JPH0691329B2 - Power supply system - Google Patents

Description

Description: BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to a power supply system, and in particular, a plurality of packages (small plant wiring circuit boards) in which electronic parts are mounted on platters (large printed wiring circuit boards) via connectors. The present invention relates to a power supply system for supplying power from a platter to a package in a structure of connecting with each other.

[Background of the Invention]

FIG. 1 shows a general structure of a data processing device. Generally platter 10 has multiple packages 14A, 14B, 14
C is connected via connector 12. Each pin 16 of the connector 12 serves as a logic signal path between the platter 10 and the package 14 and a power supply path from the platter 10 to the package 14. Conventionally, this type of structure has been standardized, and the number of power supply paths from the platter 10 to the package 14 (the number of pins of the connector arranged for power supply) is constant. However, the load current amount of each package is different, and the voltage drop due to the contact resistance of the connector in each package is not uniform, so that there is a problem that the power supply voltage to each package becomes uneven.

[Object of the Invention]

An object of the present invention is to provide a power supply system that makes the supply voltage to each platter substantially uniform.

[Outline of Invention]

The present invention includes a platter and a plurality of power supply pins that are connected to a power supply layer provided on an inner layer of the platter, and a plurality of connectors mounted on one surface of the platter and electronic components are mounted on the surface. A power supply pattern is provided, and a plurality of power supply pins and a plurality of packages each having one end attached to each connector so that the power supply patterns are in contact with each other are provided. In a power supply system in which power is supplied from a platter to each package via a package, each package is provided corresponding to the plurality of power supply pins, and is connected to a power supply layer provided in an inner layer of each package. It has through holes, and all or a predetermined number of through holes are connected to the power supply pattern according to the load current amount of each package. And wherein the Rukoto.

Example of Invention

 An embodiment of the present invention will be described below with reference to the drawings.

FIG. 2 shows a single package 14. In the connector 12, of the many pins 16, for example, 20 pins indicated by 16A are pins for power supply, and are electrically connected to the power layer of the platter 10. The pins for other logic signals are electrically connected to the logic signal layer of the platter 10. Power supply pin
16A is brought into contact with and electrically connected to the power supply pattern 24 on the package 14. Pattern 24 with through holes 20 and 22 and through holes
Some have only 20. The through hole 22 is connected to the power supply layer provided in the inner layer of the package 14. Therefore, in the example of FIG. 2, only the first, third, and first and third feeding pins 16A from the top of the drawing are connected to the power supply layer of the package 14, and the second and the top from the top of the drawing are connected. The second power supply pin 16A is not connected to the power layer of the package 14.

16A pin for powering the connector in all packages
According to the conventional example in which all are connected to the power supply layer of the package 14, for example, the contact resistance of each pin is 10 mΩ, the number of power supply pins of each connector 12 is 20, and three packages 14A,
When the load current for 14B and 14C is 70A, 35A and 10A respectively, the total voltage drop due to each connector is 35m for package 14A.
V, 17.5 mV for package 14B and 5 mV for package 14C, resulting in a 30 mV difference between packages.

However, in this embodiment, as shown in FIG. 2, the number of power supply paths from the power supply pin 16A to the power supply layer of the package 14 is set in accordance with the load current amount of each package to supply power to each package. Make the voltage almost uniform.

Based on such adjustment, a specific explanation will be given with reference to the previous example, assuming that the number of power supply pins is 20, the packages 14A, 14B,
By setting the number of power supply paths by pin 16A of 14C to 20 (all power supply pins are connected to the power supply layer of the package), 10 and 3, the voltage drop is almost uniform at 35mV, 35mV and 35mV respectively. can do.

FIG. 3 is a sectional view taken along line III-III in FIG. Power supply pin 1
6A is in contact with the pattern 24 and is connected to the inner power supply layer 28 through the through hole 22. Figure 4 shows IV-I in Figure 2.
A sectional view taken along line V is shown. The power supply pin 16A is in contact with the pattern 24, but the pattern 24 is not connected to the through hole 22 connected to the power supply layer 28, and this pin does not serve as a power supply path. By attaching the capacitor 30 to the through holes 20 and 22, it is possible that a current does not flow in terms of direct current and the same characteristics as in the inner layer connection are obtained in terms of alternating current.

〔The invention's effect〕

As described above, according to the present invention, even if there is a difference in the load current of each package, the voltage drop in each connector can be made uniform, so that it is possible to supply a substantially uniform voltage to each package, and in particular, stacking An excellent effect is exhibited in utilizing a high-density circuit configuration using a substrate.

[Brief description of drawings]

FIG. 1 shows an embodiment of the present invention. FIG. 1 is a schematic perspective view showing the entire apparatus, FIG. 2 is a schematic front view, and FIG.
The III-III line enlarged sectional view of a figure, and FIG. 4 are the IV-IV line enlarged sectional views of FIG. 10 …… platter, 12 …… connector, 14 …… package, 16 …… pin, 16A …… feeding pin.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification code Office reference number FI technical display location H02J 1/00 306 B 7509-5G

Claims (1)

[Claims] 1. A platter, and a plurality of connectors provided on one surface of the platter, comprising a plurality of power supply pins connected to a power layer provided in an inner layer of the platter,
An electronic component is mounted, a power supply pattern is provided on the surface, and a plurality of packages each having one end attached to each of the plurality of connectors so that the plurality of power supply pins are in contact with the power supply pattern are provided. However, in a power supply system in which power is supplied from the platter to each package through the plurality of power supply pins and the power supply pattern, each package corresponds to the plurality of power supply pins. Each of the plurality of through holes is provided with a plurality of through holes connected to a power supply layer provided in an inner layer of each of the packages, and all of the plurality of through holes or a predetermined through hole are provided according to the load current amount of each of the packages. A power supply system that is connected to a power supply pattern.