JPH0694429A - Visual inspection method of surface-packed part soldering - Google Patents

Abstract

PURPOSE:To easily realize the visual inspection of a soldering joint part in a narrow space by an optical system. CONSTITUTION:Visual inspection is carried out by using an optical system in which a halogen illuminator 8, a camera 9, and a fiberscope 10 are integrally fitted. In other words, halogen is emitted from the end of the fiberscope 10 to the bump part 2 of a flip chip 1 that is the object of visual inspection, and the reflected light thereof is taken in through the end of the fiberscope 10, and the judgment of acceptance is carried out by image processing. Since the image taking-in in a narrow space can be enabled, the visual inspection by means of an optical system can be enabled. Thus, the dispersion in the inspection criterion can be reduced, and the quality can be uniformed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering appearance inspection method for an optical system of a surface mount component.

[0002]

2. Description of the Related Art FIGS. 3 and 4 are schematic views showing a conventional appearance inspection method of this kind. In FIG. 3, reference numeral 1 is a flip chip having a bump portion 2 to be subjected to an appearance inspection, and 3 is surface mounting. Parts (resistors, capacitors, etc.), 4 are ceramic substrates on which these are mounted, 5 is an X-ray apparatus main body, 6 is an X-ray irradiation unit, and 7 is a transmission image input camera. In FIG. 4, 8 is a halogen illumination and 9 is a camera.

Next, an external appearance inspection method for the bump portion 2 of the flip chip 1 will be described. In the example of FIG. 3, first, the work (1 to 3 in the figure) to be subjected to the visual inspection is set in the inspection unit of the X-ray apparatus main body 5. Next, X-rays are radiated from the X-ray radiating unit 6, and a transmission image of the solder joint is taken by the camera 7.
To catch. Then, this image is displayed on the monitor screen, and the quality is judged by visual inspection by the operator. In the example of FIG. 4, the halogen light 8 irradiates the work to be subjected to the appearance inspection with the spot light, the reflected light is captured by the camera 9, and the quality is determined by image processing.

[0004]

However, in the example of FIG. 3, since X-rays are used, it is necessary to be careful in handling the device, and at the same time, the device becomes large, and the quality criterion is determined by the operator depending on the barracks. There was such a problem. Further, in the example of FIG. 4, since the surface mount component 3 is close to the flip chip 1, the image processing required for the image processing was insufficient.

The present invention has been made in order to solve the above problems, and aims at changing the image input means based on the example of FIG. 4 to obtain information necessary for image processing. There is.

[0006]

As a means for image input according to the present invention, a fiberscope is attached to the tip of a camera lens.

[0007]

The fiber scope according to the present invention has a thin outer diameter at the tip and can capture an image in a narrow space. Further, since the tip of the fiberscope is a perspective type, it becomes easy to capture an image of a hidden or embedded portion such as the bump portion 2 of the flip chip 1.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. In FIG. 1, 1-4 are the same as those shown in the above-mentioned conventional example. 8 is halogen lighting, 9 is a camera, 1
Reference numeral 0 denotes a perspective-type fiberscope, and these 8, 9, and 10 integrally form an optical system system.

Next, a method of inspecting the appearance of the flip chip 1 and the bump portion 2 will be described. First fiberscope 1
The tip portion of 0 is set on the bump portion 2 to be inspected. Next, the halogen illumination 8 is applied to the bump portion 2 from the tip portion of the fiberscope 10. The reflected light is taken in from the tip of the fiberscope 10 and the quality is judged by image processing. Since the bump portion 2 exists as shown in FIG. 2, the above operation is repeated while changing the image capturing direction (4 directions), and the visual inspection of one flip chip is completed.

[0010]

As described above, according to the present invention, it is possible to capture an image of a narrow portion or a hidden portion, and it is possible to perform a visual inspection by an optical system. As a result, the variation of the inspection determination standard is reduced, and the quality becomes uniform. Further, there is an excellent effect that the device can be made small and at the same time inexpensive.

[Brief description of drawings]

FIG. 1 is a configuration diagram of an optical system showing an embodiment of the present invention.

FIG. 2 is a perspective view showing the positions of flip chips and bumps.

FIG. 3 illustrates a conventional appearance inspection method, and is a configuration diagram of an X-ray apparatus.

FIG. 4 shows a conventional appearance inspection method, and is a configuration diagram of an optical system.

[Explanation of symbols]

 1 Flip Chip 2 Bump 3 Surface Mount Component 4 Ceramic Substrate 8 Halogen Illumination 9 Camera 10 Fiberscope

Claims (2)

[Claims] 1. An optical system system in which a halogen illumination, a camera, and a fiberscope are integrally attached as a means for capturing an image in the visual inspection of a hidden joint portion such as a bump portion of a surface-mounted prep chip. Surface mounting component soldering characterized by irradiating the object of visual inspection from the tip of the scope with halogen, capturing the reflected light into the camera from the tip of the fiberscope, and judging the quality by image processing Appearance inspection method. 2. The method for visual inspection of surface mounted component soldering according to claim 1, wherein the tip of the fiberscope is of a perspective type.