JPH0772200A - Test board - Google Patents

Abstract

PURPOSE:To package different types of semiconductor elements on a printed circuit board, perform testing without preparing a number of types of printed circuit boards on testing, and at the same time, improve reliability in the testing of electrical characteristics for a test board which is formed so that a semiconductor element is packaged on the printed circuit board and then the electrical characteristics of the semiconductor element can be tested by a tester. CONSTITUTION:A contact 3 is formed so that an I/O terminal 5A of a semiconductor element 5 and a terminal piece 8A of a socket 8 are inserted and drawn out, and the contact 3 is arranged at a specific pitch P so that a plurality of semiconductor elements 5 and sockets 8 are mixedly mounted at the insertion/ extraction part 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a test board formed by mounting a semiconductor device on a printed circuit board and testing the electrical characteristics of the semiconductor device by a tester.

To test the electrical characteristics of a semiconductor device, the semiconductor device under test is mounted on a test board and a predetermined test signal is sent to the input / output terminals of the semiconductor device.

Therefore, in such a test board, a semiconductor element to be tested can be easily mounted and a predetermined test signal can be easily connected to the input / output terminals of the semiconductor element. Need to be done.

[0004]

2. Description of the Related Art Conventionally, the structure is as shown in the conventional explanatory view of FIG. 4A is a side view, FIG. 4B is a rear view of the printed board, and FIG. 4C is a cross-sectional view of a main part of the printed board.

As shown in FIG. 4 (a), the lead insertion mounting type semiconductor element 5 is mounted on the front surface 1A of the printed circuit board 1 and the rear surface 1B of the printed circuit board 1 is placed on the tester 14 so that It was formed so that a predetermined test signal was transmitted from the tester 14 via the pad 4 provided in 1B.

As shown in FIG. 4 (c), the printed circuit board 1 is provided with through holes 18 through which the semiconductor elements 5 are inserted and removed, and the input / output terminals of the semiconductor elements 5 mounted in the through holes 18 are provided. The wiring material 15 is connected between 5A and the relay pad 17 connected to the pad 4 by the pattern wiring 16, and is formed so that the predetermined test signal sent to the pad 4 is propagated to the semiconductor element 5. There is.

Further, such a through hole 18 is formed as shown in FIG.
As shown in (b), the pad 4 is arranged in the central portion of the printed circuit board 1, while the pad 4 is circularly arranged in the peripheral portion of the printed circuit board 1.

Therefore, the semiconductor element 5 is mounted on the printed circuit board.
The electrical characteristics of the semiconductor element 5 can be tested by mounting it on the front surface 1A of 1 and connecting predetermined input / output terminals 5A to the pad 4 by laying wiring material 15 according to the circuit network formed on the semiconductor element 5. When performing the test on the semiconductor element 5 having a different circuit network, it is considered that the test is performed by replacing the wiring material 15 or by using a separately prepared printed circuit board.

[0009]

However, in such a structure in which the semiconductor element 5 is mounted in the through hole 18 of the printed board 1 and the semiconductor element 5 and the relay pad 17 are connected by the wiring material 15, Although it is possible to test the semiconductor element 5 of the lead insertion mounting type, there is a problem that it is not possible to test the semiconductor element of a different type that has an input / output terminal that cannot be mounted in the through hole 18. Even if the semiconductor element 5 is a semiconductor element 5 with different circuit networks, it is necessary to replace the wiring material 15 each time when testing semiconductor elements with different circuit networks, and due to the influence of noise on the wiring material 15, However, there was a problem that accurate test results of electrical characteristics could not be obtained.

Therefore, according to the present invention, different types of semiconductor elements can be mounted on the printed circuit board, and the test can be performed without preparing many kinds of printed circuit boards, and the electrical characteristics can be tested. The purpose is to improve the reliability of the product.

[0011]

FIG. 1 is a diagram for explaining the principle of the present invention. As shown in FIGS. 1 (a) and 1 (b), a printed circuit board 1
Inserting / removing part 2 that arranges contacts 3 in the center of surface 1A of
And a pad 4 provided on the periphery of the back surface 1B of the printed circuit board 1, and a lead insertion mounting type semiconductor element 5 is provided.
And the lead insertion mounting type socket 8
Is mounted via the contact 3 to the semiconductor element 5 by connecting the pad 4 to a tester 14 for testing electrical characteristics, and connecting the pad 4 to the contact 3 so as to have electrical continuity. A test board for testing the electrical characteristics of a surface mount type semiconductor element (6) mounted in a socket (8), wherein the contact (3) is the semiconductor element (5).
The input / output terminal 5A of the socket 8 and the terminal piece 8A of the socket 8 are formed to be inserted and removed, and the plurality of the semiconductor element 5 and the socket 8 are mounted on the insertion / removal portion 2 in a mixed manner. 3 are arranged at a predetermined pitch P, and
On the back surface 1B of the printed circuit board 1, a first connector 10 connected to the contact 3 is arranged, and a second connector 11 connected to the pad 4 by a pattern wiring 9 is arranged. By inserting respective plugs 13 provided at both ends of 12 into the first and second connectors 10 and 11, the connection between the contact 3 and the pad 4 is configured to be freely contactable and separable. .

The above-mentioned problems can be solved by such a configuration.

[0013]

[Function] That is, the contact 3 having a predetermined pitch P is provided in the insertion / removal portion 2 formed in the central portion of the surface 1A of the printed circuit board 1, and the tester is provided in the peripheral portion of the back surface 1B of the printed circuit board 1.
The pad 4 connected to 14 is arranged,
The rear surface 1B of 1 is provided with a first connector 10 connected to the contact 3 and a second connector 11 connected to the pad 4 via the pattern wiring 9, and the insertion / removal portion 2 is a lead insertion mounting type. Mounting the semiconductor element 5 and mounting the surface mounting type semiconductor element 6 via the lead insertion mounting type socket 8 and connecting the first and second connectors 10 and 11 with the shield wire 12. By connecting the pad 4 to the tester 14, the tester 14 tests the electrical characteristics of the lead insertion mounting type semiconductor element 5 and the surface mounting type semiconductor element 6.

Therefore, a plurality of different types of semiconductor elements 5 and 6 can be mounted by being mixedly mounted on the insertion / removal section 2, and the connection of the shield wire 12 can be easily changed. , Different kinds of semiconductor devices can be easily tested, and can be prevented from being affected by noise during the test, and accurate test results of electrical characteristics can be obtained, Reliability can be improved.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to FIGS. FIG. 2 is a side sectional view of an embodiment according to the present invention,
FIG. 3 is a plan view of the insertion / removal portion of the present invention. Throughout the figure,
The same reference numeral indicates the same object.

According to the present invention, as shown in FIG. 2, a lead insertion mounting type semiconductor element 5 and a lead insertion mounting type socket 8 are provided in a central portion of a surface 1A of a printed circuit board 1.
It is formed by providing the insertion / removal part 2 in which the contacts 3 for mounting are arranged and the pad 4 connected to the tester 14 is arranged on the periphery of the back surface 1B of the printed circuit board 1.
First connector 10 connected to contact 3 on back 1B
And the second connected to the pad 4 by the pattern wiring 9.
Connector 11 of the first and second connectors 10,1
The shield wire 12 is formed between the wire 1 and the wire 1.

Further, the contact 3 has a contact piece 3A into which the input / output terminal 5A of the semiconductor element 5 is inserted and removed, and a terminal piece 8A of the socket 8 is inserted and removed, and a slit portion protruding from the first connector 10. 3B and the first connector 10
Is formed by a protruding slit portion 3B and a ring-shaped sleeve 10A provided around the slit portion 3B, and the second connector 11 has a protruding slit piece 11B.
A plug 13 formed by a ring-shaped sleeve 11A provided around the slit piece 11B and fixed to both ends of the shield wire 12 has a first connector and a second connector, respectively.
The ring 13A of the plug 13 comes into contact with the sleeves 10A and 11A by being inserted into the plugs 10 and 11, and the pin 13B of the plug 13 is inserted into each of the slit portion 3B and the slit piece 11B.

Therefore, the sleeves 10A and 11A are connected by the shield 12B of the shielded wire 12, and the slit portion 3B and the slit piece 11B are connected by the signal line 12A of the shielded wire 12.

Further, the sleeves 10A and 11A are connected to the ground pattern 20, and the slit pieces 11B are connected to the pattern wiring 9
Is formed so as to be connected to the pad 4.
Further, the surface mount type semiconductor element 6 to be mounted in the socket 8 may be either a semiconductor element having a flat lead type input / output terminal 6A or a semiconductor element having an electrode type input / output terminal 6B. Can be formed.

Therefore, in the semiconductor element 5 of the lead insertion mounting type, by inserting the input / output terminal 5A into the contact piece 3A
Surface mounted semiconductor element 6 mounted on 2 and having flat lead type input / output terminal 6A or electrode type input / output terminal 6B is mounted in socket 8 and terminal piece 8A of socket 8 is inserted in contact piece 3A. It is mounted on the insertion / removal part 2, the first and second connectors 10 and 11 are connected by the shield wire 12, and the printed circuit board 1 is placed on the tester 14 to form a pad.
4 is brought into contact with a predetermined portion of the tester 14, and a test signal is sent from the tester 14 to test the electrical characteristics of the lead insertion mounting type semiconductor element 5 and the surface mounting type semiconductor element 6.

Further, the contacts 3 arranged in the insertion / removal section 2
As shown in FIG. 3, P × N with a predetermined pitch P
If the pitch P is set to, for example, 50 mil that matches the reference pitch of the printed circuit board, a plurality of semiconductor devices 5 and sockets 8 can be mounted, or the semiconductor device 5 can be installed side by side with the socket 8 Implementation can be done,
A plurality of the semiconductor elements 5 and the semiconductor elements 6 can be tested at the same time, or by mounting the semiconductor elements 5 and the semiconductor elements 6 together.

In this case, by connecting the shield 12B of the shield wire 12 for connecting the test signal to the ground, it is possible to prevent the test signal sent to the signal line 12A from being affected by noise. , The reliability of the test result can be improved, and the plug 13 can be easily inserted / removed into / from the predetermined connectors 10 and 11 according to the mounted semiconductor elements 5 and 6 to easily change the connection of the test signal. You can do it.

Therefore, it is necessary to prepare a dedicated printed circuit board according to the type of the semiconductor element to be tested or to prepare one kind of printed circuit board without changing the wiring material as in the conventional case. It is possible to test electrical characteristics of different types of semiconductor devices.

[0024]

As described above, according to the present invention,
An insertion / removal section in which contacts are arranged is provided in the central portion of the front surface of the printed circuit board, a pad connected to the tester is provided in the peripheral portion of the back surface, and a first connector connected to the contacts is provided.
A printed circuit board in which a shielded wire material that can be freely contacted and separated from the second pad-connected connector is laid, and a semiconductor element or socket is mounted in the insertion / removal section, and the electrical characteristics of different types of semiconductor elements are tested in the same manner. Can be done easily by.

Therefore, it is not necessary to prepare a new printed circuit board according to the circuit network of the semiconductor device as in the prior art, and a plurality of printed circuit boards can be tested at the same time. Since it is formed so as not to receive the test, the reliability of the test can be improved and the work of the test can be made more efficient, and the practical effect is great.

[Brief description of drawings]

FIG. 1 is an explanatory view of the principle of the present invention.

FIG. 2 is a side sectional view of an embodiment according to the present invention.

FIG. 3 is a plan view of the insertion / removal portion of the present invention.

FIG. 4 is a conventional explanatory diagram.

[Explanation of symbols]

1 Printed circuit board 2 Insertion / removal part 3 Contact 4 Pad 5,6 Semiconductor element 8 Socket 9 Pattern wiring 10 1st connector 11 2nd connector 12 Shield wire material 13 Plug 1A Front surface 1B Rear surface 5A Input / output terminal 8A Terminal piece

Claims (2)

[Claims] 1. The insertion / removal part (2) for arranging contacts (3) in the center of the surface (1A) of the printed circuit board (1) and the peripheral part of the back surface (1B) of the printed circuit board (1). A lead insertion mounting type semiconductor element (5) and a lead insertion mounting type socket (8) are provided to the insertion / removal part (2) through the contact (3). Mounted, connect a tester (14) to test electrical characteristics to the pad (4),
To test the electrical characteristics of the semiconductor element (5) and the surface mount type semiconductor element (6) mounted in the socket (8) A test board, wherein the contact (3) is an input / output terminal of the semiconductor element (5).
(5A) and the terminal piece (8A) of the socket (8) are formed so as to be inserted and removed, and a plurality of the semiconductor element (5) and the socket (8) are formed in the insertion and removal section (2). ), The contacts (3) are arranged at a predetermined pitch (P) so as to be mixedly mounted on the test board. 2. The back surface (1B) of the printed circuit board (1) according to claim 1, wherein a first connector (10) connected to the contact (3) is provided and the pad (4) is provided. A second connector (11) connected by a pattern wiring (9) is arranged on the plug and plugs (13) provided at both ends of the shield wire (12) are connected to the first and second connectors (10, 10). A test board, characterized in that the connection between the contact (3) and the pad (4) is formed so as to be freely contactable and separable by being inserted into the (11).