JPH07167795A - Wiring pattern analyzer of multilayer interconnection board - Google Patents

Abstract

PURPOSE:To not only analyze wiring pattern wired on the surface layer but also speedily and easily analyze such troubles as an opening or a short circuit caused in a wiring pattern in a lower layer. CONSTITUTION:Provided are an electric inspection device 60 for analyzing troubles in a wiring pattern, a computer 70 containing the information of wiring route of the wiring pattern, an analyzing stage 40 having an automatic scanning stage 42 for placing a multilayer wiring base board and scanning at variable velocity, a microspcope 41 for magnifying and observing the wiring pattern of the multilayer interconnection board, a photographing device 44 for photographing the image magnified with the microscope and a display 50 for indicating the photographed image on a screen.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring pattern analyzing apparatus for a multilayer wiring board, and more particularly to a wiring pattern analyzing apparatus for analyzing a defect in a wiring pattern in a lower layer of the multilayer wiring board.

[0002]

2. Description of the Related Art Analysis of a defect on a wiring pattern of a conventional multilayer wiring board will be described with reference to FIGS. In this section, an analysis of a multilayer wiring board having four wiring patterns and one power supply layer will be described. First, in FIG. 5, the multilayer wiring board 10 includes a wiring pattern 121 of the fifth metal layer, a fourth wiring layer 121
Wiring pattern 122 of the second layer metal layer, power supply mesh 123 of the third layer metal layer, wiring pattern 12 of the second layer metal layer
4 and the wiring pattern 125 of the first metal layer are provided.

Next, the multi-layer wiring board 10 is added to the electric inspection device 80 for measuring electric resistance or electric capacity shown in FIG.
And the wiring patterns 121 of the fifth-layer metal layer, which are the wiring patterns of the surface layer, and the wiring patterns of the lower layers, which are connected to the wiring pattern of the surface layer, are the fourth, second and first wiring patterns.
Wiring patterns 122, 124 and 125 of the metal layer
An electrical inspection of the net having a wiring pattern consisting of and is performed, and for a wiring pattern having a defect such as an open or a short circuit that interferes with an electrical function, the net information is output by an output device 90 such as a printer device.

Next, the multilayer wiring board 10 to be measured
Is placed on the analysis stage 112 which is provided in the analysis device 110 for recognition of XY coordinates and can be moved manually, and the net information of the defective wiring pattern obtained through the output device 90 by the above-described electrical inspection is described. Based on the defective output sheet 100, the coordinates of the multilayer wiring substrate 10 are aligned with the position measured by the electrical inspection, and the microscope (for example, stereomicroscope, metallographic microscope, etc.) 111 is used, and the analysis stage 112 is manually moved. Then, the defective portion on the defective wiring pattern is searched, and the contents of the defective wiring pattern of the multilayer wiring board 10 are investigated and analyzed.

[0005]

In the above-described conventional wiring pattern analysis device for a multilayer wiring board, in order to insulate the surface layer and the lower layer from each other between the wiring pattern layer on the surface of the board and the lower wiring pattern layer. Since the insulating layers of are laminated, it is difficult to see the connection state of the wiring pattern of the lower layer, and it is difficult to confirm the wiring route.Opens or shorts that interfere with the electrical function on the wiring pattern of the lower layer If there is a problem with, it is easy to not detect them
There is a drawback that it becomes impossible to analyze.

[0006]

According to the present invention, there is provided an inspection device for outputting defect contents of a wiring pattern of a target multilayer wiring board and position information thereof, and an inspection device based on the outputted defect contents and position information thereof. In a wiring pattern analysis device for a multilayer wiring board, comprising: a microscope for enlarging and observing a defective portion of the wiring pattern, a storage means for storing wiring route information of a wiring pattern of the multilayer wiring board, and the multilayer wiring board A scanning stage that is placed and automatically scans the wiring pattern, a control unit that controls scanning of the scanning stage based on the wiring route information and the position information of the wiring pattern, and an enlarged image by the microscope is converted into a video signal. And a display means for displaying a screen. Further, the scanning speed of the scanning stage may be changed for each layer of the multilayer wiring board.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings. 2 is a top view showing a wiring pattern of a multilayer wiring board for explaining an embodiment of the present invention, and FIG. 3 is a diagram showing a cross section of FIG. 2 and an analysis outline of the wiring pattern. First, in explaining the present embodiment, in order to facilitate understanding of the description, the configuration of the multilayer wiring board to be analyzed will be described with reference to FIGS. 2 and 3.

2 and 3, the multilayer wiring board 10 is shown.
Is for laminating the wiring pattern 15 of the first-layer metal layer formed by electrolytic plating or the like on the ceramic wiring substrate 20 having the I / O (input / output) connector pins 30, and then connecting the wiring patterns. First insulating layer 19 having insulating vias 10a is laminated, and subsequently, similarly, the wiring pattern 14, the second insulating layer 18, the power supply mesh 13, the third insulating layer of the third layer metal layer of the second layer metal layer. 17, a wiring pattern 12 of a fourth-layer metal layer, a fourth insulating layer 16, and a wiring pattern 11 of a fifth-layer metal layer, which are formed in this order to form a four-layer wiring pattern, one power supply layer, and four layers And an insulating layer.

FIG. 1 is a block diagram showing an embodiment of the wiring pattern analyzing apparatus of the present invention. In this embodiment, as shown in FIG. 1, an electric inspection device 60 having an electric inspection probe 61 for inspecting an electric function of a wiring pattern of a multilayer wiring board, a probing transfer 62, and an electric inspection stage 63 is used. The electric resistance and the electrostatic capacitance of the wiring pattern of the multilayer wiring board 10 are measured to detect a wiring pattern having a defect such as disconnection or short circuit on the wiring pattern of the multilayer wiring board 10.

A computer (for example, EWS) that stores the wiring information of the target multi-layer wiring board 10 including the electrical defect information of the defective wiring pattern detected by the electrical inspection apparatus 60 and the data of the measurement position thereof. Or a personal computer) 70, and the computer 70 processes connection information such as a wiring route of a wiring pattern extending over multiple layers as coordinate data. Then, the coordinate data of the wiring route of the processed wiring pattern is sent to the automatic scanning control device 43 provided in the analysis table 40.

The target multilayer wiring board 10 is placed on the automatic scanning stage 42, and the automatic scanning stage 42 is scanned. The automatic scanning stage 42 is controlled by an automatic scanning control device 43 which recognizes the wiring route of the defective wiring pattern of the multilayer wiring board 10 as coordinate data. As a result, the automatic scanning stage 42 can scan the wiring route of the defective wiring pattern detected by the electrical inspection device 60. That is, not only the wiring pattern 11 of the fifth-layer metal layer wired in the surface layer, but also the wiring pattern 12 of the fourth-layer metal layer, the wiring pattern 14 of the second-layer metal layer connected in the lower layer, and It is possible to automatically scan the wiring pattern 15 of the first metal layer.

As a result, the multilayer wiring board 10 installed on the automatic scanning stage 42 is scanned by the microscope 41 installed on the analysis table 40 over the wiring pattern of each defective layer, and the wiring of the wiring pattern can be seen from the appearance. You can check the route. Further, the enlarged image on the microscope 41 is converted into a video signal by the photographing device 44 attached to the microscope 41 and displayed as an image on the display device 50.

The scanning speed of the automatic scanning stage 42 can be set by the automatic scanning control device 43 and can be changed. Therefore, the scanning speed on the wiring pattern 11 of the fifth metal layer of the surface layer may be set to be higher than the scanning speed on the wiring pattern of the lower layer because the wiring pattern can be easily recognized.

For example, the scanning speed on the wiring pattern 11 of the fifth metal layer of the surface layer is 1 mm / sec, and 0.7 mm / sec when scanning on the wiring pattern 12 of the lower fourth metal layer. And the wiring pattern 1 of the second metal layer
4 is 0.5 mm / sec when scanning, and 0.3 mm when scanning the wiring pattern 15 of the first metal layer.
/ Sec. This makes it possible to more carefully inspect the lower-layer wiring pattern that is difficult to recognize.

[0015]

As described above, according to the present invention, not only is the wiring pattern wired in the surface layer analyzed, but the wiring route information of the wiring pattern of the target multilayer wiring board is recognized. Since the scanning speed can be changed while automatically scanning the wiring pattern, it is possible to quickly and easily analyze the problems such as disconnection and short circuit that occurred in the lower layer wiring pattern of the multilayer wiring board which is difficult to analyze in the past. The effect is that you can do it.

[Brief description of drawings]

FIG. 1 is a block diagram showing the configuration of an embodiment of the present invention.

FIG. 2 is a top view showing an example of a wiring pattern of a multilayer wiring board for explaining the present embodiment.

FIG. 3 is a diagram showing an outline of analysis of a cross section and a wiring pattern of FIG.

FIG. 4 is a block diagram showing an example of a conventional wiring pattern analysis device.

FIG. 5 is a top view showing an example of a wiring pattern of a multilayer wiring board for explaining a conventional example.

[Explanation of symbols]

 10 Multilayer Wiring Board 10a Insulated Vias 11,121 Wiring Pattern of Fifth Layer Metal Layer 12,122 Wiring Pattern of Fourth Layer Metal Layer 13,123 Power Supply Mesh of Third Layer Metal Layer 14,124 Wiring of Second Layer Metal Layer Pattern 15, 125 Wiring pattern of first layer metal layer 16 Fourth insulating layer 17 Third insulating layer 18 Second insulating layer 19 First insulating layer 20 Ceramic wiring board 30 I / O connector pin 40 Analyzing table 41, 111 Microscope 42 Automatic scanning stage 43 Automatic scanning control device 44 Imaging device 50 Display device 60,80 Electrical inspection device 61 Electrical inspection probe 62 Probing transfer 63 Electrical inspection stage 70 Computer 90 Output device 100 Failure output paper 110 Analysis device 112 Analysis stage

Claims (2)

[Claims] 1. An inspection device for outputting a defect content of a wiring pattern of a target multilayer wiring board and position information thereof, and a defect portion of the wiring pattern enlarged on the basis of the outputted defect content and position information thereof. In a wiring pattern analysis device for a multilayer wiring board equipped with a microscope for observing,
Storage means for storing wiring route information of the wiring pattern of the multilayer wiring board, a scanning stage for mounting the multilayer wiring board and automatically scanning the wiring pattern, wiring route information and position information of the wiring pattern A wiring pattern analysis device for a multilayer wiring board, comprising: a control means for controlling scanning of the scanning stage based on the above, and a display means for converting an enlarged image by the microscope into a video signal and displaying it on a screen. 2. The wiring pattern analysis device for a multilayer wiring board according to claim 1, wherein the scanning speed of the scanning stage is variable for each layer of the multilayer wiring board.