JPH0794035A - Inter-connecting tape wire - Google Patents

Inter-connecting tape wire

Info

Publication number
JPH0794035A
JPH0794035A JP24155493A JP24155493A JPH0794035A JP H0794035 A JPH0794035 A JP H0794035A JP 24155493 A JP24155493 A JP 24155493A JP 24155493 A JP24155493 A JP 24155493A JP H0794035 A JPH0794035 A JP H0794035A
Authority
JP
Japan
Prior art keywords
laser
conductor
plating
tape wire
copper conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24155493A
Other languages
Japanese (ja)
Inventor
Atsuhiko Fujii
Satoru Takano
淳彦 藤井
悟 高野
Original Assignee
Sumitomo Electric Ind Ltd
住友電気工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Ind Ltd, 住友電気工業株式会社 filed Critical Sumitomo Electric Ind Ltd
Priority to JP24155493A priority Critical patent/JPH0794035A/en
Publication of JPH0794035A publication Critical patent/JPH0794035A/en
Application status is Pending legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding

Abstract

PURPOSE:To provide an inter-connecting tape wire capable of easily connecting electronic parts to each other at low cost with high reliability. CONSTITUTION:A copper conductor 1 is exposed from the end part of a tape wire 10 cut into a prescribed length, and the plating 3 of a metal (for example, Sn, Ni, Zn) having a laser reflectance lower than 75% is provided on the surface of the exposed part. Laser absorptivity is enhanced by this plating, and the copper conductor 1 can be connected to leads L of electronic parts A, B by laser welding which is a local heating with high reliability. Therefore, an inter connector is not required, and the electronic part never have a bad thermal effect as in the case of soldering.

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【産業上の利用分野】この発明は、電子部品類の中継接続に用いるテープ電線、特に、被中継導体のレーザ溶接による接合を可能ならしめたテープ電線に関する。 BACKGROUND OF THE INVENTION This invention provides a tape electric wire used for the relay connection of electronic components, in particular, relates to a tape electric wire occupies possibly joining by laser welding of the relay conductor.

【0002】 [0002]

【従来の技術】従来、電子部品同士を互いに電気接続する場合には、コネクタを使用するか、中継接続用の基板やテープ電線を用いてこれ等の基板や電線の導体に電子部品のリードを半田付けするなどの方法が採られていた。 Conventionally, when electrically connecting together electronic components to each other, use the connector, the leads of electronic components thereto such as a substrate or wire conductors with a substrate or tape cable for relay connection methods such as soldering has been taken.

【0003】 [0003]

【発明が解決しようとする課題】コネクタによる接続は、コネクタハウジングの成形用金型、端子成形用金型を含むコネクタ製造設備に多額の投資を必要とする。 Connection by the connector [0005] is, mold the connector housing, it requires a substantial investment in the connector manufacturing facility including a terminal mold. しかも、その設備は1品種の1部品しか製造できず、生産の効率化、コスト削減の面で好ましくない。 Moreover, the equipment only can be manufactured one part of one variety, the efficiency of production is not preferable in terms of cost savings.

【0004】また、電子部品のリードを中継部品の導体に半田付けして中継する方法は、半田付け時に電子部品が高温に晒されるのと、半田自体の長期信頼性に不安があるため、これも好ましい接続法とは言えない。 Further, since the method to relay leads of electronic components are soldered to the conductor of the relay component, and the electronic components are exposed to high temperature during soldering, is a concern long-term reliability of the solder itself, which it can not be said also preferred connection method.

【0005】そこで、中継部品の導体を極部加熱による接合が可能なレーザ溶接で電子部品のリードに接合することを考えた。 [0005] Therefore, the conductor of the relay component thought to be joined to the electronic component leads at the junction can be laser welded by the electrode section heating. ところが、中継部品として多用されているテープ電線等の導体は通常、銅で形成されており、この銅はレーザの吸収性が悪いことから、レーザ溶接では全く接合しないか接合しても接合強度が小さくて実用に耐えないものになる。 However, conductors such as tape wires are widely used as a relay component is typically copper are formed in this copper since the absorption of the laser is poor, the bonding strength be joined or not at all joined by laser welding is small and be something that is not suitable for practical use.

【0006】この発明は、これ等の問題を解決するのに有効な中継接続用のテープ電線を提供しようとするものである。 [0006] The present invention seeks to provide a tape cable for active relay connection to solve this problem such as.

【0007】 [0007]

【課題を解決するための手段】上記の課題を解決する本発明の中継接続用テープ電線は、所定の長さにしたテープ電線の導体端部を露出させ、この露出導体の表面にレーザ反射率が75%以下の金属のメッキを施したものである。 Relay connection tape cable of the present invention to solve the above problems BRIEF SUMMARY OF THE INVENTION exposes the conductor end portion of the tape electric wire to a predetermined length, laser reflectance on the surface of the exposed conductors There are those that were plated with 75 percent or less of the metal.

【0008】なお、レーザ反射率が75%以下のメッキ用金属としてはNi、Sn、Znなどが挙げられる。 [0008] As the laser reflectance of 75% or less of the plating metal Ni, Sn, Zn and the like. これ等の金属を用いたメッキの膜厚は0.5〜50μmの範囲にあるのが望ましい。 Plating thickness using the same such metals is desirable in the range of 0.5 to 50 [mu] m.

【0009】テープ電線の導体は、被中継導体の配列ピッチが等しければ、一端側と他端側の配列ピッチを同じにする。 [0009] The tape cable conductors being equal arrangement pitch of the junction conductor, the same array pitch of the one end and the other end. また、被中継導体の配列ピッチに差がある場合にはそのピッチ差に合わせて一端側と他端側の配列ピッチを異ならせる。 Also, if there is a difference between the arrangement pitch of the relay conductor to vary the pitch of the one end and the other end in accordance with the pitch difference.

【0010】 [0010]

【作用】テープ電線の銅導体は、そのままではレーザの吸収性が悪くてレーザ溶接が難しいが、この発明では、 [Action] copper conductor tape wire, it is difficult laser welding bad absorption of laser is intact, in the present invention,
この導体の表面にレーザ反射率の低い金属をメッキしてあるので、レーザの吸収率が高まって安定したレーザ溶接が行える。 Since the surface of the conductor are plated with low laser reflective metal, it enables stable laser welding is increasing laser absorption rate of the. レーザ溶接はエネルギーを集中させて接合面のみを溶かすので半田付けと違って電子部品に及ぼす熱的影響を大巾に低減できる。 Laser welding can reduce the thermal effect on electronic components greatly unlike soldering because dissolve only bonding surfaces to concentrate the energy. また、このレーザ溶接で直接の接合を行えばコネクタも不要であり、従来の問題が全て無くなる。 The connector by performing the bonding directly in this laser welding is also not necessary, conventional problems are eliminated all.

【0011】レーザ溶接のための金属メッキの厚さは前述の0.5〜50μmが最適である。 [0011] The thickness of the metal plating for laser welding are foregoing 0.5~50μm optimal. 0.5μm未満の厚さではレーザ溶接性の向上効果がたいして現れない。 Improvement of laser weldability is not much appear in a thickness of less than 0.5 [mu] m.
一方50μmを越えるとレーザ溶接性の向上効果が横ばい状態になり、また、生産性が悪くなってコスト高になり、電線の屈曲特性も低下する。 On the other hand, if it exceeds 50μm will improve the effect of laser weldability plateau, also become high cost becomes poor productivity, bending properties of the cable also decreases.

【0012】 [0012]

【実施例】図1及び図2に、この発明のテープ電線の具体例を示す。 BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 and FIG. 2 shows a specific example of a tape electric wire of the present invention. 例示のテープ電線10、20は、電子部品A、Bの中継接続に利用するもので、銅導体1を絶縁被覆2で覆ってある。 Exemplary tape cable 10, 20 utilizes the electronic components A, B of the relay connection, are over the copper conductor 1 with an insulating coating 2. この銅導体1を図のように適当な長さ露出させ、この部分の導体表面にレーザ反射率が75 The copper conductor 1 is exposed an appropriate length as shown in the figure, the laser reflectivity conductor surface of this portion 75
%以下の金属メッキ3を施すと、この発明のテープ電線に仕上がる。 When subjected% the following metal plating 3, finished the tape cable of the present invention.

【0013】なお、図1のテープ電線10は、中継接続する電子部品A、BのリードLが同一ピッチであるので、銅導体1をリードの配列ピッチと同一ピッチで平行に配列している。 [0013] Incidentally, the tape wire 10 of FIG. 1, the electronic component A to the relay connection, the lead L of B is at the same pitch, are arranged parallel to the copper conductor 1 with the arrangement pitch and the same pitch of the lead. 一方、図2のテープ電線20は、電子部品A、BのリードLの配列ピッチが異なるので、銅導体1の配列ピッチを途中で変化させて各リードの配列ピッチに合致させている。 On the other hand, the tape wire 20 of FIG. 2, the electronic component A, since the arrangement pitch of the lead L and B are different, the arrangement pitch of the copper conductor 1 is varied in the middle is made to conform to the arrangement pitch of the leads.

【0014】以下に、より詳細な実施例について述べる。 [0014] In the following, we describe a more detailed examples.

【0015】−実験例1− 図1に示すテープ電線10を試作した。 [0015] - it was a prototype tape cable 10 shown in Experimental Example 1 FIG. この試作品は銅導体1の厚さを70μm、幅を0.8mmとし、露出した両端の表面にレーザ吸収率の異なる金属のメッキを施した。 The prototype of the thickness of the copper conductor 1 and 70 [mu] m, and 0.8mm width were applied different metallic plating of the laser absorptivity on the surface of the exposed ends. 使用したメッキ用金属は表1に示す5種類であり、 Plating metal used was 5 types shown in Table 1,
いずれも、その膜厚は10μmにした。 In any case, the film thickness was 10μm. これ等の試料に対し、電子部品のリード(Fe−42wt%Ni、0. To the sample of this like, the electronic component leads (Fe-42wt% Ni, 0.
2mm厚さ)をレーザ溶接して接合し、接合強度として剪断強度を測定した。 The 2mm thickness) were joined by laser welding, to measure the shear strength as the bonding strength. 結果を表1に併せて示す。 The results are shown in Table 1.

【0016】 [0016]

【表1】 [Table 1]

【0017】この実験結果から、レーザ反射率が下地の銅よりも高い金属メッキでは逆効果になるが、レーザ反射率が75%以下の金属メッキがあると良好な接合強度が得られることがよく判る。 [0017] From the experimental results, the laser reflectance is counterproductive at high metal plating than copper base, often good bond strength when the laser reflectance is 75% or less of the metal plating is obtained I understood.

【0018】−実験例2− 図1に示すテープ電線10を試作した。 [0018] - it was a prototype tape cable 10 shown in Experimental Example 2 FIG. ここでは表2に示すようにメッキ3をSnメッキとし、このメッキの厚さと銅導体1の厚さを変えたものを11種類用意した。 Here, the plating 3 as shown in Table 2 and Sn plating, those with different thicknesses and the thickness of the copper conductor 1 of the plating was 11 types available.
銅導体1の幅はいずれも0.8mmである。 The width of the copper conductor 1 is 0.8mm either. そして、この11種類の試料の銅導体1を電子部品のリード(Fe− Then, the 11 kinds of the copper conductor 1 of the electronic component leads sample (Fe-
42wt%Ni、0.2mm厚さ)上に載せ、レーザ溶接にて接合した。 42 wt% Ni, placed on 0.2mm thick) was bonded by laser welding.

【0019】その接合部の接合強度として剪断強度を測定し、これを表2に併せて示した。 [0019] The shear strength was measured as the bonding strength of the joint, which are shown together in Table 2.

【0020】 [0020]

【表2】 [Table 2]

【0021】この表2から判るように、、銅導体1の厚さは大きい方が高い接合強度が得られるが、80μmより厚くなってもその効果は向上しない。 [0021] The thickness is larger the higher the bonding strength ,, copper conductor 1 As can be seen from Table 2 is obtained, the effect is not improved even thicker than 80 [mu] m.

【0022】また、Snメッキの厚さも、0.5μm未満では充分な接合強度が得られていないし、逆に50μ Further, the thickness of the Sn plating also do not have sufficient bonding strength can be obtained with less than 0.5 [mu] m, 50.mu. conversely
m以上にしても効果の伸びが見られない。 Is not observed growth of the effect also be greater than or equal to m.

【0023】 [0023]

【発明の効果】以上説明したように、この発明のテープ電線は、中継用の銅導体に電子部品のリードをレーザ溶接して接合することができるので、コネクタによる中継が不要になり、また、電子部品に熱的悪影響を及ぼすこともなくなり、中継接続の簡易化、コスト低減、信頼性向上に寄与できる。 As described in the foregoing, the tape cable of the present invention, since the lead of the electronic component to the copper conductor of the relay may be joined by laser welding, the relay connector according to become unnecessary, also, also eliminated to exert thermal adverse effect on electronic components, simplification of the relay connection, cost reduction, it can contribute to improved reliability.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】実施例のテープ電線を中継対象の電子部品を含めて示す平面図 Figure 1 is a plan view of a tape electric wire shown including an electronic component to be relayed examples

【図2】他の実施例のテープ電線を中継対象の電子部品を含めて示す平面図 Figure 2 is a plan view of a tape electric wire shown including an electronic component to be relayed to another embodiment

【符号の説明】 DESCRIPTION OF SYMBOLS

1 銅導体 2 絶縁被覆 3 レーザ反射率が75%以下の金属のメッキ 10、20 テープ電線 1 copper conductor 2 insulated cover 3 plated 10,20 tape cable of the laser reflectivity of 75% or less of the metal

Claims (3)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 所定の長さにしたテープ電線の導体端部を露出させ、この露出導体の表面にレーザ反射率が75 1. A to expose the conductor end portion of the tape electric wire to a predetermined length, laser reflectance on the surface of the exposed conductor 75
    %以下の金属のメッキを施して成る中継接続用テープ電線。 The relay connection tape wire% consisting plated of the following metals.
  2. 【請求項2】 金属メッキの膜厚を0.5μm以上、5 Wherein the thickness of the metal plating 0.5μm or more, 5
    0μm以下にした請求項1記載の中継接続用テープ電線。 0μm relay connection tape cable of claim 1, wherein the below.
  3. 【請求項3】 前記導体の一端側の配列ピッチと他端側の配列ピッチを被中継導体の配列ピッチ差に合わせて異ならせてある請求項1又は2記載の中継接続用テープ電線。 Wherein the conductor one end of the arrangement pitch and the other end side according to claim 1 or 2 relay connection tape wire according to the arrangement pitch are varied in accordance with the arrangement pitch difference of the relay conductor of the.
JP24155493A 1993-09-28 1993-09-28 Inter-connecting tape wire Pending JPH0794035A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24155493A JPH0794035A (en) 1993-09-28 1993-09-28 Inter-connecting tape wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24155493A JPH0794035A (en) 1993-09-28 1993-09-28 Inter-connecting tape wire

Publications (1)

Publication Number Publication Date
JPH0794035A true JPH0794035A (en) 1995-04-07

Family

ID=17076086

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24155493A Pending JPH0794035A (en) 1993-09-28 1993-09-28 Inter-connecting tape wire

Country Status (1)

Country Link
JP (1) JPH0794035A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000049841A1 (en) * 1999-02-18 2000-08-24 Siemens Aktiengesellschaft Electrical connection method and connection site

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000049841A1 (en) * 1999-02-18 2000-08-24 Siemens Aktiengesellschaft Electrical connection method and connection site

Similar Documents

Publication Publication Date Title
EP0097833B1 (en) Substrate for integrated circuit packages
CA1123928A (en) Insulation piercing electric connector bonded to electric conductor
US6942529B2 (en) Press-clamping terminal
US4542259A (en) High density packages
JP2873954B2 (en) Method of manufacturing a chip size semiconductor package
KR100452469B1 (en) Solid electrolytic capacitor and method of manufacturing the same
US5025554A (en) Method of connecting a crimp-style terminal to electrical conductors of an electrical wire
CN1258816C (en) Semiconductor device and mfg. method thereof
CN103310957B (en) Coil member
JP2004111058A (en) Terminal for aluminum wire and connector
CN1112729C (en) Electric connection structure in electronic device and forming method for conductor surface material
JP5599466B2 (en) Solder-free electrical connection device
JP2008021501A (en) Electrical part for wiring, manufacturing method thereof, and terminal connecting part
TWI228309B (en) Semiconductor device
JPH06224014A (en) Method for manufacturing electric resistance
US4862134A (en) Electrical fuse and method for its production
JP2004204256A (en) Rectangular conductor with low thermal expansion
CN1098618C (en) Electronic device having electric wires and method of producing same
JP3201957B2 (en) Metal bumps, a method of manufacturing a metal bump, a connection structure
CN100479271C (en) Cable, cable connection method, and cable welder
JP4312409B2 (en) Common mode filter
CN101635394A (en) Cable with crimping terminal and method of making the same
KR20060048797A (en) Surface mount coil component
CN1679163A (en) A packaged semiconductor with coated leads and method therefor
CA2380126C (en) Wire bonding surface

Legal Events

Date Code Title Description
RD07 Notification of extinguishment of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7427

Effective date: 20060424