JPH0711363A - High strength and high conductivity copper alloy member and its production - Google Patents
High strength and high conductivity copper alloy member and its productionInfo
- Publication number
- JPH0711363A JPH0711363A JP15838493A JP15838493A JPH0711363A JP H0711363 A JPH0711363 A JP H0711363A JP 15838493 A JP15838493 A JP 15838493A JP 15838493 A JP15838493 A JP 15838493A JP H0711363 A JPH0711363 A JP H0711363A
- Authority
- JP
- Japan
- Prior art keywords
- copper alloy
- copper
- matrix
- conductivity
- strength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 21
- 238000004519 manufacturing process Methods 0.000 title claims description 3
- 239000010949 copper Substances 0.000 claims abstract description 24
- 230000032683 aging Effects 0.000 claims abstract description 14
- 239000011159 matrix material Substances 0.000 claims abstract description 10
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 9
- 239000000956 alloy Substances 0.000 claims abstract description 9
- 238000005482 strain hardening Methods 0.000 claims abstract description 8
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 6
- 239000000243 solution Substances 0.000 claims abstract description 6
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 6
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 6
- 239000006104 solid solution Substances 0.000 claims abstract description 5
- 239000002994 raw material Substances 0.000 claims abstract 2
- 239000000654 additive Substances 0.000 claims description 10
- 230000000996 additive effect Effects 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 abstract description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 9
- 229910000765 intermetallic Inorganic materials 0.000 abstract description 4
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 238000005219 brazing Methods 0.000 description 2
- 238000004881 precipitation hardening Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000013585 weight reducing agent Substances 0.000 description 2
- 229910019580 Cr Zr Inorganic materials 0.000 description 1
- 229910019817 Cr—Zr Inorganic materials 0.000 description 1
- 238000010273 cold forging Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Conductive Materials (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は電気・電子機器などに用
いられる鍛造性の良好な高強度・高導電性銅合金部材及
びその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-strength, high-conductivity copper alloy member having good forgeability, which is used in electric and electronic devices, etc.
【０００２】[0002]
【従来の技術】近年、電気・電子機器用部材に関して
は、小型・軽量化及び低価格化がますます要求されてき
ている。この分野で用いられる銅合金部材に関しても、
銅が本来的に持っている優れた導電性（熱伝導性）、冷
間鍛造性、ろう付け性、はんだ付け性などを失わずに、
高い強度（硬さで代表される耐力）を与えるという要求
が非常に強くなってきている。2. Description of the Related Art In recent years, there has been an increasing demand for downsizing, weight reduction, and cost reduction of members for electric and electronic equipment. Regarding copper alloy members used in this field,
Without losing the excellent electrical conductivity (heat conductivity), cold forgeability, brazeability, solderability, etc. that copper originally has,
The demand for giving high strength (proof strength represented by hardness) is becoming very strong.
【０００３】このような銅合金部材として、Ｃｒ銅、Ｚ
ｒ銅、Ｃｒ−Ｚｒ銅、Ｔｉ銅などの析出硬化型銅合金が
一般的に知られている。これらの銅合金部材は、溶体化
処理及び冷間加工を行った後、一段時効処理を行うこと
により製造されている。しかし、従来の銅合金部材で
は、高強度と高導電性とを同時に満たすことは困難であ
った。As such a copper alloy member, Cr copper, Z
Precipitation hardening type copper alloys such as r-copper, Cr-Zr copper, and Ti copper are generally known. These copper alloy members are manufactured by performing a solution heat treatment and cold working, and then performing a one-step aging treatment. However, it has been difficult for a conventional copper alloy member to simultaneously satisfy high strength and high conductivity.
【０００４】[0004]
【発明が解決しようとする課題】本発明は、銅が本来的
に持っている優れた導電性（熱伝導性）、冷間鍛造性、
ろう付け性、はんだ付け性などを失わずに、高い強度を
持った電気・電子機器用の銅合金部材を提供することを
目的とする。DISCLOSURE OF THE INVENTION The present invention provides excellent electrical conductivity (thermal conductivity) inherent in copper, cold forgeability,
It is an object of the present invention to provide a copper alloy member for electric / electronic devices having high strength without losing brazing property and soldering property.
【０００５】[0005]
【課題を解決するための手段と作用】本発明の高強度・
高導電性銅合金部材は、Ｃｒ，Ｚｒ，Ｔｉからなる群よ
り選択される少なくとも１種の元素０．１〜１．５重量
％を含み、残部がＣｕからなる組成を有し、Ｃｕマトリ
ックス中に金属間化合物が析出した合金であって、前記
Ｃｕマトリックスへの添加元素の固溶量が合金全体への
添加元素の添加量の１／２以下であることを特徴とする
ものである。[Means and Actions for Solving the Problems] High strength of the present invention
The high-conductivity copper alloy member has a composition containing 0.1 to 1.5% by weight of at least one element selected from the group consisting of Cr, Zr, and Ti, with the balance being Cu, In the alloy in which the intermetallic compound is precipitated, the solid solution amount of the additive element in the Cu matrix is 1/2 or less of the additive amount of the additive element in the entire alloy.
【０００６】本発明の高強度・高導電性銅合金部材の製
造方法は、Ｃｒ，Ｚｒ，Ｔｉからなる群より選択される
少なくとも１種の元素０．１〜１．５重量％を含み、残
部がＣｕからなる原料を、溶体化処理及び冷間加工を行
った後、二段以上の時効処理を行うことを特徴とするも
のである。The method for producing a high-strength, high-conductivity copper alloy member of the present invention contains 0.1 to 1.5% by weight of at least one element selected from the group consisting of Cr, Zr and Ti, and the balance. Is subjected to solution treatment and cold working, and then subjected to two or more stages of aging treatment.
【０００７】以下、本発明に係る高強度・高導電性銅合
金部材について、さらに詳細に説明する。本発明におい
て、Ｃｒ，Ｚｒ，Ｔｉからなる群より選択される少なく
とも１種の元素の添加量については、０．１重量％未満
では強度が不足し、一方１．５重量％を超えると熱間加
工性が劣化する。これらの添加元素の添加量は、０．５
〜１．０重量％であることがより好ましい。The high-strength, high-conductivity copper alloy member according to the present invention will be described in more detail below. In the present invention, when the amount of at least one element selected from the group consisting of Cr, Zr, and Ti is less than 0.1% by weight, the strength is insufficient, while when it exceeds 1.5% by weight, the hot workability increases. Workability deteriorates. The amount of addition of these additional elements is 0.5
It is more preferable that the content is ˜1.0 wt%.
【０００８】本発明に係る銅合金部材は、強度及び導電
性を調整するために、さらにＳｉ，Ｇｅ，Ｆｅ，Ｃｏ，
Ｙからなる群より選択される少なくとも１種の元素を
０．００５〜０．８重量％含んでいてもよい。これらの
元素の添加量については、０．００５重量％未満では添
加の効果が得られず、一方０．８重量％を超えると導電
率が低下する。本発明の銅合金部材には、以上の各元素
のほかに不可避の不純物も含まれる。The copper alloy member according to the present invention further comprises Si, Ge, Fe, Co, in order to adjust strength and conductivity.
It may contain 0.005 to 0.8% by weight of at least one element selected from the group consisting of Y. Regarding the addition amount of these elements, if the addition amount is less than 0.005% by weight, the effect of the addition is not obtained, while if it exceeds 0.8% by weight, the conductivity decreases. The copper alloy member of the present invention contains inevitable impurities in addition to the above elements.
【０００９】本発明において、溶体化処理の条件は９０
０〜９７０℃であることが好ましい。温度が９００℃未
満では、時効処理後の強度が不足する。一方、９７０℃
を超えると長時間の処理によって結晶粒界に添加元素が
凝縮するため、好ましくない。具体的には、９３０〜９
６０℃で１時間加熱した後、水冷して急冷することがよ
り好ましい。In the present invention, the solution treatment condition is 90.
It is preferably 0 to 970 ° C. When the temperature is lower than 900 ° C, the strength after aging treatment is insufficient. On the other hand, 970 ° C
If it exceeds, the additive element is condensed at the crystal grain boundaries by the treatment for a long time, which is not preferable. Specifically, 930-9
It is more preferable to heat at 60 ° C. for 1 hour and then cool with water to quench.
【００１０】本発明において、冷間加工（冷間鍛造）の
加工率は２０〜９９％であることが好ましい。加工率が
２０％未満では時効処理後の強度が不足し、一方９９％
を超える冷間加工は困難である。加工率は４０〜８０％
であることがより好ましい。In the present invention, the working rate of cold working (cold forging) is preferably 20 to 99%. If the processing rate is less than 20%, the strength after aging treatment is insufficient, while 99%
It is difficult to cold work above. Processing rate is 40-80%
Is more preferable.
【００１１】本発明において、時効処理は、二段以上行
われる。第一段の時効処理は４００〜５００℃で行うこ
とが好ましい。また、第二段の時効処理を第一段の時効
処理より１０〜１００℃高い温度で行う。この温度差が
低すぎると強度及び導電率の向上が期待できない。一
方、温度差が高すぎると、導電率は向上するが、強度が
低下する。In the present invention, the aging treatment is performed in two or more stages. The first-stage aging treatment is preferably performed at 400 to 500 ° C. Further, the second-step aging treatment is performed at a temperature higher by 10 to 100 ° C. than the first-step aging treatment. If this temperature difference is too low, improvement in strength and conductivity cannot be expected. On the other hand, when the temperature difference is too high, the conductivity is improved but the strength is decreased.
【００１２】本発明においては、第一段の時効処理と第
二段の時効処理との間に、冷間加工を行ってもよい。こ
のときの加工率は２０〜９８％であることが好ましい。
加工率が２０％未満では時効処理後の強度が不足し、一
方９８％を超える冷間加工は困難である。In the present invention, cold working may be performed between the first stage aging treatment and the second stage aging treatment. The processing rate at this time is preferably 20 to 98%.
If the working ratio is less than 20%, the strength after aging treatment is insufficient, while cold working exceeding 98% is difficult.
【００１３】以上のような方法によって得られる本発明
の銅合金部材は、Ｃｕマトリックス中に金属間化合物が
析出した、いわゆる析出硬化型の合金である。そして、
Ｃｕマトリックスへの添加元素の固溶量が合金全体への
添加元素の添加量の１／２以下となっている。この値
は、２／５以下であることがより好ましい。The copper alloy member of the present invention obtained by the above method is a so-called precipitation hardening type alloy in which an intermetallic compound is precipitated in a Cu matrix. And
The solid solution amount of the additional element in the Cu matrix is 1/2 or less of the addition amount of the additional element in the entire alloy. This value is more preferably 2/5 or less.
【００１４】このことは、本発明の銅合金部材は従来の
ものと比較して、Ｃｕマトリックスの純度が非常に高い
ことを意味している。したがって、本発明の銅合金部材
は、銅が本来的に持っている優れた導電性などの特性を
失わずに、金属間化合物の析出に起因する高い強度を有
する。This means that the copper alloy member of the present invention has a very high purity of the Cu matrix as compared with the conventional one. Therefore, the copper alloy member of the present invention has high strength due to precipitation of intermetallic compounds without losing properties such as excellent conductivity inherently possessed by copper.
【００１５】[0015]
【実施例】以下、本発明の実施例を説明する。表１及び
表２に示すような組成を有する４０ｍｍ径のインゴット
を溶製した。各インゴットを８００℃で熱間加工を行
い、３ｍｍ厚の板を作製した。得られた板を９５０℃で
１時間加熱して溶体化処理した後、水冷した。さらに、
表１及び表２に示すように、冷間加工及び時効処理を施
した。EXAMPLES Examples of the present invention will be described below. A 40 mm diameter ingot having the composition shown in Table 1 and Table 2 was melted. Each ingot was hot worked at 800 ° C. to produce a plate having a thickness of 3 mm. The obtained plate was heated at 950 ° C. for 1 hour for solution treatment, and then cooled with water. further,
As shown in Table 1 and Table 2, cold working and aging treatment were performed.
【００１６】得られた各試料について、合金全体への添
加元素の添加量に対するＣｕマトリックスへの添加元素
の固溶量の割合、ビッカース硬さＨｖ、導電率（％ＩＡ
ＣＳ）、及びビッカース硬さＨｖと導電率（％ＩＡＣ
Ｓ）とを掛け合わせたｆ値を調べた結果を併記する。For each of the obtained samples, the ratio of the solid solution amount of the additive element to the Cu matrix to the additive amount of the additive element to the entire alloy, Vickers hardness Hv, and conductivity (% IA)
CS), Vickers hardness Hv and conductivity (% IAC
The results of examining the f value by multiplying with S) are also shown.
【００１７】表１及び表２から明らかなように、本発明
に係る銅合金部材（試料６〜２０）は従来のもの（試料
１〜６）と比較して、硬さ及び導電率がともに向上し、
ｆ値が改善されている。As is clear from Tables 1 and 2, the copper alloy members according to the present invention (Samples 6 to 20) have improved hardness and conductivity as compared with the conventional ones (Samples 1 to 6). Then
The f-value is improved.
【００１８】[0018]
【表１】 [Table 1]
【００１９】[0019]
【表２】 [Table 2]
【００２０】[0020]
【発明の効果】以上説明したように本発明によれば、銅
が本来的に持っている優れた導電性（熱伝導性）、冷間
鍛造性、ろう付け性、はんだ付け性などを失わずに、高
い強度を持った電気・電子機器用の銅合金部材を提供で
き、小型・軽量化及び低価格化を達成できる。As described above, according to the present invention, the excellent electrical conductivity (heat conductivity), cold forgeability, brazing property, solderability, etc. inherently possessed by copper are not lost. In addition, it is possible to provide a copper alloy member for electric and electronic devices having high strength, and it is possible to achieve size reduction, weight reduction, and cost reduction.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 菅井 普三 神奈川県横浜市磯子区新杉田町８番地 株 式会社東芝横浜事業所内 (72)発明者 中島 信昭 神奈川県横浜市磯子区新杉田町８番地 株 式会社東芝横浜事業所内 (72)発明者 廣井 光正 神奈川県横浜市磯子区新杉田町８番地 株 式会社東芝横浜事業所内 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Fuzo Sugai, 8 Shinsita-cho, Isogo-ku, Yokohama-shi, Kanagawa Stock company, Toshiba Yokohama Works (72) Inventor Nobuaki Nakajima 8th, Shinsugita-cho, Isogo-ku, Yokohama, Kanagawa (72) Inventor Mitsumasa Hiroi 8 Shinsita-cho, Isogo-ku, Yokohama-shi, Kanagawa Stock company Toshiba Yokohama-office
Claims (2)
れる少なくとも１種の元素０．１〜１．５重量％を含
み、残部がＣｕからなる組成を有し、Ｃｕマトリックス
中に金属間化合物が析出した合金であって、前記Ｃｕマ
トリックスへの添加元素の固溶量が合金全体への添加元
素の添加量の１／２以下であることを特徴とする高強度
・高導電性銅合金部材。1. A composition containing 0.1 to 1.5% by weight of at least one element selected from the group consisting of Cr, Zr, and Ti, with the balance being Cu, and having an intermetallic composition in a Cu matrix. A high-strength, high-conductivity copper alloy, which is an alloy in which a compound is precipitated, and the solid solution amount of the additive element to the Cu matrix is 1/2 or less of the additive amount of the additive element to the entire alloy Element.
れる少なくとも１種の元素０．１〜１．５重量％を含
み、残部がＣｕからなる原料を、溶体化処理及び冷間加
工を行った後、二段以上の時効処理を行うことを特徴と
する高強度・高導電性銅合金部材の製造方法。2. A raw material containing 0.1 to 1.5% by weight of at least one element selected from the group consisting of Cr, Zr and Ti, and the balance being Cu, is subjected to solution treatment and cold working. A method for producing a high-strength, high-conductivity copper alloy member, characterized by performing two or more steps of aging treatment after the treatment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15838493A JPH0711363A (en) | 1993-06-29 | 1993-06-29 | High strength and high conductivity copper alloy member and its production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15838493A JPH0711363A (en) | 1993-06-29 | 1993-06-29 | High strength and high conductivity copper alloy member and its production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0711363A true JPH0711363A (en) | 1995-01-13 |
Family
ID=15670547
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15838493A Pending JPH0711363A (en) | 1993-06-29 | 1993-06-29 | High strength and high conductivity copper alloy member and its production |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0711363A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1582602A2 (en) * | 2004-03-29 | 2005-10-05 | Ngk Insulators, Ltd. | Copper alloy and copper alloy manufacturing method |
| KR100879210B1 (en) * | 2004-06-22 | 2009-01-16 | 현대중공업 주식회사 | Manufacturing method of chrome copper contact tip with high temperature wear resistance |
| WO2012132765A1 (en) * | 2011-03-28 | 2012-10-04 | Jx日鉱日石金属株式会社 | Cu-si-co-base copper alloy for electronic materials and method for producing same |
| CN104137191A (en) * | 2011-12-28 | 2014-11-05 | 矢崎总业株式会社 | Ultrafine conductor material, ultrafine conductor, method for preparing ultrafine conductor, and ultrafine electrical wire |
| US9476109B2 (en) | 2010-03-31 | 2016-10-25 | Jx Nippon Mining & Metals Corporation | Cu—Ni—Si—Co copper alloy for electronic material and process for producing same |
| US9490039B2 (en) | 2011-03-29 | 2016-11-08 | Jx Nippon Mining & Metals Corporation | Strip of Cu—Co—Si-based copper alloy for electronic materials and the method for producing the same |
| CN111197127A (en) * | 2018-11-19 | 2020-05-26 | 财团法人工业技术研究院 | Copper-zirconium alloy heat dissipation element and manufacturing method of copper-zirconium alloy shell |
-
1993
- 1993-06-29 JP JP15838493A patent/JPH0711363A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1582602A2 (en) * | 2004-03-29 | 2005-10-05 | Ngk Insulators, Ltd. | Copper alloy and copper alloy manufacturing method |
| EP1582602A3 (en) * | 2004-03-29 | 2009-01-21 | Ngk Insulators, Ltd. | Copper alloy and copper alloy manufacturing method |
| US9777348B2 (en) | 2004-03-29 | 2017-10-03 | Akihisa Inoue | Copper alloy and copper alloy manufacturing method |
| KR100879210B1 (en) * | 2004-06-22 | 2009-01-16 | 현대중공업 주식회사 | Manufacturing method of chrome copper contact tip with high temperature wear resistance |
| US9476109B2 (en) | 2010-03-31 | 2016-10-25 | Jx Nippon Mining & Metals Corporation | Cu—Ni—Si—Co copper alloy for electronic material and process for producing same |
| WO2012132765A1 (en) * | 2011-03-28 | 2012-10-04 | Jx日鉱日石金属株式会社 | Cu-si-co-base copper alloy for electronic materials and method for producing same |
| JP2012201977A (en) * | 2011-03-28 | 2012-10-22 | Jx Nippon Mining & Metals Corp | Cu-Si-Co-BASED COPPER ALLOY FOR ELECTRONIC MATERIAL AND METHOD FOR PRODUCING THE SAME |
| US9478323B2 (en) | 2011-03-28 | 2016-10-25 | Jx Nippon Mining & Metals Corporation | Cu—Si—Co-based copper alloy for electronic materials and method for producing the same |
| US9490039B2 (en) | 2011-03-29 | 2016-11-08 | Jx Nippon Mining & Metals Corporation | Strip of Cu—Co—Si-based copper alloy for electronic materials and the method for producing the same |
| CN104137191A (en) * | 2011-12-28 | 2014-11-05 | 矢崎总业株式会社 | Ultrafine conductor material, ultrafine conductor, method for preparing ultrafine conductor, and ultrafine electrical wire |
| CN111197127A (en) * | 2018-11-19 | 2020-05-26 | 财团法人工业技术研究院 | Copper-zirconium alloy heat dissipation element and manufacturing method of copper-zirconium alloy shell |
| CN111197127B (en) * | 2018-11-19 | 2021-03-05 | 财团法人工业技术研究院 | Copper-zirconium alloy heat dissipation element and copper-zirconium alloy shell manufacturing method |
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