JPH07188947A - Surface roughening method - Google Patents

Surface roughening method

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Publication number
JPH07188947A
JPH07188947A JP34685393A JP34685393A JPH07188947A JP H07188947 A JPH07188947 A JP H07188947A JP 34685393 A JP34685393 A JP 34685393A JP 34685393 A JP34685393 A JP 34685393A JP H07188947 A JPH07188947 A JP H07188947A
Authority
JP
Japan
Prior art keywords
surface
substrate
etching
film
fine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP34685393A
Other languages
Japanese (ja)
Inventor
Shuichi Ogasawara
修一 小笠原
Original Assignee
Sumitomo Metal Mining Co Ltd
住友金属鉱山株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co Ltd, 住友金属鉱山株式会社 filed Critical Sumitomo Metal Mining Co Ltd
Priority to JP34685393A priority Critical patent/JPH07188947A/en
Publication of JPH07188947A publication Critical patent/JPH07188947A/en
Application status is Pending legal-status Critical

Links

Abstract

PURPOSE: To form fine ruggedness on the surface of a substrate and to improve the adhesive strength of a film by forming an etching resist layer having fine pinholes reaching the surface of the substrate to be etched on the surface of the substrate and thereafter subjecting the exposed part in the substrate by the pinholes to etching.
CONSTITUTION: The surface of a substrate to be etched is coated with an etching resist having fine pinhles reaching the surface to be etched in the substrate. Then, the surface of the substrate exposed by the pinholes is selectively subjected to etching to form recessed parts on the surface of the substrate. Thus, the surface of the substrate in which a film is to be formed can suitably be roughened, and an excellent film can be formed on the face to be adhered with tight adhesion.
COPYRIGHT: (C)1995,JPO

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【産業上の利用分野】本発明は、粗面化、すなわち被膜の密着強度を改善するための接合面の粗化方法に関する。 The present invention relates to a roughening, i.e. about roughening method of the bonding surface to improve the adhesion strength of the film.

【0002】 [0002]

【従来の技術】物体表面に被膜を形成した際、その被膜の密着強度を支配する因子は物理的な密着力と化学的な密着力に分類される。 When forming a film of the Prior Art object surface, factors governing the adhesion strength of the coating can be classified into physical adhesion and chemical adhesion. 物理的な密着力としては、いわゆるアンカー効果と呼ばれる接合界面の凹凸が生み出す密着力が挙げられ、また化学的な密着力としては、接合界面の分子間力などに代表される。 The physical adhesion, adhesion may be mentioned irregularities in the joint interface so-called anchor effect produces, also as a chemical adhesion, typified intermolecular force at the bonding interface.

【0003】例えば、樹脂表面に無電解めっきを施した場合のめっき被膜の密着強度は、樹脂表面の凹凸によるアンカー効果や、樹脂表面に存在する官能基と金属との配位結合力などによって支配される。 For example, the adhesion strength of the plating film when subjected to an electroless plating on the resin surface is governed and anchor effect due to unevenness of the resin surface, such as by coordination bonding force between the functional group and the metal present on the resin surface It is.

【0004】また、金属表面に有機被膜を塗布した場合の有機被膜の密着強度は、金属表面の凹凸によるアンカー効果や、金属層と接した有機被膜中の官能基と金属との配位結合力などによって支配される。 [0004] The adhesion strength of the organic coating when the organic coating is applied to the metal surface, coordination bonding force and anchor effect due to unevenness of the metal surface, with the functional group and the metal in the organic coating in contact with the metal layer It is governed by such.

【0005】従って、密着強度を改善するためには、物理的な密着力あるいは化学的な密着力またはその両者を改良する必要があることが分かる。 Accordingly, in order to improve the adhesion strength, it can be seen that there is a need to improve the physical adhesion or chemical adhesion, or both. 物理的な密着力、即ちアンカー効果を改良する手段としては、従来、接合表面積を増加させるために接着表面凹凸を拡大する方法、 Physical adhesion, i.e. as a means of improving the anchor effect, conventionally, a method of expanding the adhesive surface irregularities in order to increase the bonding surface area,
また凹凸の形状を入り組んだ複雑な形状にすることなどが上げられ、一般的にはサンドブラスト処理やエッチング処理などによって接着表面を物理的あるいは化学的に粗化する方法が用いられてきた。 The raised and can complicate shape intricate shape of the unevenness, in general physical or chemical method of roughening the adhesive surface, such as by sand blasting or etching process it has been used.

【0006】 [0006]

【発明が解決しようとする課題】一般的にエッチング法によって接着表面を祖化する場合は、特殊なエッチング法を用いるか、特殊な素材にエッチングを適用する。 If you Sokha adhesion surface by THE INVENTION Problems to be Solved by general etching method, or using a special etching technique is applied to etch the special material. 例えば、前者には、P. For example, in the former, P. R. R. 電解あるいはパルス電解などの特殊な方法を用い電解エッチングを行うものがあり、 There is to perform electrolytic etching using a special method such as electrolytic or pulse electrolysis,
また後者には、ABC樹脂のようにマトリックス中に選択的にエッチング可能な異質な部分が存在する物質にエッチングを適用するものがある。 Also in the latter, there is to apply the etching agent is present selectively etchable heterogeneous portion in the matrix as ABC resin. これらは、特殊な場合に限られ、汎用性に欠けるという問題があった。 These are limited to special cases, there has been a problem of a lack of versatility.

【0007】本発明は、汎用性のあるエッチング法による接着表面の粗化方法を提供することを目的とする。 [0007] The present invention aims to provide a roughening method of the adhesive surface by an etching method with versatility.

【0008】 [0008]

【課題を解決するための手段】本発明者は、接着表面の微細な部分にエッチング液を接触させることにより、接着表面にアンカー効果を得る凹部を任意に形成できることを見出し、本発明を完成させるに至った。 Means for Solving the Problems The present inventors have, by contacting an etchant into fine parts of the adhesive surface, found to be able to arbitrarily form recesses to obtain the anchor effect to the adhesive surface, thereby completing the present invention It led to.

【0009】即ち、上記課題を解決するための本発明の方法は、エッチングによって表面に微細な凹凸を形成する工程において、エッチングを行う表面に達する微細なピンホールを有するエッチングレジスト層を形成した後、ピンホールにおける露出部をエッチングするものである。 [0009] That is, the method of the present invention for solving the above problems, in the step of forming fine irregularities on the surface by etching, after forming an etching resist layer having a fine pin holes reaching the surface to be etched it is intended to etch the exposed portion of the pinhole.

【0010】 [0010]

【作用】本発明は、接着表面に達する微細なピンホールを有するエッチングレジストでエッチングを行うべき基材表面を被覆し、ピンホールにおいて露出した基材表面を選択的にエッチングすることにより凹部を基材表面に形成する。 DETAILED DESCRIPTION OF THE INVENTION The present invention, the substrate surface to perform etching with an etching resist having a fine pin holes reaching the adhesive surface is coated, based on the recesses by selectively etching the exposed substrate surface in the pinhole It is formed on the wood surface. 上記ピンホールの形状、大きさ、分散度などは、被膜の種類や用途と、必要とされる密着強度との兼ね合いによって設計されるため一概に限定できない。 The shape of the pinhole size, etc. dispersity can not be limited unconditionally because it is designed and the film type and application, the balance with the adhesion strength required.

【0011】例えば、金属表面に防錆などの保護膜として有機被膜を被覆する場合、凹部を単位面積により多く、即ち狭く、かつ深く形成し、粘性の低い有機物を用いれば、有機物が凹部に完全に充填され密着性の良い被膜を形成できるが、粘性の高い有機物を用いれば、有機物が凹部に充填しきれず充分な密着性が得られないばかりか、金属面と有機被膜の間に空隙が生じ防錆効果が損なわれる。 [0011] For example, when coating organic film as a protective film, such as rust on the metal surface, more in unit area recess, i.e. narrow and deep formation, the use of the low viscosity organic, completely recess organic matter Although filled to form a good adhesion coating, by using a highly viscous organic substances, organic matter not only not be obtained sufficient adhesion can not be completely filled in the recess, the gap occurs between the metal surface and the organic coating rust effect is impaired.

【0012】また、樹脂表面に無電解めっき被膜を形成する場合は、上記と同様に、単に高い密着強度を得ようとするならば、狭くかつ深い凹部を形成すればよいが、 [0012] In the case of forming an electroless plating film on the resin surface, in the same manner as mentioned above, if simply to be obtained with high adhesion strength, it is sufficient by forming the narrow and deep recesses,
得られためっき被膜を用いて選択的溶解により回路を成する場合には、凹部内に折出しためっき被膜を除去することが難しく、回路の絶縁不良などの問題を生じることもある。 Obtained when Narusuru the circuit by selective dissolution using a plating film, it is difficult to remove the plating film that issued folded in the recess, sometimes causing problems such as the circuit of insulation failure. 従って、実操業に当たっては適正なピンホール形状を設計する必要がある。 Therefore, when actual operation it is necessary to design a proper pinhole shape. 同様に、エッチング条件も一概に限定できないため、実操業に当たっては適正なエッチング条件を求めておく必要がある。 Similarly, since the etching conditions can not be limited unconditionally, it is when actual operation it is necessary to obtain the proper etching condition.

【0013】本発明で行う微細なピンホールを有したエッチングレジスト層の形成方法は特に限定されない。 The method for forming the etching resist layer having a fine pinholes performed in the present invention is not particularly limited. 例えばエッチングレジストとしてフォトレジストを用いて、設計したピンホールが得られるようなマスクを用い、フォトリソグラフィーによって形成することもできる。 For example using photoresist as an etching resist, a mask, such as the designed pinhole can be obtained, it can be formed by photolithography. また本発明で用いたエッチングレジストは、エッチング後、不要であれば除去してもよい。 The etching resist used in the present invention, after etching may be removed if unnecessary.

【0014】 [0014]

【実施例】次に本発明の実施例について述べる。 EXAMPLES described below for the embodiment of the present invention.

【0015】幅30cm、長さ30cm、厚さ50μm [0015] width 30cm, length 30cm, thickness 50μm
の東レ・デュポン社製ポリイミドフイルム「kapto Of Du Pont-Toray Co., Ltd. polyimide film "kapto
n200H」表面に、富士薬品工業社製ネガ型フォトレジスト「FSRーS」を厚さ3μmに均一に塗布し、7 The n200H "surface, uniformly coated to a thickness of 3μm to Fujiyakuhinkogyo manufactured negative photoresist" FSR over S ", 7
0℃で30分間乾燥した。 And dried for 30 minutes at 0 ° C.. その後、直径3μmのピンホールがピッチ6μmで形成されるようなマスクを前記ポリイミドフィルム表面のフォトレジスト上にセットし、 Thereafter, a mask is set so as pinholes having a diameter of 3μm are formed at a pitch 6μm on the photoresist of the polyimide film surface,
110mJ/cm 2の紫外線を照射し現像した後、13 After developing irradiated with ultraviolet light of 110mJ / cm 2, 13
0℃で30分間乾燥した。 And dried for 30 minutes at 0 ° C.. このようにしてポリイミドフィルム表面のフォトレジストにピンホールを設けた後、 After the pinhole provided in the photoresist of the thus polyimide film surface,
これをヒドラジンー水和物に50℃で10秒間浸漬し、 This was soaked at 50 ° C. 10 seconds hydrazine over hydrate,
露出したポリイミド樹脂部をエッチングし、「FSR− The exposed polyimide resin portion by etching, "FSR-
S」を剥離した。 It was peeled off S ".

【0016】以上の処理によって、表面に3μm、深さ3μmの凹部が6μmのピッチで形成されたポリミドフイルムを得ることができた。 [0016] By the above treatment, 3 [mu] m on the surface, a recess of depth 3 [mu] m could be obtained polyimide film formed at a pitch of 6 [mu] m. 得られたポリミドフイルムにキャタライジングーアクセレレーティング法により触媒を付与した後、以下に示す組成および条件で無電解銅めっきを施した。 After applying the catalyst by resulting catalyzing over access Les rating method polyimide film was subjected to electroless copper plating in the composition and conditions are shown below.

【0017】(めっき液の組成) CuSO 4・5H 2 O : 10g/l EDTA・2Na : 30g/l 37%HCHO : 5ml/l PEG#1000 : 0.5g/ [0017] (Composition of plating solution) CuSO 4 · 5H 2 O: 10g / l EDTA · 2Na: 30g / l 37% HCHO: 5ml / l PEG # 1000: 0.5g /
l 2,2'ービピリジル : 10mg/l (めっき条件) 温 度 : 65℃ 時 間 : 10分 攪 拌 : 空気で攪拌 pH : 12.5 l 2, 2 'Bipirijiru: 10 mg / l (Plating conditions) Temperature: 65 ° C. at between 10 min 攪 拌: stirring in air pH: 12.5

【0018】以上の処理によってポリイミドフイルム表面に厚さ0.3μmの均一な無電解銅めっき被膜が得られた。 The uniform electroless copper plating film having a thickness of 0.3μm on the polyimide film surface was obtained by the above process.

【0019】次に、上述のように得られた無電解銅めっき被膜表面に、以下に示す組成および条件で電気銅めっきを施した。 Next, the electroless copper plating film surface obtained as described above, was subjected to electrolytic copper plating composition and conditions are shown below.

【0020】(めっき液の組成) CuSO 4・5H 2 O : 80g/l H 2 SO 4 : 180g/l (めっき条件) 温 度 : 23℃ 時 間 : 1時間 陽 極 : 含りん銅 攪 拌 : 空気およびカソードロッカー 陰極電流密度 : 3A/dm [0020] (plating solution composition) CuSO 4 · 5H 2 O: 80g / l H 2 SO 4: 180g / l ( Plating conditions) Temperature: 23 ° C. at between: 1 hour positive electrode: phosphorus-containing copper攪拌: air and cathode rocker cathode current density: 3A / dm
2 2

【0021】以上の処理によって、ポリイミドフイルム表面に最終的に厚さ35μmの銅被膜を均一に設けた基板が形成された。 [0021] Through the above process, finally the substrate provided with the thickness 35μm of copper film uniformly formed on the polyimide film surface. この基板のめっき被膜の密度強度は、 Density strength of the plated coating of the substrate,
JIS Cー6481に従って測定したところ、2.0 Was measured in accordance with JIS C over 6481, 2.0
kgf/cmである。 It is kgf / cm. 従って、これは、従来得られていた1.2kgf/cmのレベルに比較して顕著に高い値である。 Therefore, it is significantly higher values ​​as compared to the level of the prior obtained have been 1.2 kgf / cm. この基板を用いることによって、充分信頼性のおけるフレキシブルプリント回路(EPC)板などの電子部品を得ることが可能となった。 By using this substrate, it becomes possible to obtain a sufficiently reliable properties flexible printed circuit (EPC) electronic components such as a leaf.

【0022】 [0022]

【発明の効果】以上述べたように本発明の方法によれば、素材の構成に負うところなく、簡便なエッチング法によって接着面積を適切に粗化することが可能となり、 According to the method of the present invention as described according to the present invention above, without owes to the structure of the material, it is possible to appropriately roughen the bonding area by simple etching method,
得られた接着面には密着性に優れた被膜を形成できる。 The resulting adhesive surface capable of forming a film excellent in adhesion.
また本発明の方法は広範囲な分野に適用可能であり、その効果は極めて大きい。 The method of the present invention is applicable to a wide range of fields, the effect is very large.

Claims (1)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 エッチングによって表面に微細な凹凸を形成する工程において、エッチングを行う表面に達する微細なピンホールを有するエッチングレジスト層を形成した後、ピンホールにおける露出部をエッチングすることからなる表面粗化方法。 1. A process for forming fine irregularities on the surface by etching, after forming an etching resist layer having a fine pin holes reaching the surface to be etched consists of etching the exposed portion of the pinhole surface roughening method.
JP34685393A 1993-12-27 1993-12-27 Surface roughening method Pending JPH07188947A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP34685393A JPH07188947A (en) 1993-12-27 1993-12-27 Surface roughening method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34685393A JPH07188947A (en) 1993-12-27 1993-12-27 Surface roughening method

Publications (1)

Publication Number Publication Date
JPH07188947A true JPH07188947A (en) 1995-07-25

Family

ID=18386252

Family Applications (1)

Application Number Title Priority Date Filing Date
JP34685393A Pending JPH07188947A (en) 1993-12-27 1993-12-27 Surface roughening method

Country Status (1)

Country Link
JP (1) JPH07188947A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0805722A1 (en) * 1995-01-26 1997-11-12 Chromalloy Gas Turbine Corporation Roughening of metal surfaces
US7828983B2 (en) * 2001-11-29 2010-11-09 Transform Solar Pty Ltd Semiconductor texturing process
US9583668B2 (en) 2000-11-29 2017-02-28 The Australian National University Semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0805722A1 (en) * 1995-01-26 1997-11-12 Chromalloy Gas Turbine Corporation Roughening of metal surfaces
EP0805722A4 (en) * 1995-01-26 1998-04-22 Chromalloy Gas Turbine Corp Roughening of metal surfaces
US9583668B2 (en) 2000-11-29 2017-02-28 The Australian National University Semiconductor device
US7828983B2 (en) * 2001-11-29 2010-11-09 Transform Solar Pty Ltd Semiconductor texturing process

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