JPH0735411Y2 - 回路基板 - Google Patents

回路基板

Info

Publication number
JPH0735411Y2
JPH0735411Y2 JP1990107701U JP10770190U JPH0735411Y2 JP H0735411 Y2 JPH0735411 Y2 JP H0735411Y2 JP 1990107701 U JP1990107701 U JP 1990107701U JP 10770190 U JP10770190 U JP 10770190U JP H0735411 Y2 JPH0735411 Y2 JP H0735411Y2
Authority
JP
Japan
Prior art keywords
solder
layer
circuit board
prevention pattern
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990107701U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0463674U (US20020125480A1-20020912-P00900.png
Inventor
久男 武内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hokuriku Electric Industry Co Ltd
Original Assignee
Hokuriku Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hokuriku Electric Industry Co Ltd filed Critical Hokuriku Electric Industry Co Ltd
Priority to JP1990107701U priority Critical patent/JPH0735411Y2/ja
Publication of JPH0463674U publication Critical patent/JPH0463674U/ja
Application granted granted Critical
Publication of JPH0735411Y2 publication Critical patent/JPH0735411Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP1990107701U 1990-10-15 1990-10-15 回路基板 Expired - Lifetime JPH0735411Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990107701U JPH0735411Y2 (ja) 1990-10-15 1990-10-15 回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990107701U JPH0735411Y2 (ja) 1990-10-15 1990-10-15 回路基板

Publications (2)

Publication Number Publication Date
JPH0463674U JPH0463674U (US20020125480A1-20020912-P00900.png) 1992-05-29
JPH0735411Y2 true JPH0735411Y2 (ja) 1995-08-09

Family

ID=31854345

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990107701U Expired - Lifetime JPH0735411Y2 (ja) 1990-10-15 1990-10-15 回路基板

Country Status (1)

Country Link
JP (1) JPH0735411Y2 (US20020125480A1-20020912-P00900.png)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6666320B2 (ja) 2017-11-21 2020-03-13 ファナック株式会社 樹脂成型基板及びコンデンサの実装構造

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS645475U (US20020125480A1-20020912-P00900.png) * 1987-06-30 1989-01-12
JPS6447092A (en) * 1987-08-18 1989-02-21 Fujitsu Ltd Soldering method of surface packaging component

Also Published As

Publication number Publication date
JPH0463674U (US20020125480A1-20020912-P00900.png) 1992-05-29

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