JPH0685333B2 - Heat seal connector and manufacturing method thereof - Google Patents

Description

Detailed Description of the Invention

[0001]

[Field of Industrial Application] The present application is a liquid crystal display (LC
D), electroluminescence (EL), light emitting diode (LED), electrochromic display (ECD), plasma display, etc. between the connection terminals of the display body and the circuit board on which the drive part is mounted, or of various electrical circuits. The present invention relates to a heat seal connector used for connecting between boards and a manufacturing method thereof.

[0002]

2. Description of the Related Art Conventionally, heat seal connectors have been L
Connection of a display device such as a CD, EL, LED, ECD, or plasma display with a hard printed wiring board (PCB) or a flexible printed wiring board (FPC), or PCB, FP
It is used for connection between Cs. In recent years, the number of circuits on various electric circuit boards used in heat-seal connectors has been increasing with the increase in size, color, and miniaturization of displays, and the number of conductive lines included in one heat-seal connector is 100 to 700. On the contrary, the conductive line width of the circuit pattern and its pitch are becoming finer, and the conductive line width is 0.07 to 0.15 mm and the pitch is 0.15 to
As 0.30 mm is required, it is more difficult than ever to form conductive lines by screen printing in the related art.

That is, in the conventional method for manufacturing a heat seal connector, the conductive line is provided by screen printing a conductive paste obtained by mixing and dispersing conductive fine particles in an organic binder solution. Immediately after that, the wire is divided by a wire rod having a wire diameter of about 10 to 30 μm and an intersection point of these wire rods, which is filled in the screen opening and connected to each other along the screen opening to form a desired conductive line. Form a pattern. After that, the screen separates, but at that time, a sliding speed is generated between the mask of the screen that forms the screen opening and the conductive paste, and the viscosity of the conductive paste in the portion in contact with the mask decreases, so when the screen separates, conductive There is a tendency for so-called sagging that spreads in the width direction of the line by about 30 to 50 μm from the width of the screen opening. To obtain a fine conductive line pattern, in order to prevent this, increase the viscosity and fluctuation degree of the conductive paste, Although measures have been taken to increase the viscosity immediately after printing to suppress the flow, increasing the fluctuation degree is limited due to restrictions on the material of the conductive paste, etc.If the viscosity of the conductive paste is increased, the conductive pattern line will be blurred. Since the conductive line is easily broken and the conductive line is broken, there is a limit to this as well. Provided at least 30~50μm more narrow correcting the width of the pre-screen openings using a paste, it is necessary to obtain a desired conductive line width.

That is, FIG. 4 and FIG. 5 are both vertical cross-sectional views schematically showing the conventional conductive line screen printing, and FIG. 4 shows the desired conductive line 3 in which the screen opening 8a is formed without considering sagging. Shows a state in which the conductive lines 3 due to sagging are short-circuited to each other when screen printing is performed on the substrate 1 to be printed by using the screen plate 8 having the same width. Indicates that the width of the conductive line 3 is narrower than the desired width of the conductive line 3 and the conductive line 3 is widened due to sagging when the conductive line 3 is screen-printed on the substrate 1 to be printed.
Therefore, when the pitch is reduced to 0.15 to 0.30 mm, the width of the opening is also narrowed, the ratio of the correction is relatively large, and the ratio of the area divided by the screen material is also large. Since it becomes worse, it is difficult to obtain electrically connected conductive lines, and there is a limit to the pitch that can be handled by screen printing. Furthermore, as described later, as a method of providing an anisotropic conductive means to the heat seal connector, in the case of mixing conductive particles larger than that of the conductive paste in the conductive paste, the correction of the opening is not performed. The screen passability of the conductive paste was significantly impaired, and the limit of the pitch that could be handled by screen printing was lower.

[0005]

Therefore, in the heat-sealed connector formed by printing according to the above method, the finer the conductive line, the worse the screen passability of the conductive paste and the electrical connectivity is hindered. This is a fatal defect that constriction, faintness or disconnection causes loss of conduction, and if the conductive line width on the screen is not reduced according to the pitch, the conductive paste sags and shorts between lines ( 5) Even if a short circuit does not occur, the width between the conductive lines becomes narrower and the misalignment occurs when connecting the heat seal connector.
Due to the problem of cumulative deviation of the conductive line pattern, a short circuit is likely to occur between adjacent conductive lines, and the function as a heat seal connector cannot be achieved. Furthermore, the viscosity of the conductive paste and the setting of the printing conditions have to be changed, which is complicated, and the manufacturing conditions are unstable and the viscosity of the conductive paste and the printing conditions do not match. When the supplied conductive line becomes thick, bleeds, or sags, the insulation between the conductive lines cannot be ensured. Conversely, when the supply of conductive paste is insufficient, the electrically connected conductive line pattern cannot be obtained. Therefore, the production efficiency was low, and even if the pitch of the conductive line pattern was 0.20 mm or less, screen printing was impossible at all. The present invention improves the heat seal connector having the above-mentioned conventional problems, provides a heat seal connector having a clear and fine conductive line pattern easily and reliably, and is not industrially compatible with conventional screen printing. It is possible to provide the heat seal connector of 0.10 to 0.20 mm pitch, which was possible, by screen printing.

[0006]

DISCLOSURE OF THE INVENTION The present invention relates to the relationship between the amount and viscosity of a solvent component contained in a conductive paste used for screen printing during manufacturing of a heat-seal connector, and the time-dependent change of the conductive paste extruded from a screen opening. Focusing on the behavior, by utilizing this, the conductive paste is provided on the material to be printed (the one on which the solvent absorbing member is provided on the substrate to be printed) 3a, and at the same time the solvent is quickly removed from the conductive paste within one second. By controlling the leveling of the conductive paste by forming a conductive line having a line width approximately equal to the width of the screen opening, a diligent research has been made to provide a heat seal connector having a clear and fine conductive line pattern. It was done.

That is, according to the present invention, a member which easily absorbs the solvent component contained in the conductive paste is preferably formed in the printed portion of the printed substrate on which at least the conductive line is formed, preferably in a thickness of 0.1 to 50 μm. A fine conductive line pattern formed by printing the conductive paste on a material to be printed applied to a substrate to be printed, and quickly absorbing the solvent of the conductive paste having a low viscosity extruded from the screen opening. The present invention relates to a heat-seal connector and a method for manufacturing the heat-seal connector, wherein the heat-seal connector has an anisotropic conductive means at least at a joint with a member to be connected. That is, the conductive paste retains a low viscosity with good printability until it passes through the screen, and when it reaches the printing object, the viscosity increases instantly, and the sagging of the conductive paste in the width direction is suppressed. As a result, a heat seal connector having a clear conductive line pattern can be easily obtained.

The substrate to be printed of the heat-seal connector to which the present invention is applied is not particularly limited, but a polymer film having heat resistance such as polyimide, polyethylene terephthalate, polycarbonate, polyphenylene sulfide, polyp Tylene terephthalate, polyethylene nactate, poly-1,4-
Made of cyclohexane dimethylene terephthalate, polyarylate, liquid crystal polymer, etc., thickness considering flexibility
It is appropriately selected from a film having a thickness of 10 to 50 μm.

As the solvent absorbing member applied to the substrate to be printed, various conductive pastes can be used.
Although not particularly limited to this, after the conductive paste described later reaches the object to be printed (those having the solvent absorbing member provided on the substrate to be printed) 3a through the screen opening 8a,
Since the conductive paste needs to have the ability to absorb the solvent instantly before flowing, an organic polymer substance having a solubility parameter similar to various solvents used for preparing the conductive paste described later, for example, vinyl chloride resin, acetic acid. Vinyl resins, their copolymers, styrene resins, acrylic resins,
Thermoplastic polyester, thermoplastic polyurethane, polybutadiene, polyvinyl alcohol, polyvinyl butyral, polycarbonate resin, polyamide resin, polyimide resin, epoxy resin, alkyd resin, phenol resin, unsaturated polyester resin, isoprene rubber, butadiene rubber, butyl rubber, styrene butadiene Examples thereof include synthetic rubbers such as rubber and butadiene acrylonitrile rubber, and thermoplastic elastomers such as styrene type, polyester type and urethane type.

These polymer substances may be thermoplastic or thermosetting, but the adhesion to the substrate to be printed, the flexibility required for the heat seal connector, and the hardening of the conductive paste. , Vinyl chloride / vinyl acetate, because it should have heat resistance that does not cause deformation, cracking, slack, etc. due to the heat of about 100 to 150 ° C that is received during drying, and solvent resistance that does not cause deformation or dissolution due to the absorbed solvent. Polymers, acrylic resins, thermoplastic polyesters, thermoplastic polyurethanes, and epoxy resins are preferable, and isocyanates, amines, acid anhydrides, and aldehydes are added as a curing agent for crosslinking the polymer substance if necessary. Is also good. The addition of known curing accelerators such as tertiary amine compounds and organometallic compounds is optional, but it is desirable to avoid hygroscopic or ionic substances that promote migration of metal powder in the conductive paste.

In addition to the affinity with the above-mentioned polymer substance, the solvent absorbability of the conductive paste is such that the solvent separates the cohesive force exerted between the polymer substances from each other and enters the gap between them. With a good molecular weight of 2,000-30,000,
It is desirable that the low molecular weight is 5,000 to 30,000, but in this case, from the viewpoint of heat resistance and surface tackiness, a reinforcing filler such as dry silica, wet silica, silicate, activated calcium carbonate, etc. is used as the polymer. 0.1 for 100 parts by weight of substance
It is desirable to add up to 10 parts by weight.This is because the printing ink may bleed or sag when the screen plate separation is bad in the printing performed in the next step, so it suppresses the tackiness of the surface and the apparent heat resistance. Can be added to increase. Although heat resistance can be increased by three-dimensional crosslinking, the molecular weight between the crosslinking points is 2,000.
From the viewpoint of the above-mentioned solubility parameter and the like, it is necessary that the above is preferably 20,000 or more. Therefore,
As the polymer substance, thermoplastic polyester and thermoplastic polyurethane are most preferable.

As a coating method, a conventionally known method may be used, and a solvent having an ability to dissolve the polymer substance is not particularly limited, but it is used, for example, for preparing a conductive paste described later. It may be selected from various solvents as described above, dissolved and made into a solution, and then applied using a printing method such as a screen printing method and a gravure printing method, or roll coating, bar coating, knife coating, Spray coating, spin coating, dipping, or the like may be used. Further, the coated material is dried or cured and dried to obtain an object to be printed having a solid absorption layer.

As a portion having a member which can easily permeate the solvent component contained in the conductive paste on the substrate to be printed,
The conductive line may be limited to the printed part to be formed, or may be applied to the entire printed surface on the printed substrate. The coating thickness may be determined experimentally as long as it has a capacity enough to absorb the solvent in the conductive paste. In addition, when the surface condition such as mottled spots and streaks on the coating film caused by convection of the components of the absorption layer during the drying step of the absorption layer is unsuitable for providing a precise conductive line pattern, or as a heat seal connector. If it is easy to lose the flexibility of
It has a specific thickness selected from the range of 0.1 to 50 μm, preferably 1.0 to 20 μm. It is desirable that the surface condition is fine holes and satin that do not hinder the formation of a precise conductive line pattern because it promotes absorption, but an average roughness of 10 μm or less, preferably 3 μm or less is good, and it is absorbed on the surface of the printed material. It is necessary to be careful because there is a possibility that contamination, water, etc. that may interfere with the above, adhesion and adsorption of water may occur.

The organic binder as one component constituting the conductive paste to be screen-printed on the solvent absorbing member is generally vinyl chloride resin, vinyl acetate resin,
These copolymers, acrylic resins, thermoplastic polyesters, thermoplastic polyurethanes, polybutadienes, polyimide resins, epoxy resins, alkyd resins, phenolic resins, etc., and curing agents such as isocyanates, amines and acid anhydrides are used as necessary. As a solvent for dissolving this, ester-based, ketone-based, ether ester-based, chlorine-based, ether-based, alcohol-based, hydrocarbon-based, etc.
For example, methyl acetate, ethyl acetate, isobrovyl acetate, isobutyl acetate, butyl acetate, amyl acetate, methyl ethyl ketone, methyl isobutyl ketone, methyl isoamyl ketone, methyl amyl ketone, ethyl amyl ketone, isobutyl ketone, methoxymethylpentanone, cyclohexanone, diacetone alcohol. , Methyl cellosolve acetate, ethyl cellosolve acetate, butyl cellosolve acetate, methoxybutyl acetate, methyl carbitol acetate, ethyl carbitol acetate, dibutyl carbitol acetate, trichloroethane, trichloroethylene, n-butyl ether,
Diisoamyl ether, n-butyl phenyl ether,
Propylene oxide, furfural, isopropyl alcohol, isobutyl alcohol, amyl alcohol,
Cyclohexanol, benzene, toluene, xylene,
Isobrovyl benzene, petroleum spirit, petroleum naphtha, etc. are used, but ester-based, ketone-based, and ether ester-based are often used, and the conductive paste viscosity is 50 to 1,000 voise and the degree of fluctuation (viscosity 20 rotations / 200 rotations) is 2 Adjusted to 15. The ratio of the solvent component in the conductive paste is 80% by weight or less, preferably 50% by weight or less, in consideration of the ability of the member to absorb the solvent, such as thickness and molecular weight.

The conductive fine powder used for the conductive paste is granular, scaly, plate-like, dendritic, dice-like silver having an outer diameter of 0.1 to 100 μm, silver, silver-plated copper, copper, gold, nickel, and further. These alloys, resin powder plated with one or more of these metals, furnace black, one or more of carbon black or graphite powder such as channel black is used, 10 to 90 weight to the organic binder % And dispersed, and if necessary, additives such as a curing accelerator, a leveling agent, a dispersion stabilizer, a defoaming agent, a thixotropic agent, and a metal deactivator are added.

The screen plate used for forming a conductive line pattern using this conductive paste has a wire diameter of 10 to 40 μm.
A plain weave or twill weave of an iron alloy such as stainless steel of m or an electroformed plate formed in a grid pattern by nickel plating and stretched on a rigid frame is generally used to form a precise conductive line pattern. In this case, it is necessary to thin the wire material so as not to close the opening of the mask agent such as acrylic, that is, the opening substantially equal to the shape of the desired conductive line pattern, so as not to block the wire or the intersection of the wire, The mesh thickness is inevitably thin, but from the viewpoint of the permeability of the conductive paste, the ratio of the aperture ratio / the mesh thickness is preferably 0.8 or more, more preferably
A value of 1.5 or more is preferable, and it is necessary to increase the strength of the wire and reduce the diameter of the wire so as not to reduce the tension of the gauze and plate, and it is desirable that the aperture ratio is 30% or more, preferably 60% or more. .

Further, it is not necessary to limit the adhesive applied to the heat sheet connector of the present invention,
It may be either thermoplastic or thermosetting as long as it exhibits adhesiveness by heating, but the thermoplastic ones are bonded at a relatively low temperature for a short time and have a long bot life,
Since thermosetting materials have high adhesive strength and excellent heat resistance, these may be appropriately selected according to the purpose of use. As the thermoplastics, polyamide-based, polyester-based, ionomer-based, ethylene-vinyl acetate copolymer (EVA), ethylene-methacrylic acid copolymer (EMA), ethylene-ethyl acrylate copolymer (EEA) and other polyolefins, various synthetics Examples include rubber-based ones, and modified products and composites thereof. Examples of thermosetting resins include epoxy-based, urethane-based, acrylic-based, silicone-based, chloroprene-based, and nitrile-based resins, or synthetic rubbers. , Or a mixture thereof is exemplified, in which case, in any case, a curing agent, a vulcanizing agent, a control agent, a deterioration inhibitor, a heat resistance additive, a thermal conductivity improver,
A tackifier, a softening agent, a coloring agent and the like may be added appropriately.

As a solvent for dissolving this, ester-based, ketone-based, ether ester-based, chlorine-based, ether-based, alcohol-based, hydrocarbon-based solvents such as methyl acetate, ethyl acetate, isoprovir acetate, isobutyl acetate are used. , Butyl acetate, amyl acetate, methyl ethyl ketone, methyl isobutyl ketone, methyl isoamyl ketone, methyl amyl ketone, ethyl amyl ketone, isobutyl ketone, methoxymethylpentanone, cyclohexanone, diacetone alcohol, methyl cellosolve acetate, ethyl cellosolve acetate, butyl cellosolve acetate, Methoxybutyl acetate, methyl carbitol acetate, ethyl carbitol acetate, dibutyl carbitol acetate, trichloroethane, trichloroethylene, n-butyl ether, diisoamyl ether, n-butyl Examples include phenyl ether, propylene oxide, furfural, isopropyl alcohol, isobutyl alcohol, amyl alcohol, cyclohexanol, benzene, toluene, xylene, isoprovirbenzene, petroleum spirit, petroleum naphtha, etc. Used a lot.

The conductive particles for imparting anisotropic conductivity to this adhesive include metal particles of gold, silver, copper, nickel, palladium, stainless steel, brass, solder, etc., tungsten carbide, silica carbide, etc. Ceramic particles, carbon particles, plastic particles having a surface coated with metal, etc. are used, and the particle diameters of these are in consideration of the adhesive coating thickness, the connection pitch of the conductive lines, etc., and the stability and reliability of the connection, It is determined in consideration of the allowable limit of peeling strength, etc., but usually 5 to 150 μm is used. Further, this shape is not particularly limited, and spherical, needle-like, scale-like, plate-like, dendritic, dice-like, protruding sphere, indeterminate shape, etc. are used to improve the stability and reliability of the connection. The optimum one is selected in consideration. When this is used by dispersing it in the adhesive, the amount of the conductive particles blended is too small and particles are not present in the electrode terminal shape to be connected, causing wire breakage and high resistance value, and if too much is present. Since the anisotropic conductivity is impaired by establishing a continuous connection in the planar direction, 0.1 or more per 100 parts by volume of the adhesive component.
It may be selected from the range of 30 parts by volume, but preferably 1 to 15 parts by volume. As a method for applying and forming these anisotropically conductive adhesives, a conventionally known method as shown in the method for applying and forming the solvent absorbing member can be used.

When the adhesive component is applied and formed on the solvent absorbing member, it is desirable to select an adhesive component that does not cause erosion due to deformation, dissolution or the like of the solvent absorbing member, On the contrary, it is preferable that the solvent absorbing member is made of a substance that is not attacked by the adhesive component. Also,
When fixing the conductive particles on the conductive line pattern, the conductive particles are mixed in the conductive paste to form a line, but in order to obtain a stable connection, the conductive line area of the connecting portion is 1 mm ² per area. , Particles of 20 or more, preferably
It suffices to mix the conductive particles so that the number of the conductive particles becomes 50 or more. However, as described above, there may be a problem in the printability of the conductive lines when they are formed. It is necessary to determine the particle size in consideration of both the printability of. That is, the width of the opening or the uniform length (l) and the particle size (r) of the grid-like opening formed by the gauze and the plate forming the printing plate, and the thickness (w) of the conductive line are r. > L is unprintable, and r << w is not stable, so r <l, r
It is necessary that ≧ (1/5) w. Furthermore, if the previous solvent absorbing member is a member that exhibits adhesiveness by heat sealing, it is possible not to apply an adhesive to it, in which case the conductive line is directly connected to the circuit to be connected for electrical conduction. Becomes In this way, the adhesive provided with the anisotropic conductive means is applied to at least the connection portion with the object to be connected on the heat seal connector, and further, if necessary,
A known insulating resist layer is provided at a desired portion.

In order to manufacture the heat-seal connector of the present invention by using each of the above-mentioned materials, the solvent is added to at least a portion of the substrate to be printed selected from the above-mentioned substrate material where the conductive line is to be formed. After solution of the solvent absorbing member selected from the absorbing member, a conventionally known coating method, for example,
It is preferably applied to a thickness of 0.1 to 50 μm, preferably 1.0 to 20 μm by a printing method such as a screen printing method or a gravure printing method, a roll coating, a bar coating, a knife coating, a spray coating, a spin coating, or an infiltration method. For example, an IR drying furnace,
Drying or curing drying is carried out in a hot air drying oven, UV irradiation oven, etc. to create a printing material having a solid absorption layer, on which a desired conductive line pattern is formed from the screen plate having openings of approximately the same pattern. Screen-print the conductive paste using the selected screen plate,
Further, if necessary, an insulating adhesive or an anisotropic conductive adhesive produced by using a material selected from the materials of the adhesive is applied and formed on a desired site by the above-mentioned conventionally known application method. Further, if necessary, a conventionally known insulating resist layer is provided at a desired portion to obtain the heat seal connector of the present invention.

Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1A is a plan view of a heat-seal connector according to the present invention, and FIG. 1B is a vertical cross-sectional view schematically showing screen-printing of conductive lines at the time of manufacturing the heat-seal connector of the present invention. In the figure, a conductive line 3 is formed by using a screen plate 8 having a screen opening 8a substantially equal to a desired conductive line on a printed object 3a in which a solvent absorbing member 2 is applied on a substrate 1 to be printed.
Is screen-printed to form a clear and fine conductive line pattern. An anisotropic conductive adhesive 4 is further provided on a desired portion of this, and an insulating resist layer 5 (see FIG. 1A) is formed on the remaining portion.
FIG. 1C schematically shows a state in which the heat-seal connector is connected to the substrate 9 to be connected, and the conductive line 3 includes the electrode terminals 9 a and the conductive particles 6 on the substrate 9 to be connected. Electrically connected via. The longitudinal sectional view of the heat-seal connector shown in FIG. 2 shows a case where the conductive particles 6 are mixed in the conductive line 3. At this time, the conductive particles 6 pass over the insulating adhesive 7 and the connected substrate (not shown). (Not shown) is to be connected to the upper electrode terminal (not shown). Figure 3
Is a vertical cross-sectional view showing a connection state between the heat-seal connector and the connected substrate 9. When the solvent absorbing member 2 has adhesiveness by itself, the conductive line 3 is connected to the electrode terminal 9a of the connected substrate 9. It is intended to obtain electrical continuity by making direct contact.

[0023]

The heat-seal connector and the method for producing the same according to the present invention comprises printing the conductive paste on a material to be printed, which is obtained by applying a member that easily absorbs the solvent component contained in the conductive paste to the base material to be printed. As a result, in the production of a heat-seal connector by conventional screen printing, there are many restrictions on the amount of the solvent component and the viscosity of the conductive paste from the point of sagging or bleeding of the conductive paste. Although it was not possible to form a fine conductive line pattern from the viewpoint of the screen passability of the paste, the solvent component of the conductive paste on the substrate to be printed easily absorbs the solvent component of the conductive paste and the viscosity of the component to control the viscosity. Eliminates bleeding, thus reducing conductive paste limits and facilitating screen penetration Rashimeru it becomes possible, printing of difficult or impossible and once was fine conductive line pattern becomes readily possible in the prior art. Further, since the restriction of the function of the conductive paste is reduced, it becomes easy to manufacture a stable product that does not depend on the manufacturing conditions of the heat seal connector, and the production efficiency can be improved. In addition, since it is possible to eliminate the correction of the screen opening that was previously provided with the assumption that the conductive paste is dripping or bleeding, it is even easier to print fine conductive line patterns.
Furthermore, even when the conductive paste contains conductive particles larger than the diameter of the conductive fine particles in the conductive paste (FIG. 2), it is particularly advantageous to eliminate this correction value. Further, since the anchor effect of the conductive line to the printed material is enhanced, the adhesion of the conductive line is improved, the printability is improved, and the bending resistance as the heat seal connector is also improved.

[0024]

EXAMPLES Specific embodiments of the present invention will be described below with reference to Examples and Comparative Examples. Examples 1-5 and Comparative Examples 1-7. After the conductive line pattern was screen-printed on the material to be printed using the following materials shown in Table 1, the surface temperature was 120 ° C.
It was placed in a dryer for 3 minutes, and further dried and cured in a batch dryer at 120 ° C. for 5 hours. On the other hand, for SBR type synthetic rubber,
Nickel particles are blended as conductive particles, and a white anisotropic anisotropic conductive adhesive is further prepared by adding titanium white, and this is applied to the connection portion of the conductive line pattern and dried, and the remaining portion is commercially available. An insulating resist layer was formed using resist ink SR-610 (manufactured by Toyobo Co., Ltd.) to obtain a heat seal connector. The line width, line state, line state after heat sealing, bending resistance (adhesion), and yield were measured for this by the following test methods, and the respective results are also shown in Table 1.

Details of the materials and test methods used in each of the above examples are as follows. (Material) Solvent absorption member-1 Molecular weight 20,000 to 25,000 synthesized from terephthalic acid, isophthalic acid, sebacic acid, ethylene glycol, neopentyl glycol, glass transition point 45 ° C, hydroxyl value
6.0KOHmg / g, acid value 1.0KOHmg / g, solubility parameter 9.2
100 parts by weight of a saturated copolyester resin of was dissolved in toluene, and a biuret hexamer of hexamethylene diisocyanate was blocked with methyl ethyl ketoxime to synthesize 85% solids and 12% by weight of isocyanate.
10 parts by weight of the blocked isocyanate compound described above are uniformly dissolved and mixed, and 0.1 parts by weight of triethylenediamine (manufactured by Tosoh Corporation) as a curing accelerator is further added and uniformly mixed.

Solvent absorption member-2 Molecular weight of 500 to 800 synthesized from terephthalic acid, isophthalic acid, sebacic acid, ethylene glycol and neopentyl glycol as raw materials, glass transition point 35 ° C., hydroxyl value 26.0.
100 parts by weight of a saturated copolyester resin having KOHmg / g, an acid value of 1.0 KOHmg / g, and a solubility parameter of 8.9 was dissolved in toluene, and 10 parts by weight of the same blocked isocyanate compound as the solvent absorbing member-1 was added thereto to homogenize it. Melt mix,
Furthermore, 0.1 parts by weight of triethylenediamine (manufactured by Tosoh Corporation) was added as a curing accelerator and uniformly mixed.

Solvent absorption member-3 Molecular weight of 20,000 to 25,000 synthesized from terephthalic acid, isophthalic acid, sebacic acid, ethylene glycol, neopentyl glycol, glass transition point 45 ° C., hydroxyl value
6.0KOHmg / g, acid value 1.0KOHmg / g, solubility parameter 9.0
100 parts by weight of the saturated copolyester resin is dissolved in toluene, and 10 parts by weight of the same blocked isocyanate compound as the solvent absorbing member-1 is added thereto, and 0.1 part by weight of triethylenediamine (manufactured by Tosoh Corporation) is used as a curing accelerator. , And silica gel ^# 200 (AEROSIL, Nippon Aerosil) 1
Parts by weight Mixing and stirring uniformly.

Printed material-1 A polyethylene terephthalate film (Lumirror S-10, manufactured by Toray Industries, Inc.) having a thickness of 25 μm was used as a printed material.
The solvent absorbing member-1 was coated on one side by a kiss coater so that the thickness of the coating film after drying was 3 μm, and dried by an infrared (IR) dryer. Printed material-2: The same printed material as the above, without a solvent absorbing member on the surface. Printed matter-3 Using the same printed matter as the above, the thickness of the coating film after drying the solvent absorbing member-1 on one side with a kiss coater is 0.03 to
It is applied on the entire surface to a thickness of 0.05 μm and dried with an IR dryer. Printed material-4 The same printed material as described above was used, and the thickness of the coating film after drying the solvent absorbing member-1 on one surface thereof with a kiss coater was 80 μm.
It is applied to the entire surface so that it becomes and dried with an IR dryer. Material to be printed-5 The same material to be printed as described above was used, and the thickness of the coating film after drying the solvent absorbing member-2 on one surface thereof with a kiss coater was 3 μm.
It is applied to the entire surface so that it becomes and dried with an IR dryer. Printed material-6 The same printed material as described above was used, and the thickness of the coating film after drying the solvent absorbing member-3 on one surface thereof with a kiss coater was 3 μm.
It is applied to the entire surface so that it becomes and dried with an IR dryer.

Conductive paste-1 Molecular weight of 20,000 synthesized from terephthalic acid, sebacic acid, ethylene glycol and neopentyl glycol
~ 25,000, hydroxyl value 6.0KOHmg / g, acid value 1.0KOHmg / g, solubility parameter 9.2 saturated copolyester resin,
A mixture of hexamethylene diisocyanate biuret trimer was blocked with methyl ethyl ketoxime to synthesize a mixture of solid isocyanate 85% and blocked isocyanate compound having an isocyanate content of 12% by weight as an organic binder, to which ethyl carbitol acetate was added as a solvent. , Conductive paste using scale-like silver powder with a particle size of 1-3 μm as conductive particles (viscosity 160 poise, B type viscometer 25 ° C, solvent ratio 20
%, Fluctuation degree 3.8: (viscosity 20 rotations / 200 rotations)). Conductive paste-2 To the same organic binder and solvent as used in conductive paste-1, silver flakes having a particle size of 1 to 3 μm are added as conductive particles, and further dendritic nickel particles having a particle size of 10 to 15 μm are mixed. Conductive paste (viscosity 160 poise, B type viscometer 25
℃, solvent ratio 20%, thixotropy 3.8: (viscosity 20 revolutions / 200 revolutions)).

Screen plate-1: 36 patterns having 300 lines each having a pitch of 0.2 mm and a length of 0.1 mm and a length of 35 mm are provided, and the screen wire diameter is 20 μm and the mesh thickness is 20.
Nickel electroforming plate with μm, aperture ratio 34%, aperture ratio / thickness = 1.7. Screen plate-2 This is the same nickel electroforming plate as printing plate-1 except that it has 300 lines with a pattern of 0.2 mm pitch, 0.05 mm width and 35 mm length. Screen plate-3 This is the same nickel electroforming plate as printing plate-1 except that it has 200 lines with a pattern of 0.3 mm and a width of 0.15 mm and a length of 40 mm. Screen version-4 36 patterns with 200 lines of 0.35 pitch, 0.15 mm width and 40 mm length, 36 patterns, screen wire diameter 27 μm, mesh thickness 54
A stainless screen plate with μm, aperture ratio of 43%, aperture ratio / thickness = 0.8.

(Test method) Line width: The width of 100 printed conductive lines is measured by a microscope.
The average value (unit: μm) measured by SOPHIA-EX (manufactured by Beldex) is shown. -Line state: The presence or absence of defects such as distortion, disconnection, dripping, and bleeding as a heat seal connector was judged by visual observation and a microscope.・ Line condition after heat-sealing: 140 ℃ (adhesive temperature) 30kg / c at the joint part of the heat-sealing connector obtained in each example, on a PCB with almost the same pitch and line width.
The conductive line after heat-sealing at m ² for 12 seconds is shown as observed with the naked eye and a microscope. -Bending resistance (adhesion): The joint part of the heat seal connector obtained in each example was heat-sealed on a PCB having a pitch and a line width almost the same as this, and bent at 180 °,
A load of 50 g / cm ² was applied for 1 minute, this was performed once for both mountain folds and valley folds, that is, a 360 ° fold was defined as one, and the rate of increase in resistance (%) was shown.・ Yield: Only 100 shots of the conductive line pattern are printed, and the obtained conductive line pattern is electrically inspected to determine that there is no disconnection or short circuit as a non-defective product. Displayed in.

[0032]

[Table 1]

[0033]

The heat-seal connector and the method for producing the same according to the present invention comprise printing the conductive paste on a material to be printed on which a member capable of easily absorbing the solvent component contained in the conductive paste is applied. That is, it is possible to easily provide a heat seal connector having a clear and fine conductive line pattern by suppressing sagging of the conductive paste without impairing printability. Not only is it possible to expand the screen opening that was conventionally corrected to be smaller than the desired conductive line pattern by assuming the sag of the conductive paste. Has not only improved the printability and greatly improved the printing yield, but it has been considered impossible in the past. A heat seal connector having a conductive line pattern of 0.2 mm pitch or less is easily and highly reproducibly provided.

[Brief description of drawings]

FIG. 1 is an example of a heat seal connector manufactured by the heat seal connector manufacturing method of the present invention, in which (a) is a plan view,
(B) is a longitudinal sectional view schematically showing line printing, (c)
[Fig. 3] is a vertical sectional view schematically showing a state after connection.

FIG. 2 is a vertical cross-sectional view showing another example of the heat seal connector of the present invention.

FIG. 3 is a vertical sectional view showing still another example of the heat seal connector of the present invention.

FIG. 4 is a vertical cross-sectional view schematically showing line printing by a conventional heat seal connector manufacturing method.

FIG. 5 is a vertical cross-sectional view schematically showing line printing by another manufacturing method of a conventional heat seal connector.

[Explanation of symbols]

1 ... Printed substrate, 2 ... Solvent absorbing member, 3 ... Conductive line,
3a ... Printed material, 4 ... Anisotropic conductive adhesive, 5 ... Insulating resist layer, 6 ... Conductive particles, 7 ... Insulating adhesive, 8 ... Screen plate, 8a ... Screen opening, 9 ... Connected substrate,
9a ... Electrode terminal.

Claims (2)

[Claims] 1. A substrate to be printed, a solvent absorbing member for absorbing at least a solvent component contained in a conductive paste applied to a portion to be printed on which a conductive line is to be formed, and the solvent. A heat seal comprising: a conductive line pattern formed by printing the conductive paste on an absorbing member; and an anisotropic conductive connecting means formed on at least a joint portion of the conductive line pattern with a substrate to be connected. connector. 2. The method for manufacturing a heat-seal connector according to claim 1, wherein the solvent absorbing member is applied to the printed portion, and the conductive paste is screen-printed on the solvent absorbing member. A method for manufacturing a heat-seal connector, which comprises obtaining a line pattern.