JPH0729645Y2 - 半導体装置用複合リードフレーム - Google Patents

半導体装置用複合リードフレーム

Info

Publication number
JPH0729645Y2
JPH0729645Y2 JP504588U JP504588U JPH0729645Y2 JP H0729645 Y2 JPH0729645 Y2 JP H0729645Y2 JP 504588 U JP504588 U JP 504588U JP 504588 U JP504588 U JP 504588U JP H0729645 Y2 JPH0729645 Y2 JP H0729645Y2
Authority
JP
Japan
Prior art keywords
lead frame
lead
frame
recess
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP504588U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01108946U (enrdf_load_stackoverflow
Inventor
諭 大和田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP504588U priority Critical patent/JPH0729645Y2/ja
Publication of JPH01108946U publication Critical patent/JPH01108946U/ja
Application granted granted Critical
Publication of JPH0729645Y2 publication Critical patent/JPH0729645Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP504588U 1988-01-18 1988-01-18 半導体装置用複合リードフレーム Expired - Lifetime JPH0729645Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP504588U JPH0729645Y2 (ja) 1988-01-18 1988-01-18 半導体装置用複合リードフレーム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP504588U JPH0729645Y2 (ja) 1988-01-18 1988-01-18 半導体装置用複合リードフレーム

Publications (2)

Publication Number Publication Date
JPH01108946U JPH01108946U (enrdf_load_stackoverflow) 1989-07-24
JPH0729645Y2 true JPH0729645Y2 (ja) 1995-07-05

Family

ID=31208076

Family Applications (1)

Application Number Title Priority Date Filing Date
JP504588U Expired - Lifetime JPH0729645Y2 (ja) 1988-01-18 1988-01-18 半導体装置用複合リードフレーム

Country Status (1)

Country Link
JP (1) JPH0729645Y2 (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH01108946U (enrdf_load_stackoverflow) 1989-07-24

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