JPH07106787A - Shielding device of flexible printed wiring board - Google Patents

Shielding device of flexible printed wiring board

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Publication number
JPH07106787A
JPH07106787A JP26408293A JP26408293A JPH07106787A JP H07106787 A JPH07106787 A JP H07106787A JP 26408293 A JP26408293 A JP 26408293A JP 26408293 A JP26408293 A JP 26408293A JP H07106787 A JPH07106787 A JP H07106787A
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JP
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Application
Patent type
Prior art keywords
insulating film
shield
formed
hole
hole portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP26408293A
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Japanese (ja)
Other versions
JP3070358B2 (en )
Inventor
Teigen Ri
Shoichi Shimizu
廷原 李
正一 清水
Original Assignee
Fuji Xerox Co Ltd
富士ゼロックス株式会社
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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, and noise or electromagnetic interference
    • H05K1/0218Reduction of cross-talk, and noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038Through-connections or via connections
    • H05K3/4053Through-connections or via connections by thick-film techniques
    • H05K3/4069Through-connections or via connections by thick-film techniques for via connections in organic insulating substrates

Abstract

PURPOSE: To shield electromagnetic disturbing waves by constituting a laminated structure by putting a first insulating film on which a wiring pattern is formed between a second and third insulating films on which shielding patterns are respectively formed.
CONSTITUTION: Signal lines formed on a first insulating film are put between shielding lines 12 formed on the same film 10 in the lateral direction and between a second and third insulating films 20 and 30 in the vertical direction. Since the lines 12, film 20, and a shielding pattern 31 formed on the film 30 are electrically connected to each other through a conductive material 40 filling a first and second hole sections 13 and 22 and a plurality of hole sections 13 and 22 are formed along the length direction of the lines 12, the signal lines 11 are equivalently surround by shielding layers and the lines 11 are isolated not only from each other, but also from the outside.
COPYRIGHT: (C)1995,JPO

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【産業上の利用分野】本発明は、電気機器等の接続に際して使用されるフレキシブル印刷配線板のシールド装置の構造に関する。 The present invention relates to a structure of a flexible printed wiring board of the shield device used upon connection of electric appliances.

【0002】 [0002]

【従来の技術】フレキシブル印刷配線板については、内部の信号回路を電磁妨害波等のノイズから保護するためのシールド構造が採用されていた。 The Background of the Invention Flexible printed wiring board, a shield structure for protecting the interior of the signal circuit from the noise such as electromagnetic interference has been adopted. フレキシブル印刷配線板のシールド装置は、図3に示すように、絶縁フィルム1上に長手方向に沿って信号線2及び接地線3を形成し、絶縁フィルム1の側方に形成された延長部4に前記接地線3と接続されるシールドパターン5を形成している。 The flexible printed wiring board of the shield apparatus, as shown in FIG. 3, the insulating film 1 in the longitudinal direction to form a signal line 2 and the ground line 3 on the extension portion 4 formed on the side of the insulating film 1 wherein forming the shield pattern 5 which is connected to the ground line 3. そして、図4に示すように、信号線2を包み込むように延長部4を折曲させて巻回し、両面テープ6等の接着剤を巻回接着させてシールド構造を形成していた(特開昭62−269389号公報参照)。 Then, as shown in FIG. 4, turn bent so by winding the extension 4 in such a manner as to wrap the signal line 2 and to form a shield structure of an adhesive such as a double-sided tape 6 is adhered winding (JP Akira see Japanese Unexamined Patent Publication No. 62-269389).

【0003】 [0003]

【発明が解決しようとする問題点】上記フレキシブル印刷配線板のシールド構造によれば、信号線2全体をシールドパターン5で包み込む構造であるので、外部から信号線2に侵入するノイズを遮断し、また、信号線2からのノイズが外部へ放射することを遮断している。 THE INVENTION Problems to be Solved point] According to shield structure of the flexible printed wiring board, since it is the enclosing structure the whole signal line 2 by the shield pattern 5, cuts off the noise entering from the outside to the signal line 2, also it blocked that noise from the signal line 2 is radiated to the outside. しかしながら、各信号線同士についてのノイズの干渉については、何等対策が取られておらず、隣接する信号線からの影響を受けるという問題点があった。 However, for interference noise for each signal line to each other, whatever measures are not taken, there is a problem that affected from the adjacent signal line.

【0004】本発明は上記実情に鑑みてなされたもので、フレキシブル印刷配線板の周辺に位置する電気機器からの電磁妨害波をシールド可能とするとともに、複数の信号線同士のノイズの干渉を防止することができるフレキシブル印刷配線板のシールド装置を提供することを目的とする。 [0004] The present invention has been made in view of the above, as well as the electromagnetic interference from electrical equipment located around the flexible printed wiring board possible shield, preventing interference noise among the plurality of signal lines and to provide a shielding device of a flexible printed wiring board can be.

【0005】 [0005]

【課題を解決するための手段】上記従来例の問題点を解決するため請求項1のフレキシブル印刷配線板のシールド装置は、信号線とこの信号線を挟むシールド線とを有する配線パターンを形成した第1の絶縁フィルムを、前記配線パターンを覆う面積を有するシールドパターンを形成した第2の絶縁フィルム及び第3の絶縁フィルムで挟んだ積層構造を有している。 SUMMARY OF THE INVENTION The above conventional shielding device of a flexible printed wiring board according to claim 1 for solving the problems is to form a wiring pattern and a shield line sandwiching the signal line and the signal line a first insulating film, a second insulating film and the laminated structure sandwiched between the third insulating film to form a shield pattern having an area that covers the wiring pattern. そして、前記シールド線の長手方向に沿って複数の第1孔部を第1の絶縁フィルムに穿孔し、第1の絶縁フィルム上に積層される第2の絶縁フィルムの前記第1孔部に対応する位置に第2孔部を穿孔する。 Then, corresponding to the along the longitudinal direction of the shielded wire and drilling a plurality of first holes in the first insulating film, the first hole of the second insulating film laminated on the first insulating film on the drilling a second hole at a position. また、第1孔部の開口面積より第2孔部の開口面積を大きくし形成し、第1孔部及び第2孔部に導電性材料を充填することにより、前記シールド線と第2 Further, by making the opening area of ​​the first hole portion opening area of ​​the second hole to form large, filled with a conductive material in the first hole and the second hole portion, the shield line and the second
の絶縁フィルム及び第3の絶縁フィルムに形成したシールドパターンとを電気的に接続する。 Insulating film and a shield pattern formed on the third insulating film to electrically connect.

【0006】 [0006]

【作用】本発明のフレキシブル印刷配線板のシールド装置によれば、第1の絶縁フィルム上に形成された信号線は同一絶縁フィルム上に形成されるシールド線で挟むように構成され、また、上下方向については第2の絶縁フィルム及び第3の絶縁フィルムに形成されたシールドパターンで挟まれる。 According to the flexible printed wiring board of the shield apparatus of the present invention, the first insulating film on which is formed in the signal line is configured so as to sandwich with a shield line formed on the same insulating film, also, the upper and lower the direction is sandwiched between the shield pattern formed on the second insulating film and the third insulating film. 前記シールド線と第2の絶縁フィルム及び第3の絶縁フィルムに形成したシールドパターンとは、第1孔部及び第2孔部に充填された導電性材料により電気的に接続され、第1孔部及び第2孔部はシールド線の長手方向に沿って複数形成されているので、前記信号線は、等価的にシールド層で周囲を囲まれ、隣接する信号線との遮断及び外部との遮断を図ることができる。 Wherein the shield line and the second insulating film and the third insulating film to form the shield pattern, a conductive material filled in the first hole and the second hole portion are electrically connected, the first hole portion and since the second hole portion is formed with a plurality along the longitudinal direction of the shielded wire, the signal line is equivalently surrounded by a shielding layer, the blocking and blocking an external and adjacent signal lines it is possible to achieve.

【0007】 [0007]

【実施例】本発明にかかるフレキシブル印刷配線板のシールド装置の実施例について、図1及び図2を参照しながら説明する。 For the embodiment of the flexible printed wiring board of the shield apparatus according to the embodiment of the present invention will be described with reference to FIGS. フレキシブル印刷配線板のシールド装置は、それぞれ同じ面積の第1の絶縁フィルム10、第2 The flexible printed wiring board of the shield device, the first insulating film 10 of the same area, respectively, the second
の絶縁フィルム20及び第3の絶縁フィルム30を、絶縁フィルム30,10,20の順に積層して構成されている。 The insulating film 20 and the third insulating film 30, which are stacked in this order of the insulating film 30,10,20. 第1の絶縁フィルム10には、図2(a)に示すように、絶縁フィルム10上に複数本の信号線11と複数本のシールド線12とを交互に配置し、各信号線11 The first insulating film 10, as shown in FIG. 2 (a), on the insulating film 10 is disposed a plurality of the signal lines 11 and a plurality of shielded wires 12 alternately, each signal line 11
がシールド線12で挟まれた配線パターンが形成されている。 There wiring pattern is formed sandwiched between the shield wire 12. 配線パターンは、絶縁フィルム10の長尺側に沿って形成された複数本の導電性の薄膜パターンで構成されている。 Wiring pattern is composed of a plurality of conductive thin film pattern formed along the long side of the insulating film 10. また、第1の絶縁フィルム10には、各シールド線12の長手方向に沿った数箇所の位置に、シールド線12の幅より狭い径の円形開口を有する第1孔部1 In addition, the first insulating film 10, the position of several positions along the longitudinal direction of the shielded wire 12, the first hole portion 1 having a circular opening of smaller diameter than the width of the shielded line 12
3が穿孔されている。 3 is perforated.

【0008】第2の絶縁フィルム20には、図2(b) [0008] The second insulating film 20, and FIG. 2 (b)
に示すように、第1の絶縁フィルム10(信号線11及びシールド線)の配線パターンを覆う面積を有する長方形状のシールドパターン21が形成され、前記第1の絶縁フィルム10の第1孔部13に対応する位置に円形状の開口面積を有する第2孔部22が穿孔されている。 As shown in, rectangular shield pattern 21 having an area that covers the wiring pattern of the first insulating film 10 (signal lines 11 and the shield line) is formed, the first hole portion 13 of the first insulating film 10 the second hole portion 22 having a circular opening area is perforated at a position corresponding to. 第2孔部22の開口面積は、第1孔部13の開口面積より大きくし形成されている。 Opening area of ​​the second hole portion 22 is formed larger than the opening area of ​​the first hole portion 13.

【0009】第3の絶縁フィルム30は、図2(c)に示すように、第1の絶縁フィルム10配線パターンを覆う面積を有する長方形状のシールドパターン31が形成されている。 A third insulating film 30, as shown in FIG. 2 (c), rectangular shield pattern 31 having an area to cover the first insulating film 10 wiring pattern is formed. シールドパターン21,31は、それぞれ導電性の薄膜パターンで構成されている。 Shield pattern 21 and 31 is composed of a thin film pattern of each conductive.

【0010】絶縁フィルム10,20,30は、例えば特開平1−89586号に開示されるように、半硬化状態を有し加熱加圧することによって硬化する絶縁材料で構成されている。 [0010] The insulating films 10, 20, 30, for example as disclosed in JP-A-1-89586, is formed of an insulating material which is cured by heating and pressurizing has a semi-cured state. 上記したような3枚の絶縁フィルムを、絶縁フィルム30,10,20の順に重ね合せて加熱加圧することにより接合させ、第1図に示すような積層構造のフレキシブル印刷配線板のシールド装置を形成する。 The three insulating films as described above, are joined by heating and pressing together one on top of the insulating film 30,10,20, forming a flexible printed wiring board of the shield apparatus of the laminated structure as shown in FIG. 1 to. 第1孔部13及び第2孔部22部分においては、 In the first hole portion 13 and the second hole 22 portion,
第1孔部13と第2孔部22とが同芯状に位置するよう接合される。 A first hole portion 13 and the second hole portion 22 is joined so as to be positioned coaxially. また、第2孔部22の開口面積を第1孔部13の開口面積より大きくしたので、接合積層時においては第2孔部22に対してその下層のシールド線12の一部が露出するようになる。 Further, since the opening area of ​​the second hole portion 22 larger than the opening area of ​​the first hole portion 13, at the time of bonding lamination so that a portion of the underlying shield line 12 to the second hole portion 22 is exposed become.

【0011】第1孔部13及び第2孔部22には導電性ペースト等の導電性材料40を充填して硬化させるこにより、第3の絶縁フィルム30に形成したシールドパターン31、第1の絶縁フィルム10に形成したシールド線12、第2の絶縁フィルム20に形成したシールドパターン21とを導電性材料40を介して電気的に接続している。 [0011] By this the first hole 13 and second hole portion 22 is cured by filling a conductive material 40 such as conductive paste, a shield pattern 31 formed on the third insulating film 30, a first shielded line 12 formed on the insulating film 10, and a shield pattern 21 formed on the second insulating film 20 via the conductive material 40 are electrically connected. 第2孔部22の開口面積を第1孔部13の開口面積より大きくしたので、下層のシールド線12の一部を露出させることができ、導電性材料40の充填でシールドパターン21とシールド線12とを確実に接続可能としている。 Since the opening area of ​​the second hole portion 22 larger than the opening area of ​​the first hole portion 13, it is possible to expose a portion of the underlying shield wire 12, the shield pattern 21 and the shield line filling of the conductive material 40 It is reliably connectable and 12. また、複数の信号線11及びシールド線1 Further, a plurality of signal lines 11 and the shield line 1
2の長手方向両端側には、コネクタ等に接続するための接続部(図示せず)が形成されている。 The second longitudinal end side connecting portion for connecting to a connector or the like (not shown) is formed.

【0012】上記構造のシールド装置によれば、信号線11の平面方向は信号線11を挟むシールド線12で、 According to shield apparatus having the above structure, the planar direction of the signal line 11 in the shield wire 12 which sandwich the signal line 11,
上下方向はシールドパターン21,31で外部と遮断されている。 Vertical is isolated from the outside by a shield pattern 21 and 31. 更に、第1孔部13及び第2孔部22が形成された部分においては、各シールドパターン21,31 Further, in the portion where the first hole portion 13 and the second hole portion 22 is formed, the shield pattern 21, 31
とシールド線12とが導電性材料40で接続されているので、信号線11の周囲をシールド層で囲むようになる。 Because it is connected with the shield wire 12 are conductively material 40, made around the signal line 11 to surround by the shield layer. そして、第1孔部13及び第2孔部22を形成する長手方向の間隔dを調整することにより、信号線11の全体にわたってこれを囲むシールド層が等価的に形成される。 By adjusting the longitudinal spacing d forming the first hole portion 13 and the second hole portion 22, the shield layer surrounding it throughout the signal line 11 is formed equivalently. 第1孔部13及び第2孔部22を形成する長手方向の間隔dは、フレキシブル印刷配線板に柔軟性を持たせるとともに、信号線11を囲むシールド効果を得るためには、送信する信号の波長の1/20程度の間隔にする。 Distance d in the longitudinal direction to form a first hole portion 13 and the second hole portion 22, as well as to provide flexibility to the flexible printed circuit board, in order to obtain the shielding effect that surrounds the signal lines 11, the signal to be transmitted to about 1/20 of the interval of wavelength. また、電磁波を遮断するような場合には、前記間隔は10〜20cmとするのが適している。 Further, in the case that blocks electromagnetic waves, the spacing is suitable for a 10 to 20 cm.

【0013】上記実施例においては、第1孔部13及び第2孔部22は円形状としたが、他の形状でもよく、第1孔部13の開口面積より第2孔部22の開口面積を大きくして、下層のシールド線12の一部が開口部から露出するような構成であればよい。 [0013] In the above embodiment, the first hole portion 13 and the second hole 22 was circular, may have other shapes, the opening area than the opening area of ​​the first hole portion 13 and the second hole portion 22 the increase, part of the underlying shielding line 12 may have a configuration such as to be exposed from the opening.

【0014】 [0014]

【発明の効果】本発明のフレキシブル印刷配線板のシールド装置によれば、、第1の絶縁フィルム上に形成された信号線は同一絶縁フィルム上に形成されるシールド線で挟むように構成され、また、上下方向については第2 According to the flexible printed wiring board of the shield apparatus of the present invention] ,, first insulating film on which is formed in the signal line is configured so as to sandwich with a shield line formed on the same insulating film, Further, the vertical direction second
の絶縁フィルム及び第3の絶縁フィルムに形成されたシールドパターンで挟まれる。 Sandwiched by the insulating film and a shield pattern formed on the third insulating film. 前記シールド線と第2の絶縁フィルム及び第3の絶縁フィルムに形成したシールドパターンとは、第1孔部及び第2孔部に充填された導電性材料により電気的に接続され、第1孔部及び第2孔部はシールド線の長手方向に沿って複数形成されているので、孔部の間隔を調整することにより、前記信号線は、 Wherein the shield line and the second insulating film and the third insulating film to form the shield pattern, a conductive material filled in the first hole and the second hole portion are electrically connected, the first hole portion and since the second hole portion is formed with a plurality along the longitudinal direction of the shielded wire, by adjusting the spacing of the holes, the signal lines,
等価的にシールド層で周囲を囲まれ、隣接する信号線との遮断及び外部との遮断を確実に図ることができる。 Equivalently surrounded by a shield layer, it is possible to ensure blocking and blocking an external and adjacent signal lines. 従って、フレキシブル印刷配線板の周辺に位置する電気機器からの電磁妨害波をシールド可能とするとともに、複数の信号線同士のノイズの干渉を防止することができる。 Therefore, the electromagnetic interference from electrical equipment located around the flexible printed circuit board thereby enabling the shield, it is possible to prevent noise interference between the plurality of signal lines.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】 本発明のフレキシブル印刷配線板のシールド装置の実施例を示す断面説明図である。 1 is a sectional view showing an embodiment of a flexible printed wiring board of the shield apparatus of the present invention.

【図2】 フレキシブル印刷配線板のシールド装置を構成する各絶縁フィルムを示すもので、(a)は第1の絶縁フィルムの平面説明図、(b)は第2の絶縁フィルムの平面説明図、(c)は第3の絶縁フィルムの平面説明図である。 [Figure 2] shows the respective insulating film constituting the flexible printed wiring board of the shield apparatus, (a) shows the plan view of the first insulating film, (b) is a plan explanatory view of the second insulating film, (c) is a plan view of the third insulating film.

【図3】 従来のフレキシブル印刷配線板の展開説明図である。 3 is an exploded explanatory view of a conventional flexible printed wiring board.

【図4】 図3のフレキシブル印刷配線板の使用状態における断面説明図である。 4 is a cross-sectional view in the use state of the flexible printed wiring board of FIG.

【符号の説明】 DESCRIPTION OF SYMBOLS

10…第1の絶縁フィルム、 11…信号線、 12… 10 ... first insulating film, 11 ... signal line, 12 ...
シールド線、 13…第1孔部、 20…第2の絶縁フィルム、 21…シールドパターン、 22…第2孔部、 30…第3の絶縁フィルム、 31…シールドパターン、 40…導電性材料 Shielded wire, 13 ... first hole portion, 20 ... second insulating film, 21 ... shield pattern, 22 ... second hole portion, 30 ... third insulating film, 31 ... shield pattern, 40 ... conductive material

Claims (1)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 信号線とこの信号線を挟むシールド線とを有する配線パターンを形成した第1の絶縁フィルムを、前記配線パターンを覆う面積を有するシールドパターンを形成した第2の絶縁フィルム及び第3の絶縁フィルムで挟んだ積層構造から成るフレキシブル印刷配線板のシールド装置であって、 前記シールド線の長手方向に沿って複数の第1孔部を第1の絶縁フィルムに穿孔し、第1の絶縁フィルム上に積層される第2の絶縁フィルムの前記第1孔部に対応する位置に第2孔部を穿孔し、 第1孔部の開口面積より第2孔部の開口面積を大きくし形成し、第1孔部及び第2孔部に導電性材料を充填することにより、前記シールド線と第2の絶縁フィルム及び第3の絶縁フィルムに形成したシールドパターンとを電気的に接続して成るフ 1. A signal line and the first insulating film to form a wiring pattern and a shield line sandwiching the signal line, a second insulating film and the formation of the shield pattern having an area that covers the wiring pattern a flexible printed wiring board of the shield device comprising a laminated structure sandwiched between the third insulating film, the shield line longitudinally along drilled first hole plurality of the first insulating film, a first the second hole was drilled at a position corresponding to the first hole of the second insulating film which is laminated on the insulating film, to increase the opening area of ​​the second hole portion than the opening area of ​​the first hole portion formed and by filling the conductive material in the first hole and the second hole portion, formed by electrically connecting the shield pattern formed on the insulating film of the shield wire and the second insulating film and the third full キシブル印刷配線板のシールド装置。 Kishiburu printed wiring board of the shield apparatus.
JP26408293A 1993-09-29 1993-09-29 The flexible printed wiring board of the shield device Expired - Fee Related JP3070358B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26408293A JP3070358B2 (en) 1993-09-29 1993-09-29 The flexible printed wiring board of the shield device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26408293A JP3070358B2 (en) 1993-09-29 1993-09-29 The flexible printed wiring board of the shield device

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JPH07106787A true true JPH07106787A (en) 1995-04-21
JP3070358B2 JP3070358B2 (en) 2000-07-31

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JP2007335455A (en) * 2006-06-12 2007-12-27 Fujikura Ltd Flexible printed wiring board
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JP2008091635A (en) * 2006-10-02 2008-04-17 Nitto Denko Corp Wiring circuit board
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JP2012089903A (en) * 2009-07-13 2012-05-10 Murata Mfg Co Ltd Signal line

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JP2007335455A (en) * 2006-06-12 2007-12-27 Fujikura Ltd Flexible printed wiring board
JP2008091634A (en) * 2006-10-02 2008-04-17 Nitto Denko Corp Wiring circuit board and electronic apparatus
JP2008091635A (en) * 2006-10-02 2008-04-17 Nitto Denko Corp Wiring circuit board
US8022308B2 (en) 2006-10-02 2011-09-20 Nitto Denko Corporation Wired circuit board and electronic device
EP2268110A1 (en) * 2009-06-10 2010-12-29 HTC Corporation Flexible printed circuit and fabrication method thereof
JP2011014656A (en) * 2009-06-30 2011-01-20 Toshiba Corp Electronic apparatus and flexible printed wiring board
JP4930655B2 (en) * 2009-07-13 2012-05-16 株式会社村田製作所 Signal line and a manufacturing method thereof
US9374886B2 (en) 2009-07-13 2016-06-21 Murata Manufacturing Co., Ltd. Signal line path and manufacturing method therefor
JP2012089903A (en) * 2009-07-13 2012-05-10 Murata Mfg Co Ltd Signal line
JP5354018B2 (en) * 2009-08-11 2013-11-27 株式会社村田製作所 Multi-layer board
US8692125B2 (en) 2009-08-11 2014-04-08 Murata Manufacturing Co., Ltd. Multilayer substrate
WO2011018979A1 (en) * 2009-08-11 2011-02-17 株式会社村田製作所 Multilayered substrate
JP2010192903A (en) * 2010-02-23 2010-09-02 Toshiba Corp Electronic apparatus
JP2012014754A (en) * 2010-06-29 2012-01-19 Dainippon Printing Co Ltd Suspension substrate, method of manufacturing suspension substrate, suspension, suspension with element, and hard disc drive
JP2011061243A (en) * 2010-12-22 2011-03-24 Toshiba Corp Flexible printed circuit board
JP2011238938A (en) * 2011-06-16 2011-11-24 Toshiba Corp Electronic equipment

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