JPH07336078A - Cooling structure of heating-element package - Google Patents

Abstract

PURPOSE:To prevent dew condensation even when the temperature of a refrigerant which is circulated in a refrigerant flow passage for a cooling means is made lower than an outer circumferential temperature regarding the cooling structure of a heating-element package for an LSI or the like. CONSTITUTION:A cooling structure is constituted of a heating-element package 10 in which a heating element 2 is housed, of a cooling means 4 which is installed additionally at the heating-element package and which cools the heating-element package by circulating a refrigerant, of a heat-insulating member 5 which wholly covers the heating-element package and the cooling means and of input/output terminals 1b which are installed at the heating-element package and which protrude from the heat-insulating member so as to be capable of being connected to the outside.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling structure for a heating element package such as an LSI. In recent years, a package that accommodates a heating element such as a semiconductor chip has an increased amount of heat generation as the degree of integration of the semiconductor chip increases, and it is not possible to sufficiently cool the package by air cooling. Therefore, a cooling means for circulating the coolant is provided on the upper surface of the heating element package to absorb the heat of the semiconductor chip into the coolant for cooling. But,
When the coolant temperature is lower than the outer peripheral temperature, the surface of the cooling jacket or the heating element package is condensed, and therefore a countermeasure is required.

[0002]

2. Description of the Related Art Conventionally, as shown in the side sectional views of FIGS. 3 (a) and 3 (b) and its perspective view, a heating element package 20 has a heating element (semiconductor chip) 12 in a recess 11a of a package base 11. It is housed and sealed by a sealing plate 13, and a cooling means 14 by means of a refrigerant flow, that is, a cold plate having a refrigerant flow passage 14a therein is fixed to the upper surface of the package base 11 with an adhesive (not shown). The refrigerant used is CFC, liquid nitrogen, carbon fluoride, air, or the like.

The heating element package is mounted on a printed wiring board (not shown) or the like, and piping from a heat exchanger (not shown) is connected to the nipple at the inlet and outlet of the refrigerant flow passage to cool the heating element package by circulating the refrigerant. There is.

[0004]

However, according to the above cooling structure, when the temperature of the refrigerant is lower than the peripheral temperature when the refrigerant is circulated to cool the heating element package, dew condensation occurs on the surface. Condensation may cause corrosion, short circuit, migration, or the like at the joint with the printed wiring board. Therefore, it suffices to flow the refrigerant having a temperature higher than the outer peripheral temperature, but there is a problem that the cooling effect is deteriorated.

In view of the above problems, it is an object of the present invention to provide a heating element package cooling structure capable of preventing dew condensation even when the temperature of the refrigerant flowing through the refrigerant flow passage of the cooling means is lower than the outer peripheral temperature. .

[0006]

In order to achieve the above object, in the cooling structure of the heating element package of the present invention,
A heating element package containing a heating element, a cooling means attached to the heating element package for cooling the heating element package by circulating a refrigerant, a heat insulating member covering the entire surface of the heating element package and the cooling means, and the heating element. And an input / output terminal provided on the package and protruding from the heat insulating member so as to be externally connectable.

[0007]

By covering the entire surface of the heat-generating body package containing the heat-generating body and the cooling means attached to the heat-generating body package by means of the circulation of the cooling medium with a heat insulating member, the heat insulating member is maintained even if the temperature of the circulating coolant is lower than the outer peripheral temperature. Since the surface covered with is not affected by the ambient temperature, dew condensation can be prevented.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The gist of the present invention will be described in detail below with reference to the embodiments shown in the drawings. 1 (a) and 1 (b) are a side sectional view and a perspective view of a first embodiment according to the present invention.

In the heating element package 10 of FIG. 1, a heating element 2 (a semiconductor chip is shown in the figure) is housed in a recess 1a of a package base 1 made of ceramic or the like and sealed with a sealing plate 3 to cool it by means of a refrigerant flow. 4, that is, a cold plate made of a highly heat-conductive metal having a refrigerant flow passage 4a therein is fixed to the upper surface of the package base 1 with an adhesive (not shown), and the heating element package 10 together with the cooling means (cold plate) 4 is covered over the entire surface. The heat insulating member 5 covers it. As the refrigerant, CFC, liquid nitrogen, carbon fluoride, air or the like is used.

The heat insulating member 5 is made of foam resin such as urethane foam and styrene foam. Further, the input / output terminal 1b protruding on the mounting surface is connectable to a printed wiring board (not shown), and the nipple 4b at the inlet / outlet of the refrigerant flow passage 4a protruding on the upper surface is exposed so as to be connectable to a pipe from a heat exchanger (not shown). .

As described above, when the heating element package is mounted on a printed wiring board or the like and is cooled by circulating the coolant by covering the entire surface with the cooling means by the coolant circulation, the temperature of the circulating coolant is controlled. Even if the temperature is lower than the outer peripheral temperature, it is not affected by the outer peripheral temperature, so that dew condensation can be prevented and the cooling effect can be improved.

FIG. 2 is an exploded side sectional view and an assembled side sectional view of a second embodiment according to the present invention. FIG. 2 is composed of a heating element package 10 provided with a cooling means (cold plate) 4 for circulating the refrigerant of FIG. 1 and a heat insulating socket 6 connecting the heating element package 10.

The heat insulating socket 6 is divided into a box-shaped socket body 6a and a lid 6b for closing the opening of the socket body 6a. The heating element package 10 is connected and housed in the socket body 6a and used by closing the lid 6b. To do. The socket body 6a has a pin hole 6a-3 corresponding to the input / output terminal 1b of the heating element package 10,
Mold between outer case 6a-1 and 6a-2, and inner case 6a-1
An inner space surrounded by the outer case 6a-2 and the outer case 6a-2 is filled with a heat insulating member 5 such as urethane foam. Heating element package 10
The contact pin 6c for inserting and connecting the input / output terminal 1b is inserted and engaged in the pin hole 6a-3, and protrudes toward the mounting surface side so as to be connectable to a printed wiring board (not shown).

The one lid 6b is also formed by molding in the same manner, and filling the inner space between the outer cases 6b-1 and 6b-2 with a heat insulating member 5 such as urethane foam. The lid 6b is provided with a through hole 6b-3 for inserting the nipple 4b at the inlet / outlet of the refrigerant flow passage of the heating element package 10 connected to the socket body 6a.

When a heating element package integrally provided with a cooling means for circulating a refrigerant is connected to the socket, by using the heat insulating socket having such a structure,
The heating element package can be connected so as to be housed in a heat insulating socket, and the entire surface of the heating element package is covered with a heat insulating member. Therefore, as in the first embodiment, even if the temperature of the refrigerant is lower than the outer peripheral temperature, the outer peripheral temperature is not affected, dew condensation can be prevented, and the cooling effect can be improved.

[0016]

As described above in detail, according to the present invention,
In a heating element package that is integrally equipped with a cooling means for circulating the refrigerant, the refrigerant temperature can be set lower than the outer peripheral temperature to prevent dew condensation, so there is no risk of corrosion, short circuit, migration, etc. at the joint with the printed wiring board. It has an extremely useful effect in the industry such that it can provide a heating element package with high heat resistance and cooling effect.

[Brief description of drawings]

FIG. 1 is a side sectional view and a perspective view of a first embodiment according to the present invention.

FIG. 2 is an exploded side sectional view and an assembled side sectional view of a second embodiment according to the present invention.

FIG. 3 is a side sectional view and a perspective view thereof according to the prior art.

[Explanation of symbols]

 1 Package Base 1b Input / Output Terminals 2 Heating Element 4 Cooling Means 5 Insulating Member 6 Insulating Socket 6a Socket Body 6b Lid 6c Contact Pins 10,20 Heating Element Package

Claims (2)

[Claims] 1. A heating element package (10) accommodating a heating element (2), and cooling means (4) attached to the heating element package (10) for cooling the heating element package (10) by circulating a refrigerant. A heat insulating member (5) covering the entire surface of the heating element package (10) and the cooling means (4); and an insert provided on the heating element package (10) protruding from the heat insulating member (5) for external connection. A heating element package cooling structure comprising an output terminal (1b). 2. A heat insulating member (5), comprising a contact pin (6c) for connecting an input / output terminal (1b) of a heating element package (10) to be housed so that one end thereof can be externally connected.
(5) Socket body (6a) protruding from the socket body
(6a) with a lid (6b) consisting of a heat insulating member (5), the socket body (6a) accommodates the heating element package (10) provided with the cooling means (4), The heating element package (1
A heating element package cooling structure characterized in that the input / output terminal (1b) of (0) is connected to the contact pin (6c), and the lid (6b) is capped on the socket body (6a).