JPH07117432B2 - Method of manufacturing composite sensor - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a one-chip (integrated type) composite sensor applied to an environment measurement sensor of an air conditioner product.

[0002]

2. Description of the Related Art A composite sensor in which a polymer material and a metal material are combined is manufactured by using a planar technique such as semiconductor manufacturing.

In the conventional manufacturing process procedure, as shown in FIG. 5, a thin film electrical resistance sensor 12 made of a metal material is patterned on a substrate of a sensor chip 11 by sputter deposition and wet processing (see FIG. 5A). Then, the thin film capacitance sensor 13 is formed on the substrate by spin coating, dry processing, and sputter deposition to form a pattern (see FIG. 5).
Then, in order to make the sensor function of 12 multifunctional, the substrate under the thin film electrical resistance sensor 12 was partially etched using a chemical solution (FIG. 5).
(See (c)).

The process flow is shown in FIG. That is, conventionally, the thin film electrical resistance sensor 12 is formed in 100 steps (wet process), the thin film capacitance sensor 13 is formed in 102 step (dry process), and the portion of the substrate made of the chemical solution is formed in 101 step (wet process). Etching was performed.

[0005]

However, in the conventional process procedure as described above, when the sensor substrate etching step causes a crack in a part of the substrate due to a manufacturing error as shown in FIG. That sensor, like the capacitance sensor 13a, has been wiped out. In addition, the thin film capacitance sensor 13 is eroded by the chemical solution when the substrate is etched,
Performance deterioration was observed.

The present invention has been made in view of the above points, and it is an object of the present invention to provide a method of manufacturing a composite sensor capable of completely preventing other influences even if a substrate crack occurs due to a manufacturing error. To aim.

[0007]

The present invention is a method for manufacturing a composite sensor in which a polymer material and a metal material are combined, the manufacturing process procedure is changed, and after patterning a thin film electrical resistance sensor on a substrate, By etching the substrate with a chemical solution and then forming a pattern on the thin film capacitance sensor, erosion by the etching liquid of the thin film capacitance sensor and deterioration of the performance of the sensor against the occurrence of cracks during the substrate etching process It is something that I tried to lose.

[0008]

According to the manufacturing method of the present invention as described above, even if some mistakes occur in the etching process of the sensor substrate, which is prone to manufacturing errors, the thin film capacitance which is easily eroded by the chemical used for the processing. The failure of the sensor can be completely prevented, and the sensor manufacturing yield can be improved accordingly.

[0009]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 3 shows the structure of the sensor substrate of each manufacturing unit. In FIG. 3, reference numeral 10 denotes the entire sensor substrate, and the manufacturing process proceeds in this unit. One of the sensor substrates is the sensor chip 11, and FIG. 1 and FIG. 2 show the manufacturing process procedure for the AA ′ cross section.

That is, the manufacturing method of the present invention is as follows:
In step 00 (wet process), the sensor material (metal material) of the thin film electrical resistance sensor 12 (air flow sensor or radiation sensor) is sputter-deposited on the substrate of the sensor chip 11.
A pattern is formed by chemical solution processing (wet processing) (see FIG. 1A). Next, in step 101 (wet process), the substrate below the sensor chip 11 is partially etched using a chemical solution (see FIG. 1B).
After the substrate etching process, in a 102 step (dry process), the sensor material (polymer material) of the thin film capacitance sensor 13 is spin-coated, and a pattern is formed by non-chemical solution processing (dry processing) to form a composite sensor. To manufacture.

In this example, reactive ion etching was performed as a dry processing method. Also,
Titanium was used as the metal material for the thin film electrical resistance sensor 12, and polyimide was used as the polymer material for the thin film capacitance sensor 13.

Thus, by forming the thin film capacitance sensor 13 after etching the substrate with the chemical solution, as shown in FIG. 4, even if the substrate is cracked due to a manufacturing error (FIG. 4).
(Refer to (b)), but it is possible to stop the trouble only at the cracked portion, and to completely prevent the influence on others (refer to FIG. 4 (c)). As a result, it is possible to prevent erosion of the thin-film capacitance sensor due to the etching solution and deterioration of the performance of the sensor against the occurrence of cracks during the substrate etching process.

[0014]

As described above, according to the present invention, in a method of manufacturing a composite sensor in which a polymer material and a metal material are combined, even if a substrate is cracked due to a manufacturing error, only the cracked portion is defective. , Can completely prevent the influence on others. Therefore, the sensor manufacturing yield is improved, and the sensor price can be kept low.

Furthermore, it is not necessary to change the conditions and the like by simply changing the procedure of the manufacturing process up to now, and a jig or the like for covering the sensor part is not necessary, which has the advantage of cost reduction.

[Brief description of drawings]

FIG. 1 is a sectional view for explaining a manufacturing method according to an embodiment of the present invention.

FIG. 2 is a flowchart for explaining the manufacturing method of the embodiment.

FIG. 3 is a diagram showing a configuration of a substrate of a manufacturing unit.

FIG. 4 is a view showing a cracked state of a substrate when the manufacturing method of the present invention is used.

FIG. 5 is a sectional view for explaining a conventional manufacturing method.

FIG. 6 is a flowchart for explaining a conventional manufacturing method.

FIG. 7 is a view showing a cracked state of a substrate when a conventional manufacturing method is used.

[Explanation of symbols]

Reference numeral 10 ... Sensor substrate, 11 ... Sensor chip, 12 ... Thin film electrical resistance sensor, 13 ... Thin film capacitance sensor, 13a ... Corroded thin film capacitance sensor.

Claims (1)

[Claims] 1. A method of manufacturing a composite sensor in which a polymer material and a metal material are combined, wherein a thin film electrical resistance sensor made of a metal material is patterned on a substrate, and then the substrate below the thin film electrical resistance sensor is chemically treated. And forming a thin film capacitance sensor made of a polymer material on the substrate by dry processing.