JPH0774044A - Manufacture of laminated inductor - Google Patents

Abstract

PURPOSE:To form insulator layers on conductor patterns so as to be flat in such a way that the formation process of the insulating layers is simple and that a defect such as a pinhole or the like is not caused by a method wherein the insulator layers are formed in such a way that an insulator paste from a fine discharge port is coated and formed continuously in a belt shape inside a plurality of sections. CONSTITUTION:In a process in which insulator layers and conductor patterns are laminated and formed repeatedly, an insulator paste is discharged from a plurality of fine discharge ports in a belt shape in individual rows in a plurality of sections on an insulator sheet 50 having the plurality of sections by using a discharge device 40 provided with the individual discharge ports, and the insulator layers 51 which are belt-shaped are coated and formed continuously. Then, the insulator layers on the conductor patterns can be formed in such a way that the formation process of the insulator layers is simple and that a defect such as a pinhole or the like is not caused. Thereby, the conductor patterns whose definition is high can be printed and formed, the insulator layers whose number is many can be laminated, and it is possible to obtain the inductor whose yield is high, which is small and whose inductance value is large.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a laminated inductor used for surface mounting on a high density mounting circuit board of a small electronic device.

[0002]

2. Description of the Related Art Heretofore, a laminated inductor of this kind has been disclosed in Japanese Patent Laid-Open No. 60-100414, and as shown in FIGS. Of the conductive pattern 3 of a plurality of electrically insulating or insulating printed ferrite magnetic layers 4a, 6a, 8a,
Formed by a printing method with 10a interposed, the end portions of the conductive patterns are continuously connected, and the upper and lower layers 1a, 21a and the intermediate magnetic material layers 4a, 6a, 8a, 10a and the conductive pattern 3 are integrally burned. It was formed as a unity.

Further, a laminated inductor according to another method is disclosed in JP-A-48-81057 and US Pat. No. 376.
As described in Japanese Patent No. 5082, a plurality of sheet-shaped ferrite magnetic layers (hereinafter referred to as ferrite green sheets) having a thickness of several tens to several tens μm are formed by a doctor blade method or extrusion molding, and through holes are punched, It has been proposed to manufacture a laminated inductor by printing a conductive pattern and filling the through holes with a conductor, stacking the whole and finally firing.

[0004]

However, in the laminated inductor according to the above-mentioned conventional printing method, since the ferrite magnetic material layer is formed by printing, pinholes are easily generated in the printed portion, and the ferrite magnetic material layer is sandwiched between the laminated inductors. A short circuit occurs between the coil conductive patterns that circulate in the lower layer, which deteriorates the yield.

There is also a method of printing the ferrite magnetic layer a plurality of times in order to reduce pinholes, but in this case, the number of times of printing is extremely increased in order to obtain a desired laminated body. When the conductive pattern is printed through the edge of the magnetic layer due to the thickness of the ferrite magnetic layer becoming too thick by printing multiple times, the conductive pattern is sufficient at the edge of the thick magnetic layer. There was a problem that the wire was not printed and was broken.

Further, if the magnetic material layer and the conductive pattern are alternately printed and laminated, the upper part of the conductive pattern is raised, and when the number of laminated layers is increased, that is, when the inductance value is increased, the printing is formed with high precision and high yield. There was a problem that I could not do it.

On the other hand, in the case of the above-mentioned conventional green sheet type laminated inductor, a green sheet is prepared in advance, the through holes are punched out, the conductive patterns are printed and the conductors are filled in the through holes, and the whole is stacked up and down. This is a method of connecting conductors between layers, but this method has drawbacks that it is difficult to reliably fill the through holes with conductors, and the reliability of the connection between the conductors is poor when the green sheets are stacked. .

Further, when the green sheets on which the conductive patterns are formed are laminated, the adhesion between the layers is poor even if they are heated and pressed at the time of lamination due to the thickness of the conductive patterns, and due to uneven compression in the insulating layer. There is a problem that compressive strain occurs, and there are many quality defects such as cracks, delamination, and deterioration of magnetic properties.

Further, when a laminated body is formed of green sheets, the green sheet is an excellent method for producing a large area with a single material, but when a part of the laminated body is compounded with different materials, However, there is a problem that the green sheet needs to be formed of a plurality of materials, which is a very complicated and difficult process.

The present invention is to solve such a conventional problem, and the formation of the insulating layer is simple, and there are no defects such as pinholes, and the insulating layer on the conductive pattern can be formed flatly. As a result, it is possible to form a high-definition conductive pattern by printing and stack many insulator layers, and to reduce the step at the edge of the insulator layer so that the conductive layer can be formed through the edge. An object of the present invention is to provide a method for manufacturing an excellent laminated inductor, which has a high yield in which a conductive pattern is not easily broken even when a pattern is printed.

Further, according to the present invention, since a different material can be freely formed on the insulating layer, an excellent laminated inductor manufacturing method can be provided in which desired frequency characteristics can be realized by selecting an appropriate material. The purpose is to do.

[0012]

In order to solve the above-mentioned problems, the present invention provides a method of forming an insulator layer from a fine ejection port in a step of repeatedly forming an insulator layer and a conductive pattern in layers. The paste is continuously applied in a strip shape in a plurality of sections. Further, the present invention provides a strip-shaped uneven step on the insulating sheet, and the size of the uneven step is set to about half of the coating thickness of the insulating layer in the next step, whereby the edge of the insulating layer is reduced. The difference in level between the parts is small.

[0013]

Therefore, according to the present invention, in the process of repeatedly laminating the insulating layer and the conductive pattern,
Since the insulating layer is formed by applying the insulating paste continuously in a strip shape from a fine discharge port in a plurality of sections, the insulating layer forming process is simple and there are no defects such as pinholes.
Since the insulating layer on the conductive pattern can be formed flatly, high-definition conductive pattern can be printed and many insulating layers can be stacked, resulting in high yield, small size, and large inductance value. To be

Further, according to the present invention, since the insulating sheet is provided with a band-shaped uneven step and the size of the uneven step is set to about half of the coating thickness of the insulating layer in the next step, The step difference at the edge of the body layer can be reduced, and the disconnection failure at the edge can be significantly reduced by forming the conductive pattern.

[0015]

Embodiments of the present invention will be described in detail below with reference to the drawings.

In the present invention, the insulator is an electrically insulating material, and in this embodiment, particularly low temperature sintering (10
It is assumed that an insulating material in which glass powder mainly composed of alumina is mixed, which is capable of being heated to 00 ° C or less), is used. The magnetic material is F
A NiO, ZnO, CuO-based ferrite magnetic material mainly composed of e ₂ O ₃ is used.

Further, these insulating materials or ferrite magnetic materials are respectively mixed with known appropriate binders such as methyl cellulose and butyral resin, solvents and plasticizers.
Knead to make a paste. Furthermore, the conductor is Ag-Pd,
Although it can be formed by printing using a paste composed of Ag, Pd, other metal powder and a binder, Ag is used as the metal powder in this embodiment.

1 to 14 show a stacking process and a structure of a multilayer inductor according to a first embodiment of the present invention in the order of processes, (a) is a plan view and (b) is a sectional view. Although one laminated inductor is shown in order to simplify the explanation of this figure, in an actual embodiment, as shown in FIG. 16, a predetermined section is defined so that a plurality of plural inductors can be printed or coated at the same time. ing. The steps shown in FIGS.
It should be understood as the P part of one section shown in FIG.

First, an insulating sheet 1 is prepared as shown in FIGS. 1 (a) and 1 (b). In this insulator sheet 1, a green sheet of insulator is formed on a polyester film (hereinafter referred to as PET) (not shown) by the doctor blade method as in the above-mentioned conventional example. As another method, an insulator paste may be printed on PET, or a strip-shaped insulator may be formed from the insulator paste described below.
If the entire surface is uniform and no through holes are required, it is best to use a green sheet.

Next, as shown in FIGS. 2 (a) and 2 (b), a film thickness after the insulator layer 2 is dried by applying an insulator paste to an approximately half region of the insulator sheet 1 (hereinafter simply referred to as a film thickness). As about 30 μm. More specifically, FIG.
A discharge device 40 having a plurality of fine discharge ports as shown in FIG.
As a result, as shown in FIG. 17, on the insulating sheet 50 having a plurality of compartments, the insulating paste is ejected in a strip shape from each ejection port for each row of the plurality of compartments so that about half the area of each compartment is continuously covered. Is applied and formed. Due to the formation of the insulating layer 2, unevenness in a strip shape is generated on the surface of the insulating sheet.

Next, as shown in FIGS. 3A and 3B, the conductive pattern 3 is printed with a conductive paste to form a coil of about half a turn.

Next, as shown in FIGS. 4 (a) and 4 (b),
The insulating layer 4 having a thickness of about 60 μm was formed on the conductive pattern 3 and in the region where the insulating layer 2 was absent, that is, in the above-mentioned band-shaped recess. The insulating layer 4 was formed by a method similar to that of the insulating layer 2 described above, so that the insulating layer 4 was continuously applied in a band shape. Here, the film thickness is set to 60 μm in order to maintain the step difference with the insulator layer 2 at 30 μm and to obtain the reliability of the insulating property. For example, the film thickness of the insulator layer 4 is 30 μm.
If the thickness of the insulating layer 2 is 15 μm, the step between the insulating layers 1 and 2 or 2 and 4 can be 15 μm if the thickness of the insulating layer 2 is 15 μm.

Next, as shown in FIGS. 5A and 5B, a conductive pattern 5 is formed on the insulating layers 2 and 4 by printing so as to overlap one end of the conductive pattern 3. Also at this time, since the uneven step between the insulating layers 2 and 4 is about 30 μm, the conductive pattern 5 can be printed with high accuracy without causing disconnection due to printing failure even in the step portion.

Next, as shown in FIGS. 6 (a) and 6 (b), the insulating layer is formed on the conductive patterns 3 and 5 at the same position as the insulating layer 2 and in the same shape by the same method. 6 was also formed with a film thickness of about 60 μm.

In the same manner as shown in FIG.
As shown in (b) to (a) and (b) of FIG. 11, the formation of the insulating layer and the conductive pattern is repeated for about half a turn, and the layers are alternately stacked until a desired inductance is obtained. 11A and 11B, the conductive pattern 11 having the end of the coil pattern is shown. Conductive pattern 1
1 is drawn out to the end of the unit partition and is connected to an end face electrode described later. Similarly, the conductive pattern 3 in FIGS. 3A and 3B is also drawn to the end of the unit partition so as to be connected to the end face electrode, and this conductive pattern is the starting end of the coil pattern.

Next, as shown in FIGS. 12 (a) and 12 (b),
An insulating layer 12 having a thickness of about 30 is formed on the conductive patterns 9 and 11 in the same position and shape as the insulating layer 8 by the same method.
μm. The application of the insulator layer 12 is for filling the step difference of about 30 μm between the insulator layers 8 and 10 and planarizing it. Although this insulator layer 12 can be manufactured in the next step even if it is omitted, it is indispensable when a large uneven step is obtained or when a laminated inductor of higher quality is obtained.

As the final step of the laminating step, FIG.
As shown in (a) and (b), the insulating sheet 21 is manufactured by the same method as that of the insulating sheet 1, and the conductive pattern 11,
It is stacked on the insulator layer 12 and heated and pressed to complete the stacking process. At this time, an insulator sheet having a thickness of 0.3 mm was used.

Next, according to a plurality of division lines shown by broken lines in FIG. 16, each piece is cut with a dicing saw or a sharp cutter and peeled from PET. The peeled laminate is placed in a firing furnace and treated at the required firing temperature and time for the insulator. In this example, the maximum firing temperature was 900 ° C. and the time was 2 hours. The obtained laminated body was barrel-polished, and then, as shown in FIG.
A conductive paste similar to the conductive pattern was applied to the end face where 1 was exposed, and baked at an appropriate temperature to form the film-shaped external terminal 22. Alternatively, as is well known, the film-shaped external terminal 22 may be applied before baking the laminated body and baked simultaneously with the film-shaped external terminal 22.

FIGS. 19A to 19D show an example of effective coating formation of an insulating layer of the present invention. FIG. 19 (a)
FIG. 19B is a plan view of the process of FIG. 8 of the present embodiment, and FIG.
FIG. 19C is a cross-sectional view taken along the line AA ′, and FIG. 19C is a schematic view for explaining the formation of a flat insulator layer 51 on the conductive pattern 55 with an insulator paste. Furthermore, FIG.
(D) is a cross-sectional view taken along the line A-A 'when the insulating layers are laminated in the same shape by a printing method as in the conventional example.

As in the present embodiment, the minute discharge ports as shown in FIG. 19C are held on the insulating sheet 50 at a constant height h, and the insulating sheet 50 and the conductive pattern 55 are formed.
When the insulating paste is applied on the top, the height between the discharge port and the conductive pattern becomes smaller than h due to the film thickness of the conductive pattern, and thus the film thickness of the formed insulator also becomes thin, resulting in insulation. The body layer can be formed flat with or without a conductive pattern.

In FIG. 19B, a laminated state in which the insulating layers 4 and 8 are flattened is realized. On the other hand, in the conventional example, since the insulator layer is formed by a printing method such as screen printing, as shown in FIG.
Since the insulating layer is formed with almost the same thickness in all the printed areas regardless of the presence or absence of the conductive pattern, the insulating layers 4 and 8 on the upper side having the conductive pattern have a convex portion, and the number of stacked layers is further increased. If the number of charges increases, the convex portion of the insulator layer becomes larger and the next conductive pattern cannot be formed. If it is necessary to increase the thickness of the conductive pattern by design,
The coating method according to the present invention is more effective because a flat insulator can be easily formed.

Further, the insulating layers 2, 4, 6, 8, of the present embodiment
An efficient method of the strip-shaped continuous coating method of 10 and 12 will be described with reference to FIG. In FIG. 17, the strip-shaped insulating layer is formed by applying the coating for each row of each section from one position of the discharge port of the insulating paste. However, FIG.
As shown in (a) and (b), the discharge port is made slightly wider,
If it is modified so as to correspond to two rows, it is possible to apply from one location of the discharge port to two rows of partitions at the same time, and the production efficiency is doubled. At this time, the conductive patterns need only be arranged in the same direction so that the required insulating layer 52 is applied to each column. For example, the strip-shaped insulator layers 52 shown in FIGS. 18A and 18B are the insulator layers 2, 6 and 10 shown in FIGS. 1 to 13, and the strip-shaped insulator layers 53 are shown in FIGS.
This corresponds to the insulator layers 4, 8 and 12 indicated by 3.

FIG. 20 shows the second embodiment of the present invention.
This will be described with reference to (a) and (b) and FIGS. In this embodiment, the insulating sheet 1 described in detail in the first embodiment is formed by stacking the insulating layers and the conductive patterns alternately without providing uneven steps. Therefore, the first step
In the embodiment of FIG.
Has been omitted. 20 shows a manufacturing process and a structure corresponding to FIG.

According to this method, when the conductive patterns 5 and 9 are formed by printing, the step difference between the insulating layers is as large as 60 μm if the thickness of the insulating layer is the same as in the first embodiment. 5 and 9 disconnection failures frequently occur.
Therefore, in this example, the insulating layers 4, 6, 8 and 10 were formed by coating with a thickness of 40 μm.

According to the coating method using the discharge device as in the present invention, it is possible to form a pinhole-free insulating layer without a defect such as printing. . Also in this embodiment, as in the case of the first embodiment, the insulating layer on the conductive pattern can be formed flat, so that high-quality and highly laminated inductance is possible.

FIG. 21 shows the third embodiment of the present invention.
This will be described with reference to (a) and (b). In this example, a ferrite magnetic material having a high magnetic permeability was used as the insulating material in the first example. The material composition is Fe ₂ O ₃ 49 mol
%, NiO 10 mol%, ZnO 30 mol%, CuO 1
A magnetic material of 1 mol% was used. In the manufacturing method, magnetic layers and conductive patterns are alternately laminated in the same steps as in FIGS. 1 to 14, cutting, firing, and end face electrodes are formed.
As shown in (b), a laminated inductor made of a magnetic material was obtained.

The inductance characteristics of Examples 1 and 3 are shown in FIG.
9 shows. It can be seen that Example 1 has a low inductance but can be used in a high frequency band, and Example 3 can obtain a high inductance in a frequency band up to 100 MHz.

FIG. 22 shows the fourth embodiment of the present invention.
This will be described with reference to (a) and (b). In this embodiment, the magnetic layers 4a, 6a, 8a and 10a in the third embodiment described above are used.
In place of the magnetic layer 4b, 6b, 8b, 10b using a ferrite magnetic material having a low magnetic permeability but excellent high frequency characteristics.
Was formed. The material composition is Fe ₂ O ₃ 49 mol%, N
iO 30mol%, ZnO 10mol%, CuO 11mol%
Of magnetic material. In the manufacturing method, magnetic layers and conductive patterns are alternately laminated in the same steps as those in the third embodiment, and cutting, firing, and end face electrodes are formed, and two kinds are prepared as shown in FIGS. 22 (a) and 22 (b). A laminated inductor made of the magnetic material described above was obtained. The configuration of the present embodiment is particularly effective in obtaining desired frequency characteristics as a laminated inductor by combining magnetic materials having various frequency characteristics.

FIG. 23 shows the fifth embodiment of the present invention.
This will be described with reference to (a) and (b). In this example, instead of the magnetic layers 4a and 8a in the third example, the magnetic layers 4b and 8b were formed by using a ferrite magnetic material having a low magnetic permeability but excellent high frequency characteristics. In the manufacturing method, magnetic layers and conductive patterns are alternately laminated in the same steps as in the third embodiment to obtain a laminated inductor composed of two kinds of magnetic materials as shown in FIGS. 23 (a) and 23 (b). .

The structure of the present embodiment has the same characteristic effect as that of the fourth embodiment. When a desired frequency characteristic is obtained as a laminated inductor by combining magnetic materials having various frequency characteristics. Is especially effective for
It is also very good at removing noise in the high frequency band.

The characteristics of this embodiment are shown in FIG. The magnetic material a, which is the comparative data in the figure, has the characteristics of Example 3 in which a high magnetic permeability material is used for all the magnetic materials, and the magnetic material b has all the magnetic materials having low magnetic permeability but excellent high frequency characteristics. This is a characteristic when a magnetic material is used.

As a modified example of this embodiment, as shown in FIG.
It shows in (b). One of the features of the present invention is that a strip-shaped continuous insulating layer having an arbitrary film thickness can be obtained from the discharging device. Therefore, the magnetic layer 1a shown in FIGS.
Also, 21a can be easily formed by two kinds of strip-shaped magnetic material layers to form the magnetic material layers 1a, 1b, 21a and 21b. That is, it is formed of two kinds of magnetic materials, each of which is about half each, so that the same material is formed in the direction in which the magnetic flux of the laminated body passes.

According to this method, the magnetic characteristics of the laminated body are obtained by adding the magnetic characteristics of the magnetic materials a and b. Therefore, in order to obtain a desired frequency characteristic, it is only necessary to select the magnetic materials a and b. You can easily obtain high quality products. In this example, the magnetic material layer was formed of two kinds of materials, but the material of the band-shaped magnetic material was increased to three kinds and four kinds depending on the desired frequency characteristic, and the application method at that time was to reduce the size of the ejection port to 1 By forming the strip-shaped lines corresponding to the lines into, for example, two lines and forming them with the respective materials, the laminated body can be formed with three or four kinds of different materials.

FIG. 25 shows the sixth embodiment of the present invention.
This will be described with reference to (a), (b) and FIGS. 26 (a), (b). In this embodiment, an example in which a non-magnetic layer is formed in a part of the magnetic path is formed according to the manufacturing method of the present invention in order to improve the DC superposition characteristic. In FIGS. 25A and 25B, the uppermost layer 21 and the lowermost layer 1 sandwiching the conductive pattern are formed of a nonmagnetic insulating material, and the inner insulating layers 4a, 6a, 8 are formed.
a and 10a are formed of a ferrite magnetic material.

In FIGS. 26 (a) and 26 (b), some layers 2 and 4 of the internal magnetic layer are formed of a non-magnetic material.
This non-magnetic material is an insulating material in which glass powder mainly containing alumina used in the first embodiment is mixed. Since each of these examples has an open magnetic circuit configuration, an inductance value is low, but an excellent DC superposition characteristic can be obtained.

FIG. 27 shows the seventh embodiment of the present invention.
This will be described with reference to (a) and (b). In this embodiment, the connection resistance between the coil pattern starting end 3a and the terminal end 11a and the film-like external terminal 22 is reduced, and the direct current resistance of the laminated inductor is further reduced. Coil pattern start end 3a
In order to reduce the connection resistance between the film-shaped external terminal 22 and
After the conductive pattern 3 shown in FIG. 3 is formed by printing, a part of the pattern corresponding to the film-shaped external terminal side of the conductive pattern 3 is further printed to increase the film thickness.

Further, in order to reduce the connection resistance between the coil pattern end 8a and the film-shaped external terminal 22, after the conductive pattern 11 is formed by printing in FIG. 11, one corresponding to the film-shaped external terminal side of the conductive pattern 11 is further formed. The film thickness is increased by printing the pattern of the part.

Conventionally, when the film thickness of only a part of the patterns is made thicker, the step due to the film thickness between the insulating layer and the conductive pattern becomes large, and voids are generated in the formation of the insulating layer in the next step. In addition, although there were many problems in terms of quality such as pinholes due to defective printing, according to the present invention, as described in detail in the first embodiment, since the insulating layer can be formed by coating, it can be formed flat. As described above, there is no problem in quality, and it is possible to obtain a laminated inductor of good quality and low DC resistance.

The eighth embodiment of the present invention will be described with reference to FIG. In this embodiment, the conductive pattern is formed by the thermal spraying device 41 as shown in FIG. The conductive pattern is formed by closely mounting a desired metal mask 42 on the insulating sheet 50, and spraying a metal melt such as Ag from the nozzle portion of the thermal spraying device 41 toward the metal mask 42. As a result, in a short time, the sprayed metal conductor portion 43 can obtain a metal conductor film having the same shape as the coil pattern according to the above-described embodiment.

Since the sprayed metal conductor portion 43 can easily have a large conductor film thickness and a small conductor resistance, it is very effective in reducing the direct current resistance of the laminated inductor. The manufacturing process of this embodiment is the first
The method of forming the conductive pattern is different from that of Example 1, and the other manufacturing methods are the same.

As described above, the present invention has been described with respect to some examples, but it is obvious that many modifications are possible within the scope of the present invention. For example, it is possible to form a laminated body on the alumina substrate or the ferrite substrate by the method described in the above-mentioned embodiment. Further, depending on the object to be formed, the formation of a plurality of ejection ports corresponds to the object to be formed. And may be different.

In the method of forming the unevenness of the insulating sheet, the unevenness is provided by forming a strip-shaped insulating layer on the flat insulating sheet in the above-mentioned embodiment. Such an insulating sheet can be formed by grinding a part of the sheet into a strip shape with a dicing saw or the like, or the unevenness can be provided by heating and pressing the insulating sheet into a strip shape with a mold.

Further, in the present embodiment, the conductive pattern is formed by printing with a spiral coil pattern of about half turn, but if there is a margin in the area of the laminated body, about 1.5 turns or about 2.5 turns of the spiral pattern are formed. It is also possible to form a coil pattern.

The discharging device of the insulating paste used for forming the strip-shaped insulating layer of the present invention may be a dispenser, a drawing device, a die coater or the like which is generally used for various purposes, but is limited to these devices. It is not something that will be done.

Although the present invention has been described in detail with respect to the laminated inductor, it should be understood that the inductor is not limited to a single coil, but may include a transformer type having a plurality of coils.

[0056]

As is apparent from the above-described embodiment, the present invention can form an insulating layer in a process of repeatedly laminating and forming an insulating layer and a conductive pattern in a plurality of sections on an insulating sheet. This is a continuous strip-shaped coating of insulating paste from multiple fine outlets, which makes the insulating layer formation process simple and free from defects such as pinholes, and thick conductive film. Since the insulator layer on the pattern can be formed flatly, it is possible to print a highly precise conductive pattern and stack many insulator layers, resulting in high yield, small size, small DC resistance and large inductance. It has the effect of obtaining a value.

Further, a band-shaped uneven step is provided on the insulating sheet, and the size of the uneven step is about half of the coating thickness of the insulating layer in the next step, and the conductive pattern is formed. Therefore, there is an effect that the disconnection failure at the edge portion can be significantly reduced.

[Brief description of drawings]

FIG. 1 is an explanatory view of a first step in one embodiment of the method for manufacturing a laminated inductor of the present invention.

FIG. 2 is an explanatory diagram of the second step.

FIG. 3 is an explanatory view of the third step.

FIG. 4 is an explanatory diagram of the same fourth step.

FIG. 5 is an explanatory view of the fifth step.

FIG. 6 is an explanatory view of the sixth step.

FIG. 7 is an explanatory diagram of the seventh step.

FIG. 8 is an explanatory diagram of the eighth step.

FIG. 9 is an explanatory diagram of the ninth step.

FIG. 10 is an explanatory diagram of the tenth step.

FIG. 11 is an explanatory diagram of the eleventh step.

FIG. 12 is an explanatory diagram of the 12th step.

FIG. 13 is an explanatory diagram of the thirteenth step.

FIG. 14 is an explanatory diagram of the fourteenth step.

FIG. 15 is an explanatory diagram showing a state in which the insulator layer is formed.

FIG. 16 is a plan view showing an insulator sheet having the same plurality of sections.

FIG. 17 is a plan view showing a state where a strip-shaped insulating layer is formed on an insulating sheet which also has a plurality of sections.

FIG. 18 is a plan view of a state where two rows of insulating layers are simultaneously applied and formed.

FIG. 19 is an explanatory view showing an example of a laminated inductor formed by flattening by the same method and a conventional laminated inductor.

FIG. 20 is an explanatory view showing another embodiment of the present invention.

FIG. 21 is an explanatory diagram of another embodiment of the present invention.

FIG. 22 is an explanatory diagram of another embodiment of the same.

FIG. 23 is an explanatory diagram of another embodiment of the present invention.

FIG. 24 is an explanatory view of another embodiment.

FIG. 25 is an explanatory view of another embodiment of the present invention.

FIG. 26 is an explanatory view of another embodiment of the present invention.

FIG. 27 is an explanatory view of another embodiment of the present invention.

FIG. 28 is an explanatory view showing formation of a conductive pattern by thermal spraying in another example.

FIG. 29 is an inductance characteristic diagram of the laminated inductor according to the present invention.

[FIG. 30] Similarly, an inductance characteristic diagram

FIG. 31 is an explanatory view of a certain step in the conventional method for manufacturing a laminated inductor.

[Explanation of symbols]

 1 Insulator Sheet 2, 4, 6, 8, 10, 12 Insulator Layer 3, 5, 7, 9, 11 Conductive Pattern 21 Insulator Sheet 22 Membrane External Terminal 40 Discharge Device 41 Spraying Device 42 Metal Mask 43 Spraying Metal Conductor part 50 Insulator sheet 51 having a plurality of compartments 51, 52, 53 Band-shaped insulator layer 55 Conductive pattern

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kunio Yamakawa 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Shinya Matsutani, 1006 Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd.

Claims (10)

[Claims] 1. A first conductor pattern having the same shape is printed in each of a plurality of sections on a first insulator sheet, and then a plurality of sections are formed on the first conductive pattern while leaving one end of the first conductive pattern. The first insulating layer is continuously applied to the inside of the insulating paste in a strip shape from a fine ejection port, and then the second conductive pattern is connected to the first conductive pattern at one end thereof. Printed on the layer and then on the second conductive pattern, leaving the other end of the second conductive pattern, and between the first strip-shaped insulator layers continuously in the second section.
The insulating layer of is applied a strip of insulating paste from a fine discharge port, the following conductive pattern, the same step is performed a predetermined number of times so that the conductive pattern is superimposed in the stacking direction,
Finally, an insulator sheet is formed on the entire uppermost layer, the laminate thus obtained is cut into each section, and the cut unit laminate is fired at a high temperature to obtain a sintered body. A method of manufacturing a laminated inductor, wherein film-shaped external terminals, which are respectively connected to a start end and an end of the conductive pattern exposed on an end face, are formed on the side end face. 2. The method for manufacturing a laminated inductor according to claim 1, wherein the coating of the strip-shaped insulating layer is continuously formed by coating the insulating paste in a plurality of sections from a plurality of fine discharge ports. 3. A strip-shaped insulating layer is formed by continuously forming an insulating paste from each of a plurality of fine discharge ports so as to simultaneously cover adjacent rows in a plurality of sections. Item 2. A method for manufacturing a laminated inductor according to Item 1. 4. A strip-shaped uneven step is provided on the first insulating sheet, and the size of the uneven step is about half the film thickness of the insulating layer. Of the insulating layer and the second insulating layer and the next insulating layer, and the insulating layer between the other insulating layers, while maintaining the uneven step of about half the thickness of the insulating layer, the conductive pattern and the insulating layer. The method for manufacturing a laminated inductor according to claim 1, 2, or 3, wherein the laminated inductors are overlapped a predetermined number of times in the laminating direction. 5. The method for producing a laminated inductor according to claim 1, claim 2, claim 3 or claim 4, wherein the insulator sheet and the insulator layer are electrically insulating magnetic materials. 6. The method for manufacturing a laminated inductor according to claim 5, wherein the insulating sheet and the insulating layer are electrically insulating magnetic materials having different magnetic permeability. 7. The method for manufacturing a laminated inductor according to claim 5, wherein the insulating layer is formed of an electrically insulating magnetic material having at least two kinds of magnetic permeability. 8. In an insulating sheet and an insulating material, an electrically insulating magnetic material having at least two kinds of magnetic permeability is formed so as to be the same material in a direction in which a magnetic flux generated by a conductive pattern of a laminated body passes. 7. The method for manufacturing a laminated inductor according to claim 5 or 6. 9. The film thickness of the conductive pattern in the portion exposed on the end face is larger than that of the spiral pattern.
A method for manufacturing the laminated inductor described. 10. The method of manufacturing a laminated inductor according to claim 1, wherein the conductive pattern is formed by thermal spraying of a metal material.