JPH07249570A - Spin transfer for photomask manufacture - Google Patents

Abstract

PURPOSE:To provide a spin treater, which is capable of improving a treatment of the lower side (rear) of a substrate in the manufacture of a photomask. CONSTITUTION:A spin treater is constituted into a structure, wherein a substrate 8 is held and fixed on a chuck part 2 in a spin treating tank 1, which is used in a developing treatment of a photomask or the like and consists of side surface parts and a bottom, and while the substrate 8 is rotated, a treating liquid is injected simultaneously on both surfaces of the upper and lower surfaces of the substrate by upper and lower nozzles to treat the substrate, and the spin treater is provided with a chuck- receiving part 3 for fixedly rotating the chuck part 2 and a rotation drive system 4. The part 3 is positioned on the side lower than the bottom of the tank 1, has a chuck-receiving main body 31, which is given a rotation from the system 4, and chuck- receiving joints 32, which are stretched from the bottom of the tank 1 to the side higher than the bottom and consist of one place and a plurality of places where the chuck part is directly held, the joints 32 are arranged in such a way as to position on the outside of the rotation region of the substrate, the part 2 consists of chuck joints 22 to joint directly with the joints 32, holding parts 21 and a main body 23 to couple the joints 22 with the parts 21 and the parts 22 and the main body 23 are at least arranged on the outside of the rotation region of the substrate.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the manufacture of photomasks used in the manufacture of semiconductor devices such as ICs and LSIs, and more specifically, in the manufacture of photomasks having a high-density wiring pattern, high-quality processing accuracy. The present invention relates to a spin processing apparatus having

[0002]

2. Description of the Related Art A photomask is used as an original plate when forming a circuit pattern of a semiconductor element such as an IC or an LSI, and is generally made mainly of chromium, molybdenum or the like on a glass substrate such as quartz. A pattern formed of a light shielding layer is arranged. Conventionally, in the manufacture of this photomask, usually, (1) ultraviolet rays such as g-line (436 nm) and i-line (365 nm) or electron beams are mainly used to form chromium, molybdenum, etc. on a glass substrate such as quartz. A step of exposing a blank (having a light-shielding layer formed on substantially the entire surface) a resist (photosensitive resin), which is applied to the light-shielding layer and is sensitive to ultraviolet rays such as g-line and i-ray, and an electron beam, into a predetermined pattern shape, (2) A step of selectively removing the resist (photosensitive resin) that has been selectively exposed by a developer to form a resist pattern, (3) after this, if necessary, a descum treatment and a baking treatment are performed, A step of etching (corroding) the exposed light-shielding film according to the selectively removed resist pattern to form a pattern of a light-shielding layer, (4) then removing the resist film and performing a cleaning treatment Step of performing includes a like, in these processes, the development process of the resist, etching of the light-shielding layer, cleaning or the like of the substrate has been carried out. Further, in the process of inspecting and repairing the photomask, the cleaning process, the developing process, and the etching process are performed as needed.

In the above-mentioned development processing, a spray development method in which a developing solution or a rinsing solution is spray-applied (sprayed) while rotating (spinning) a processing substrate is usually used. Also in the above etching process, a spray etching method has been used in which the etching liquid is spray-coated (sprayed) while the processed substrate is rotated (spun). And even in the substrate cleaning process,
A spray cleaning method has been used in which a cleaning liquid or pure water is spray-coated (sprayed) on a rotating processed substrate.
As described above, in the manufacture of the photomask, the rotation (spin) processing in which the processing is performed while rotating the processing substrate has been widely used in various steps. Here, spray coating (spraying) means spraying a processing liquid onto a processing substrate from a nozzle or the like.

However, when a resist film is formed on a processed substrate, there is a problem that the resist wraps around the back surface of the substrate and the back surface is stained. At the same time as (jetting), a method for treating the back surface without contamination was required. Also, in the spray etching process, the etching solution wraps around to the back surface during etching, which causes stains and the like, which is a quality problem. However, it was necessary to wash away the etching solution, but in this process it is difficult to completely prevent the etching solution from wrapping around, so during the spray etching process, pure water or the like is sprayed from the back surface to remove it, and,
The demand for washing came out. Further, even in the cleaning process of the processed substrate by the spray cleaning method, there is still a problem of the processing liquid sneaking into the back surface of the processed substrate, and a cleaning method by a rotation (spin) process capable of simultaneously cleaning the back surface has been demanded.

In order to deal with these problems, a spin processing apparatus using a spin chuck as shown in FIG. 3 is used,
When processing the front surface of the processing substrate, a method of performing the processing from the back surface has also been adopted. In FIG. 3, 200 is a chuck, 210 is a substrate holding unit, 230 is a chuck arm unit, 800 is a processing substrate, 240 is a pin, and 220 is a chuck receiver (not shown) rotated by a rotation driving unit. It is a chuck joining part that is fitted (joined). Figure 3
As shown in FIG. 3, the chuck part 200 is provided with a plurality of chuck arms 230, and the pins 240 on the chuck arms 230 hold and fix the end surface of the processing substrate 800. It is fixed to and rotates integrally with a chuck receiving portion which is rotated by a rotation driving portion. The processing is performed by rotating the processing substrate 800 with the rotation driving unit at a predetermined rotation speed.
This is performed by spray coating (spraying) a processing liquid such as a developing liquid or an etching liquid from above and below the processing substrate 800.

However, in recent years, with the miniaturization and high integration of semiconductor elements, photomasks have been required to be further miniaturized and highly integrated, and the spin processing described above also leads to further improvement in quality. It has come to be demanded. In the spin processing using the chuck shown in FIG. 3, since the chuck arm 230 is provided as described above, the chuck arm 230 prevents the processing solution such as the developing solution or the etching solution from being jetted to the processing substrate. The treatment liquid spray-applied (sprayed) from the lower surface side of the treatment substrate 800 becomes non-uniform, and the uniformity of treatment is impaired. For this reason, it has become impossible to meet the demand for quality improvement due to the miniaturization and high integration of the photomask, and the spin processing apparatus has also been required to be improved.

[0007]

SUMMARY OF THE INVENTION Under the circumstances, the present invention intends to provide a spin processing apparatus which can meet the demand for quality improvement accompanying miniaturization and high integration of photomasks. is there.

[0008]

A spin processing apparatus for manufacturing a photomask according to the present invention is provided with a processing substrate on a chuck portion in a spin processing tank having a side surface portion and a bottom portion, which is used in the development processing, etching processing, etc. of a photomask. A spin processing apparatus for simultaneously spraying and processing a processing liquid onto the upper and lower surfaces of a processing substrate by nozzles above and below the processing substrate while holding, fixing and rotating, and a chuck receiving portion for fixing and rotating the chuck portion. , A rotation receiving system for rotatably driving the chuck receiving portion, the chuck receiving portion being located below the bottom of the spin processing tank, the chuck receiving main body receiving rotation from the rotation driving system, and the spin processing tank. Has a chuck receiving joint portion formed of one or a plurality of portions for directly holding the chuck portion, which extends upward from the bottom portion of
Further, the chuck receiving joining portion is arranged so as to be located outside the processing substrate rotation region, and the chuck portion includes a chuck joining portion that directly joins the chuck receiving joining portion, a substrate holding portion that holds and fixes the processing substrate, A chuck body that connects the chuck joining portion and the substrate holding portion, and at least:
The chuck joint portion and the chuck body are arranged outside the processing substrate rotation region. Then, in the above, the bottom of the spin processing tank has a hollow structure, a processing liquid pipe for supplying a processing liquid to the hollow portion is passed, and the hollow processing part passes through the bottom surface of the spin processing tank to the processing substrate in the spin processing tank. The nozzle portion is provided to apply the treatment liquid from the lower side. Further, the substrate holding portion of the spin processing apparatus for manufacturing a photomask described above fixes the two side portions sandwiching each corner at the four corners of the substrate with pins, and is arranged above the chuck body.

[0009]

The spin processing apparatus for manufacturing a photomask according to the present invention has the above-described structure, and thus the adverse effect of the chuck arm of the chuck in the conventional spin processing apparatus as shown in FIG. The processing liquid from (1) can be nozzle-coated (sprayed) on the lower surface of the processing substrate without obstructing the course. Further, the nozzle of the processing liquid on the lower surface (back surface) of the processing substrate can be easily arranged at any position including the central portion of the processing tank occupied by the conventional chuck arm, and a plurality of nozzles can be arranged. It is possible. As a result, it is possible to significantly improve the uniformity of the processing liquid on the back surface of the processing substrate during processing as compared with the conventional processing apparatus. As a result, it is possible to eliminate the non-uniformity of the back surface (lower surface) processing when processing the front and back surfaces of the processed substrate, and to meet the demand for quality improvement accompanying miniaturization and high integration of the photomask.

[0010]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows an exploded sectional view of the apparatus of the embodiment, and FIG. 2 shows a schematic sectional view of this apparatus. 1 and 2, 1 is a spin processing tank, 2 is a chuck unit, 3 is a chuck receiving unit, 4 is a rotary drive system, 5 is a support, 6a and 6b are process liquid pipes, 7a and 7b are nozzles, 8 is a processing substrate,
Reference numeral 11 denotes a side surface portion of the spin processing tank 1, and 12a and 12b denote bottom portions of the spin processing tank 1.

As shown in FIG. 1, the chuck part 2 has a substrate holding part 21 for holding and fixing the processing substrate 8, a chuck joining part 22 for joining with a chuck receiving part, and a substrate holding part 21 and a chuck joining part 22 for connection. The chuck main body 23, which does not extend outside the center of rotation of the chuck part 200, unlike the chuck arm part 230 of the conventional chuck part 200 shown in FIG. Also, the substrate holder 2
1 has four pieces so as to hold and fix the four corners of the processing substrate 8, and pins 24 are arranged in each of the substrate holding portions so as to be fixed from both side portions sandwiching the corner portion of the processing substrate. As a result, the nozzle 7 on the lower surface (back surface) of the processing substrate 8 is processed during processing.
The injection of the treatment liquid from b is not hindered. Of course, at the time of processing, there is no obstacle to the ejection of the processing liquid from the nozzle 7a on the upper surface (front surface) of the processing substrate 8, and the processing on both sides of the processing substrate can be made uniform. The chuck joining portion 22 is composed of one piece or a plurality of pieces, and is fitted (joined) with the chuck receiving joining portion of the chuck receiver 3.

The chuck receiving portion 3 is, as shown in FIG.
The structure is fixed to the column 5 through a bearing 41 and can rotate around the column 5, and is rotated by a rotary drive system 4 including a motor 4a, a timing belt 4b, and the like.
Chuck receiving joint 3 consisting of one or more places
2 is disposed above the bottom portions 12a and 12b of the spin processing tank 1, and as shown in FIG. 2, the chuck receiving joint portion 32 is fitted (joined) with the chuck portion 2 and the chuck joint portion 32. It As a result, the chuck portion 2 is fixed to the chuck receiving portion 3, and is integrated with the chuck receiving portion 3 and rotated by the rotary drive system 4. Further, the processing substrate 8 is held and fixed by the substrate holding portion 21, and is rotated integrally with the chuck portion 2 and the chuck receiving portion 3.

In this embodiment, the chuck receiving joint 32 is connected to the chuck receiver 31 so as to be located outside the rotation region of the processing substrate. Also, the chuck part 2
Also, the corners of the processing substrate 8 are fixed only by the substrate holding portion 21 so that obstacles are not placed as much as possible on the processing area on the lower surface (back surface) of the processing substrate 8, and the chuck is a portion other than the substrate holding portion 21. The bonding portion 22 and the chuck body 23 are located outside the rotation region of the processing substrate.

Further, in this embodiment, as shown in FIG. 1, the pillar 5 is hollow, the hollow portion 13 is provided below the bottom portion 12a of the spin treatment layer 1, and the treatment liquid pipe 6b is provided in the hollow portion. By passing it through, it becomes possible to arrange the nozzle 7b for injecting the processing liquid for processing the lower surface (back surface) of the processing substrate 8 at an arbitrary position on the bottom 12a of the spin processing tank 1.

In FIG. 1, the treatment liquid pipe 6b and the nozzle 7b are simply shown as a pair, but a plurality of treatment liquid pipes and nozzles may be provided at the bottom 12a of the spin treatment tank 1. Good, by providing a plurality, it is possible to improve the processing uniformity. It is also possible to provide a set of a plurality of processing liquid pipes and nozzles and perform processing with a plurality of types of processing liquids. Further, it is also possible to branch the treatment liquid and jet it from a plurality of nozzles.

[0016]

As described above, the spin processing apparatus for manufacturing a photomask according to the present invention is of a quality that is required by the miniaturization and high integration of the photomask in accordance with the higher integration and downsizing of semiconductor elements such as IC and LSI. It is supposed to be able to handle up.

[Brief description of drawings]

FIG. 1 is a schematic view of a spin processing apparatus according to an embodiment of the present invention.

FIG. 2 is a schematic sectional view of the device.

FIG. 3 is a schematic view of a chuck table in a conventional spin processing apparatus for manufacturing a photo mask.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Spin treatment tank 11 Side surface part 12a, 12b Bottom part 13 Hollow part 2 Chuck part 21 Substrate holding part 22 Chuck joining part 23 Chuck main body 24 pin 3 Chuck receiving part 31 Chuck receiving main part 32 Chuck receiving joining part 4 Rotation drive system 4a Motor 4b Timing belt 41 Bearing part 5 Struts 6a, 6b Processing liquid piping 7a, 7b Nozzle 8 Processing substrate 200 Chuck part 210 Substrate holding part 220 Chuck joining part 230 Chuck arm part 240 pins 800 Processing substrate

Claims (3)

[Claims] 1. A nozzle is provided above and below the processing substrate while the processing substrate is held and fixed on a chuck portion in a spin processing tank having a side surface portion and a bottom portion, which is used in development processing, etching processing, etc. of a photomask. A spin processing apparatus for simultaneously processing and processing a processing liquid onto the upper surface and the lower surface of the processing substrate, comprising a chuck receiving portion for fixing and rotating the chuck portion, and a rotary drive system for rotationally driving the chuck receiving portion. The chuck receiving part is located below the bottom of the spin processing tank, extends above the bottom of the spin processing tank and the chuck receiving main body that receives rotation from the rotation drive system, and holds the chuck directly. And a chuck receiving joint formed of a plurality of locations, and
The chuck receiving joint portion is arranged so as to be located outside the processing substrate rotation region, and the chuck portion includes a chuck joining portion that directly joins the chuck receiving joint portion, a substrate holding portion that holds and fixes the treatment substrate, and a chuck joining portion. A spin processing apparatus for manufacturing a photomask, comprising: a chuck main body that connects the substrate holding section to the substrate holding section, and at least the chuck bonding section and the chuck main body are arranged outside the processing substrate rotation area. 2. The spin processing tank according to claim 1, wherein the bottom of the spin processing tank has a hollow structure, a processing liquid pipe for supplying a processing liquid to the hollow portion is passed, and the hollow processing portion is passed through the bottom surface of the spin processing tank.
A spin processing apparatus for manufacturing a photomask, comprising a nozzle section for applying a processing liquid from below to a processing substrate in a spin processing tank. 3. The substrate holding part according to claim 1, wherein the two side parts sandwiching each corner are fixed by pins at four corners of the substrate, and the substrate holding part is arranged on an upper part of the chuck body. Spin processing equipment for photo mask manufacturing.