JPH0675971A - Management system for semiconductor manufacture device - Google Patents
Management system for semiconductor manufacture deviceInfo
- Publication number
- JPH0675971A JPH0675971A JP22687792A JP22687792A JPH0675971A JP H0675971 A JPH0675971 A JP H0675971A JP 22687792 A JP22687792 A JP 22687792A JP 22687792 A JP22687792 A JP 22687792A JP H0675971 A JPH0675971 A JP H0675971A
- Authority
- JP
- Japan
- Prior art keywords
- device data
- semiconductor manufacturing
- time
- data
- measurement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 58
- 239000004065 semiconductor Substances 0.000 title claims abstract description 58
- 238000007726 management method Methods 0.000 claims abstract description 24
- 238000005259 measurement Methods 0.000 claims description 70
- 238000013523 data management Methods 0.000 claims description 19
- 230000005540 biological transmission Effects 0.000 claims description 15
- 238000013500 data storage Methods 0.000 abstract description 20
- 238000010586 diagram Methods 0.000 description 7
- 238000013459 approach Methods 0.000 description 2
- 238000004904 shortening Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/30—Computing systems specially adapted for manufacturing
Landscapes
- General Factory Administration (AREA)
- Management, Administration, Business Operations System, And Electronic Commerce (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体製造装置で測定
した装置データに応じて、自動的に適切な装置データ測
定時刻制御を行う半導体製造装置管理システムに関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus management system for automatically performing appropriate apparatus data measurement time control according to apparatus data measured by a semiconductor manufacturing apparatus.
【０００２】[0002]
【従来の技術】従来の半導体製造装置管理システムの一
例を図５、図６に基づいて説明する。図５は従来の半導
体製造装置管理システムの構成図であり、図６は半導体
製造装置の装置マスタデータを格納する装置マスタデー
タ格納テーブルの一例である。図５おいて、２３は装置
データ管理装置、２４は半導体製造装置、３は伝達経路
であり、装置データ管理装置２３は伝達経路３によって
半導体製造装置２４と接続されている。装置データ管理
装置２３は装置データ判定手段４と、警告発信手段５
と、装置データ格納手段８と、装置マスタデータ格納テ
ーブル２５と、装置データ格納テーブル９で構成されて
おり、半導体製造装置２４には測定動作起動手段２６
と、装置データ測定手段１１と、装置データ発信手段１
２が設置してある。2. Description of the Related Art An example of a conventional semiconductor manufacturing apparatus management system will be described with reference to FIGS. FIG. 5 is a block diagram of a conventional semiconductor manufacturing apparatus management system, and FIG. 6 is an example of an apparatus master data storage table for storing apparatus master data of a semiconductor manufacturing apparatus. In FIG. 5, 23 is a device data management device, 24 is a semiconductor manufacturing device, 3 is a transmission path, and the device data management device 23 is connected to the semiconductor manufacturing device 24 by the transmission path 3. The device data management device 23 includes a device data determination means 4 and a warning transmission means 5.
And a device data storage means 8, a device master data storage table 25, and a device data storage table 9. The semiconductor manufacturing device 24 includes a measurement operation starting means 26.
, Device data measuring means 11 and device data transmitting means 1
2 is installed.
【０００３】図６において、イアテムは、装置名１３、
上限値１４、上警戒値１５、下警戒値１６、下限値１７
で構成されている。In FIG. 6, the item is the device name 13,
Upper limit value 14, upper warning value 15, lower warning value 16, lower limit value 17
It is composed of.
【０００４】以上のように構成された半導体製造装置管
理システムについて、以下その動作について説明する。
まず、測定動作起動手段２６によって一定時間毎に装置
データを測定させる指令が半導体製造装置２に発せら
れ、装置データ測定手段１１によって装置データが測定
され、測定された装置データは装置データ発信手段１２
によって伝達経路３を経由し装置データ管理装置２３に
伝達される。装置データ管理装置２３では、装置データ
判定手段４によって装置マスタデータ格納テーブル２５
から装置データの該当する装置名１３の上限値１４、上
警戒値１５、下警戒値１６、下限値１７を検索し装置デ
ータがこれら規格値を越えている場合には警告発信手段
８によって半導体製造装置２４に警報する。次に装置デ
ータを装置データ格納手段８によって、装置データ格納
テーブル９に格納する。The operation of the semiconductor manufacturing apparatus management system configured as described above will be described below.
First, the measurement operation starting unit 26 issues a command to the semiconductor manufacturing apparatus 2 to measure the device data at regular intervals, the device data measuring unit 11 measures the device data, and the measured device data is the device data transmitting unit 12.
Is transmitted to the device data management device 23 via the transmission path 3. In the device data management device 23, the device data determination means 4 causes the device master data storage table 25.
The upper limit value 14, the upper warning value 15, the lower warning value 16, and the lower limit value 17 of the corresponding device name 13 of the device data are searched from the device data, and when the device data exceeds these standard values, the warning transmission means 8 is used to manufacture the semiconductor. Alert device 24. Next, the device data is stored in the device data storage table 9 by the device data storage means 8.
【０００５】[0005]
【発明が解決しようとする課題】半導体製造装置を管理
するにあたって、装置データは上限値や下限値に近いほ
ど、また装置データの推移が上限値や下限値に向かうほ
ど装置が稼働を停止する可能性が高く装置管理上重要と
なる。When managing a semiconductor manufacturing apparatus, the apparatus can stop operating as the apparatus data approaches the upper limit value or the lower limit value, and as the transition of the apparatus data approaches the upper limit value or the lower limit value. Highly important and important for device management.
【０００６】しかしながら前記のような構成では、半導
体製造装置の装置データは半導体製造装置２４に登録さ
れた一定時間間隔でしか測定されず、装置データが重要
性の高いものであっても測定時間間隔は短くならず、ま
た、装置データの重要性が低い場合であっても何回も測
定してしまうといった問題点を有していた。However, in the above-mentioned configuration, the device data of the semiconductor manufacturing apparatus is measured only at the constant time intervals registered in the semiconductor manufacturing apparatus 24, and even if the apparatus data is highly important, the measurement time interval is not measured. Has a problem in that it is not shortened, and measurement is performed many times even when the importance of the device data is low.
【０００７】本発明は上記従来の問題点を解決するもの
で、装置データの重要度を判定し、重要度の高い場合に
は装置データ測定時間間隔を短くし、重要度の低い場合
には装置データ測定時間間隔を長くする半導体製造装置
管理システムを提供することを目的とする。The present invention solves the above-mentioned conventional problems by determining the importance of device data, shortening the device data measurement time interval when the importance is high, and reducing the device data measurement time interval when the importance is low. An object of the present invention is to provide a semiconductor manufacturing apparatus management system that lengthens a data measurement time interval.
【０００８】[0008]
【課題を解決するための手段】上記問題点を解決するた
めに本発明の半導体製造装置管理システムは、装置デー
タ管理装置を有し、前記装置データ管理装置と少なくと
も一つの半導体製造装置とを接続する伝達経路を有し、
前記装置データ管理装置において前記半導体製造装置に
装置データを測定せしめる時刻を決定する測定時刻決定
手段を有し、前記測定時刻決定手段により決定された時
刻に前記半導体製造装置に装置データ測定を開始せしめ
る測定指令発信手段を有し、前記装置データの測定結果
を前記装置データ管理装置に格納するものである。In order to solve the above problems, a semiconductor manufacturing device management system of the present invention has a device data management device, and connects the device data management device and at least one semiconductor manufacturing device. Has a transmission path to
The device data management device has a measurement time determination means for determining a time at which the semiconductor manufacturing device measures the device data, and causes the semiconductor manufacturing device to start device data measurement at the time determined by the measurement time determination device. It has a measurement command transmitting means and stores the measurement result of the device data in the device data management device.
【０００９】[0009]
【作用】本発明は上記した構成によって、以下の作用を
得る。The present invention has the following functions due to the above-mentioned structure.
【００１０】測定時刻決定手段によって装置データの装
置管理に対する重要度を判定しその重要度によって次回
の装置データを測定せしめるまでの時間を変化させ、測
定時刻決定手段で決定した時刻に装置データ測定指令を
測定指令発信手段によって半導体製造装置に発信し半導
体製造装置に装置データを測定させることで、装置デー
タの重要度に応じて装置データの測定時間間隔を変化さ
せる。The measurement time determining means determines the importance of the device data for device management, and the time until the next device data is measured is changed according to the importance, and the device data measurement command is issued at the time determined by the measurement time determining means. Is transmitted to the semiconductor manufacturing apparatus by the measurement command transmitting means and the semiconductor manufacturing apparatus measures the apparatus data, thereby changing the measurement time interval of the apparatus data according to the importance of the apparatus data.
【００１１】[0011]
【実施例】以下本発明の半導体製造装置管理システムの
一実施例を、図１、図２、図３、図４を参照しながら説
明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the semiconductor manufacturing equipment management system of the present invention will be described below with reference to FIGS. 1, 2, 3, and 4.
【００１２】図１は本発明の実施例における半導体製造
装置管理システムの構成を示すものである。図１におい
て、１は装置データ管理装置、２は半導体製造装置、３
は伝達経路であり、装置データ管理装置１６は伝達経路
３によって半導体製造装置１７と接続されている。装置
データ管理装置１は装置データ判定手段４と、警告発信
手段５と、測定時刻決定手段６と、測定指令発信手段７
と、装置データ格納手段８と、装置データ格納テーブル
９と、装置マスタデータ格納テーブル１０とで構成され
ており、半導体製造装置２には装置データ測定手段１１
と、装置データ発信手段１２が設置してある。FIG. 1 shows the configuration of a semiconductor manufacturing apparatus management system according to an embodiment of the present invention. In FIG. 1, 1 is a device data management device, 2 is a semiconductor manufacturing device, 3
Is a transmission path, and the device data management apparatus 16 is connected to the semiconductor manufacturing apparatus 17 through the transmission path 3. The device data management device 1 includes a device data determination means 4, a warning transmission means 5, a measurement time determination means 6, and a measurement command transmission means 7.
, Device data storage means 8, device data storage table 9, and device master data storage table 10. Device data measuring means 11 is provided in the semiconductor manufacturing apparatus 2.
And the device data transmission means 12 is installed.
【００１３】図２は本発明の半導体製造装置管理システ
ムの、半導体製造装置２の装置マスタデータを格納する
装置マスタデータ格納テーブル１０の一例である。アイ
テ名は装置名１３、上限値１４、上警戒値１５、下警戒
値１６、下限値１７と、装置データの測定時間間隔の最
長を定義する最長測定時間間隔１８と、装置データの測
定時間間隔の最短を定義する最短測定時間間隔１９とで
構成される。FIG. 2 shows an example of the device master data storage table 10 for storing the device master data of the semiconductor manufacturing device 2 in the semiconductor manufacturing device management system of the present invention. Aite name is device name 13, upper limit value 14, upper warning value 15, lower warning value 16, lower limit value 17, longest measurement time interval 18 that defines the longest measurement time interval of device data, and measurement time interval of device data. And the shortest measurement time interval 19 that defines the shortest of
【００１４】図３は測定時刻決定手段６によって測定時
刻を決定する原理の第一例を説明するためのもので、い
ま測定された装置データの測定値２０から次に装置デー
タが規格値を外れるまでの時間を予想し、この予想時間
によって次回に半導体製造装置２に装置データを測定す
る時刻を決定するものである。以下、図３の測定時刻決
定の原理を説明する。２０は今測定された装置データ、
２１は測定値２０の１つ前に測定された装置データ、２
２は測定値２０の一つ前に測定された装置データであ
り、Ｘ０は装置データ２０のデータ値、Ｘ１は上限値１
４のデータ値、Ｔ１は最短測定時間間隔１９のデータ
値、Ｔ２は最長測定時間間隔１８のデータ値、線分ＡＣ
は装置データ値２２、２３、２４の傾きの平均ａを点Ａ
から延長したもので、点Ｃは線分ＡＣと上限値Ｘ１との
接点、Ｔ０は点Ｃの時間値である。この時間値Ｔ０がＴ
１＜Ｔ０＜Ｔ２の場合は次回までの測定時間間隔ＴをＴ
０とし、Ｔ０＞Ｔ２の場合には測定時間間隔ＴをＴ２と
し、Ｔ０＜Ｔ１の場合は測定時間間隔ＴをＴ１にする。
現在の時刻にここで決定されたＴを加えることで次回の
測定時刻を決定することができる。FIG. 3 is for explaining the first example of the principle of determining the measurement time by the measurement time determining means 6. The device data deviates from the standard value from the measured value 20 of the device data measured now. The time until the device data is measured next time in the semiconductor manufacturing device 2 is determined by the estimated time. Hereinafter, the principle of determining the measurement time in FIG. 3 will be described. 20 is the measured device data,
21 is device data measured before the measured value 20 and 2
2 is device data measured before the measured value 20, X0 is a data value of the device data 20, and X1 is an upper limit value 1.
4 data values, T1 is the data value of the shortest measurement time interval 19, T2 is the data value of the longest measurement time interval 18, the line segment AC
Is the average a of the slopes of the device data values 22, 23, 24 at point A
The point C is the contact point between the line segment AC and the upper limit value X1, and T0 is the time value of the point C. This time value T0 is T
When 1 <T0 <T2, the measurement time interval T until the next time is T
0, the measurement time interval T is T2 when T0> T2, and the measurement time interval T is T1 when T0 <T1.
The next measurement time can be determined by adding T determined here to the current time.
【００１５】図４は測定時刻決定手段６によって測定時
刻を決定する原理の第２例を説明する為のもので、測定
時刻決定手段６において装置データが上限値または下限
値に近いほど次回までの測定時間間隔が短くなるような
グラフを作成し、このグラフと装置データを比較し、次
回の測定時刻を決定するものである。以下、図４の測定
時刻決定の原理を説明する。２０は今測定された装置デ
ータ、Ｘ１は上限値１４のデータ値、Ｘ２は下限値１７
のデータ値、Ｘ３はＸ１とＸ２との中間値であり、Ｘ３
＝（Ｘ１＋Ｘ２）／２である。Ｘ０は装置データのデー
タ値、Ｔ１は最短測定時間間隔、Ｔ２は最長測定時間間
隔であり、Ｘ２＜Ｘ＜Ｘ３では下限値Ｘ２に近いほど測
定時間間隔Ｔが短く、Ｘ３＜Ｘ＜Ｘ１では上限値Ｘ１に
近い程測定時間間隔Ｔが短かくする。またＸ＜Ｘ２また
はＸ＞Ｘ１では測定時間間隔は最短測定時間間隔Ｔ１に
する。このグラフを測定時刻決定手段６によって作成
し、装置データ２０を対応させ、次回までの測定時間間
隔Ｔ４を求める。この時間Ｔ４を現在の時刻に加えるこ
とで次回の測定時刻を決定することができる。FIG. 4 is for explaining the second example of the principle of determining the measurement time by the measurement time determining means 6, and as the device data in the measurement time determining means 6 becomes closer to the upper limit value or the lower limit value, the next time. A graph is created such that the measurement time interval is shortened, and this graph is compared with the device data to determine the next measurement time. Hereinafter, the principle of determining the measurement time in FIG. 4 will be described. 20 is the device data just measured, X1 is the upper limit value 14 data value, X2 is the lower limit value 17
Data value X3 is an intermediate value between X1 and X2, and X3
= (X1 + X2) / 2. X0 is the data value of the device data, T1 is the shortest measurement time interval, T2 is the longest measurement time interval, and the closer the measurement time interval T is to the lower limit value X2 in X2 <X <X3, the upper limit in X3 <X <X1. The closer the value is to X1, the shorter the measurement time interval T is. When X <X2 or X> X1, the measurement time interval is the shortest measurement time interval T1. This graph is created by the measurement time determination means 6, and the device data 20 is associated with the measurement time interval T4 until the next time. By adding this time T4 to the current time, the next measurement time can be determined.
【００１６】以下、図１を用いて本発明の半導体製造装
置管理システムの動作原理を説明する。半導体製造装置
２の装置データ測定手段１１によって測定された装置デ
ータは装置データ発信手段１２により伝達経路３を経由
して装置データ管理装置１に伝達される。つぎに、装置
データ判定手段４によって装置マスタデータ格納テーブ
ル１０から装置データの装置名１３に該当する上限値１
４、上警戒値１５、下警戒値１６、下限値１７、最長測
定時間間隔１８、最短測定時間間隔１９のデータを検索
し、装置データが規格値の範囲にない場合には警告発信
手段５によって適切な警告を半導体製造装置２に発信す
る。次に、測定時刻決定手段６によって、前記図３、図
４の測定時刻決定の原理で説明した原理により次回の測
定時刻を決定する。装置データは装置データ格納手段７
によって装置データ格納テーブル９に格納される。次の
測定指令は、測定時刻決定手段６によって決定された測
定時刻に達した時に測定指令発信手段７によって半導体
製造装置２に発信され、半導体製造装置２で装置データ
が測定される。以上の動作を何回も繰り返し、装置デー
タ管理装置１は装置データの管理を行う。The operation principle of the semiconductor manufacturing apparatus management system of the present invention will be described below with reference to FIG. The device data measured by the device data measuring means 11 of the semiconductor manufacturing device 2 is transmitted to the device data management device 1 via the transmission path 3 by the device data transmitting means 12. Next, the upper limit value 1 corresponding to the device name 13 of the device data from the device master data storage table 10 by the device data determination means 4
4, the upper warning value 15, the lower warning value 16, the lower limit value 17, the longest measurement time interval 18, the data of the shortest measurement time interval 19 is searched, and when the device data is not within the standard value range, the warning transmission means 5 is used. An appropriate warning is sent to the semiconductor manufacturing device 2. Next, the measurement time determination means 6 determines the next measurement time according to the principle described in the principle of measurement time determination in FIGS. The device data is stored in the device data storage means 7.
Are stored in the device data storage table 9. The next measurement command is transmitted to the semiconductor manufacturing apparatus 2 by the measurement command transmitting unit 7 when the measurement time determined by the measurement time determining unit 6 is reached, and the semiconductor manufacturing device 2 measures the device data. The device data management device 1 manages device data by repeating the above operation many times.
【００１７】以上のように本実施例によれば、装置デー
タの値の重要度により、次回に半導体製造装置に装置デ
ータを測定せしめるまでの時間を変化させることができ
る。As described above, according to the present embodiment, the time until the next time the semiconductor manufacturing apparatus measures the device data can be changed depending on the importance of the value of the device data.
【００１８】尚、図３では傾きａを３つの装置データを
用いて計算したが、２つ以上の装置データであればいく
つの装置データを用いてもよい。In FIG. 3, the slope a is calculated using three device data, but any number of device data may be used as long as it is two or more device data.
【００１９】尚、図４でのグラフはＸ２＜Ｘ＜Ｘ３、Ｘ
３＜Ｘ＜Ｘ１で直線としたが、中間値Ｘ３から離れるほ
ど時間が短くなれば、曲線であってもよい。The graph in FIG. 4 shows that X2 <X <X3, X
Although 3 <X <X1 is a straight line, a curved line may be used if the time becomes shorter as the distance from the intermediate value X3 increases.
【００２０】[0020]
【発明の効果】以上のように本発明は、装置データの装
置管理に対する重要度を判定し、それに応じて半導体製
造装置に装置データを測定せしめるまでの時間を適切に
変化させることによって装置状況が悪化するほど密に装
置データを管理できるので、半導体製造装置の装置管理
精度を向上させることができる。As described above, according to the present invention, by determining the importance of device data for device management, and appropriately changing the time until the semiconductor manufacturing device measures the device data, the device status can be changed. Since the device data can be managed more densely as it gets worse, the device management accuracy of the semiconductor manufacturing device can be improved.
【図１】本発明の実施例における半導体製造装置管理シ
ステムの構成図FIG. 1 is a configuration diagram of a semiconductor manufacturing apparatus management system according to an embodiment of the present invention.
【図２】本発明の実施例における半導体製造装置の装置
マスタデータを格納する装置マスタデータ格納テーブル
の一例を示す図FIG. 2 is a diagram showing an example of an apparatus master data storage table for storing apparatus master data of a semiconductor manufacturing apparatus according to an embodiment of the present invention.
【図３】本発明の実施例における測定時刻を決定する原
理の第一例を説明する特性図FIG. 3 is a characteristic diagram illustrating a first example of the principle of determining the measurement time in the embodiment of the present invention.
【図４】本発明の実施例における測定時刻を決定する原
理の第二例を説明する特性図FIG. 4 is a characteristic diagram illustrating a second example of the principle of determining the measurement time in the embodiment of the present invention.
【図５】従来の半導体製造装置管理システムの構成図FIG. 5 is a block diagram of a conventional semiconductor manufacturing equipment management system.
【図６】従来の半導体製造装置管理システムにおける半
導体製造装置の装置マスタデータを格納する装置マスタ
データ格納テーブルの一例を示す図FIG. 6 is a diagram showing an example of an apparatus master data storage table for storing apparatus master data of a semiconductor manufacturing apparatus in a conventional semiconductor manufacturing apparatus management system.
１、２３ 装置データ管理装置 ２、２４ 半導体製造装置 ３ 伝達経路 ４ 装置データ測定手段 ５ 警告発信手段 ６ 測定時刻決定手段 ７ 測定指令発信手段 ８ 装置データ格納手段 ９ 装置データ格納テーブル １０、２５ 装置マスタデータ格納テーブル １１ 装置データ測定手段 １２ 装置データ発信手段 １３ 装置名 １４ 上限値 １５ 上警戒値 １６ 下警戒値 １７ 下限値 １８ 最長測定時間間隔 １９ 最短測定時間間隔 ２０、２１、２２ 装置データ ２６ 測定動作起動手段 1, 23 Device Data Management Device 2, 24 Semiconductor Manufacturing Device 3 Transmission Route 4 Device Data Measuring Means 5 Warning Sending Means 6 Measurement Time Determining Means 7 Measurement Command Sending Means 8 Device Data Storage Means 9 Device Data Storage Tables 10, 25 Device Master Data storage table 11 Device data measuring means 12 Device data transmitting means 13 Device name 14 Upper limit value 15 Upper warning value 16 Lower warning value 17 Lower limit value 18 Longest measuring time interval 19 Shortest measuring time interval 20, 21, 22 Device data 26 Measuring operation Starting means
Claims (4)
タ管理装置と少なくとも一つの半導体製造装置とを接続
する伝達経路を有し、前記装置データ管理装置において
前記半導体製造装置に装置データを測定せしめる時刻を
決定する測定時刻決定手段を有し、前記測定時刻決定手
段により決定された時刻に前記半導体製造装置に装置デ
ータ測定を開始せしめる測定指令発信手段を有し、前記
装置データの測定結果を前記装置データ管理装置に格納
することを特徴とする半導体製造装置管理システム。1. A device data management device, a transmission path connecting the device data management device and at least one semiconductor manufacturing device, wherein the device data management device measures device data in the semiconductor manufacturing device. It has a measurement time determining means for determining the time of the measurement, has a measurement command transmitting means for starting the device data measurement in the semiconductor manufacturing device at the time determined by the measurement time determining means, the measurement result of the device data A semiconductor manufacturing device management system, which is stored in the device data management device.
格値から前記装置データの装置管理に対する重要度を判
断し、前記重要度によって半導体製造装置に前記装置デ
ータを測定せしめる時刻を決定する請求項１記載の半導
体製造装置管理システム。2. The measurement time determination means determines the importance of the device data for device management from the device data and the standard value, and determines the time at which the semiconductor manufacturing device measures the device data based on the importance. 1. The semiconductor manufacturing apparatus management system according to 1.
時間に対する傾きから前記装置データの規格値から外れ
るまでの時間を予測し、前記予測時間の長さから半導体
製造装置に前記装置データを測定せしめる時刻を決定す
る請求項１記載の半導体製造装置管理システム。3. A measuring time determining means predicts a time until the standard value of the device data deviates from a slope with respect to time of past device data, and the device data is sent to a semiconductor manufacturing device from the length of the predicted time. The semiconductor manufacturing apparatus management system according to claim 1, wherein a time at which measurement is performed is determined.
限値の中間から前記上限値および前記下限値に向かうほ
ど半導体製造装置に装置データを測定せしめるまでの時
間が短くなるグラフを作成し、前記グラフに前記装置デ
ータを代入して得られる時間から前記半導体製造装置に
前記装置データを測定せしめる時刻を決定する請求項１
記載の半導体製造装置管理システム。4. A graph in which the measurement time determining means makes the time required for the semiconductor manufacturing apparatus to measure the device data becomes shorter from the middle of the upper limit value and the lower limit value of the standard value toward the upper limit value and the lower limit value. Then, the time at which the semiconductor manufacturing apparatus measures the device data is determined from the time obtained by substituting the device data into the graph.
The semiconductor manufacturing equipment management system described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22687792A JPH0675971A (en) | 1992-08-26 | 1992-08-26 | Management system for semiconductor manufacture device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22687792A JPH0675971A (en) | 1992-08-26 | 1992-08-26 | Management system for semiconductor manufacture device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0675971A true JPH0675971A (en) | 1994-03-18 |
Family
ID=16851980
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22687792A Pending JPH0675971A (en) | 1992-08-26 | 1992-08-26 | Management system for semiconductor manufacture device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0675971A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007019431A (en) * | 2005-07-11 | 2007-01-25 | Tokyo Electron Ltd | Apparatus, system, and program for substrate treatment monitor and recording medium |
| WO2014007081A1 (en) * | 2012-07-04 | 2014-01-09 | 株式会社日立国際電気 | Substrate treatment system, substrate treatment device, data processing method and storage medium |
| JP2015176903A (en) * | 2014-03-13 | 2015-10-05 | 東京エレクトロン株式会社 | Control device, substrate processing device and substrate processing system |
-
1992
- 1992-08-26 JP JP22687792A patent/JPH0675971A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007019431A (en) * | 2005-07-11 | 2007-01-25 | Tokyo Electron Ltd | Apparatus, system, and program for substrate treatment monitor and recording medium |
| WO2014007081A1 (en) * | 2012-07-04 | 2014-01-09 | 株式会社日立国際電気 | Substrate treatment system, substrate treatment device, data processing method and storage medium |
| JPWO2014007081A1 (en) * | 2012-07-04 | 2016-06-02 | 株式会社日立国際電気 | Substrate processing system, substrate processing apparatus, data processing method, and storage medium |
| JP2015176903A (en) * | 2014-03-13 | 2015-10-05 | 東京エレクトロン株式会社 | Control device, substrate processing device and substrate processing system |
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