an adhesive 77 on the end face of the light guide plate 44 structure It has.

【0004】 [0004]

【発明が解決しようとする課題】ところが、従来のLE The object of the invention is to be Solved However, the conventional LE
D照明は基板11と導光板44を接着する際、孔22に入りきらない接着剤77が接着面以外の箇所にはみ出してしまうという問題がある。 D illumination when bonding the substrate 11 and the light guide plate 44, the adhesive 77 that do not fit into the hole 22 there is a problem that protrudes at a position other than the adhesive surface. 接着剤77が導光板44、 Adhesive 77 light guide plate 44,
基板11の表面にはみ出すと、後で拭き取らねばならず生産工程の上で煩わしい。 When the protruding on the surface of the substrate 11, burdensome on the production process not must be wiped off later. また拭き取った後でも製品の美観を損ねる恐れがある。 In addition there is a possibility that detract from the aesthetics of the product even after wiping off. さらに、接着剤77が導光板44の平面側にはみ出すと導光板表面に凹凸が発生し、 Furthermore, irregularities occurred protrude the surface of the light guide plate on the plane side of the adhesive 77 light guide plate 44,
均一な発光面が得られなくなる恐れがある。 There is a possibility that uniform light-emitting surface can not be obtained.

【0005】そこで本発明の目的は、LEDを装着した基板を導光板の端面に接着するに際し、接着剤が接着面以外にはみ出さず、導光板平面を汚さないLED照明を実現することにある。 [0005] It is an object of the present invention, when bonding the substrates fitted with LED on the end face of the light guide plate, the adhesive is to realize the LED lighting pollute without protruding besides bonding surface, the light guide plate plane .

【0006】 [0006]

【課題を解決するための手段】本発明のLED照明は、 Means for Solving the Problems] LED lighting invention,
基板1に形成された孔2にLED素子3を装着してなる光源が、接着剤7を介して導光板4の端面に接続されてなるLED照明において、基板1の表面には、孔2と接続された溝5が形成されていることを特徴とする Light source formed by mounting the LED elements 3 in the hole 2 formed in the substrate 1, in the connected LED illumination comprising the end face of the light guide plate 4 through the adhesive 7, the surface of the substrate 1, and holes 2 wherein the connected groove 5 is formed

【0007】さらに、本発明の好ましい態様として、前記基板1には、溝5に接続されて、その溝5よりも深い第二の孔6が形成されていることを特徴とする。 Furthermore, a preferred embodiment of the present invention, the substrate 1 is connected to the groove 5, wherein the second hole 6 deeper than the groove 5 is formed.

【0008】さらにまた本発明の好ましい態様は、前記溝5は基板1の端面を貫通して形成されていることを特徴とする。 [0008] Furthermore preferred embodiments of the present invention, the groove 5 is characterized in that it is formed through the end face of the substrate 1. 但し、この溝5は前記第二の孔6と接続していてもよいことはいうまでもない。 However, the groove 5 is naturally may be connected to the second hole 6.

【0009】 [0009]

【作用】本発明のLED照明では、基板と導光板とを接着した際に、基板表面に過剰の接着剤が逃げる為の溝を、LED素子が装着された孔と接続して形成しているので、接着剤が接着面以外にはみ出すことがない。 [Action] In the LED lighting of the present invention, upon bonding the substrate and the light guide plate, a groove for excess glue escapes to the substrate surface, LED elements are formed by connecting the mounting pore because, adhesive is not that protrude in addition to the adhesive surface. また前記溝よりも深い深さで第二の孔を設けることにより、 By providing a second hole at a deeper depth than the groove also
溝から出る過剰の接着剤をより効果的にプールすることができる。 It can be pooled excess adhesive exiting from the groove more effectively. さらにまた、基板の端面に貫通して溝を形成すると、過剰の接着剤は基板の端面にしか出て来ず、導光板の平面側には出てこないので、美観を損ねることがない。 Furthermore, when a groove is formed through the end face of the substrate, the excess adhesive not come out only on the end face of the substrate, does not come out on the plane side of the light guide plate, it is not impairing the appearance.

【0010】 [0010]

【実施例】図1に本発明の一LED照明の構造を示す分解斜視図を示し、図2に図1のLED照明の構造を示す模式断面図を示す。 EXAMPLES shows an exploded perspective view showing a structure of a LED lighting according to the present invention in FIG. 1 shows a schematic cross-sectional view showing the structure of an LED lighting Figure 1 Figure 2.

【0011】基板1は白色のポリカーボネートよりなる。 [0011] The substrate 1 is made of white polycarbonate. その他、基板1にはメラミン、アクリル等の樹脂、 Additional, the substrate 1 melamine resin such as acryl,
またはアルミナのようなセラミックが使用できる。 Or ceramics such as alumina can be used. これらの材料を所望の形状に加工して、LED素子を装着する基板として利用できる。 By processing these materials into a desired shape, it can be used an LED element as a substrate for mounting. 好ましく白色の材料を選択することにより、LED素子の発光を孔2の内部で反射させて輝度をあげることができる。 Preferably by selecting the white material, the light emission of the LED element is reflected by the inside of the hole 2 can be mentioned luminance. またLED照明を面光源のバックライトとして用いる場合、その面光源の薄さが要求されるので、基板は厚さが5mm以下の直方体とすることが好ましい。 In the case of using the LED lighting as a backlight of a surface light source, since the thinness of the surface light source is required, the substrate is preferably thickness is less of a rectangular parallelepiped 5 mm.

【0012】LED素子3を挿入する孔2は図1に示すような楕円形の他、円、矩形どのような形状でも基板1 [0012] Another hole 2 for inserting the LED element 3 is elliptical, as shown in FIG. 1, substrate circle, be rectangular any shape 1
に形成可能である。 It can be formed on. またLED素子3は、図1に示すような発光チップをカップ状のリードフレームに載置したものの他、発光チップ単独でも挿入可能である。 The LED element 3 is another, also be inserted in the light-emitting chips alone but placing the light-emitting chips as shown in FIG. 1 the cup-shaped lead frame. 但し、 However,
発光チップ単独で挿入する際には、孔2の中に予め電極を形成しておく必要があることはいうまでもない。 When inserting the light emitting chip alone, it is needless to say that it is necessary to form a pre-electrode into the hole 2. さらにまた、LED素子3は孔2に挿入された状態で、あるいは挿入される前に、例えばエポキシ樹脂のような封止材料8でモールドしてもよい。 Furthermore, while the LED element 3 is inserted into the hole 2, or before it is inserted, for example, a sealing material 8 may be molded, such as epoxy resin. 図2は孔2に挿入されたLED素子3をエポキシ樹脂よりなる封止材料8でモールドした状態を示している。 Figure 2 shows a state in which mold the LED element 3 inserted into the hole 2 in the sealing material 8 made of epoxy resin.

【0013】導光板4はアクリル樹脂よりなる。 [0013] The light guide plate 4 is made of acrylic resin. その他、導光板4に、LEDの発光波長を変換する目的で蛍光顔料、蛍光染料を混入したり、前記蛍光物質を導光板表面に塗布してもよい。 Additional, the light guide plate 4, a fluorescent pigment for the purpose of converting an emission wavelength of LED, or by mixing a fluorescent dye, the fluorescent material may be applied to the light guide plate surface. また別に、均一な面状光源を得る目的で導光板4の表面にアルミナ粉末のような光拡散物質を塗布してもよい。 Separately, the light diffusing material may be applied such as alumina powder on the surface of the light guide plate 4 in order to obtain a uniform surface light source. また、導光板4と基板1とを接着する接着剤7には、LEDの発光を減衰させないように無色透明の接着剤を使用している。 Furthermore, the adhesive 7 for bonding the light guide plate 4 and the substrate 1, using the adhesive of colorless and transparent so as not to attenuate the emission the LED.

【0014】次に本発明の特徴である溝4は、図1のようなV字形の他、矩形、円形どのような形状で形成してもよい。 [0014] grooves 4 is then a feature of the present invention, other V-shaped as in FIG. 1, a rectangular, may be formed in a circular any shape. 溝4をLED素子3を挿入する孔2と接続するように形成したことにより、孔2から溢れ出る接着剤7 By forming the grooves 4 so as to be connected to the hole 2 for inserting the LED element 3, flowing over the hole 2 adhesive 7
を溝4に逃がすことができる。 The can escape into the groove 4.

【0015】図1および図2に示すように、本発明ではさらに好ましい例として、溝5と接続して、溝5よりも深い深さで第二の孔6を基板1に形成している。 [0015] As shown in FIGS. 1 and 2, as more preferred examples in the present invention, connected to the groove 5, to form a second hole 6 into substrate 1 with deeper than the groove 5 depth. この第二の孔6の作用は図2に示すように、導光板4と基板1 The operation of this second hole 6, as shown in FIG. 2, the light guide plate 4 and the substrate 1
との接着時に、溝5からさらに溢れ出た接着剤7を第二の孔6に逃がすことで、接着剤7が導光板4と基板1との接着面からはみ出さないようにしている。 During the adhesion between, so that by releasing the adhesive 7 exiting further overflows from the groove 5 to a second hole 6, does not protrude from the adhesive surface of the adhesive 7 is the light guide plate 4 and the substrate 1.

【0016】図3は本願の他の実施例のLED照明の構造を示す模式断面図である。 [0016] FIG. 3 is a schematic sectional view showing the structure of an LED lighting according to another embodiment of the present application. 図1及び図2と異なるところは、基板1に第二の孔6を形成していないことである。 1 and 2 differs from the is that the substrate 1 does not form a second hole 6. このLED照明は孔2より溢れ出た接着剤7が溝5 Adhesive 7 The LED lighting overflowing from hole 2 groove 5
を通って、基板1の端面を貫通した溝5からはみ出していることを示している。 Through, indicating that protrudes from the groove 5 extending through the end face of the substrate 1. このように、溝5を基板1の端面を貫通して形成することにより、過剰の接着剤7が出ていく箇所が基板1の端面に限定されるので、面光源となる導光板の平面を汚すことがない。 Thus, by forming the groove 5 through the end face of the substrate 1, the portion where excess adhesive 7 exits are limited to the end surface of the substrate 1, the plane of the light guide plate serving as a surface light source It is not that dirty.

【0017】 [0017]

【発明の効果】以上説明したように、本発明のLED照明は基板側に接着剤を逃がすための溝が設けられているので、導光板と基板とを接着しても、接着剤が導光板表面にはみ出すことがない。 As described above, according to the present invention, since the LED lighting of the present invention has grooves provided for releasing the adhesive to the substrate, be adhered to the light guide plate and the substrate, adhesive light guide plate never protruded to the surface. 特に基板に複数個形成された孔にそれぞれLEDを装着して直線的に並べた光源と、 A light source arranged linearly in particular mounting the LED each hole is a plurality formed in the substrate,
導光板とを接着した構造のLED照明を実現した場合、 If the light guide plate to achieve a LED lighting bonding structure,
基板表面に形成した溝はLEDを装着した孔と孔とを直線的に繋ぐので、溝を伝わる接着剤の流れが非常にスムースになり、余分な部分にはみ出すことない。 Since groove formed on the substrate surface linearly connects the hole and the hole fitted with a LED, becomes very smooth flow of the adhesive transferred to the groove, it never protrudes extra parts. 従って生産性に優れ、外観もよいLED照明が実現できる。 Thus excellent productivity, appearance good LED lighting can be achieved.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】 本発明の一実施例のLED照明の構造を示す部分的な分解斜視図。 Figure 1 is a partial exploded perspective view showing the structure of an LED illumination of one embodiment of the present invention.

【図2】 図1のLED照明の構造を示す部分模式断面図。 Figure 2 is a partial schematic sectional view showing the structure of an LED illumination of FIG.

【図3】 本発明の他の実施例のLED照明の構造を示す部分模式断面図。 Figure 3 is a partial schematic sectional view showing the structure of an LED lighting according to another embodiment of the present invention.

【図4】 従来のLED照明の構造を示す部分模式断面図。 Figure 4 is a partial schematic sectional view showing a structure of a conventional LED lighting.

【図5】 図4のLED照明の外観を示す部分平面図。 Figure 5 is a partial plan view showing an appearance of the LED illumination of FIG.

【符号の説明】 DESCRIPTION OF SYMBOLS

1・・・・基板 2・・・・孔 3・・・・LED素子 4・・・・導光板 5・・・・溝 6・・・・第二の孔 7・・・・接着剤 8・・・・封止材料 1 ... substrate 2 ... hole 3 ... LED element 4 .... light guide plate 5 ... groove 6 ... second hole 7 ... adhesive 8 & ... sealing material

Claims (3)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 基板(1)に形成された孔(2)にLE 1. A LE into a hole formed in the substrate (1) (2)
    D素子(3)を装着してなる光源が、接着剤(7)を介して導光板(4)の端面に接続されてなるLED照明において、 基板(1)の表面には、孔(2)と接続された溝(5) Formed by attaching a D element (3) light sources, in the connected LED illumination comprising the end surface of the adhesive (7) via a light guide plate (4), on the surface of the substrate (1), holes (2) connected groove (5)
    が形成されていることを特徴とするLED照明。 LED lighting, characterized in that There are formed.
  2. 【請求項2】 前記基板(1)には、溝(5)に接続されて、その溝(5)よりも深い第二の孔(6)が形成されていることを特徴とする請求項1に記載のLED照明。 Wherein said substrate (1) is claim is connected to the groove (5), characterized in that the second hole (6) is formed deeper than the groove (5) 1 LED lighting according to.
  3. 【請求項3】 前記溝(5)は基板(1)の端面を貫通して形成されていることを特徴とする請求項1または請求項2に記載のLED照明。 Wherein said groove (5) LED lighting according to claim 1 or claim 2, characterized in that it is formed through the end face of the substrate (1).
JP6266467A 1994-10-31 1994-10-31 Led illuminator Pending JPH08130329A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6266467A JPH08130329A (en) 1994-10-31 1994-10-31 Led illuminator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6266467A JPH08130329A (en) 1994-10-31 1994-10-31 Led illuminator

Publications (1)

Publication Number Publication Date
JPH08130329A true JPH08130329A (en) 1996-05-21

Family

ID=17431340

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6266467A Pending JPH08130329A (en) 1994-10-31 1994-10-31 Led illuminator

Country Status (1)

Country Link
JP (1) JPH08130329A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008060595A (en) * 1996-06-26 2008-03-13 Siemens Ag Semiconductor element
JP2014187398A (en) * 1996-07-29 2014-10-02 Nichia Chem Ind Ltd Light emitting device and display device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008060595A (en) * 1996-06-26 2008-03-13 Siemens Ag Semiconductor element
JP2009065194A (en) * 1996-06-26 2009-03-26 Siemens Ag Light-emitting semiconductor element
US9196800B2 (en) 1996-06-26 2015-11-24 Osram Gmbh Light-radiating semiconductor component with a luminescence conversion element
JP2014187398A (en) * 1996-07-29 2014-10-02 Nichia Chem Ind Ltd Light emitting device and display device

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