JPH0710517Y2 - Hybrid integrated circuit - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Overview] A single-in-line type hybrid integrated circuit, which has a small area for mounting electronic parts, and a circuit board for mounting the electronic parts, in order to enable surface mounting in a state where the board is erected. A plurality of single-in-line terminals fixed to one end of the board, the terminals are alternately bent in the opposite direction, and the board can be surface-mounted on the motherboard in an upright state,
Alternatively, a circuit board having a small area for mounting an electronic component and a plurality of dual in-line terminals fixed to one end of the circuit board so as to be alternately reversed, and the terminals are alternately bent in opposite directions, It is configured such that the substrate can be surface-mounted on the motherboard in an upright state.

[Industrial application field]

The present invention relates to a single in-line type hybrid integrated circuit.

A hybrid integrated circuit (HiC), which is packaged by mounting multiple electronic components on a small area circuit board, and is itself mounted on a motherboard as a single component, is a single in-line (SIL) type depending on the type of terminals used. And dual in-line (DIL) type. Since these terminals are formed to be inserted into the terminal holes of the motherboard and soldered, forming is required when surface-mounting on the surface of the motherboard.

[Conventional technology]

Fig. 5 is an explanatory diagram of conventional general HiC, (a) is SIL
Type, (c) is a DIL type. The SIL type is a small area ceramic substrate 1 in which one row of SIL terminals 2 parallel to the substrate surface are fixed to the end portion, and a plurality of electronic components 3 are mounted on one surface or both surfaces of the substrate 1 to form a package. To do. This SIL type HiC is mounted by inserting the terminals 2 into the terminal holes 5 of the motherboard 4 with the substrate 1 standing upright as shown in FIG. 6 is the solder.

DIL type HiC has a plurality of DIs on each of two opposite sides of the substrate 1.
The terminal 7 for L is fixed, the board 1 is made horizontal, and it mounts on a motherboard. The soldering of the DIL terminal 7 is performed in the same manner as in (b).

The discrete mounting described above can be applied when a glass / epoxy resin or the like having good workability can be used for the mother board 4, but a ceramic substrate which is hard to be thermally deformed by a device placed in a high temperature environment such as a vehicle device is used as a motherboard. The situation is different when used for 4. As is well known, since the workability of ceramics is poor, the terminal hole 5 as shown in FIG.
Difficult to install. Even if the terminal hole 5 is provided, if the flow dip is performed, the substrate 1 is easily damaged by the heat.

Therefore, it becomes necessary to carry out surface mounting as shown in FIG. The same figure (a) is a DIL in which the lower end 71 of the terminal 7 is bent for surface mounting.
It is a perspective view of a type HiC. The lower end 71 of this terminal 7 is placed on the ceramic mother board 4 as shown in FIG.
It is soldered flat on.

[Problems to be solved by the device]

As shown in FIG. 6 (a), the DIL type HiCs are arranged on the substrate 1 facing each other 2
Since two rows of terminals 7 are provided apart from each other on the sides, the stability during transportation from the positioning on the cream solder to the solder heating and melting step is high. Therefore, the surface 7 can be easily surface-mounted by forming only by bending the lower end 71 of the terminal 7. However, since the substrate 1 is mounted horizontally, the mounting density is reduced.

On the other hand, SIL type HiC can be mounted at high density because the substrate 1 is used vertically, but since the terminals 2 have only one row as shown in FIG. 5 (a), the lower ends of the terminals 2 are simply bent. There is a strong possibility that the product will fall down when transported to the solder heating furnace. Sixth
In order to improve this point, the figure (c) shows the one row of terminals 2 formed into a zig-zag shape.
Is a package in which the substrate 1 and the like are sealed. Hi like this
C is called zigzag in-line type, for example
It is introduced in Japanese Patent No. 9839. However, since the lower end of the terminal 2 in this case is of a vertical type and is not separated as much as the DIL, sufficient stability cannot be obtained (there is a possibility of falling).

The present invention is intended to provide a surface mounting type SIL HiC with good stability.

[Means for Solving the Problems]

FIG. 1 is a first principle view of the present invention, (a) is a perspective view,
(B) is a side view. In this example, one row of the SIL terminals 2 is fixed to one side of the substrate 1, and the lower end 21 is alternately bent in the opposite direction. In the figure, the adjacent terminals are indicated by the symbol A,
It is distinguished by B, C ....

FIG. 2 is a second principle view of the present invention, (a) is a perspective view,
(B) is a side view. In this example, one row of DIL terminals 7 that are alternately opposite to each other is fixed to one side of the substrate 1, and the lower end 71 thereof is alternately bent in the opposite direction. Each code A, B, C ……
Is the same as in FIG.

[Action]

As shown in FIG. 1, the SIL terminal 2 is fixed by sandwiching the end portion of the substrate 1 with a tulip-shaped clip 22 and soldering the portion. The prototype of the whole terminal 2 is parallel to the substrate 1, but in the present invention, it is bent at the bending portion 23 so that the lower end 21 is orthogonal to the substrate 1, in other words, is formed to be parallel to the mother board 4. . This enables surface mounting on the mother board 4, but at this time, the lower ends 21A, 21B, ... Of the adjacent terminals 2A, 2B ,.

The DIL terminal 7 is a U-shaped clip 7 as shown in FIG.
The end portion of the substrate 1 is sandwiched by 2 and the portion is fixed by soldering. The prototype of the whole terminal 7 is orthogonal to the substrate 1, but in the present invention, it is bent twice so that the lower end 71 becomes parallel to the mother board 4. Reference numerals 73 and 74 are bent portions. At this time, the adjacent terminals 7A, 7B, ... Are previously installed in opposite directions, and their lower ends 71A, 71B ,. In this way, the substrate 1 can be stably installed on the mother board 4 in an upright state, and can be surely surface-mounted by reflow soldering.

The merit of using the DIL terminal 7 for the SIL type HiC is that the total height h ₂ ′ of FIG. ₂ (b) is lower than the total height h ₂ of FIG. 1 (b) to achieve small size and thinness and further stability. Is the point that can be increased. That is, the bent portion 2 of the SIL terminal 2 in FIG. 1 (b)
3, it is difficult to set the position too high due to its terminal shape. Therefore, the distance h ₁ from the surface of the mother board 4 to the lower end of the substrate 1 becomes higher than h ₁ ′ in FIG. 2B, and as a result, h ₂ > h ₂ ′. However, this is only a technical matter, and h ₁ can be shortened as much as possible by increasing the position of the bent portion 23. Alternatively, it may be bent horizontally just below the clip 22 and then bent twice like a DIL terminal.

〔Example〕

An embodiment of the present invention using the DIL terminal 7 will be described below with reference to FIGS. 3 and 4.

FIG. 3 is an explanatory diagram when the DIL terminal is attached. This kind of DIL
The terminals 7 are connected to each other in the shape of a comb by a tie bar (not shown), and the pitch between adjacent terminals is, for example, 2.54 mm. Therefore, first, as shown in FIG. 3A, the terminals 7A, 7C, ... Connected by tie bars from the front surface side of the substrate 1 are fixed.
Next, turn over the substrate 1 as shown in (b) and half pitch (1.27m
m) Send and fix terminals 7B, 7D, ... Connected with another tie bar. In this way, the terminals 7A, 7B, 7C, ... Are alternately fixed in opposite directions, and the pitch thereof is half of 2.54 mm (1.27 mm) connected by tie bars. The terminals 7A, 7B, 7C, ... Fixed in this way are formed as shown in FIG. 2 after cutting the tie bars.

FIG. 4 is an explanatory diagram when mounted on a motherboard.
(A) is an overall perspective view, (b) is an enlarged view of a land portion,
(C) is an enlarged view of a soldering portion. The mother board 4 is a ceramic substrate, and a wiring pattern 41 and lands 42 are printed on the surface of the mother board 4 as shown in an enlarged view in FIG.
The substrate 1 on which the DIL terminals 7 are fixed and formed is positioned and placed on the lands 42 on which the cream solder 6 is printed in advance, and is carried into the heating furnace while being held by the adhesive force. . When the solder 6 is heated and melted, the terminal 7 and the land 42 are completely fixed. The terminals 7 and the substrate 1 are also fixed by the solder 6, and the solder 6 is attached by a flow dip before being mounted on the mother board 4. Other electronic components such as IC on the motherboard 4
The chip components 32 such as 31 and chip resistors are also surface-mounted by reflow soldering at the same time.

In this invention, the SIL type HiC that uses the board 1 vertically is mounted on the surface, but this is a DI that uses the board 1 horizontally.
This is because the mounting density on the motherboard 4 is higher than that of the L-type HiC.

[Effect of device]

As described above, according to the present invention, the SIL HiC can be surface-mounted on the motherboard. Further, although the substrate is a vertical type that enables high-density mounting, it has good stability and has an advantage that it does not easily fall down even when transported in a state before soldering.

[Brief description of drawings]

FIG. 1 is a first principle diagram of the present invention, FIG. 2 is a second principle diagram of the present invention, FIG. 3 is an explanatory diagram of attaching a DIL terminal of the present invention, and FIG. 4 is a motherboard of the present invention. FIG. 5 is an explanatory view of the conventional discrete mounting type terminal when mounted, and FIG. 6 is an explanatory view of the conventional surface mounting type terminal. In the figure, 1 is a circuit board, 2 is a SIL terminal, 3 is an electronic component,
4 is a mother board, 6 is solder, and 7 is a DIL terminal.

Claims (2)

[Scope of utility model registration request] 1. A circuit board (1) having a small area on which an electronic component (3) is mounted, and a plurality of single in-line terminals (2) fixed to one end of the circuit board, the terminals being alternated. A hybrid integrated circuit characterized by being bent in the opposite direction, and formed into a shape that can be surface-mounted on a mother board in a state where the substrate is erected. 2. A small-area circuit board (1) on which an electronic component (3) is mounted, and a plurality of dual in-line terminals (7) fixed to one end of the circuit board so as to be alternately reversed. And a terminal which is alternately bent in the opposite direction, and is formed into a shape that can be surface-mounted on the mother board in a state where the substrate is upright.