JPH0729855Y2 - カメラ用ケース - Google Patents
カメラ用ケースInfo
- Publication number
- JPH0729855Y2 JPH0729855Y2 JP1989124661U JP12466189U JPH0729855Y2 JP H0729855 Y2 JPH0729855 Y2 JP H0729855Y2 JP 1989124661 U JP1989124661 U JP 1989124661U JP 12466189 U JP12466189 U JP 12466189U JP H0729855 Y2 JPH0729855 Y2 JP H0729855Y2
- Authority
- JP
- Japan
- Prior art keywords
- protective layer
- camera
- case
- cover
- rays
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Accessories Of Cameras (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989124661U JPH0729855Y2 (ja) | 1989-10-25 | 1989-10-25 | カメラ用ケース |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989124661U JPH0729855Y2 (ja) | 1989-10-25 | 1989-10-25 | カメラ用ケース |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0364025U JPH0364025U (US07582779-20090901-C00044.png) | 1991-06-21 |
JPH0729855Y2 true JPH0729855Y2 (ja) | 1995-07-12 |
Family
ID=31672568
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989124661U Expired - Fee Related JPH0729855Y2 (ja) | 1989-10-25 | 1989-10-25 | カメラ用ケース |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0729855Y2 (US07582779-20090901-C00044.png) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8927900B2 (en) | 2000-09-13 | 2015-01-06 | Hamamatsu Photonics K.K. | Method of cutting a substrate, method of processing a wafer-like object, and method of manufacturing a semiconductor device |
US8969752B2 (en) | 2003-03-12 | 2015-03-03 | Hamamatsu Photonics K.K. | Laser processing method |
WO2015108315A1 (ko) * | 2014-01-15 | 2015-07-23 | 정영자 | 엑스레이 촬영장치 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6212160U (US07582779-20090901-C00044.png) * | 1985-07-05 | 1987-01-24 |
-
1989
- 1989-10-25 JP JP1989124661U patent/JPH0729855Y2/ja not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8927900B2 (en) | 2000-09-13 | 2015-01-06 | Hamamatsu Photonics K.K. | Method of cutting a substrate, method of processing a wafer-like object, and method of manufacturing a semiconductor device |
US8933369B2 (en) | 2000-09-13 | 2015-01-13 | Hamamatsu Photonics K.K. | Method of cutting a substrate and method of manufacturing a semiconductor device |
US8946589B2 (en) | 2000-09-13 | 2015-02-03 | Hamamatsu Photonics K.K. | Method of cutting a substrate, method of cutting a wafer-like object, and method of manufacturing a semiconductor device |
US8969761B2 (en) | 2000-09-13 | 2015-03-03 | Hamamatsu Photonics K.K. | Method of cutting a wafer-like object and semiconductor chip |
US8969752B2 (en) | 2003-03-12 | 2015-03-03 | Hamamatsu Photonics K.K. | Laser processing method |
WO2015108315A1 (ko) * | 2014-01-15 | 2015-07-23 | 정영자 | 엑스레이 촬영장치 |
Also Published As
Publication number | Publication date |
---|---|
JPH0364025U (US07582779-20090901-C00044.png) | 1991-06-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |